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ESPOO, Finland, 14th of December 2021 - There has been a need for enhanced coating methods in organic electronic manufacturing as foldable phones and other future product iterations need materials that are lighter, more reliable and enable folding and stretching of a device. Thus, the use of thin film encapsulation solutions has become more common in organic electronic manufacturing.

Atomic layer deposition (ALD) has already proven to be the coating solution of choice for a wide range of applications in the semiconductor industry. Inorganic films, which are the standard output of an ALD process, are however susceptible to crack or develop defects under severe mechanical stress. This issue is magnified when depositing on large surface areas often required in flexible organic electronics manufacturing. Picosun’s novel approach to address these issues, for which patent rights are pending, includes nanolamination of dense inorganic layers deposited with ALD to maintain excellent barrier performance‚ with organic or hybrid molecular layer deposition (MLD) layers to offer enhanced flexibility and de-emphasize the defects which may appear when films are stressed.

Picosun research on an industrially viable ALD/MLD process was demonstrated on wafers and polymer substrates over 200 mm in diameter with a deposition temperature of 90 °C using Picosun ALD tools. The results showed great thickness uniformity and higher throughput compared to pure ALD film deposition. The MLD film proved to be stable in ambient environment and the complementary strengths of ALD and MLD hindered H2O permeation through the film stack, which enables flexibility in moisture barrier design.

“We are excited to bring these insights to the market as there has been little information available from stable and industrially viable MLD processes in full wafer scale. Besides organic electronics, we see immense potential with the ALD/MLD films in the manufacturing of LEDs, MEMS and medical packaging”, states Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

Watch the Picosun webinar to learn more about the topic and Picosun results:
https://info.picosun.com/webinars/ald-mld-nanolaminate-films

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

August 30, 2021 11:30 AM SAST

AMSTERDAM–Leading AI-for-Manufacturing company, DataProphet, today announces the formation of its Semiconductor Advisory Board. With great pride, the company welcomes the newly formed strategic committee of trusted industry-specific advisors — Susan Wilkerson and Markus Keil.

In Markus Keil and Susan Wilkerson, DataProphet has teamed with two highly respected, seasoned professionals who are deeply committed to bringing their wealth of semiconductor industry knowledge to help DataProphet achieve its ambitions of integrating its data-driven AI-as-a-Service into all value-adding processes in the semiconductor value chain around the world, including fabs and Original Equipment Manufacturers (OEMs).

Susan Wilkerson and Markus Keil are distinguished additions to DataProphet’s wider Industry Advisory Board. They directly reflect the company’s growth-oriented, go-to-market mindset at a crucial inflection point in its commercial development.

DataProphet’s Semiconductor Advisory Board members bring a proven track record as change agents in semiconductor manufacturing, helping shape and guide the industry through myriad challenges and transformations over years of unprecedented technological and economic transformation. Susan Wilkerson and Markus Keil will work closely with DataProphet’s leadership team to ensure they are best meeting the critical production KPIs of the semiconductor industry as it moves into a new era.

Regarding the announcement, Susan Wilkerson had this to say: “I’m excited to be selected for DataProphet’s Semi Advisory Board, which focuses on utilizing AI and Machine Learning to enable prescriptive operational efficiencies in the Semiconductor industry. The Dataprophet team’s underlying philosophy translates into product offerings committed to making the end customer experience as simple and positive as possible while proving clear customer value at every stage. Their AI-as-a-Service seamlessly inputs environmental variables and proactively models complex integration in the manufacturing process. This will enable chipmakers to address their most significant technical challenges. With DataProphet’s data-driven solutions, fabs will access opportunities to improve operational cost, yield, and time to market faster than ever before.”

