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Preliminary agenda

  • Climate risk in 2025: why now and what’s next?

    • Regulation and Business Case Rationale

  • A Fireside chat: Risilience and SEMI member perspective: Lam Research

  • Strategic approach to climate risk evaluation and measurement

    • Risilience Case Study:  Semiconductor value chain company risk assessment

  • About the SEMI Environmental Risk Mitigation and Reporting Working Group

  • Q&A

 

To Register, Email Jordan Famularo, [email protected]

United States

- Sustainability

This exclusive event for SEMI members will help companies understand how to identify and measure climate risks in the semiconductor value chain, and develop strategies for integrating climate risk into internal business decisions. Join us for this 45-minute virtual session and strengthen your grasp of the leading edge of data-driven strategy and quantification for climate risk across our industry.

Times

2 Sessions available for global business hours:

EMEA: April 1, 2025 - 5:00-5:45 pm CET

America:  April 1, 2025, 8:00-8:45 am or 5:00-5:45 pm Pacific Time

Asia Pacific: April 2, 2025 8-8:45 am Singapore  

Off Add to Calendar 2025-04-01 00:00:00 2025-04-02 00:00:00 Navigating Climate Risk This exclusive event for SEMI members will help companies understand how to identify and measure climate risks in the semiconductor value chain, and develop strategies for integrating climate risk into internal business decisions. Join us for this 45-minute virtual session and strengthen your grasp of the leading edge of data-driven strategy and quantification for climate risk across our industry.Times2 Sessions available for global business hours:EMEA: April 1, 2025 - 5:00-5:45 pm CETAmerica:  April 1, 2025, 8:00-8:45 am or 5:00-5:45 pm Pacific TimeAsia Pacific: April 2, 2025 8-8:45 am Singapore   United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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PDF Solutions, Inc. (Nasdaq: PDFS) today announced it has entered into a definitive agreement to acquire secureWISE, LLC, the most widely used secure, remote connectivity solution in the semiconductor manufacturing equipment industry, from Telit IOT Solutions Inc.

The secureWISE global network enables equipment manufacturers to bring up new equipment faster, provide operational support, and maximize the value derived from the equipment customers’ investments. It is currently used by over 100 equipment vendors to connect and control their tools located in over 190 semiconductor fabs and to manage the exchange of multiple petabytes of data annually.

PDF Solutions empowers semiconductor companies to maximize their manufacturing effectiveness. The PDF Solutions platform breaks down data silos to enable engineers to uncover critical relationships across manufacturing and design, resulting in better process control, product screening, and equipment operations.

As the semiconductor industry becomes more globally distributed, and as advanced devices rely on the integration of multiple chiplets into a single package, more collaboration and integration are required across the semiconductor industry. This collaboration needs to be executed securely with each participant controlling access to its intellectual property.

Today, secureWISE customers have built applications on top of the secureWISE network to deliver equipment analytics. PDF Solutions expects the acquisition to accelerate equipment makers’ ability to derive value from equipment data by enabling them to leverage PDF Solutions’ Exensio analytics software.

Beyond enabling equipment vendors to build equipment analytics at foundries, the acquisition of secureWISE is expected to dramatically expand the capability of PDF Solutions’ secure DEX OSAT network by allowing equipment makers, fab operators, and fabless companies to collaborate to optimize chip manufacturing and test.

“This acquisition extends PDF Solutions analytics for equipment makers and fabless to the factory manufacturing level, which allows them to generate value from AI,” said Dr. John Kibarian, President, CEO and co-founder of PDF Solutions. He continued, “We provide the leading analytics platform for semiconductor manufacturing, and with secureWISE, the PDF Solutions platform will also be able to help members of the semiconductor ecosystem collaborate through a secure, direct connection and control the manufacturing process down to the production equipment.”

