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Industry survey finds 83% of respondents would be more inclined to buy used equipment with money-back guarantee.

Moov, the largest and fastest growing global marketplace for used semiconductor equipment, today announced changes to its industry-first “Money Back Guarantee” (‘MBG’) program that will expand access to buyers by eliminating the premium previously associated with this warranty. Moov will now offer its no-questions-asked, money-back guarantee free of charge for end users (semiconductor manufacturers) who purchase semiconductor equipment and parts through Moov’s global marketplace, valid on over 90% of inventory. This announcement comes as Moov’s marketplace surpasses another milestone, exceeding $4bn FMV in active listings for pre-owned semiconductor manufacturing equipment.

Historically, reliability has been a significant barrier for semiconductor manufacturers looking to incorporate secondhand equipment in their procurement strategies. In fact, this problem has been so pervasive that 81% of industry respondents surveyed by Moov “strongly agree” or “agree” that reliability is a top barrier to purchasing secondhand semiconductor manufacturing equipment.

“Reliability is arguably the biggest barrier to the growth of the global secondary equipment market, and the growth of used equipment as a percentage of fabs’ overall equipment spend,” said Steven Zhou, CEO and cofounder of Moov Technologies. “In growing Moov to become the world’s largest marketplace for used equipment, solving the reliability challenge is at the core of just about everything we’ve built – from verified listings to digital inspections, white-glove logistics, and most importantly our no-questions-asked money-back guarantee.”

A money-back guarantee fundamentally shifts risk away from buyers and significantly impacts manufacturers’ willingness to purchase used equipment. Indeed, 83% of industry respondents agreed that they would be more inclined to purchase secondhand equipment if offered a 100% no-questions asked money-back guarantee.

Moov’s decision to offer its MBG free to all buyers reflects its commitment to quality.

“We eliminated the small premium on this program because Moov stands by the quality of our service and inventory on our marketplace,” said Raymond Mahon, Head of Customer Success at Moov. “All eligible purchases on Moov will now include our no-questions-asked, money-back guarantee so that buyers can fully leverage the secondary market as an integral part of their procurement strategy – without the risk historically associated with purchasing secondhand equipment.”

To learn more about Moov’s Money Back Guarantee program visit www.moov.co/services.

About Moov Technologies Inc.
Headquartered in Tempe, Arizona, and Austin, Texas, Moov is a technology-driven marketplace and asset management platform that matches buyers and sellers of pre-owned semiconductor manufacturing equipment. Built by a team with more than 50 years of experience in the manufacturing equipment brokerage industry, Moov's platform ensures accurate listings and faster transactions. CEO Steven Zhou and Managing Director Maxam Yeung co-founded the company in 2017. To learn more, please visit Moov.co.

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PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

This webinar will address the what, why, and how of PFAS in the semiconductor industry. Laurie Beu, noted semiconductor EHS consultant and leader of SIA’s Semiconductor PFAS Consortium, will provide an overview of PFAS materials, concerns about health effects, and the current state of regulatory response. Laurie’s talk will be followed by Ralph Dammel, Technology Fellow at EMD Electronics, who will provide insights from a materials manufacturer’s perspective on the use of PFAS in the multiple markets addressed by EMD. He will discuss the importance of PFAS in lithography chemicals, the impact of potential new regulations, and options to reduce or eliminate the use of PFAS in semiconductor applications.

Virtual, Online
United States

Laurie Beu
Laurie S. Beu, P.E.
Consultant
Laurie S. Beu Consulting
Ralph R. Dammel
Ralph R. Dammel
Technology Fellow, CTO Office
EMD Electronics
James Amano
Moderator
James Amano
Sr. Director, EHS
SEMI
EMG FOA Standards

PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue.

Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector. 

 

10:00 am - 11:00 am Off Add to Calendar 2023-10-18 10:00:00 2023-10-18 11:00:00 Spelling semiconductors without “F” (luorine) PFAS is prevalent in our world and very much in our current conversation. But what is it? (or more correctly, what are they?), why are they under great scrutiny? are they all hazardous? and how would the semiconductor industry be impacted by their removal? With so much at stake, it is imperative that we have clarity in the discussion to ensure we successfully address this issue. Join the SEMI Electronic Materials Group (EMG) for a open conversation about the impact on the materials sector.    Virtual, Online United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles

SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA) Fluxless Reflow Soldering System, a revolutionary step for the Advanced Packaging Semiconductor sector.

The innovative technology behind this system is based on the Electron Attachment (EA) principle for activating hydrogen, a method that AirProducts has been refining for the past 15 years to efficiently reduce surface oxides. The EA technology is engineered to break down H₂ molecules into hydrogen anions, which are then targeted towards the soldering surfaces to effectively clean and reduce oxides before the reflow process. Additionally, this technology operates at ambient pressure and temperatures well within the window of traditional reflow processes.

