downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Member company iconResource item iconStore item iconGroup 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content
Default Banner Image

South Korea

About SEMI Supply Chain Management Initiative

Drupal Staggerd_575x336_SCM_Survey_Readout_v2@2x

The SEMI Supply Chain Management initiative is a unique global platform that brings together top industry leaders to advance a more resilient and agile electronics supply chain. Recent geopolitical and natural events have exposed vulnerabilities but also new opportunities that require industry-wide and precompetitive collaboration. That's where SEMI comes in. The initiative’s newly formed Industry Advisory Council is committed todriving engagement, creating tools and solutions through collaboration, and ensuring alignment in global end-to-end supply chain continuity, visibility, and transparency. Through deep dives, educational forums, benchmarking, standards development, and strategic partnerships, SEMI seeks to empower our members to anticipate and respond to future disruptions proactively.

 

If you are interested in learning more about how your company can participate in the SCM initiative, please contact us at [email protected].

+
Drupal Staggerd_575x336_SCM_Survey_Readout_v2@2x
Belgium France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_SCM_Survey_Readout_v2@2x Business Executive Technical
Highlighted content

Join us for an insightful webinar as we present the findings from the 2024 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.

The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape.

During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.

Choose your session:

United States

Bettina Weiss headshot
Bettina Weiss
Chief of Staff & Corporate Strategy
SEMI

Opening Remarks

Kushal.jpg
Kushal Jolapara
Associate
McKinsey & Company, Inc.
Henry
Henry Marcil
Partner
McKinsey & Company, Inc.
Jakob
Jakob Münch
Senior Consultant
McKinsey & Company, Inc.

2024 SCM Survey Briefing

Q&A

Smart MFG

Join us for a webinar on the 2024 Semiconductor Supply Chain Survey results, a collaboration between SEMI and McKinsey & Company. Discover key trends, challenges, and opportunities across the value chain. Gain insights to benchmark your organization and enhance your strategic planning. 

Register now for one of the sessions:

Off Add to Calendar 2024-06-24 00:00:00 2024-06-24 00:00:00 Benchmark Your Supply Chain Agility Join us for a webinar on the 2024 Semiconductor Supply Chain Survey results, a collaboration between SEMI and McKinsey & Company. Discover key trends, challenges, and opportunities across the value chain. Gain insights to benchmark your organization and enhance your strategic planning. Register now for one of the sessions:US/EU: 8:00 AM – 9:00 AM PT [Register Now]  Asia: 5:00 PM – 6:00 PM PT [Register Now]  United States SEMI.org [email protected] America/Los_Angeles public
Event format
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_GenAI_v1@2x Business Executive Technical
Highlighted content

Generative artificial intelligence (GenAI) applications are becoming increasingly popular and with new model and applications being currently launched every day. However, GenAI applications are very compute intensive requiring specialized servers and chips.

In this webinar, panelists will discuss different adoptions scenarios and their implications on the semiconductor industry. In particular, they will dive deep on the need for additional manufacturing capacity for logic and memory as we expect the biggest investment needs there.

You will also hear from the CEO of SEMI on the potential AI holds for the semiconductor industry, along with SEMI's ongoing efforts to address this transformative technology.

United States

8:00 am - 8:10 am

Opening Remarks

8:10 am - 8:15 am

SEMI Smart Data-AI Initiative

8:15 am - 8:25 am

Semiconductor Industry Outlook Driven by GenAI

8:25 am - 8:35 am

Silicon Demand Forecast and Scenarios

8:35 am - 8:50 am

Implication for the Ecosystem

8:50 am - 9:00 am

Q & A

Explore the surge in GenAI applications and their impact on the semiconductor industry, including discussions on adoption scenarios and the need for increased manufacturing capacity, with insights from SEMI's CEO on AI's potential and SEMI's proactive strategies.