Mike Dempsey, Vice President of secureWISE LLC, said, “We believe PDF Solutions is the ideal partner to accelerate secureWISE’s evolution, ensuring we remain at the forefront of industry trends and ahead of our customers’ needs. This acquisition will strengthen our ability to anticipate, pioneer, and integrate a far richer suite of security, collaboration, and analytics capabilities into our platform. As data exchange and collaboration become increasingly relevant to the semiconductor industry, this acquisition will better position secureWISE to deliver maximum long-term benefit to its customers who have invested in our platform.”

Under the terms of the definitive agreement, PDF Solutions will pay a cash amount of $130.0 million, subject to customary purchase price adjustments. The purchase price will be funded by a combination of cash on hand and $70M of new bank debt. The acquisition is subject to certain closing conditions and is expected to close in the first calendar quarter of 2025.

TD Securities (USA) LLC acted as financial advisor and Latham & Watkins LLP acted as legal advisor to PDF Solutions.

Updated Financial Outlook
John Kibarian, CEO and President of PDF Solutions, said, “Assuming the transaction closes in the first quarter of 2025, and with purchase accounting adjustments, we would expect to achieve a full year 2025 revenue growth rate between 21% to 23% on year-over-year basis. Given that, we also expect to achieve 2025 gross margin in line with our corporate gross margin, our target model 20% operating margin, and for EPS to be slightly accretive.”

Conference Call
PDF Solutions will discuss this announcement on a live conference call beginning at 3:00 p.m. Pacific Time / 6:00 p.m. Eastern Time today. To participate in the live call, analysts and investors should pre-register at: https://register.vevent.com/register/BI9abfc7eadb2245c5ba00c59922fe6c87.

Registrants will receive dial-in information and a unique passcode to access the call. We encourage participants to dial into the call ten minutes ahead of the scheduled time. The teleconference will also be webcast simultaneously on the Company’s website at https://ir.pdf.com/webcasts. A replay of the conference call webcast will be available after the call on the Company’s investor relations website. A copy of this press release will also be available on PDF Solutions’ website at News & PR Archives - PDF Solutions following the date of this release.

Forward-Looking Statements
The statements in this press release regarding the expected future financial results, benefits and synergies of the secureWISE acquisition on PDF Solution’s product offerings, and the expected closing of the secureWISE acquisition are forward looking and are subject to future events and circumstances. Actual results could differ materially from those expressed in these forward-looking statements. Risks and uncertainties that could cause results to differ materially include risks associated with: uncertainties with respect to the timing of the closing of the proposed transaction, including when and whether all conditions to closing will be satisfied; the failure of expected benefits from the proposed transaction to be realized or to be realized within the expected time period; uncertainties with respect to the future performance of secureWISE following an acquisition by PDF Solutions; PDF Solution’s ability to integrate secureWISE and its product and service offerings, the cost and schedule of new product development; continued adoption of the PDF Solution’s and secureWISE’s solutions by new and existing customers; the fact that operating costs and business disruption may be greater than expected following the public announcement or consummation of the proposed transaction; potential adverse reactions or changes to business or employee relationships, including those resulting from the public announcement or consummation of the proposed transaction; the incurrence of significant transaction costs related to the proposed transaction; unknown or understated liabilities of secureWISE; and other risks set forth in PDF Solutions’ periodic public filings with the Securities and Exchange Commission, including, without limitation, its Annual Reports on Form 10-K, most recently filed for the year ended December 31, 2023, Quarterly Reports on Form 10-Q, and Current Reports on Form 8-K and amendments to such reports. The forward-looking statements made herein are made as of the date hereof, and PDF Solutions does not assume any obligation to update such statements nor the reasons why actual results could differ materially from those projected in such statements.

About PDF Solutions
PDF Solutions (Nasdaq: PDFS) provides comprehensive data solutions designed to empower organizations across the semiconductor and electronics industry ecosystem to improve the yield and quality of their products and operational efficiency for increased profitability. The Company’s products and services are used by Fortune 500 companies across the semiconductor and electronics ecosystem to achieve smart manufacturing goals by connecting and controlling equipment, collecting data generated during manufacturing and test operations, and performing advanced analytics and machine learning to enable profitable, high-volume manufacturing.

