SOPOT, Poland — February 17, 2025 — The SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, March 12-14 in Sopot, Poland, is themed AI: Catalyst to Propel Europe’s Competitiveness. The event will explore how AI is reshaping economic, technological, and market dynamics within the semiconductor industry. Experts will examine AI-driven innovation, efficiency improvements, and the balance between collaboration and competition (co-opetition) in fostering Europe’s leadership in the global semiconductor market. Registration is open.

ISS Europe 2025 will feature featured speakers addressing key unprecedented challenges and opportunities in the semiconductor industry. Topics will focus on the role of artificial intelligence (AI) in shaping the industry, strategies to strengthen Europe’s semiconductor supply chain resilience, sustainability, and innovative approaches to workforce development. Industry executives, market analysts, economists, and policymakers will convene to discuss the latest industry trends and advancements. 

“As AI, automation, and sustainability reshape our industry, it is crucial that we foster collaboration and innovation to secure Europe’s competitive edge,” said Laith Altimime, President of SEMI Europe. “At ISS Europe 2025, industry leaders will share their strategies for supply chain resilience, workforce development, and the transition from systems on chips to systems of chips. By working together, we can drive technological advancement and build a more sustainable and robust semiconductor ecosystem for the future.”

ISS Europe 2025 Featured Speakers  

• Andreas Schleicher, Director for Education and Skills, Organisation for Economic Co-operation and Development (OECD)
• Benedikt Ernst, SVP, Head of Strategy & Transformation, Electronics, Merck KGaA, Darmstadt, Germany
• Bill Lussier, Managing Director, Tokyo Electron Europe Ltd (TEL)
• Charles Vaillant, Chief Technology Officer and Chief Digital Officer, MANN+HUMMEL
• Christophe Frey, VP of EU Engagements and General Manager, Arm France
• Dariusz Standerski, Secretary of State, Ministry of Digital Affairs, Poland
• George Dritsantos, VP of Secure Power Central and Eastern Europe, Schneider Electric
• Hendrik Bourgeois, VP, European Government Affairs, Intel
• Jean-Christophe Eloy, CEO, Yole Group
• John Behnke, General Manager FPS Product Line, INFICON
• Meike Boekelmann, Chief Human Resources Officer, Comet Group
• Rainer Kiefer, EVP Global Head of Sales, Schenker AG
• Thomas Kralinski, State Secretary, Saxon State Secretary of Economic Affairs, Labour, Energy and Climate
• Volker Herbig, VP, BU MEMS, X-FAB

 ISS Europe 2025 Highlights

Session 1: Europe’s Strategy in a Shifting Geopolitical Landscape
Industry leaders will analyze how Europe is addressing global market trends and navigating geopolitical challenges to maintain a leadership position and drive innovation.

Session 2: Technology Roadmap to Net Zero: Breakthroughs and Energy Strategies
Experts will discuss breakthrough technologies, energy strategies, and AI-driven innovations shaping the semiconductor industry’s journey toward Net Zero goals.

Session 3: Shaping Europe’s Future Workforce: Strategies for Growth
Thought leaders will share actionable strategies to cultivate the workforce of tomorrow, emphasizing collaboration between industries, academia, and governments to drive innovation and sustainable growth.

Session 4: AI for Smarter Sustainable Manufacturing
Speakers will explore how AI can transform semiconductor manufacturing with smarter, sustainable processes while addressing workforce readiness and revitalizing European manufacturing capabilities.

Session 5: Driving Innovation to the Next Generation from Materials to System Level
Experts will highlight next-generation advancements in materials, design, and AI that are driving semiconductor innovation and enabling future technological breakthroughs.

Sponsors

• Headline:
  Invest in Pomerania
• Platinum: 
  Comet, Edwards, INFICON, MANN+HUMMEL, Polish Investment & Trade Agency, Schneider Electric, Synopsys and Tokyo Electron Limited (TEL)
• Gold:
  EBARA and Merck KGaA, Darmstadt, Germany
• Event: 
  DB Schenker, EV Group (EVG), HCLTech, imec, JSR Micro, Ovivo and VAT

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2025 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#ISSEurope).

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.  

