Gütenbach, Germany – December 16, 2025 – RENA Technologies is proud to be a key industrial partner in a new 1.3 million Euro Government-funded project led by the National Physical Laboratory (NPL) and supported by the Department for Science, Innovation and Technology (DSIT). The initiative will establish critical new metrology capabilities to strengthen the UK’s semiconductor innovation infrastructure and accelerate the development and adoption of next-generation semiconductor materials and processes.

This strategic investment underlines the UK’s commitment to maintaining global competitiveness in semiconductors, helping to attract private investment, strengthen supply chains, and support long-term economic growth. As advanced semiconductor materials become central to technologies such as electric vehicles, renewable energy, 5G communications and advanced electronics, robust measurement, verification and standards are increasingly essential.

The project brings together a broad consortium spanning industry and academia. Together, the partners cover the full innovation landscape, from materials research and process development to device fabrication and performance verification.

“At RENA, we develop advanced wet processing and surface treatment solutions that are critical in manufacturing of compound semiconductors and emerging materials. Through this collaboration, RENA will contribute industrial insight and process expertise to ensure that new measurement and testing capabilities are closely aligned with real manufacturing challenges.” States Peter Schneidewind, CEO of RENA Technologies.

While silicon remains the foundation of much of today’s semiconductor industry, many high-growth applications increasingly depend on advanced materials such as gallium arsenide (GaAs), gallium nitride (GaN), silicon carbide (SiC), and indium phosphide (InP). These materials offer superior performance in high-power, high-frequency and optoelectronic applications, but they also introduce new complexities in processing, characterization and quality assurance. Reliable standards and independent measurement methods are therefore essential to derisk innovation and support scale-up.

Through this project, consortium partners will work with NPL to:
• Develop new UK measurement and test capabilities for advanced semiconductor materials by combining academic research excellence with world-leading metrology expertise.
• Apply these capabilities to critical industry challenges, including assessing material integrity, verifying RF performance, and testing device reliability under demanding operating conditions.
• Share the resulting capabilities openly with industry, helping to build national consensus and strengthen the UK’s influence in international standards development for novel semiconductor technologies.

Following extensive consultation the consortium has identified three priority application areas where the UK can have the greatest global impact: power electronics, RF-communications, and optoelectronics. These areas align closely with RENA’s customer base and technology roadmap, particularly in power and compound semiconductor manufacturing.
By participating in this program, RENA reinforces its commitment to supporting the UK semiconductor ecosystem with industrially relevant innovation, enabling customers to adopt advanced materials with confidence, and helping position the UK as a global leader in next-generation semiconductor technologies.

About NPL
The National Physical Laboratory (NPL) is the UK's National Metrology Institute (NMI), developing and maintaining the national primary measurement standards, as well as collaborating with other NMIs to maintain the international system of measurement. As a public sector research establishment, it delivers extraordinary impact by providing the measurement capability that underpins the UK's prosperity and quality of life. NPL develops the metrology required to ensure the timely and successful deployment of new technologies and work with organizations as they develop and test new products and processes.

About RENA Technologies GmbH
RENA Technologies is a leading global supplier of production machines for wet chemical surface preparation. RENA products are used in path-breaking application fields such as semiconductors, MedTech, renewable energies, and the glass industry. RENA equipment is used to treat or modify surfaces of, for example, semiconductor wafers, solar cells, glass, optical substrates or other high-tech products using wet chemical processes. RENA offers proven standard machines as well as customer-specific solutions and process support.

• Read more about RENA joins UK Government-funded consortium to strengthen national semiconductor metrology capabilities

OXFORD INSTRUMENTS PROVIDES COHERENT WITH STATE-OF-THE-ART, FULLY AUTOMATED PROCESSING EQUIPMENT, FOR 6” INP WAFER MANUFACTURING, ENABLING NEXT GENERATION AI APPLICATIONS

Oxford Instruments (OXIG), a leading provider of advanced plasma processing solutions for the compound semiconductor industry, announces the key role it is playing to support the industry’s first fully automated 6-inch indium phosphide (InP) wafer fabrication capability for photonic devices, led by Coherent Corp. (NYSE: COHR), a global leader in compound semiconductors and high-performance optical networking solutions.