Founded in 1991, PDF Solutions is headquartered in Santa Clara, California, with operations across North America, Europe, and Asia. The Company (directly or through one or more subsidiaries) is an active member of SEMI, INEMI, TPCA, IPC, the OPC Foundation, and DMDII. For the latest news and information about PDF Solutions or to find office locations, visit: https://www.pdf.com.

Headquartered in Santa Clara, Calif., PDF Solutions also operates worldwide in Canada, China, France, Germany, Italy, Japan, Korea, Sweden, and Taiwan. For the Company’s latest news and information, visit https://www.pdf.com.

About secureWISE
The secureWISE platform enables secure and controlled remote connectivity, collaboration and service enablement in the semiconductor industry. The secureWISE suite of products and services is designed to give OEM suppliers role-based, real-time and on-demand access to their equipment that is installed at the production facilities of their customers, to deliver valuable operational insights, mission-critical performance, substantial time and cost savings, and new service revenue opportunities. As the only remote access tool built around the ISMI guidelines, secureWISE is installed in over 90% of the world’s 300mm semiconductor fabs and also numerous solar and chemical plants across the globe. https://www.telit.com/iot-platforms-overview/telit-securewise/

PDF Solutions and the PDF Solutions logo are trademarks or registered trademarks of PDF Solutions, Inc. and/or its subsidiaries in the United States and other countries. Other trademarks used herein are the property of their owners.

SOPOT, Poland — February 17, 2025 — The SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, March 12-14 in Sopot, Poland, is themed AI: Catalyst to Propel Europe’s Competitiveness. The event will explore how AI is reshaping economic, technological, and market dynamics within the semiconductor industry. Experts will examine AI-driven innovation, efficiency improvements, and the balance between collaboration and competition (co-opetition) in fostering Europe’s leadership in the global semiconductor market. Registration is open.

ISS EuropeISS Europe 2025 will feature featured speakers addressing key unprecedented challenges and opportunities in the semiconductor industry. Topics will focus on the role of artificial intelligence (AI) in shaping the industry, strategies to strengthen Europe’s semiconductor supply chain resilience, sustainability, and innovative approaches to workforce development. Industry executives, market analysts, economists, and policymakers will convene to discuss the latest industry trends and advancements. 

“As AI, automation, and sustainability reshape our industry, it is crucial that we foster collaboration and innovation to secure Europe’s competitive edge,” said Laith Altimime, President of SEMI Europe. “At ISS Europe 2025, industry leaders will share their strategies for supply chain resilience, workforce development, and the transition from systems on chips to systems of chips. By working together, we can drive technological advancement and build a more sustainable and robust semiconductor ecosystem for the future.”

ISS Europe 2025 Featured Speakers  

 ISS Europe 2025 Highlights

Session 1: Europe’s Strategy in a Shifting Geopolitical Landscape
Industry leaders will analyze how Europe is addressing global market trends and navigating geopolitical challenges to maintain a leadership position and drive innovation.

Session 2: Technology Roadmap to Net Zero: Breakthroughs and Energy Strategies
Experts will discuss breakthrough technologies, energy strategies, and AI-driven innovations shaping the semiconductor industry’s journey toward Net Zero goals.

Session 3: Shaping Europe’s Future Workforce: Strategies for Growth
Thought leaders will share actionable strategies to cultivate the workforce of tomorrow, emphasizing collaboration between industries, academia, and governments to drive innovation and sustainable growth.

Session 4: AI for Smarter Sustainable Manufacturing
Speakers will explore how AI can transform semiconductor manufacturing with smarter, sustainable processes while addressing workforce readiness and revitalizing European manufacturing capabilities.

Session 5: Driving Innovation to the Next Generation from Materials to System Level
Experts will highlight next-generation advancements in materials, design, and AI that are driving semiconductor innovation and enabling future technological breakthroughs.

Sponsors

For more details, please visit the Industry Strategy Symposium Europe (ISS Europe) 2025 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#ISSEurope).