Off Add to Calendar 2024-06-18 00:00:00 2024-06-18 00:00:00 GenAI – the next S-curve for the semiconductor industry? Explore the surge in GenAI applications and their impact on the semiconductor industry, including discussions on adoption scenarios and the need for increased manufacturing capacity, with insights from SEMI's CEO on AI's potential and SEMI's proactive strategies. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format

HATFIELD, Pa. (USA), APRIL 18, 2024 — Brooks Instrument, a world leader in advanced flow measurement and control, has acquired Creative Machining Technology of Corona, California. The acquisition took place April 1, 2024, under Illinois Tool Works (ITW), Brooks Instrument’s parent company.

Creative Machining Technology (CMT) provides a variety of machining and manufacturing services, ranging from individual part production through end-item manufacturing, kitting and assembly.

The company has long been a key supplier to Brooks Instrument, with core competencies rooted in high-precision CNC machining. CMT has proven expertise manufacturing and polishing ultrahigh-purity components with extremely tight tolerances for demanding applications, including semiconductor manufacturing.

“By integrating Creative Machining Technology into Brooks Instrument, we are enhancing our in-house expertise for critical machined components and machining capabilities, which adds to our supply chain assurance for producing ultrahigh-purity instruments,” said Brent Best, Vice President and General Manager — Brooks Instrument Semiconductor Division, an ITW Company. “In addition, we’ve increased our capabilities for quick-turn customer R&D requests to create more innovative flow measurement and control solutions.”

CMT has extensive experience manufacturing to tolerances as tight as 0.0001". This proficiency and CMT’s manufacturing facilities will enable Brooks Instrument to more quickly and effectively design and produce complex wetted flow path components for the company’s industry-leading mass flow controllers (MFCs). MFCs are the most important element in the gas delivery systems used for semiconductor manufacturing. In addition, CMT has both Class 1,000 and Class 10,000 clean rooms for processing and handling extremely delicate electronic components that require a controlled environment.

“This acquisition is part of our strategic approach to grow our business and position us for long-term success in the semiconductor market as we ramp up to meet anticipated growth in this segment,” said Best. “Moving forward, we are excited to have CMT join Brooks Instrument as we focus on continuous improvement, growing our technology offerings and meeting our customers’ needs.”

The CMT acquisition is the latest in Brooks Instrument’s initiatives to serve the semiconductor industry. Earlier this year the company launched a new GF120xHT Series mass flow controller for high-temperature environments, while last year opened a new manufacturing site in Malaysia to expand production and partnership opportunities with key customers in the Asia-Pacific region.

For more information about Brooks Instrument’s full range of capabilities for the semiconductor industry, visit www.brooksinstrument.com/en/markets/semiconductor-manufacturing.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech manufacturing, laboratories and other processes and industries. With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

Kitchener, Ontario, April 2, 2024 – The SEMI North America Information and Control Committee (I&CC) has announced that Albert Fuchigami, a Senior Standards Specialist at PEER Group®, has been confirmed as a Technical Committee co-chair during its recently held spring meeting.

As an I&CC co-chair, Fuchigami will help coordinate the various SEMI task forces responsible for the development and maintenance of communication and control SEMI Standards used to automate the semiconductor manufacturing process. Fuchigami will also play an important role in facilitating collaboration between the regional technical committees while providing mentorship and guidance on navigating SEMI rules and regulations.

“I greatly appreciate the support from committee members to confirm me as co-chair,” says Fuchigami. “SEMI I&C Standards are essential to satisfy our industry’s ever growing demands for big data, smart manufacturing, and automation in an efficient and scalable manner. I look forward to helping move their development further in this role.”

Fuchigami is heavily involved in the SEMI Standards Program in North America, Japan, Taiwan, South Korea, and China. He co-leads the SEMI North America Data Diagnostic Acquisition (DDA) Task Force, has authored various SEMI articles and tech briefs, and regularly shares his knowledge and expertise at industry conferences and events.