The key advantages of this technology include:
• Truly Residue-Free: Enhanced reflow quality without flux-induced solder voids and wafer contamination. No post-reflow cleaning equipment is required and significantly less oven cleaning.
• In-line Process: Easily integrated into existing manufacturing lines without batch processing. The EA process occurs immediately before the reflow process.
• Environmental Impact: The EA flux-free process is entirely residue-free and environmentally benign with no organic vapors, hazardous residues, or CO2 emission.
• Ambient Pressure and sub-reflow temperatures: No vacuum requirements and safely processes substrates.

Sikama, as the exclusive global integrator of this technology and partner with AirProducts, views the technology and equipment commercialization as “a game-changer for this industry, as the need for advanced solutions to packaging evolutions in the semiconductor industry continue to evolve”, according to Herb Weigel, President and CEO of Sikama International.

The Sikama EA1200 Solder reflow oven is certified to EN 600204-1, SEMI S2/S8/S22/S23/F47/E6, is CE certified, and is verified to be compliant with NFPA79 in installed applications. Nearly 50 Worldwide Patents have been issued on this technology. The technology is well suited to provide significant benefits to small geometries in wafer bumping, copper pillar, and flip chip applications.

Established in 1982, Sikama International, Inc. designs and produces its products in Santa Barbara, California. Their reflow system offerings provide exceptional performance, with the fluxless systems set to redefine industry standards.

Reliable. Repeatable. Responsible. Reflow.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

South Korea Standards - Homepage Feature Products
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Seoul
South Korea

Standards

Information & Control Korea TC Chapter 

Fall Meeting 2023

Date: Friday, September 22, 2023

Time: 15:00-18:00 KST

via Hybrid

 

AGENDA 

(subject to change) 

Last updated: September 22, 2023

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

Off Add to Calendar 2023-09-22 00:00:00 2023-09-22 00:00:00 Information & Control Korea TC Chapter Meeting Information & Control Korea TC Chapter  Fall Meeting 2023 Date: Friday, September 22, 2023 Time: 15:00-18:00 KST via Hybrid   AGENDA  (subject to change)  Last updated: September 22, 2023   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Seoul South Korea SEMI.org [email protected] America/Los_Angeles public
South Korea standards
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Seoul
South Korea

Standards

FPD Metrology Korea TC Chapter 

Fall Meeting 2023

Date: Thursday, September 21, 2023

Time: 15:00-17:30 (KST)

via Hybrid

 

AGENDA 

(subject to change) 

Last updated: August 21, 2023 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

Off Add to Calendar 2023-09-21 00:00:00 2023-09-21 00:00:00 FPD Metrology Korea TC Chapter Meeting FPD Metrology Korea TC Chapter  Fall Meeting 2023 Date: Thursday, September 21, 2023 Time: 15:00-17:30 (KST) via Hybrid   AGENDA  (subject to change)  Last updated: August 21, 2023    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Seoul South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.

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Abstract:

For many generations of technology nodes, Moore’s Law has reliably delivered the doubling of transistor density every 1.5-2 years while bringing down the cost per transistor. However, in recent advanced nodes, Moore’s Law has slowed down and the cost of advanced node chips has increased.

To keep up with performance demands, manufacturers have continued to increase chip size to have large System on Chip (SoCs), and we have seen chip sizes reach the lithographic reticle limits. Moreover, increasing chip size beyond reticle limits also decreases chip yields and contributes to increasing the cost of manufacturing. Thus, increasing chip sizes beyond reticle limits is not a solution.

The semiconductor industry needs to be on the path of delivering more performance and functionality at reasonable prices despite the slowing of Moore’s Law.

One popular approach the industry is adopting to deliver improved performance is focusing on advanced packaging, including the use of chiplets, hybrid bonding and state of the art 3D stacked systems. This course will discuss the meaning and the need for advanced packaging and dive deeper into each one of these advanced packaging approaches. 

Outline

  1. Need to Advanced Packaging
  2. Types of Advanced Packaging
  3. 3D bonding and Intro to Hybrid Bonding for Advanced Packaging
  4. Types of Hybrid Bonding, Current Status and Challenges
  5. Future opportunities in Hybrid Bonding
  6. Summary

Featured Speaker Biography:

Arsalan Alam is a Sr. Packaging Engineer at AMD’s Advanced Packaging Group in Austin, Texas. He completed his PhD in Electrical and Computer Engineering with the Center for Heterogeneous Integration and Performance Scaling (CHIPS) group at the University of California, Los Angeles, in 2021. He received his Master’s degree in Microelectronics and VLSI from IIT Roorkee, India and his Bachelor’s degree in Electronics and Communication Engineering from the Zakir Hussain College of Engineering and Technology, India. His research interest is in advanced packaging, including FOWLP, 2.5D, and 3D. He holds about 20 publications and two patents with multiple patents pending. He was the winner of the IEEE EPS Packaging Vision Award, 2020 and recipient of the Broadcom Foundation Fellowship, 2017-2018.