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.  

Contact Information:

Maria Daniela Perez / SEMI Europe 
Phone: +49 160 2562977 
Email: [email protected]  

Sherrie Gutierrez / SEMI Corporate
Phone: +1 831 889 3800 
Email: [email protected]

MUNICH, Germany ─ October 14, 2024 ─ Semiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management. The Advanced Packaging Conference (APC) and Fab Management Forum (FMF) at SEMICON Europa will each focus on driving sustainable solutions to meet the evolving demands of the semiconductor market. Co-located with electronica, SEMICON Europa is the region’s premier event connecting the entire electronics design and manufacturing supply chain. Registration is open for APC and FMF.

SEMICON Europa"Global collaboration across the semiconductor industry is essential for driving sustainable, exponential growth,” said Laith Altimime, president of SEMI Europe. ”SEMI Europe Advanced Packaging Conference and Fab Management Forum provide invaluable platforms for stakeholders to share insights and innovations, ensuring we leverage cutting-edge technologies and strategies that enhance performance while paving the way for a more sustainable future." 

Advanced Packaging Conference ─ 
Chiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency 

Demand for High Performance Computing (HPC) is increasing, driven by advancements in artificial intelligence and Large Language Models like ChatGPT. HPC’s expansion requires innovative solutions in chiplet design, heat dissipation, and power optimization. The upcoming APC will provide a platform to explore enhancing each of these developments, highlighting collaboration among academia, industry, and government.   

This year’s APC will focus on:

  • The Role of Chiplets in Enhancing Performance and Efficiency
  • Power Optimization Techniques for Next-Generation Applications
  • Advances in Miniaturization and Material Integration
  • Innovations in Heat Dissipation and Thermal Management
  • Collaborations Across Academia, Industry, and Government   

Speakers include experts from Amkor Technology, ASE Global, Atotech an MKS Brand, Besi, Chip Integration Technology Center (CITC), Comet Yxlon, EV Group (EVG), Evatec, GlobalFoundries, Guangdong Fenghua Semiconductor Technology, Henkel, IBM, Infineon Technologies, JCET, Koh Young Europe, QuantumDiamonds, RHP-Technology, RoodMicrotec, Robovision, STATS ChipPAC, and SUSS MicroTec.

The conference is sponsored by ASE Global, Atotech an MKS Brand, Comet Yxlon, IBM, Koh Young Europe and SUSS MicroTec.

Fab Management Forum ─
Driving Innovation: Competitive, Sustainable and Collaborative Strategies 

To meet its evolving demands, the semiconductor industry must adopt competitive, sustainable, and collaborative strategies that enhance fab efficiency and performance. Industry stakeholders can develop innovative solutions for a sustainable future by integrating cutting-edge technologies and fostering partnerships.  This year’s FMF will focus on:

  • Key Strategies in a Global Market Landscape
  • Advancing Smart Manufacturing Solutions
  • Europe's Environmental Transition: Stability to Sustainability
  • Next-Gen Core Technologies for Future Fabs

Speakers include experts from Algorismic, ams OSRAM, BMW Group, Comet Yxlon, Flexciton, Infineon Technologies, INFICON, imec, Kontron AIS, minds.ai, Robert Bosch Semiconductor Manufacturing, STMicroelectronics, Synopsys, Texas Instruments, Tokyo Electron Europe, Watlow, and X-Fab.

The forum is sponsored by Comet Yxlon, Flexciton, INFICON, Lynceus, Tokyo Electron Europe (TEL), and Watlow.