Contact Information:

Maria Daniela Perez / SEMI Europe 
Phone: +49 160 2562977 
Email: [email protected]  

Sherrie Gutierrez / SEMI Corporate
Phone: +1 831 889 3800 
Email: [email protected]

• Read more about SEMI ISS Europe 2025 Speakers to Address AI, Sustainability, Supply Chain Resilience, and Workforce Development

MUNICH, Germany ─ October 14, 2024 ─ Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.

"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growth,” said Laith Altimime, president of SEMI Europe. ”SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future." 

Advanced Packaging Conference ─ 
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency 

Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.   

This year’s APC will focus on:

• The Role of Chiplets in Enhancing Performance and Efficiency
• Power Optimization Techniques for Next-Generation Applications
• Advances in Miniaturization and Material Integration
• Innovations in Heat Dissipation and Thermal Management
• Collaborations Across Academia, Industry, and Government   

Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.

Fab Management Forum ─
Driving Innovation: Competitive, Sustainable and Collaborative Strategies 

To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships.  This year’s FMF will focus on:

• Key Strategies in a Global Market Landscape
• Advancing Smart Manufacturing Solutions
• Europe's Environmental Transition: Stability to Sustainability
• Next-Gen Core Technologies for Future Fabs

Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.

The forum is sponsored by Comet Yxlon, Flexciton, INFICON, Lynceus, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2024 Highlights

• CxO Summit: Top executives will share strategies for sustainable growth in Europe's semiconductor sector, focusing on navigating the evolving landscape through sustainability, supply chain resilience, and technological advancements.
• III-V Summit – Integrated Photonics: This summit will examine the role of III-V compound semiconductors in advancing next-generation electronics, focusing on their impact on high-performance, energy-efficient devices in telecommunications, computing, and photonics.
• ITF Chip into the Future - Powered by imec: This session will cover the EU Chips Act's implementation and impact on Europe's semiconductor ecosystem, highlighting collaborative research and innovations in chip design and manufacturing.
• MEMS & Imaging Sensors Summit: This summit will explore recent advancements in MEMS and imaging sensor technologies, focusing on their impact on agriculture, automotive, and healthcare, along with the integration of AI, machine learning, and data fusion in next-generation applications.
• Executive Forum Programs: These sessions will provide updates on key technological trends, including Silicon Carbide (SiC) power semiconductors, smart mobility solutions, and AI-driven manufacturing processes. Industry experts will also address sustainable energy and challenges related to electrification, presenting the latest innovations aimed at overcoming these obstacles.
• TechARENA Programs: Focused on emerging technologies, TechARENA sessions will explore advancements in fields such as medical technology, quantum computing, and cybersecurity. The discussions will also address global challenges related to supply chain management, sustainability, and talent development, with an emphasis on the role of European research and innovation in driving the growth of the semiconductor industry.

Programs in halls C1, C2 and Entrance West are complimentary for all SEMICON Europa and electronica visitors. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

SEMICON Europa 2024 

• Platinum: 
  Comet Yxlon, Edwards, INFICON, Invest in Pomerania, Koh Young Europe, Lam Research, Merck KGaA, Darmstadt, Germany, Schneider Electric, Siemens, Soitec, SUSS MicroTec and Tokyo Electron Europe (TEL)
• Gold: 
  Exyte, KLA and Synopsys
• Silver: 
  Adeia, EBARA, HCLTech, Honeywell, Kanken and Semilab
• Event:
  ASE Global, Atotech an MKS Brand, Catalonia Trade & Investment, CI Semi, Comet Group, DB Schenker, Entegris, EV Group (EVG), Flexciton, Fluor, IBM, imec, Lynceus, SCREEN, and Watlow 

About SEMI 

SEMI ^® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ^® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts 

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977 
Email:  [email protected] 

Samer Bahou / SEMI Corporate
Phone: +1 408 943 7870
Email: [email protected]

• Read more about SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future

Sunnyvale, USA - Meylan, FRANCE – May 29, 2024 Numem - a leader in high-performance Memory IP Cores and Memory Chip/Chiplet based on its patented NuRAM (MRAM) and SmartMem technologies, and IC’ALPS - a leader in ASIC/SoC design and supply chain management, have pooled their expertise to meet the challenge of developing an ambitious integrated circuit with RISC-V processors, 2MBytes of NuRAM and a DSP/AI Custom Datapath Accelerator. The Custom SoC was developed in an advanced technology node.