Markus Keil contextualized the significance of his inclusion in this way: “Upon meeting the DataProphet team, I became quickly aware of a unique group of excellent talents and leadership backed by high-caliber investors. My sense was: here is a company to make a big difference in the young industry of AI. This is why I’m very honored to have the opportunity to support DataProphet in bringing its AI-for-Manufacturing and Machine Learning (ML) applications into the semiconductor industry. AI and ML are megatrends with the capability to influence many aspects of how we work, design, build and use technology. Furthermore, in my opinion, semiconductors are a logical and natural target industry for DataProphet’s pioneering technology. Fabs are very data-centric environments with some catch-up work to do in using AI. With Dataprophet’s unique innovations, its use of big data prescriptive analytics, along with their very customer-centered approach, I am convinced this company will be successful in bringing its game-changing technology to fabs worldwide.”

In response to the formation of the Advisory Board, DataProphet CEO and co-founder Frans Cronje stated: “I am very excited by today’s announcement of our Advisory Board for the semiconductor industry! The experts who have joined our board will help guide DataProphet as we introduce our state-of-art AI solution to fabs around the world. Susan Wilkerson and Markus Keil will help us navigate the intricacies and challenges that customers in the semiconductor manufacturing industry face. I am looking forward to the results we will achieve together.”

ABOUT DATAPROPHET
DataProphet is a Venture Capital-backed, high-growth AI-for-Manufacturing company pioneering the development and deployment of Deep Learning solutions for manufacturers across key industry verticals worldwide. As heavy industries move towards autonomous manufacturing, its world-leading AI-driven solutions guide clients from over-dependence on human experts to Machine Learning expert guidance. DataProphet’s mission is for its manufacturing process agnostic AI-as-a-Service innovations to continue revolutionizing process optimization in support of the wide range of manufacturing sectors it currently partners with and to extend its partnerships even further. The company helps manufacturers—of semiconductors, automotive equipment, rubber, glass, plastic, gray iron, and minerals—meet and exceed critical KPIs with cutting-edge, human-in-the-loop AI deployments requiring no additional hardware investment. In this way, DataProphet supports adopters of its technology to become more competitive and resource-efficient as they digitally transform. DataProphet AI deployments guarantee ROI in the first year of operation and provide ongoing and complete post-installation support, including additional data sources and full model maintenance.

ABOUT SUSAN WILKERSON
Susan Wilkerson joined Veeco in April 2020 as Senior Vice President of Global Customer Operations. Before her employment with Veeco, she served as Vice President & General Manager of Strategic Global Accounts for Lam Research Corporation from 2011 to 2020. She was also previously Vice President & General Manager of Americas Sales & Service for Verigy. Susan Wilkerson was with Applied Materials for over fifteen years, holding positions of increasing responsibility—these included Global Account Management, Vice President & General Manager, and Vice President of Operations for the North America Region. Susan Wilkerson was also engaged in multiple consulting ventures, co-founding BlueRock Consulting LLC in 2008.

ABOUT MARKUS KEIL
Markus Keil has 25 years of global experience in the technology industry with a strong operational and business focus in Asia, Europe, and the US. Mr. Keil has worked as a CEO, Business Area Manager, and Business Unit COO in highly innovative environments. He also bore Multi-Operations-Site responsibility for ten manufacturing sites in six countries (in Europe, the US, and Asia), and brings solid operational experience along the entire semiconductor manufacturing supply chain—from Equipment Vending, Wafer Manufacturing, Chip-Packaging, Multi-Chip Module Assembly, and Testing with a large inhouse and outsourced footprint. Mr. Keil started up several manufacturing sites (greenfields), transferring technology and building HVM Technology organizations. He has post-M&A integration experience and has led several significant organizational integration and transformation projects in the semiconductor industry. Markus Keil is a hands-on team player and vision builder with a strategic mindset.

ESPOO, Finland, 23 of November 2021 – Picosun Group has launched a Medical Materials Library consisting of over ten materials intended for medical-related coating and encapsulation with Atomic Layer Deposition (ALD). ALD coatings are ultra-thin, and they guarantee hermetic encapsulation of virtually any implanted device.