In recognition of his contributions to the international SEMI Standards program, Fuchigami was awarded the North American SEMI International Standards Leadership Award in 2022 and the Japan Information and Control Technical Committee Award in 2021.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2024. Follow PEER Group on LinkedIn.

Kitchener, Ontario, March 28, 2024 – PEER Group® is proud to announce that it has earned Intel’s EPIC Distinguished Supplier Award. Through its dedication to Excellence, Partnership, Inclusion, and Continuous (EPIC) quality improvement, PEER Group has achieved a level of performance that consistently exceeds Intel’s expectations.

“As one of the 27 Distinguished Supplier Award recipients in 2024, PEER Group stands out among suppliers in Intel’s trusted supply chain,” said Keyvan Esfarjani, chief global operations officer at Intel. “Through their relentless drive to improve, they have achieved a level of performance that consistently exceeds Intel’s expectations and serves as a benchmark across the ecosystem.”

The Intel EPIC Distinguished Supplier Award recognizes a consistent level of strong performance across all performance criteria. Of the thousands of Intel suppliers around the world, only a few hundred qualify to participate in the EPIC Supplier Program. The EPIC Distinguished Award is the second-highest honor a supplier can achieve. In 2024, only 27 suppliers in the Intel supply chain network earned this award.

To qualify for an Intel EPIC Distinguished Supplier Award, suppliers must exceed expectations, meet aggressive performance goals, and score 80 percent or higher in performance assessments throughout the year. Suppliers must also meet 80 percent or more of their improvement plan deliverables and demonstrate formidable quality and business systems.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2024. Follow PEER Group on LinkedIn.

Belgium France Germany Ireland Italy Japan Singapore South Korea Taiwan United States Watch Now 800x800 Earth Month Lightning Talks Business Executive
Highlighted content

United States

9:00 am - 9:02 am
Wojtek Osowiecki
Lam Research & Co-Leader SEMI CESI Working Group

Welcome

9:02 am - 9:10 am
John Niggley
Tualatin Facilities Manager
Lam Research

The power of facilities management for sustainability

9:10 am - 9:18 am
Gregory Woods
Sr. Equipment Engineer Plasma
ASML

Environmental Stewardship: An ERG Perspective

9:18 am - 9:26 am
Patrick McCrummen
Community Impact Leader
DuPont

Empowering people to thrive

9:26 am - 9:34 am
Ron McCune
Sr. Director, Strategic Planning
TEL

Raising Awareness on People, Planet and Profit through internal campaigns

9:34 am - 9:42 am
Werner Haberstock
Advantest

Employee activities at Advantest - Planet vs Plastic, beach clean-up, tree planting, and more!

9:42 am - 9:50 am
Paola Gonzalez Aguirre
Entegris

Sustainable Packaging solutions

9:50 am - 9:58 am
Laurens Polgar
NXP

Sustainability Portfolio

9:58 am - 10:00 am
Justin Harris
Climate Equity Collaborative & Co-Leader, CESI

Wrap Up & Follow Up

Sustainability

Discover how other semiconductor companies center climate and social impact during Earth Month.  Explore the transformative potential of employee initiatives in enhancing environmental sustainability, employee-driven climate action, equity, and advancing their goals with this webinar recorded April 19, 2024.  You will find great ideas for using in your company to build employee morale and bond over taking action to protect, clean and plan for a cleaner, healthier tomorrow. 

 

During the first-ever SEMI Earth Month Lightning Talks, organized by the Climate Equity and Social Impact (CESI) working group. speakers from across our industry presented on the initiatives and achievements of ESG innovation, and employee impact.  They discussed new climate equity activities, with some great technology innovation thrown in. 

9:00 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles Register Now
Event format

Brooks Instrument, a world leader in advanced flow measurement and control, has released its new GF120xHT Series high-temperature thermal mass flow controller. This is the company’s first high-temperature mass flow controller in the GF family and is specifically designed to support solid and liquid precursors required in semiconductor manufacturing.