This SoC has been designed and implemented to highlight the Numem high-performance, low power Memory subsystem with a RISC V Processor and AI Accelerator for ultra-low power applications. It has been developed through a close collaboration between Numem and IC’ALPS.

The physical implementation of this integrated circuit was made in a secure space (isolated location, network, and servers, encrypted exchanges, etc.) to meet with the stringent protection of sensitive data required by this program.

“We were very pleased with the collaboration and quality of service provided by IC’ALPS which made this on-time tape out possible and first time functional silicon,” said Jack Guedj, CEO of Numem. NuRAM with SmartMem is a high-performance memory subsystem which is 2-3x smaller and boast significant power reduction over SRAM,” he added.
 
Lucille Engels, COO of IC’ALPS indicated: “The challenges were numerous including: architecture, power domains, protection of the sensitive data, run times pushing improvement of EDA flow and the pressure of the tape out deadline.”

Numem and IC’Alps intend to extend their partnership to serve new customers SoC projects – feel free to contact us.

NUMEM/IC'ALPS with ultra-low-power SoC for Sensor and AI

About NUMEM
Numem, headquartered in Sunnyvale, California, is the leading provider of Memory Subsystem Chip/Chiplet and IP based on proven foundry MRAM process. Numem’s patented NuRAM technology enables best in class power/performance and reliability with 2.5x smaller area and 85x lower leakage power than traditional SRAM. Numem’s SmartMem subsystem technology significantly improves performance and endurance as well as ease-of-use and reliability for high-volume deployment and enables to reach ultra-high bandwidth.
Visit our website at https://www.numem.com or contact us at [email protected].

About IC’Alps
IC’Alps is your one-stop-shop ASIC partner. Based in France (HQ in Grenoble, two design centers in Grenoble and Toulouse), the company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. Its areas of expertise include analogic, digital and mixed-signal circuits (sensor/MEMS interfaces, ultra-low power consumption, power management, high-resolution converters, high voltage, signal processing, ARM and RISC-V based multiprocessors architectures, hardware accelerators) on technologies from 0.18 µm down to 5 nm, and from multiple foundries (TSMC, Global Foundries, Tower Semiconductor, X-FAB, STMicroelectronics, etc.). The company is active worldwide in medical, industrial, automotive, IoT, IA, mil-aero and digital identity & security sectors. IC’Alps is ISO 9001:2015, ISO 13485:2016, EN 9100:2018 certified, Common Criteria on-demand, IATF16949-ready, member of TSMC Design Center Alliance (DCA), ARM Approved Design Partner and X-FAB’s partner network. More information on www.icalps.com and follow us on https://www.linkedin.com/company/ic-alps

• Read more about NUMEM & IC'ALPS Collaborate to Develop an ultra-low-power SOC for Sensor and AI applications

Brewer Science is the first and only company in the semiconductor industry with GreenCircle Certification.

Rolla, Mo.– April 3, 2024–Brewer Science, a global technology leader, is pleased to announce it has earned Zero Waste to Landfill Certification for the ninth consecutive year. The Zero Waste to Landfill Certification represents Brewer Science’s commitment to the responsible management of end-of-life materials and demonstrates the company’s commitment to waste diversion practices.

Brewer Science is the first and only company in the semiconductor and microelectronics industry to achieve GreenCircle Certification – Zero Waste to Landfill. GreenCircle certifies an organization for Zero Waste to Landfill Certification if 100% of the materials leaving the facility are intended to be diverted from landfill via one of GreenCircle’s acceptable means of diversion. Waste diversion from landfill, defined as the prevention and reduction of generated waste through source reduction, recycling, reuse, or composting, has been characterized as one of the best ways manufacturing companies can demonstrate genuine environmental responsibility.