The materials library is a reflection of over six years extensive research and development that shows ALD can render biocompatibility to a substrate coated with Picosun library materials. Biocompatibility tests were carried out according to ISO standards in accredited third-party laboratories. The performed tests included for example cytotoxicity, antimicrobial activity, skin irritation or sensitization, hemocompatibility, bacterial endotoxins, bioburden and sterilization residuals. From the tested materials Picosun is able to design tens of different types of end materials according to customer needs.

ALD technology provides dimensionless coating thus enabling miniaturization of components and devices in the field of electronic implants. Antibacterial function together with excellent barrier properties and outstanding corrosion resistance pave the way for using the materials both in electronic and orthopedic implants and show high potential in pharmaceutical packaging. The superior film uniformity and conformality ensure a pinhole-free coverage over even the smallest details of the device.

“The demonstrated results show the undisputable opportunities ALD offers to the medical sector already today. While the basic surgical principles and technologies have remained the same for decades, now ALD enables unforeseen applications potentially improving patient safety and cost-effectiveness by extending implant durability and reducing adverse effects”, says Niku Oksala, professor of surgery at Tampere University and medical advisor for Picosun.

“Picosun’s Medical Materials Library targeted to the medical device manufacturer segment reflects the innovative spirit of the company. I’m really excited over the fact that we are able to flexibly design tailored encapsulations according to our customers’ needs. I’m especially proud of our medical customers and partners who are already in pre-clinical and clinical trials with their ALD coated devices”, says Juhani Taskinen, Vice President, Medical Business Area of Picosun Group.

More information:
Juhani Taskinen
Vice President, Medical Business Area, Picosun Group
Tel: +358 50 4066 957
Email: [email protected]
www.picosun.com

About Picosun
Picosun provides the most advanced ALD (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

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CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021年 SEMI 中日交流协作会 China SEMI.org [email protected] America/Los_Angeles public
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CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021 SEMI China-Japan Collaboration Conference China SEMI.org [email protected] America/Los_Angeles public
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Report highlights female engineers are passionate about engineering despite barriers to entering the field;
KLA Corporation’s new Engineering Inspiration Report showcases motivators, passions and challenges to entering the engineering field

MILPITAS, Calif., October 26, 2021 - KLA Corporation (NASDAQ: KLAC) today announced the KLA Engineering Inspiration Report, a new multi-regional research that shows engineers are extremely passionate about possibilities that the field provides. The inaugural report notes roughly two-thirds (65%) of engineers and students indicate they entered the field to create something that might change people’s lives.

Overall, nearly two-thirds of engineers (64%) indicate they are just as, if not more, passionate than they were when they entered the field. While there is no statistical difference in those numbers (women: 61% and men: 64%), women are faced with additional challenges such as the lack of family engineering role models and a later introduction to the engineering career path than their male counterparts. Further, 59% of female engineers say they were challenged in that STEM was not considered an appropriate field for women when they were on the path to engineering. The data speaks to the perseverance of women in engineering to continue in a career with a high level of passion despite the barriers they faced along the way.

The KLA Engineering Inspiration Report reveals the motivations, inspirations and major challenges on the path to becoming an engineer. As the gap between the supply and demand of engineering talent across industry sectors has increased, KLA found it critical to better understand the unique needs of those who choose the career path to encourage a more diverse set of people to explore the engineering profession. To gain insights, KLA commissioned the survey of both students and engineers in five regions which include the U.S., the U.K., China, Taiwan and Israel to assess their feelings, the drivers behind success and the barriers to entry that we need to work together to overcome.

On the launch of the report, KLA’s Chief Executive Officer and President Rick Wallace commented, “The insights gleaned from the Engineering Inspiration Report offer the opportunity for us to customize the KLA workplace experience, not only for our existing engineers but also those of the next generation. Part of our vision at KLA is ‘the future is ours to create,’ and engineers are critical to making that a reality and bringing cutting-edge innovations to life. It is up to us to ensure that we are creating an inspirational, stimulating and inclusive environment for them to work.”