Virtual
United States

Arsalam Alam
Arsalan Alam, PhD
Senior Packaging Engineer
AMD
Gity Samadi
Moderator
Gity Samadi, PhD
Senior Director, R&D Programs
SEMI
FlexTech

This course will discuss the meaning and the need for advanced packaging such as chiplets, and 3D stacked systems, with a deep dive into hybrid bonding.

Our speaker will be a young, but distinguished engineer from AMD's Advanced packaging Group in Austin, Texas, Dr. Arsalan Alam. Come up to speed quickly and efficiently on the latest thinking on how the semiconductor industry will be delivering more performance and functionality despite the physical limitations of the atom.

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles

[August 7, 2023 – Taipei, Taiwan] Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join SEMICON Taiwan held at Taipei Nangang Exhibition Center, Hall 1 – 1F from September 6 - 8, 2023. Visit booth #I2800 to experience the latest in Smart Factory Semiconductor Inspection.

TRI's AI-powered AOI solutions for the Semiconductor and Advanced Packaging Industry can inspect Die and Wire Bonding, wafer surface and bumps, epoxy, and foreign material detection.

For the first time, TRI will be exhibiting the Wafer Inspection Platform, TR7950Q SII, equipped with a state-of-the-art mechanical structure, an optimal 2.5 µm high resolution, with an outstanding 25MP camera. The TR7950Q SII is equipped with an innovative optical module for the inspection of highly reflective surfaces, specialized for Wafer Inspection.

TRI will showcase the latest 3D SPI with a 3.5 µm high-resolution 25MP Camera, TR7007Q SII, and the AI-powered 3D AOI, TR7700Q SII, with the improved 25MP 2.5 µm configuration. The TR7007Q SII and the TR7700Q SII represent TRI's latest inspection innovations for the Advanced Packaging and Semiconductor Industry. The lineup will also include an X-ray Inspection Demo Station and TRI's innovative AI Solutions, which include the AI Station, AI Training Tool, and the AI Verify Host.

Visit TRI's Booth No. I2800 at SEMICON Taiwan 2023 to learn more about TRI's SEMI applications and the latest innovations in Test and Inspection for the Advanced Packaging Industry.

About TRI
Test Research, Inc. (TRI) offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. TRI provides the most cost-effective solutions to meet a comprehensive range of manufacturing Test and Inspection requirements. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

Sikama International, a trusted provider of state-of-the-art reflow systems is proud to announce their new partnership with CMT, a global leader specializing in back-end semiconductor solutions.

CMT was formed in August 2010 by Mr. CW Kwak, who has over 30 years experience in the semiconductor industry. CMT offers both material and equipment solutions in the back-end semiconductor assembly market.

CMT is a unique global marketing and sales company. CMT focuses on a micro-level marketing working directly with clients and customers through offering specific projects, right beta sites, and global project management. CMT focuses on short-term projects to deliver sales on client’s current products, then offers mid-term projects for next 2-3 years, and long-term programs 5-10 years out to deliver continuous long-term growth and sustainability.

Sikama’s new partnership with CMT will enable both companies to expand their reach to provide customers with an expansive range of solutions on a global platform.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

Wooptix SL, a company based in Tenerife, Madrid and San Francisco, has announced the signing of a 10-million-dollar Series B financing round. The round includes participation by: Bullnet Capital, CDTI (Centre for the Development of Technology and Innovation), Danobatgroup, European Innovation Council Fund (EIC), Fagor Automation, Intel Capital, Mondragón Promotion and Tel Ventures.

The company is focused on commercializing semiconductor metrology equipment incorporating wavefront phase imaging. “Phemet®, the system developed by Wooptix, measures the silicon wafer warpage, and its accuracy is a “significant advance in the industry,” affirms José Manuel Ramos, Founder and CEO of the company.

Wooptix's patented technology enables blank and patterned wafer-shape measurement in less time and with higher resolution than current systems being used in the industry. "Wooptix's wavefront sensor and its semiconductor applications are generating interest from key players in the semiconductor industry as evidenced by the Series B financing round,” explains Javier Elizalde, Co-founder and COO.

The company has been recognized as well by the EIC Accelerator Program through a 2.5M€ grant in addition to the equity investment. The grant and investment support Wooptix's product introduction and future technological innovation including the manufacture, delivery, and installation of three semiconductor metrology tools in Japan, the USA and the Netherlands this year.