Mass flow controllers (MFCs) are the most important component in the gas delivery systems used to produce an integrated circuit. The GF120xHT Series MFC flow module can operate between 45°C and 150°C. In comparison, traditional thermal MFCs can only operate up to 50°C. By offering a greater operating range than conventional thermal MFCs, the GF120xHT Series can precisely deliver vapor to the process chamber, even when that material is a liquid or a solid at room temperature.

The GF120xHT is unique in its capability to support upgrades from Brooks Instrument’s legacy heated 9861 and VC4900 MFC series. With ultrafast EtherCAT® communication, programmable alarms and warnings developed specifically for advanced process control, and fault detection and classification (FDC) tracking, it’s also an optimum choice for next-generation platforms.

“Our high-temperature GF120xHT MFC will solve customer pain points by delivering precursors for critical processes, such as selective atomic layer deposition (ALD), in advanced logic and memory applications,” said Dr. Mohamed Saleem, chief technology officer, semiconductor platform, at ITW, the parent company of Brooks Instrument. “The GF120xHT will deliver these critical precursors reliably, accurately and without particle contamination.”

The new MFC features a variety of user-friendly qualities that support advancements in semiconductor manufacturing, including:

High-Temperature Capabilities: In a typical thermal MFC, the mechanical components can be heated to high temperatures, but the electronic components cannot. To support high-temperature applications, the electronics are remotely connected to the mechanical flow module of the GF120xHT Series. The flow module can operate at temperatures up to 150°C, while the remote electronics are mounted in a cooler location (About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech manufacturing, laboratories and other processes and industries. With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam X Technical
Highlighted content

While silicon carbide (SiC) has long been known for its superior properties for power device manufacturing, economical high-volume production has been hard to achieve. Small substrates, high cost, and challenging manufacturing infrastructure have limited the reach of this enabling technology. With the advent of larger substrates, however, the outlook for SiC is ever brighter and, shall we say, more powerful?
From the building of these larger substrates to the development of equipment designed for SiC processing, the semiconductor industry has challenges ahead. In this webinar, we will explore these aspects of growing and maturing the SiC supply chain from the materials and equipment perspective.

United States

Rob circle
Robert Rhoades
President and CTO, X-trinsic;
Sr. Technology Analyst, TECHCET

Market Trends Perspective

David circle
David Kirsch
Vice President & General Manager, North America
EV Group

Implementation Perspective

EMG 10:00 am - 11:00 am Off Add to Calendar 2024-04-03 10:00:00 2024-04-03 11:00:00 Ready for Prime Time - the SiC Value Chain Prepares for Mass Adoption United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format

Registration

Registration

Early-bird Registration Close: Friday, May 24 / 5:00pm in KST

[Early Bird]

· SEMI Member: KRW 308,000
· Non-Member: KRW 363,000

[Regular]

· SEMI Member: KRW 385,000
· Non-Member: KRW 385,000

 

※ Registration fee includes lunch and reception.

Registration
South Korea Registration SMC-Korea-2024-Banners-squre.jpg Business Technical

OVERVIEW

  • Date: May 29(Wed), 2024
  • Time: 09:00 - 18:30
  • Venue: Convention Hall 2, 3F, Suwon Convention Center

 

NOTICE

  • Simultaneous interpretation will be provided
  • Presentation files agreed by speakers will be provided to attendees.