Oxford Instruments’ cutting-edge plasma processing equipment is central to Coherent’s groundbreaking achievement of ramping up 6-inch InP fabs in Sherman, Texas, and Järfälla, Sweden. These fabs will play a pivotal role in driving advancements in AI datacentre, telecommunications, and sensing applications. Coherent’s transition to 6-inch wafers is set to deliver significant benefits, including a substantial increase in capacity, lower die cost and more than four times the number of devices per wafer.

Oxford Instruments has supplied fully automated, high-throughput 6-inch InP processing equipment, enabling Coherent to achieve these remarkable productivity gains. This advanced equipment is designed to support the transition from 800G to 1.6T products, a key requirement to meet the growing demands of AI interconnects and optical communications.

“We have been the leading supplier of InP plasma etch equipment to the datacom market, and Coherent, for many years. Our technology, with the quality, throughput and reliability that we have developed alongside excellent service, is ideally positioned to support the current device demand inflection we are seeing with the release of generative AI applications. We are delighted to be partnering with Coherent during this exciting period of market expansion and look forward to continuing to develop and release innovative and valuable plasma processing solutions.” Matt Kelly, Managing Director, Oxford Instruments Plasma Technology.

"Coherent’s move to 6-inch InP wafer fabrication marks a transformative milestone for the industry. Oxford Instruments’ expertise in plasma processing has been essential in enabling our Sherman and Järfälla fabs to reach world-class performance,” said Dr. Beck Mason, Executive Vice President – Semiconductor Devices at Coherent. “Together, we are advancing InP technology to support faster networks, greater efficiency, and the new applications that will define the future of connectivity."

The joint efforts of Oxford Instruments and Coherent have culminated in a manufacturing platform that sets the stage for the next generation of InP optoelectronic devices. These devices are critical enablers for applications ranging from AI datacentres and datacom transceivers to advanced sensing in consumer electronics and automotive technologies.

• Read more about Enabling AI with Fully Automated Equipment for 6” InP Wafer Processing

Nijmegen, October 20, 2025 – Chip Integration Technology Center (CITC) will become part of TNO. This strategic move marks a significant step toward ensuring the long-term continuity and stability of CITC’s research and operations. The integration emphasizes TNO’s ambition to take a leading position in the innovation of chip packaging technologies and strengthen the regional semiconductor ecosystem in Nijmegen.

“In the coming years, TNO aims to play a key role in the development of advanced chip packaging in the Netherlands,” says Arnaud de Jong, director of High Tech Industry at TNO. “By integrating CITC into TNO, we can intensify and expand our research efforts. We also contribute to the further development of Lifeport in Nijmegen as a strong, future-proof semiconductor ecosystem.” With the investment in CITC, TNO connects chip technology activities between Nijmegen and other semiconductor hubs such as Eindhoven.

Advanced chip packaging
CITC was founded in 2019 by TNO and Delft University of Technology (TU Delft), among others, as an independent innovation center for advanced chip packaging technology. Within an ecosystem of companies, research institutions and educational organizations, CITC has developed into a broad R&D hub that collaborates on technological breakthroughs in advanced chip packaging.

“CITC’s integration into TNO marks a noteworthy moment for CITC. This step underscores our shared vision for the future of chip integration and packaging technology,” says Jeroen van den Brand, general manager of CITC in Nijmegen. “This provides room for growth, accelerates innovation, and strengthens CITC’s international position as a center of expertise for chip packaging.”

Strategic choice for Nijmegen
CITC’s integration into TNO will formally take effect on January 1, 2026. CITC will become part of TNO’s High Tech Industry business unit and will remain located at the Noviotech Campus in Nijmegen. Toni Versluijs, chairman of the CITC Supervisory Board: “CITC continues on its current course. For the Supervisory Board, it is essential that, with TNO’s ambition and investment, we secure continuation of the CITC activities, while building on the existing talent and technology and give CITC room to grow further.”