Other SEMICON Europa 2024 Highlights

  • CxO Summit: Top executives will share strategies for sustainable growth in Europe's semiconductor sector, focusing on navigating the evolving landscape through sustainability, supply chain resilience, and technological advancements.
  • III-V Summit – Integrated Photonics: This summit will examine the role of III-V compound semiconductors in advancing next-generation electronics, focusing on their impact on high-performance, energy-efficient devices in telecommunications, computing, and photonics.
  • ITF Chip into the Future - Powered by imec: This session will cover the EU Chips Act's implementation and impact on Europe's semiconductor ecosystem, highlighting collaborative research and innovations in chip design and manufacturing.
  • MEMS & Imaging Sensors Summit: This summit will explore recent advancements in MEMS and imaging sensor technologies, focusing on their impact on agriculture, automotive, and healthcare, along with the integration of AI, machine learning, and data fusion in next-generation applications.
  • Executive Forum Programs: These sessions will provide updates on key technological trends, including Silicon Carbide (SiC) power semiconductors, smart mobility solutions, and AI-driven manufacturing processes. Industry experts will also address sustainable energy and challenges related to electrification, presenting the latest innovations aimed at overcoming these obstacles.
  • TechARENA Programs: Focused on emerging technologies, TechARENA sessions will explore advancements in fields such as medical technology, quantum computing, and cybersecurity. The discussions will also address global challenges related to supply chain management, sustainability, and talent development, with an emphasis on the role of European research and innovation in driving the growth of the semiconductor industry.

Programs in halls C1, C2 and Entrance West are complimentary for all SEMICON Europa and electronica visitors. For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on LinkedIn or X @SEMIEurope (#SEMICONEuropa).

SEMICON Europa 2024 

About SEMI 

SEMI ® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON ® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts 

Maria Daniela Perez / SEMI Europe
Phone: +49 160 2562977 
Email:  [email protected] 

Samer Bahou / SEMI Corporate
Phone: +1 408 943 7870
Email: [email protected]

Registration

For questions or inquiries, please contact: 

Elle Liang

[email protected]

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The wide adoption of Artificial Intelligence is profoundly impacting many industries, perhaps none more so than the semiconductor industry. Beyond serving as a growth driver for chips across a diverse range of applications, AI and semiconductors are beginning a virtuous cycle where AI is helping to design more powerful chips that in turn enable more advanced AI. The semiconductor industry’s path to $1 trillion in annual revenue by the end of the decade is promising, thanks in large part to AI, but what will that journey actually look like?

This webinar will examine the industry’s AI-driven growth opportunities in depth, while looking at the technological innovation needed to fuel the market expansion. Dr. Handel Jones, CEO of IBS, and author of When AI Rules the World, will share his analysis of how AI will shape the outlook for semiconductor end-markets and segments – along with the race to achieve 1.0nm technology nodes and accelerate the virtuous AI-semiconductor development cycle. He will also cover the future of semiconductor market growth in the AI era as well as areas of opportunities.

About IBS

United States

10:00 am - 10:05 am
Ajit Manocha, SEMI
Ajit Manocha
CEO
SEMI

Welcome Remarks

10:05 am - 10:10 am
Pushkar Apte
Pushkar Apte
Strategic Technology Advisor, Smart Data-AI
SEMI

SEMI Smart Data-AI Initiative and Future of Computing Update

10:10 am - 11:00 am
Handel Jones
Dr. Handel Jones
CEO
IBS

Why AI Will Propel the Semiconductor Market to $1 Trillion and Achieve 1.0nm by 2030

11:00 am - 11:15 am

Q&A

Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments.

10:00 am - 11:15 am Off Add to Calendar 2024-11-20 10:00:00 2024-11-20 11:15:00 Analyzing AI-Driven Growth: $1T and Beyond Explore how Artificial Intelligence will impact the semiconductor market through the end of the decade with a deep-dive analysis of the fast-shifting industry landscape focusing in on growth across end markets and segments. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles On-demand
Event format
Belgium France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Register Now (8-9am PT) Register Now (5-6pm PT) [email protected] Business Executive Featured Speakers
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In today’s fast-paced and interconnected world, the electronics industry faces unprecedented challenges from global disruptions, geopolitical uncertainties, and supply chain vulnerabilities. To remain competitive and resilient, organizations must adopt robust risk management frameworks that proactively identify and mitigate risks.