 

SPONSORS

SMC-Korea-2023-Sponsor_DW.jpg SMC-Korea-2023-Sponsor_DP.jpg SMC-Korea-2023-Sponsor_JSR.jpg SMC-Korea-2023-Sponsor_ET.jpg
SMC-Korea-2023-Sponsor_DS_0.jpg Air LiquideHuntsman
 
line_2.jpg

 

CONTACT

Convention Hall 2, 3F, Suwon Convention Center
Suwon-si
Gyeonggi-do
South Korea

10:00 am - 10:05 am
 Hyun-Dae (H. D.) Cho - President, SEMI Korea
HD Cho
President
SEMI Korea

Welcome

10:05 am - 10:35 am
seongtae oh
Seong Tae Oh
Fellow
TEL

Process Technologies for Continuous Scaling of Logic Devices

The rapid growth of AI, big data, IoT, and 5/6G communication necessitates the sophisticated computing power and efficiency of semiconductor devices, driving demand for various components such as HPC, GPU, ASIC, FPGA, and HBM. Semiconductor device and equipment industries are also challenging various new technologies to accommodate such diversifying applications and proceed with sustainable development in the era of AI and ICT.
According to the roadmap over the next 10 years, semiconductor technologies are expected to develop into the scaling technologies to further extend the existing Moore's Law and hybrid device technologies that integrate legacy nodes and advanced nodes into one. Therefore, in this presentation, we will look at the latest logic technology roadmap and introduce new process technologies to implement it.

※ Biography

10:35 am - 11:00 am
Wonho Yeon
Wonho Yeon
Research Fellow
KIEP

Supply Chain Management

11:00 am - 11:25 am
Mark Thirsk
Mark Thirsk
Managing Partner
Linx Consulting

Localization Challenges of the Materials Supply Chain

11:25 am - 11:50 pm
Stefan CHITORAGA
Stefan CHITORAGA
Technology and Market Analyst- Packaging & Assembly
Yole Group

Material Trends in Advanced Packaging & Power Module Packaging (video recording)

11:50 am - 1:00 pm

Lunch

1:00 pm - 1:25 pm
Dr. Montray C. Leavy
Montray C. Leavy
Deputy CTO
Entegris

Materials Innovation Advancing the Angstrom Era

Materials innovation within the Semiconductor industry has been a driving force since the planar 2D MOSFET to the current 3D gate-all-around (GAA) transistor architectures and will continue its criticality as we embark on 500-layer flash memory designs and Angstrom level critical interconnect dimensions. To achieve these once incomprehensible levels of lateral and vertical scaling, device design engineers and manufacturers are increasingly relying on disruptive materials innovation to enable the density and performance gains required at each successive technology node. As the performance requirements for the most advanced devices become more challenging, materials have shown to have an increased contribution to device performance over scaling and design. This has led to a greater portion of the periodic table being incorporated into semiconductor processing.

The integration of new materials, such as novel photoresists, interconnect metals & alloys, ultra-pure polymers, chemically modified polymer membranes, and formulated chemicals, into the chip fabrication increases process complexity and makes yield ramps more challenging. With more process steps in the overall device build, speed to yield and process integrity are more critical than ever to achieve technology qualification schedules. This presentation will focus on Entegris’ approach to materials innovation, the integration of these novel materials coupled with co-optimized solutions enabling industry technology roadmaps and yield requirements while preserving integrity of delivery and process control.

※ Biography

1:25 pm - 1:50 pm
Sadaaki Katoh
Sadaaki Katoh
JOINT2 Team Manager
Resonac

Advanced Packaging Materials and Evaluation Platform at Resonac

Resonac has started Packaging Solution Center as new R&D center to propose one-stop solution for customers in 2018 and established the co-creative packaging evaluation platform “JOINT2” with leading companies to accelerate the development of advanced materials, equipment and substrates for 2.xD and 3D package in October, 2021.

2.xD and 3D packages require to connect chips and components in high density, therefore, both wiring pitch and vertical interconnect dimension must be finer and finer. At the same time, in order to achieve better performance, more and more chips are integrated together and thus the package size is increasing. To meet these requirement, we are developing fine vertical/lateral interconnect technology and the study of fabrication and reliability for the extremely large 2.5D advanced package.
The presentation will cover the significance and strengths of JOINT2, and updates on research and development.