Sustainability continues to be a prominent focus for Brewer Science, with remarkable progress towards goals, including:

• Net Zero Carbon Footprint by 2050
• Reduce Scope 1 and Scope 2 GHG emissions by 80% from baseline 2018 by 2030
• Divert over 75% of hazardous waste volume to re-use applications annually
• Achieve 100% renewable energy consumption annually

Education continues to play an important role in advocating for sustainable development across the supply chain. Brewer Science has developed a new program aimed at bridging the gap in environmental initiatives among its stakeholders. You can find the Sustainability Outreach Program at the bottom of Brewer Science’s Going Green webpage.

Brewer Science provides a comprehensive evaluation of the company’s five impact areas in its annual Impact Report, which can also be found on the Going Green page.

“The Sustainability Outreach Program we are launching this year is designed to work with our partners, whether that be our employees, suppliers, customers, or other organizations in the communities in which we serve, to collaborate and align on sustainability programs and projects to have a net positive impact on the environment,” states Matthew Beard, Executive Director, Strategic Planning, Management Systems, and Sustainability at Brewer Science.

For semiconductor companies, it is essential to evaluate the materials used in manufacturing, identify any more environmentally friendly alternatives, and handle the waste responsibly. Brewer Science established its Green Chemistry Program in 2019, which is an effort to identify chemical alternatives that are proven to be more sustainable, as well as divert hazardous materials for reuse applications. Additionally, Brewer Science organizes an annual community collection recycling program partnering with waste disposal companies and volunteer crews to prevent community e-waste from becoming a part of a landfill. The company shares about its sustainability programs on its “Going Green” page to encourage other tech companies to adopt more sustainable practices.

About Brewer Science
Brewer Science is a global leader in developing and manufacturing next-generation materials and processes that foster the technology needed for tomorrow. Since 1981, we’ve expanded our technology portfolio within advanced lithography, advanced packaging, smart devices, and printed electronics to enable cutting-edge microdevices and unique monitoring systems for industrial, environmental, and air applications. Our relationship-focused approach provides outcomes that facilitate and deliver critical information. Our headquarters are in Rolla, Missouri, with customer support throughout the world. We invite you to learn more about Brewer Science at www.brewerscience.com.

About the GreenCircle Certified, LLC
GreenCircle Certified, LLC was established to ensure specificity in third-party certification after encountering many unsubstantiated claims in the marketplace. Since 2009, GreenCircle has offered forward-thinking companies a competitive advantage by providing specific, third-party certification of environmental claims. GreenCircle’s rigorous evaluation process provides independent verification that claims of sustainable aspects of products and operations are valid. Manufacturers, suppliers, regulators, occupants, and consumers can be assured that products labeled with the GreenCircle Certified mark have been thoroughly assessed and their claims verified to applicable standards. Learn more at www.greencirclecertified.com/.

• Read more about Brewer Science Earns GreenCircle Certification for Zero Waste to Landfill for Ninth Consecutive Year

Kitchener, Ontario, April 2, 2024 – The SEMI North America Information and Control Committee (I&CC) has announced that Albert Fuchigami, a Senior Standards Specialist at PEER Group®, has been confirmed as a Technical Committee co-chair during its recently held spring meeting.

As an I&CC co-chair, Fuchigami will help coordinate the various SEMI task forces responsible for the development and maintenance of communication and control SEMI Standards used to automate the semiconductor manufacturing process. Fuchigami will also play an important role in facilitating collaboration between the regional technical committees while providing mentorship and guidance on navigating SEMI rules and regulations.

“I greatly appreciate the support from committee members to confirm me as co-chair,” says Fuchigami. “SEMI I&C Standards are essential to satisfy our industry’s ever growing demands for big data, smart manufacturing, and automation in an efficient and scalable manner. I look forward to helping move their development further in this role.”

Fuchigami is heavily involved in the SEMI Standards Program in North America, Japan, Taiwan, South Korea, and China. He co-leads the SEMI North America Data Diagnostic Acquisition (DDA) Task Force, has authored various SEMI articles and tech briefs, and regularly shares his knowledge and expertise at industry conferences and events.

In recognition of his contributions to the international SEMI Standards program, Fuchigami was awarded the North American SEMI International Standards Leadership Award in 2022 and the Japan Information and Control Technical Committee Award in 2021.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2024. Follow PEER Group on LinkedIn.

• Read more about PEER Group’s Albert Fuchigami confirmed as SEMI North America Information and Control Technical Committee co-chair