Engineers want to make an impact

When first introduced to engineering, around two-thirds of engineers and students were highly motivated by the ability to solve problems (68%), the chance to create something that might change people’s lives (65%) and the opportunity to bring the future to today (65%). In addition, half (50%) of engineers and students indicate they have been inspired by sustainability issues, such as climate change, overpopulation and major natural disasters, and 39% by social concerns such as social disparities and disparities of resources.

In Taiwan, seven in 10 (70%) engineers and students say the digital revolution, such as the emergence and adoption of AI, machine learning and other technologies, drew them to the field—which is over 20 percentage points higher than the multi-regional average (49%).
When looking for careers in engineering, students and engineers similarly indicate that salary is important but so are the opportunities for career growth and other life benefits such as sabbaticals, new parent programs, financial planning support and time off to volunteer. Outside of work, engineers and students turn to music (29%), exercise (28%) and nature (28%) to draw inspiration for their day-to-day work—possibly further indicating the need for a package deal when choosing an employer.
Women on the engineering career path are determined and perseverant

Women in engineering want change. More than half (54%) of female engineers and students say they were motivated by the chance to break the glass ceiling when first introduced to engineering.

One of the biggest challenges is when and how women are introduced to engineering as a career. Nearly half (44%) of all engineers and students indicate they were first introduced to the engineering field by family or friends. Yet, when looking by gender, only 9% of female students report a parent introduced them to the field (vs. 17% of male students), and only one-third (35%) of female students report they were motivated by the chance to follow in the footsteps of a parent or family member (vs. 50% of male students).

Further, when asked when they began considering engineering as a career path, male students are more likely to say high school, while female students indicate undergrad.

Engineering degrees can be costly and time consuming, yet may not be teaching all the right skills

Across all regions, engineers cite common challenges to entering the field, with the stress of needing to achieve academic excellence, the time it takes to become an engineer and the cost of education as the top challenges. Though in some regions, like Israel and Taiwan, the challenges are more prevalent. When thinking about why more people do not chose engineering as a career path, half (50%) of students and engineers in Israel point to the stress of needing to achieve academic excellence as a barrier to pursuing the career (multi-regional average: 36%). More than half (56%) of students and engineers in Taiwan say the time it takes to become an engineer is a top reason why more people do not consider the field (multi-regional average: 40%).

Beyond the education required, professional engineers indicate a gap between the skills they were taught in school and the skills required to be successful in their career. Engineers rank teamwork, time management and project management among the top skills required for success, yet more than half (52%, 63% and 60%, respectively) of students say those skills are not being taught in their current programs.

The passion is high and so are opportunities

Almost all students and engineers indicate they are highly passionate about the chance to join the field and, in turn, would recommend their career to others. 86% of students say they are very passionate about the opportunity to become an engineer, and 82% of engineers say they would recommend becoming an engineer to someone they know.

These results are even higher in certain regions. For instance, 94% of U.K. students say they are very passionate about the opportunity to become an engineer, and nearly nine in 10 U.K. engineers (88%) and Chinese engineers (88%) say they would recommend becoming an engineer to someone they know.

Additional Resources

For more details about the KLA Engineering Inspiration Report and to hear stories from KLA engineers about why they became an engineer, please visit www.kla.com/EngineeringInspiration.

Methodology

In partnership with IPSOS, a global business and consumer research services organization, a survey was fielded from June 4 – July 29, 2021 in five regions (the United States, the United Kingdom, China, Taiwan and Israel) in their native language. The survey sample included 1,083 students and 2,278 engineers, using an online methodology with a varied sample per market and per audience.

About KLA

KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. We provide advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, our expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at www.kla.com (KLAC-F).

Technetics PTFE & Polymer Solutions (aka Technetics Group Houston) has been acquired by Edgewater Capital Partners effective September 3, 2021.   The new name is Altamira Material Solutions LP.