Lucas van Vliet, member of the CITC Supervisory Board on behalf of TU Delft: “The collaboration between TU Delft and TNO within CITC will change form as of January 1 but remains as strong as ever. TU Delft believes in the importance and growth potential of chip packaging and sees incorporating CITC into a strong organization like TNO as an opportunity to further accelerate innovation in chip technology.”

- ENDS -

About CITC
CITC is a non-profit, joint innovation center specializing in heterogeneous integration and advanced chip packaging technology. With the aim of bridging the gap between academia and industry, CITC has created an effective ecosystem where companies, research and educational institutions collaborate. CITC was founded in 2019 with strategic partners TNO and Delft University of Technology and is supported by the province of Gelderland and Nijmegen municipality. Located on Noviotech Campus Nijmegen, CITC is perfectly situated in the heart of the Dutch semiconductor industry.
www.citc.org

About TNO
TNO is the largest independent research and technology organization in the Netherlands and one of the largest in the EU. We innovate, investigate, and orchestrate, collaborating closely with governments, universities and the private sector. We inform government on policies and empower evidence-based decision-making through rigorous investigations, cutting-edge scientific insights, and reliable measurements. By building national and international consortia and ecosystems, we drive technological and methodological breakthroughs that help to realise a secure, sustainable, healthy, and digital society, and strengthen the earning power of the Dutch economy.
www.tno.nl/en/

Contact
Christian Ketelaars, Communications Manager
E [email protected]
M +31 (0)6 48 15 42 92

• Read more about CITC becomes part of TNO: boost for chip packaging in Nijmegen

Martinez, CA—EUV Tech (EUVT), a global leader in designing and manufacturing at-wavelength EUV metrology equipment, is excited to announce the release of the FALCON Photoresist Flood Exposure Tool. As our next-generation EUV resist characterization and diagnostics tool, FALCON allows photoresist manufacturers to rapidly and accurately test EUV resist sensitivity, as well as providing patterning materials developers critical insights into exposure mechanisms.

Built upon EUV Tech’s proven resist tool technology, FALCON is a fully automated tool that supports high-throughput contrast curves on EUV-patterning materials and radiation chemistry diagnostics by integrating a wide variety of optional add-on analysis and processing modules.

Enhancing FALCON’s platform is an array of in-situ analysis and process modules, including Fourier Transform Infrared (FTIR) Spectroscopy, Atomic Mass Spectrometry, Total Electron Yield (TEY), Photo-Electron Spectroscopy (PES), environmental and vacuum bake module with additional diagnostics, and a scanner-environment exposure module.

Key to FALCON’s effectiveness is its highly uniform exposure spot size of 6 mm, supporting high-sensitivity chemical analysis and over 1,000 exposures for a 300 mm wafer in a single recipe run. Built-in data visualization tools make it possible to analyze this rich data. Combining uniformity, high configurability, and deep data collection and analysis makes FALCON a highly efficient, cost-effective tool for advanced photoresist development.

For more information on the enhanced FALCON Flood Exposure Tool or any of EUV Tech’s at-wavelength metrology tools, please visit euvtech.com.

About EUV Tech
EUV Tech enables technology advancement in the frontiers of semiconductor manufacturing and material science through the development of world-leading EUV and soft-x-ray instrumentation and techniques.

For further information, contact:
EUV Tech, Inc.
[email protected]
+1 (925) 229-4388

• Read more about EUV Tech Advances Semiconductor Manufacturing with the Launch of FALCON

Test Research, Inc. (TWSE: 3030), the leading test and inspection systems provider for the electronics manufacturing industry, is proud to announce its successful partnership with Bosch in the development of an AI visual check solution for MEMS packaging.

Bosch has recognized TRI's valuable contribution to their success in MEMS packaging in 2025 with a Certificate of Appreciation. The certificate acknowledges the successful completion of the AI visual check for MEMS packaging, highlighting the strong cooperation and partnership between the two companies.