※ Biography

1:50 pm - 2:15 pm
seonjun heo.png
Seongjun Heo
Process Engineering Director
Lam Research

Dry Resist for Holistic EUV Patterning

EUV lithography infrastructure has become the critical element of semiconductor industry to enable the device scaling down. It consists of not only light source, optical system but also masks, photoresist. The EUV stochastic effects present challenges to optimizing EUV resist resolution, line edge roughness, and sensitivity simultaneously. To overcome these challenges, Lam introduced the new dry resist combined with the new dry development technology.

Lam’s EUV dry resist, coupled with ASML’s EUV scanners and Lam’s holistic patterning solutions, will extend the patterning roadmap (Moore’s Law) for the next 10 years and beyond by offering a high-resolution, high-fidelity, defectivity-free, and greener solution for ≤32nm pitch L/S, and ≤40nm pitch pillar and contact hole EUV patterning in the fab. EUV dry resist technology also has been validated demonstrating superior dose-to-defectivity for <32nm pitch L/S, well suited for logic applications. Lam’s EUV dry resist is uniquely suited for future HiNA EUV patterning thanks to robust resist thickness scaling while maintaining high etch selectivity and high contrast.

※ Biography

2:15 pm - 2:30 pm

Break

2:30 pm - 2:55 pm
김용성
Yongsung Kim
TL
SK hynix

Sustainability Challenges of the Semiconductor Industry

As demand for chips surge, the semiconductor industry is struggling to reduce its environmental footprint. While the environmental impacts of semiconductor (and electronic products that depend on them) have mostly been liked to ‘manufacturing’ and ‘use’ phases of products which consume a significant amount of water and energy, the attention is shifting to the 'material extraction’ and ‘end-of-use’ phases of products following concerns over the e-waste issue. In this presentation, I will focus on the latest findings of the global e-waste challenge, what this means from the materials perspective, and its implications to product design and manufacturing. I will also introduce SK hynix's strategy and targets towards improving the circularity of products, and our partnership with customers/vendors to achieve a common goal.

2:55 pm - 3:20 pm
Eun-Ho Sohn
Eunho Sohn
Head of Interface Materials and Chemical Engineering Research Center
KRICT

Trends in Regulation of PFASs (per- and polyfluoroalkyl substances) and Technological Development Strategies

Fluorine compounds exhibit exceptional physical properties that set them apart from other organic materials. Consequently, they have been utilized as core materials to enhance the functionality, performance, and value of products across various key industries including electrical and electronics, semiconductors, displays, and automobiles.
However, on March 22nd of last year, the European Chemicals Agency (ECHA) issued a report imposing restrictions on the usage of over 10,000 types of per- and polyfluoroalkyl substances (PFASs) across all industries, sparking significant upheaval within the sector.
In this presentation, we will learn in detail about the definition of PFAS, and the content, progress, and schedule of PFAS regulations in Europe and the United States, and contemplate the direction of future technology development.

※ Biography

3:20 pm - 3:45 pm
김광섭
Karl Kim
APAC Semiconductor Marketing Manager
Syensqo

Sustainability Opportunities for A Diverse and Secure Fluorinated Material Supply Chain

As semiconductors become more advanced and the fabrication processing conditions more extreme, the essentiality of a sustainable and secure fluorinated material supply chain plays a vital role in the future of semiconductor manufacturing. The principles of developing this supply chain are directly aligned to support the sustainability and emission roadmaps of the semiconductor industry. Syensqo will introduce the following content:
1) Priorities when Specifying Materials for a Sustainable Supply Chain
2) The Key to Sustainability - Application Segmentation
3) Case Studies

※ Biography

3:45 pm - 4:10 pm
dupont_Jae Hwan Sim
Jae Hwan Sim
R&D manager/Korea R&D EUV team leader
DuPont

Innovating Safe and Sustainable by Design: Strategies and Steps toward Reduction of Substances of Concern in Photolithography Materials

Growing scientific evidences suggest that certain per- and polyfluoroalkyl substances (PFAS) pose global environmental and health risks. In response, global governments are contemplating measures to limit the use of these chemicals in various industries. However, specific types of PFAS are indispensable and no substitutes are currently available for most chip manufacturing applications in the semiconductor industry. Aligned with the objective of Safer and Sustainable by Design, DuPont has launched a comprehensive program to reduce PFAS usage in photoresist and associated lithography materials. In this presentation, we will provide an overview of DuPont's innovative initiatives and technical challenges encountered in this endeavor.