This webinar is brought to you by the Resiliency Working Group, part of the SEMI Supply Chain Management Initiative. We will explore the creation and implementation of an industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Attendees will learn how to assess potential risks, develop mitigation strategies, and leverage cutting-edge tools to improve visibility and responsiveness across their supply networks.

Key topics include:


•     The critical risks impacting electronics supply chains and how to address them.
•     Best practices for building a resilient and adaptable risk management framework.
•     Strategies for real-time risk monitoring, supplier risk assessments, and scenario planning.
•     How to align your supply chain with industry standards for business continuity and operational stability.

Who should attend:


•    Supply chain managers
•    Risk officers
•    Operations executives
•    Anyone involved in supply chain planning and resilience in the electronics sector

Join us to discover actionable insights and practical approaches to future-proof your electronics supply chain, ensuring it remains resilient, efficient, and prepared for any disruption.
 

Speaker bio:

Austin Evans is the Director of Supply Chain Risk Management at Intel.  He is responsible for overseeing risk management for Intel’s supply chain as well as Intel’s Contingent Workforce Program Office.  His organization is responsible for business continuity, governance, resilience, supply chain security and compliance. 

United States

Austin Evans.jpg
Austin Evans
Director of Supply Chain Risk Management
Intel
Standards

Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring.

Off Add to Calendar 2024-10-24 00:00:00 2024-10-24 00:00:00 Building Resilient Supply Chains Join us for a deep dive into the new industry-standard risk management framework tailored to the unique complexities of the electronics supply chain. Hosted by the SEMI Resiliency Working Group, this webinar will equip supply chain professionals with actionable insights on assessing critical risks, developing robust mitigation strategies, and leveraging advanced tools for real-time monitoring. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam EMG webinar HI Technical
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Heterogeneous Integration (HI) has come a long way in 50 years. The world of multi-chip modules (MCMs) has given way to a vast ecosystem of chiplets, 3D stacked die, and co-packaging of antenna, high-bandwidth memory (HBM), and optics. HI is at the center of “More than Moore” development activities, as innovative engineers look for creative ways to overcome the slower scaling of silicon technology. The promise of HI is new devices with superior power, performance, area, and cost (PPAC). All these promises come with new challenges. Managing different process nodes, physical characteristics, mechanical stresses, and other system-level challenges not found in monolithic system-on-chip (SoC) devices, creates a great opportunity for design and manufacturing companies to reshape our industry. 

 

In this webinar, we’ll explore this enabling technology from both the device maker and material supplier perspectives. We will learn about demands placed on devices by new applications and what new tools are needed to meet these demands. We will also hear about the challenges placed on materials and equipment suppliers to develop processes capable of manufacturing the individual components and integrating them into final products. Join us as our panel of experts address the issues and opportunities involved with heterogeneous integration. 
 

United States

Arsalam Alam
Arsalan Alam, PhD
Member of Technical Staff (MTS), 3D Stacking Technology Group
AMD Packaging

2nd Generation 3D V-Cache™ Enablement

Andrea Chacko
Andrea Chacko, PhD
Director of Packaging Solutions
Brewer Science
Dong Shun Bai
Dongshun Bai, PhD
Business Development Director and Senior Technologist of Packaging Solutions
Brewer Science

Enabling Heterogeneous Integration through Material Design

The realization of Heterogeneous Integration (HI) has been key in driving advancements in semiconductor technology. The complexities of integrating dissimilar materials continue to be a challenge for HI. All advanced packaging technologies rely on advanced materials to address the many challenges in achieving continued shrinking and improved performance of devices. Novel materials capable of managing mechanical stresses and increased thermal budgets with strict cleanliness requirements are required for processes such as wafer thinning, fan-out wafer-level packaging, and hybrid bonding. This presentation will highlight how advanced materials can address the growing challenges in the industry.

Andrea Maret
Andrea Maret
Senior Knowledge Manager
Entegris

Webinar Moderator

APHI CAST EHS NBMC Smart MFG SMG Sustainability EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI

Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration.