This collaboration demonstrates TRI's expertise in AI-driven inspection solutions and its commitment to providing valuable solutions for the electronics manufacturing industry. TRI's AI-powered solutions include the AI Defect Detection, AI Smart Programming, AI Verify Host, AI training tool, AI Station, and more.

Please visit the following link to learn more about TRI's AI Solutions:
https://www.tri.com.tw/en/about/about-107-2-2.html

Learn more about the Bosch Group by following the link below:
https://www.bosch-presse.de/pressportal/de/en/company-page.html

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About Test Research, Inc. (TRI)

TRI (TWSE: 3030), offers the most robust product portfolio in the industry for Automatic Test and Inspection solutions. Learn more at http://www.tri.com.tw. For sales and service information, please write to us at [email protected] or call +886-2-2832 8918.

• Read more about TRI and Bosch Partner on AI Solution for MEMS Packaging

Stanton Chase is pleased to announce that Sundar Rajan Ramalingam has joined the firm as a Partner in North America. His addition strengthens the firm's executive search and leadership consulting capabilities for the semiconductor sector at a time of rapid transformation.

Sundar brings nearly three decades of leadership experience across manufacturing and global technology sectors. He has scaled a multi-billion-dollar global engineering division and supported the growth of several Global Capability Centers (GCCs). Within the semiconductor ecosystem, he has played a pivotal role in building and advising leadership teams across chip design, chip-to-cloud platforms, semiconductor fabs, and foundry operations.

This deep operational and strategic background gives Sundar a unique perspective on the evolving talent needs of semiconductor organizations.

"The semiconductor industry is entering a pivotal era—what I call a 'perfect leadership storm'—driven by generative AI, strategic autonomy imperatives, and breakthroughs like 3nm and advanced packaging," said Sundar. "While these trends are accelerating innovation, the industry also faces a growing talent gap. Companies need capable leaders who can navigate complexity, scale innovation, and build resilient teams. I plan to use my experience in technology and manufacturing to help semiconductor companies find executives who deliver results and foster sustainable growth."

Sundar's career spans both strategic HR leadership and general management with P&L responsibility, offering clients a rare blend of technical insight and leadership development expertise.

"Sundar fits well with our North American team and fills a specific need in our practice," said Mickey Matthews, Managing Director at Stanton Chase in North America and Chair of the Governance Committee. "His time working across borders gives him a genuine understanding of how global teams function. Blending this multicultural understanding with Sundar's deep technology products and services vertical expertise matters a lot to the clients we serve and specifically in the semiconductor space."

Jan-Bart Smits, Managing Partner at Stanton Chase Amsterdam and Global Sector Leader for Semiconductors, added: "Sundar joins us when the semiconductor industry sits at a turning point. Firms in this sector are looking for something different in their executives—people who understand both market forces and engineering details. Sundar knows this world and will further enhance our ability to serve chip makers and their suppliers."

As the semiconductor industry moves into a new chapter—marked by AI-driven demand, geopolitical shifts, and the race toward next-gen nodes—Sundar's appointment signals Stanton Chase's commitment to helping clients lead with confidence and clarity.

Sundar holds an MBA from XLRI Jamshedpur (India) and completed executive education programs, including the Chief Human Resource Officer Program at Wharton, University of Pennsylvania.

He will serve clients from Stanton Chase offices in Baltimore and Raleigh, USA, as well as Bangalore, Hyderabad, and Chennai, India—locations near semiconductor business centers.

Click here to learn more about Sundar.

Click here to learn more about Stanton Chase's semiconductor expertise.

About Stanton Chase

Stanton Chase ranks among the top global retained executive search firms with more than 76 offices in 45 countries and a worldwide team of senior consultants. Stanton Chase serves clients across multiple industry specialties and places C-suite executives, senior managers, and board members for companies ranging from global corporations to emerging businesses. Stanton Chase belongs to the Association of Executive Search and Leadership Consultants (AESC), adhering to the highest industry standards of professionalism and ethics.

• Read more about Stanton Chase Welcomes Sundar Rajan Ramalingam as Partner in the Semiconductor Practice