※ Biography

4:10 pm - 4:35 pm
Floris Buijzen
Floris Buijzen
Senior Director Product Management
Corbion

CORBION: PURASOLV® ELECT for a more Sustainable Semiconductor Manufacturing

Solvents are used extensively in the semiconductor manufacturing process. Solvents are estimated to be responsible for around 7% of the Scope 3 emissions of the semiconductor industry. The typical solvents that are used are produced from fossil resources and with that not in line with net zero ambitions. For more than 20 years Corbion has been supplying biobased ethyl lactate to the semiconductor industry under it’s brand name PURASOLV® ELECT, meeting the stringent requirements of the industry. Typical applications are photoresist for i/g-line / KrF / ArF / EUV, RRC, Edge bead removal and as thinner. Biobased ethyl lactate is sustainable and safe by design: it is produced from renewable resources, non-toxic and safe to workers, biodegradable and offers a significant carbon footprint reduction compared to incumbent solvents. Switching to biobased ethyl lactate thus enables more sustainable semiconductor manufacturing.

※ Biography

4:35 pm - 4:50 pm

Break

4:50 pm - 5:20 pm
ki ill moon
Ki-Ill Moon
VP
SK hynix

Technology and Future of Semiconductor Packaging Materials

The technological advancement of semiconductor materials is a key factor along with the technological advancement of the process. And recently, the importance of Advanced PKG is increasing, and SK Hynix has achieved the result of improving product performance by developing MR-MUF materials. This proves the importance of materials. In the future, there are more packaging challenges for high-speed memory products such as HBM, and I plan to announce Need for material development to satisfy them.

※ Biography

5:20 pm - 5:50 pm
Seongjun Park
Sungjun Park
Executive Vice President and Head of Material Development Team
Samsung Electronics

Big Challenges for Small Worlds

The number of transistors in semiconductor chip has been increased twice every two years for more than 50 years, following the famous Moore’s Law and somehow, it was taken to be granted. In reality, it was a big accomplishment with an unimaginable amount of efforts and collaborations, including the development of new materials.

New material has been developed and introduced to improve the performance and capacity of electronic devices through smaller design rules. New Photo Resists (PR) for higher resolution with smaller defects and higher uniformity were developed. And Precursors were also developed to meet the process challenges for the smaller design rules, such as higher aspect ratios. High etch selective Etchant and CMP Slurry with low scratch were requested. And the requirements in new materials are getting tougher and stronger with the evolution of AI, which needs more computing power than ever. Even materials that has never been expected in industry and has been studied only in academia are being actively considered.

Even the worse, the surrounding situation for material development and manufacturing is getting tougher. Environmental regulations are getting tighter. Gases with high global warming potential were begun to be replaced. Recently, EU announced banning PFAS materials in near future and US raised bars for PFAS materials. And carbon zero policy is coming to us slowly but firmly.

In this talk, we will discuss the current status and future direction of material research. We will discuss the development directions to improve the performance of devices and to consider environmental regulations. And we will discuss the virtue of working together as a big one-team to overcome all the obstacles mentioned above in the world of extreme technology.