10:00 am - 11:00 am Off Add to Calendar 2024-10-16 10:00:00 2024-10-16 11:00:00 Heterogeneous Integration finds its place Dive into the dynamic world of semiconductor materials and discover the future landscape as the industry experts provide a glimpse into the future of the semiconductor ecosystem in the era of heterogenous integration. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles REGISTER NOW
Event format

Sunnyvale, USA - Meylan, FRANCE – May 29, 2024 Numem - a leader in high-performance Memory IP Cores and Memory Chip/Chiplet based on its patented NuRAM (MRAM) and SmartMem technologies, and IC’ALPS - a leader in ASIC/SoC design and supply chain management, have pooled their expertise to meet the challenge of developing an ambitious integrated circuit with RISC-V processors, 2MBytes of NuRAM and a DSP/AI Custom Datapath Accelerator. The Custom SoC was developed in an advanced technology node.

This SoC has been designed and implemented to highlight the Numem high-performance, low power Memory subsystem with a RISC V Processor and AI Accelerator for ultra-low power applications. It has been developed through a close collaboration between Numem and IC’ALPS.

The physical implementation of this integrated circuit was made in a secure space (isolated location, network, and servers, encrypted exchanges, etc.) to meet with the stringent protection of sensitive data required by this program.

“We were very pleased with the collaboration and quality of service provided by IC’ALPS which made this on-time tape out possible and first time functional silicon,” said Jack Guedj, CEO of Numem. NuRAM with SmartMem is a high-performance memory subsystem which is 2-3x smaller and boast significant power reduction over SRAM,” he added.
 
Lucille Engels, COO of IC’ALPS indicated: “The challenges were numerous including: architecture, power domains, protection of the sensitive data, run times pushing improvement of EDA flow and the pressure of the tape out deadline.”

Numem and IC’Alps intend to extend their partnership to serve new customers SoC projects – feel free to contact us.

NUMEM/IC'ALPS with ultra-low-power SoC for Sensor and AI

About NUMEM
Numem, headquartered in Sunnyvale, California, is the leading provider of Memory Subsystem Chip/Chiplet and IP based on proven foundry MRAM process. Numem’s patented NuRAM technology enables best in class power/performance and reliability with 2.5x smaller area and 85x lower leakage power than traditional SRAM. Numem’s SmartMem subsystem technology significantly improves performance and endurance as well as ease-of-use and reliability for high-volume deployment and enables to reach ultra-high bandwidth.
Visit our website at https://www.numem.com or contact us at [email protected].

About IC’Alps
IC’Alps is your one-stop-shop ASIC partner. Based in France (HQ in Grenoble, two design centers in Grenoble and Toulouse), the company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. Its areas of expertise include analogic, digital and mixed-signal circuits (sensor/MEMS interfaces, ultra-low power consumption, power management, high-resolution converters, high voltage, signal processing, ARM and RISC-V based multiprocessors architectures, hardware accelerators) on technologies from 0.18 µm down to 5 nm, and from multiple foundries (TSMC, Global Foundries, Tower Semiconductor, X-FAB, STMicroelectronics, etc.). The company is active worldwide in medical, industrial, automotive, IoT, IA, mil-aero and digital identity & security sectors. IC’Alps is ISO 9001:2015, ISO 13485:2016, EN 9100:2018 certified, Common Criteria on-demand, IATF16949-ready, member of TSMC Design Center Alliance (DCA), ARM Approved Design Partner and X-FAB’s partner network. More information on www.icalps.com and follow us on https://www.linkedin.com/company/ic-alps

About SEMI Supply Chain Management Initiative

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The SEMI Supply Chain Management initiative is a unique global platform that brings together top industry leaders to advance a more resilient and agile electronics supply chain. Recent geopolitical and natural events have exposed vulnerabilities but also new opportunities that require industry-wide and precompetitive collaboration. That's where SEMI comes in. The initiative’s newly formed Industry Advisory Council is committed todriving engagement, creating tools and solutions through collaboration, and ensuring alignment in global end-to-end supply chain continuity, visibility, and transparency. Through deep dives, educational forums, benchmarking, standards development, and strategic partnerships, SEMI seeks to empower our members to anticipate and respond to future disruptions proactively.