This acquisition includes two PTFE and Polymer processing facilities in Houston and one location in Hatfield, PA that provides best in class chemical etching services for the fluoropolymer industry.

The Altamira team wants you to know how much we appreciate your support over the years.   We are all eager to continue to serve you.     These changes in our organizational structure will allow us to focus more on our core business and improvements in our processes to support our customers.     More importantly, the team you have grown to trust and rely on for your products is not changing, it’s growing!   We are all excited about the opportunities ahead under our new ownership.

Andrew Bastian, General Manager for Altamira states; "The team Altamira Material Solutions is excited to build on our 50-year history of supplying industry leading PTFE products with our new partner Edgewater. We have a big vision for the future and expect to achieve great things together. This partnership is a win for our employees and customers. We couldn't be happier with the opportunity to work together toward a bright future."

For any additional information about Altamira , please contact Roxanne Dittrich, Business Director ([email protected]).

www.Altamira-MS.com

Registration Details

Members - FREE

    Register with your company email to receive the member price

Non-Members - $25

No Cancellations

Questions:  Contact Ayo Kajopaiye, [email protected]

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Silicon on Insulator technology is a very diverse and multi-faceted enabler of semiconductor products.  In certain areas if offers performance advantages across a wide dynamic range of leakage and in other areas it enables the use of high voltages in multi-domain designs.  It also inherently bring low capacitance which makes it great for ultra-fast switching in RF designs and significantly improved radiation robustness compared to bulk CMOS; it’s easy to see why SOI technology continues to expand in use through-out the industry.

Attend this webinar to see how these advantages are being applied to products in the medical and automotive (and more) application spaces.

CA
United States

8:00 am - 8:10 am
Carlos Mazure
Carlos Mazure
SOI Consortium

Welcome and Introduction

8:10 am - 8:30 am
Jon Cheek
Jon Cheek
Sr. Director, Process Technology Development
NXP Semiconductor

SOI Technology: Enabling Everything from Automotive to 6G

Abstract – The use of Fully-Depleted SOI, FD-SOI, combined with an ultrathin buried oxide create a technology ideally suited for the Internet of Things revolution. FDSOI enables the dynamic modulation of the threshold voltage during operation, not just during the design phase, to open a whole new world of creative product opportunities. One such example is the creation of ultralow leakage embedded SRAM memories which consume so little power that some resulting IoT products can last years on a single household battery. Other versions of SOI Technology with thick buried oxide enable use of 50V to 70V domains on a chip without need of complex isolation schemes. This ability to provide high voltage support along with digital processing is yet another reason SOI is adopted to provided differentiation in product offerings. Each of these approaches will be discussed and shown how it benefits the final products.

8:30 am - 8:50 am
Giulio Ricotti ST
Giulio Ricotti
Design Director & Technical Staff Fellow
ST Microelectronics

BCBD-SOI Technologies and Applications in Ultrasound Imaging and More

Giulio Ricotti – Design Director and Technical Staff Company Fellow - STMicroelectronics

After earning his Electronics Engineering degree, Giulio joined ST in 1994 as a design engineer in their Smart Power (SP) products group. Currently a Design Director and Technical Staff Company Fellow, Giulio has more than 60 patents and has authored 70 publications. Giulio has also been awarded the “Premio dei Premi” in 2009 by the Italian president Giorgio Napolitano for his crucial contribution to innovation with the 4D ultrasound imaging project that is used today all over the world for pregnancy and cardiology screenings.

8:50 am - 9:00 am
Ayo Kajopaiye Pic
Ayo Kajopaiye & Carlos Mazure
SOI Consortium

Discussion & Q&A

FOA

Join us for the the first in a series of webinars focused on applications of SOI technology, brought to you by the SEMI SOI Consortium. The series will underline the breadth of products that SOI technologies cover.

The first webinar of the series will feature ST Microelectronics and NXP.  ST Microelectronics will focus on their BCD-SOI technologies and applications, such as medical ultrasound imaging. NXP will showcase multiple applications of SOI technologies in automotive from power electronics through infotainment.