※ Biography

5:50 pm - 6:30 pm

Networking Reception

EMG

Materials Resilience: Navigating Challenges, Embracing Opportunities

Currently, sustainablility and efficiency of global supply chains are becoming more critical to the semiconductor industry. Global political tensions are affecting the semiconductor market, which is further revealing the vulnerabilities of the supply chain. In addition, ongoing environmental regulations are also having an increasing impact on the industry. The growing demand for eco-friendly products and manufacturing processes puts companies under pressure to introduce innovative technologies and solutions along with this regulatory compliance.
These trends present new challenges and opportunities for the semiconductor industry. SMC Korea reflects these issues and discusses current market conditions and future prospects. Through this conference, we expect major companies and experts will be able to share their experiences and knowledge, find innovative solutions together, and explore the future of the industry together. Don't miss these up-to-date discussions presented by global experts.

10:00 am - 6:30 pm Off Add to Calendar 2024-05-29 10:00:00 2024-05-29 18:30:00 SMC Korea 2024 Materials Resilience: Navigating Challenges, Embracing OpportunitiesCurrently, sustainablility and efficiency of global supply chains are becoming more critical to the semiconductor industry. Global political tensions are affecting the semiconductor market, which is further revealing the vulnerabilities of the supply chain. In addition, ongoing environmental regulations are also having an increasing impact on the industry. The growing demand for eco-friendly products and manufacturing processes puts companies under pressure to introduce innovative technologies and solutions along with this regulatory compliance.These trends present new challenges and opportunities for the semiconductor industry. SMC Korea reflects these issues and discusses current market conditions and future prospects. Through this conference, we expect major companies and experts will be able to share their experiences and knowledge, find innovative solutions together, and explore the future of the industry together. Don't miss these up-to-date discussions presented by global experts. Convention Hall 2, 3F, Suwon Convention Center Suwon-si Gyeonggi-do South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

WILMINGTON, Del., Feb. 29, 2024 — DuPont (NYSE: DD) today announced that Jon Kemp, President, DuPont Electronics & Industrial, has been named Chair of the Board of Industry Leaders of SEMI, a global industry association serving the electronics design and manufacturing supply chain.

The Board of Industry Leaders provides strategic guidance and direction for key global SEMI initiatives and programs – including sustainability, workforce development, supply chain management, and global advocacy – to address semiconductor industry challenges and advance its growth. The Board comprises executive-level thought leaders representing the diversity of SEMI membership. As Chair, Kemp will lead the Board in its work, which also includes identifying emerging technology and business issues where SEMI can build impactful member value for the future.

“Jon is already a valued contributor to the SEMI International Board of Directors in its fiduciary role, and we are pleased to have him stepping up to chair our Board of Industry Leaders to make sure our members’ voices and needs are reflected across the diverse range of our programs and initiatives,” said SEMI President and CEO Ajit Manocha. “We look forward to working with Jon to address some of the global semiconductor industry’s toughest challenges, such as our talent gap, and empowering the industry’s continued growth and innovation.”

As President of DuPont’s Electronics & Industrial business, Kemp leads the organization in serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, defense, industrial and transportation industries. Kemp has more than 20 years of experience in the electronics industry and strategic leadership, including his service on the SEMI International Board of Directors since 2016.

“I’m honored to be part of this group of industry leaders who are tackling some of the most critical issues facing the semiconductor industry that no single company or organization can solve alone, like sustainability, government advocacy, workforce development, and supply chain management,” said Kemp. “There’s tremendous value in collaborating across industries and I look forward to what we’ll achieve together across the semiconductor ecosystem.”

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About DuPont Electronics & Industrial
DuPont Electronics & Industrial is a global supplier of new technologies and performance materials serving the semiconductor, circuit board, display, digital and flexographic printing, healthcare, aerospace, industrial, and transportation industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. http://electronics.dupont.com

About DuPont
DuPont (NYSE: DD) is a global innovation leader with technology-based materials and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, construction, water, healthcare and worker safety. More information about the company, its businesses and solutions can be found at www.dupont.com/. Investors can access information included on the Investor Relations section of the website at investors.dupont.com.