"Keeping in mind that each Phemet® is only a metric ton weight, together with the sensitivity of the instrument components that enable measurements at the nanometer scale, Wooptix demonstrates a world-class engineering and operations capability,” continues Elizalde.

Next steps
Wooptix has a well defined roadmap for each product line to meet the needs of lab and fab customers. In the case of the semiconductor metrology business unit, the next step is to automate Phemet®. Enhanced automation will reduce risk of contamination of wafers under measurement and provide consistent reproducibility to the system. Due to the flexibility of Wooptix’s design, another step is to integrate Phemet® into existing semiconductor equipment platforms from tool vendors.

Phemet® and the Series B financing round demonstrate Wooptix’s growth and maturity as it begins initial tool deliveries to customers. "It is really valuable for us to transition now from an R&D company to become a product and manufacturing company. With this objective in mind, we are building the necessary infrastructure, including procedures and certifications to protocols and management teamwork, to support customers as we enter the market," explains José Manuel Ramos.

Semiconductor Equipment Industry in Numbers
According with SEMI (the global semiconductor industry association) the semiconductor equipment sales forecast for 2023 is $87 billion. "The semiconductor equipment market will see a strong rebound in 2024,” said Ajit Manocha, SEMI President and CEO. "Projections for robust long-term growth driven by high-performance computing and ubiquitous connectivity remain intact.”

As reported by SEMI, the wafer fab equipment segment is projected to account for the bulk of the recovery to $100 billion in 2024, generating $87.8 billion in sales, a 14.8% increase.

About Wooptix
Wooptix is a leader in semiconductor metrology through wavefront phase imaging, a technique derived from adaptive optics research in astronomy. With a multidisciplinary team, Wooptix aims to disrupt the semiconductor metrology industry with the highest lateral resolution and fastest measurement technique for inline fab measurements.

The company has developed Phemet®, a wafer shape lab tool for blank and patterned wafers, ahead of the upcoming fully automated fab tool, expected in 2024. Wooptix has already deployed Phemet® at several customer sites worldwide.

Wooptix is based at Tenerife, Madrid (Spain) and San Francisco (USA).

PENANG, MALAYSIA - AUGUST 2023 ViTrox, which aims to be the world’s most trusted technology company, is excited to announce its first-ever participation in ELEXCON Shenzhen 2023, one of the influential trade shows in Southern China, at Hall 9, Booth #9G17 in Shenzhen Convention & Exhibition Center (SZCEC), China from 23rd to 25th August 2023.

ViTrox will be showcasing its latest Back-end Semiconductor Inspection Solutions, which are the Tray-Based Vision Handler – TR3000i and the Post Seal Vision Handler – VR20i G2 during the event.

Introducing the Tray-to-Tape & Reel Vision Inspection Handler –TR3000i, the cutting-edge solution tailored for 5G, IoT, Automotive, and Industry 4.0 industries. Its high-resolution 6-sided vision system ensures comprehensive inspections, supporting sizes from 1.8x1.8mm to 130x130mm without conversion. The TR3000i's robust handling features auto-pitching, tape width conversion, 8 active approaches for Smart Taper Precision, and up to 3x14 pick-and-place nozzles. With additional hardware configurations like the Smart Reel Changer, Auto Nozzle Changer, AUX Tray, and Extended Track, it guarantees high efficiency and high throughput. Fully automated and A.I.-powered, it optimises production yield, setting new standards for efficiency, connectivity, and precision in emerging industries.

ViTrox’s Post Seal Vision Handler – VR20i G2 is a game-changer in reel-to-reel inspection. Designed for tape widths from 8mm to 32mm, it features advanced visual inspection capabilities and automated mechanisms for track and dummy reel width adjustment, ensuring precise component handling. The system supports various package types with multiple vision inspections, enabling comprehensive and high-quality results. With dual-track to improve productivity, it enhances throughput by processing over 130K UPH for a 2mm pocket pitch and 80K UPH for a 4mm pocket pitch, while fast changeovers for different carrier tapes minimise downtime. The VR20i G2 guarantees maximum efficiency, reduces human error, and greatly reduces the return on investment (ROI) period, making it the ideal solution to automate your final gate inspection.

Start your productivity-boosting journey with ViTrox's advanced solutions! Secure an appointment to meet our technical experts and experience live product demonstrations by clicking the registration link. If you want to know more about our solutions, feel free to reach out to us at [email protected]. Get ready to take your productivity to the next level!

Registration Link: https://wj.qq.com/s2/12764140/8c87/

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider through the most innovative, advanced, and cost-effective machine vision solution of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.