 

8:00 am - 9:00 am Off Add to Calendar Disabled America/Los_Angeles
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Brooks Instrument, a world leader in advanced flow, pressure, vacuum and vapor delivery solutions, will feature its new GP200 Series pressure-based mass flow controller (P-MFC) at SEMICON Europa, November 16-19, in Munich, Germany. The company will be exhibiting in booth B1572.

The new GP200 Series is the industry’s first fully pressure-insensitive, pressure-based mass flow controller designed specifically for advanced etch and chemical vapor deposition processes in semiconductor manufacturing.

Providing ≤ ±1% process gas accuracy and ≤ ±0.15% S.P. repeatability, the ultrafast GP200 Series meets the critical requirements for high aspect ratio etch processes for TSV, MEMS and high-throughput continuous plasma processes.

Featuring a patented architecture that overcomes the limitations of conventional P-MFCs, the GP200 is designed to maintain accurate flow delivery of low vapor pressure and high-pressure gases into processes operating from high vacuum above atmospheric pressure. In comparison, conventional P-MFCs require high supply pressures and low outlet pressures or their performance quickly degrades. By offering a greater flexibility than conventional P-MFCs, the GP200 Series is the first universal pressure-based solution and upgrade for traditional P-MFCs and thermal MFCs.

The GP200’s extreme pressure insensitivity and zero leak-by valve (ZLV) technology enables design engineers to reduce gas panel complexity, size and cost by eliminating the need for point-of-use pressure regulators and transducers.

In addition to its GP200 Series P-MFC, Brooks will showcase other key products such as vacuum and pressure measurement sensors, gauges and instrumentation used in wafer process equipment and fab gas distribution.

For more information about the complete range of Brooks Instrument products and solutions for semiconductor applications, visit www.brooksinstrument.com.

For more information about the GP200 Series P-MFC, including specifications and videos, visit experience.brooksinstrument.com/pressure-based-mass-flow-controller-gp200.

About Brooks Instrument
Since 1946, Brooks Instrument has been a leader in precision fluid measurement and control technology. Providing instrumentation for flow, pressure and vapor delivery, the company serves customers in semiconductor and high-tech industrial manufacturing and process industries.

With manufacturing, sales and service locations in the Americas, Europe and Asia, Brooks Instrument has the world’s largest installed base of mass flow controllers. Its broad family of products includes brands such as Celerity, UNIT Instruments and Tylan.

For more information, please visit www.BrooksInstrument.com. The company is also on LinkedIn (www.linkedin.com/company/Brooks-Instrument) and YouTube (www.youtube.com/user/Brooks407).

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels. This proprietary process, based on wet etch chemistry, will enable YES to expand its wet processing capabilities.

“We are very pleased to partner with YES in this effort to extend our smartEBR technology to more complex applications,” said Pirmin Muffler, founder and Managing Director of Osiris. “We selected YES as our partner because of their proven ability to rapidly bring innovation to high-volume manufacturing production environments.”

“YES is committed to developing a variety of solutions for panel-based applications in the PCB and advanced packaging markets” said Zia Karim, CTO of YES. “When combined with our extensive process expertise, the smartEBR technology will allow our customers to remove metal, photoresist and dielectric coatings efficiently from a variety of panel types, ensuring high yield and defect control.”

“Our mission is to be the preferred provider of surface modification and material enhancement solutions in the markets that we serve,” said Rezwan Lateef, President of YES. “The Osiris EBR technology adds an important element to our product portfolio, as we continue to support and enable the ambitious roadmaps of our key semiconductor customers.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials, and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

About Osiris International GmbH
Osiris International GmbH is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor, microOLED, Mask and microsystems (MEMS) technology. The company provides a wide range of optimized front- and back-end solutions used in the processing of a variety of substrates. For more information, please visit www.osiris-nano.com.