 

If you are interested in learning more about how your company can participate in the SCM initiative, please contact us at [email protected].

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Join us for an insightful webinar as we present the findings from the 2024 Semiconductor Supply Chain Survey, a collaborative effort between the SEMI Supply Chain Management initiative and McKinsey & Company.

The annual survey aims to establish benchmarks for operational agility metrics, covering the entire value chain from material suppliers to OEMs, offering a comprehensive view of the landscape.

During this webinar, we will share results from the survey uncovering key trends, challenges, and opportunities within the semiconductor supply chain. By attending, you'll gain valuable insights to benchmark your organization against peers, identify areas for improvement, and course-correct more effectively. Please contact us if you like to learn about how your company can participate in the SCM initiative.

Choose your session:

United States

Bettina Weiss headshot
Bettina Weiss
Chief of Staff & Corporate Strategy
SEMI

Opening Remarks

Kushal.jpg
Kushal Jolapara
Associate
McKinsey & Company, Inc.
Henry
Henry Marcil
Partner
McKinsey & Company, Inc.
Jakob
Jakob Münch
Senior Consultant
McKinsey & Company, Inc.

2024 SCM Survey Briefing

Q&A

Smart MFG

Join us for a webinar on the 2024 Semiconductor Supply Chain Survey results, a collaboration between SEMI and McKinsey & Company. Discover key trends, challenges, and opportunities across the value chain. Gain insights to benchmark your organization and enhance your strategic planning. 

Register now for one of the sessions:

Off Add to Calendar 2024-06-24 00:00:00 2024-06-24 00:00:00 Benchmark Your Supply Chain Agility Join us for a webinar on the 2024 Semiconductor Supply Chain Survey results, a collaboration between SEMI and McKinsey & Company. Discover key trends, challenges, and opportunities across the value chain. Gain insights to benchmark your organization and enhance your strategic planning. Register now for one of the sessions:US/EU: 8:00 AM – 9:00 AM PT [Register Now]  Asia: 5:00 PM – 6:00 PM PT [Register Now]  United States SEMI.org [email protected] America/Los_Angeles public
Event format
Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam 360x317_Event_Calendar_Ad_GenAI_v1@2x Business Executive Technical
Highlighted content

Generative artificial intelligence (GenAI) applications are becoming increasingly popular and with new model and applications being currently launched every day. However, GenAI applications are very compute intensive requiring specialized servers and chips.

In this webinar, panelists will discuss different adoptions scenarios and their implications on the semiconductor industry. In particular, they will dive deep on the need for additional manufacturing capacity for logic and memory as we expect the biggest investment needs there.

You will also hear from the CEO of SEMI on the potential AI holds for the semiconductor industry, along with SEMI's ongoing efforts to address this transformative technology.

United States

8:00 am - 8:10 am

Opening Remarks

8:10 am - 8:15 am

SEMI Smart Data-AI Initiative

8:15 am - 8:25 am

Semiconductor Industry Outlook Driven by GenAI

8:25 am - 8:35 am

Silicon Demand Forecast and Scenarios

8:35 am - 8:50 am

Implication for the Ecosystem

8:50 am - 9:00 am

Q & A

Explore the surge in GenAI applications and their impact on the semiconductor industry, including discussions on adoption scenarios and the need for increased manufacturing capacity, with insights from SEMI's CEO on AI's potential and SEMI's proactive strategies.

Off Add to Calendar 2024-06-18 00:00:00 2024-06-18 00:00:00 GenAI – the next S-curve for the semiconductor industry? Explore the surge in GenAI applications and their impact on the semiconductor industry, including discussions on adoption scenarios and the need for increased manufacturing capacity, with insights from SEMI's CEO on AI's potential and SEMI's proactive strategies. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format