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While silicon carbide (SiC) has long been known for its superior properties for power device manufacturing, economical high-volume production has been hard to achieve. Small substrates, high cost, and challenging manufacturing infrastructure have limited the reach of this enabling technology. With the advent of larger substrates, however, the outlook for SiC is ever brighter and, shall we say, more powerful?
From the building of these larger substrates to the development of equipment designed for SiC processing, the semiconductor industry has challenges ahead. In this webinar, we will explore these aspects of growing and maturing the SiC supply chain from the materials and equipment perspective.

United States

Rob circle
Robert Rhoades
President and CTO, X-trinsic;
Sr. Technology Analyst, TECHCET

Market Trends Perspective

David circle
David Kirsch
Vice President & General Manager, North America
EV Group

Implementation Perspective

EMG 10:00 am - 11:00 am Off Add to Calendar 2024-04-03 10:00:00 2024-04-03 11:00:00 Ready for Prime Time - the SiC Value Chain Prepares for Mass Adoption United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
Event format

Registration for this course is free.

For questions, please contact Paul Trio at [email protected]

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Electromagnetic Interference and Electrical Overstress Management: Why, What, and How

Electromagnetic interference (EMI) is becoming more critical in all aspects of semiconductor manufacturing, affecting productivity and yield.  

The SEMI E176 Standard, "Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment," addresses this issue. This document provides practical, actionable guidance on establishing an acceptable EMI environment in semiconductor processes: from assessing the EMI environment to EMI mitigation to verification. SEMI E176 sets recommended EMI limits for different process categories. The Standard can benefit every stage of the semiconductor process and electronic assembly.  
 

Who Should Attend:

  • Semiconductor Device Manufacturers
    • Manufacturing and Quality Directors
    • Department and Production Managers
    • Line Supervisors
    • Sales: VP and Managers
  • Equipment Manufacturers
    • Director-Level and VP Engineering and QA
    • Engineering Department Managers
    • Sales: VP and Managers (customer satisfaction)

 

Meet the Instructor

Vladimir Kraz

 

 

 

 

 

Vladimir Kraz, President, OnFILTER

Biography

 

 

SEMI HQ
CA
United States

1. Overview of SEMI and SEMI Standards
- SEMI as a resource for your company

2. EMI and EMC - an overview

3. Effect of EMI on processes and equipment
- EMI and Electrical Overstress
- Equipment precision
- Process variations
- Other problems

4. Sources and propagation of EMI

5. Overview of SEMI E.33
- Emphasis on Table 1: Compliance Assignment/Responsibility Table

6. Overview of SEMI E.176

7. Basics of a viable EMI program at a factory based on SEMI E.176
- Purpose
- Structure
- Resources and budget
- Similarity and synergy with already-existing ESD program

Standards

Join us for a hybrid experience with both in-person and virtual attendance options.

4:00 pm - 5:00 pm Off Add to Calendar 2023-12-18 16:00:00 2023-12-18 17:00:00 EMI and EOS Management Course Join us for a hybrid experience with both in-person and virtual attendance options. SEMI HQ CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register now
Event format

Registration

Registration for this workshop is free.

For questions, please contact Mayura Padmanabhan at [email protected].

 

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Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Cybersecurity workshop new location Business Executive Technical
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SEMI Cybersecurity Launch Workshop

Join us for a 2-day working session to align our industry on concrete next steps to secure semiconductor manufacturing against an ever-evolving threat environment. With our complex and interconnected supply chains, no single company can be safe unless all companies are safe. Our consortium of device makers, foundries, equipment makers, component suppliers, and software suppliers are working together to rapidly develop a practical plan to improve security now, and for years to come while minimizing costs and avoiding duplication.

 

Who should attend:

• Device makers • Foundries • Tool suppliers • Component makers • Software suppliers ​and CISOs • Executives • Decision-makers • Managers • Security professionals

Intel - SC12 - Santa Clara 12
CA
United States

Day 1: December 6, 2023 - Noon - 7 pm PT

12:00 pm - 7:00 pm

• Consortia governance, structure, deliverables, and roadmap for 2024
• E187 SEMI Standard implementation ideation session
• Develop a method to survey, evaluate, and certify manufacturing equipment cybersecurity protections
• Globalization of SEMI Taiwan’s E187 reference architecture and checklist

Day 2: December 7, 2023 - 8 am - 3 pm PT

8:00 am - 3:00 pm

• Opportunities for collaboration and information sharing for cyber threats and incidents
• Supply Chain Cybersecurity working session
• Create a semiconductor industry-specific framework to measure security and implementation approach across the entire ecosystem
• Review NIST industry profiles and evaluate for suitability in semiconductor
• Next steps: Including forming working groups and assigning leaders

- Standards

Join us for a 2-day workshop aimed at developing and advocating a practical, standards-based, industry-wide approach to improving cybersecurity and resilience across the semiconductor supply chain.

Time:

Day 1: Noon - 7 pm PT

Day 2: 8 am – 3 pm PT

In-person registration has reached capacity. However, you can still register to participate online.

 

Off Add to Calendar Disabled America/Los_Angeles Register now
Event format

SANTA BARBARA, CA – September 1, 2023 – Sikama International Inc., in collaboration with AirProducts Inc.™, is proud to announce the full commercial launch of its acid-free Electron Attachment (EA) Fluxless Reflow Soldering System, a revolutionary step for the Advanced Packaging Semiconductor sector.

The innovative technology behind this system is based on the Electron Attachment (EA) principle for activating hydrogen, a method that AirProducts has been refining for the past 15 years to efficiently reduce surface oxides. The EA technology is engineered to break down H₂ molecules into hydrogen anions, which are then targeted towards the soldering surfaces to effectively clean and reduce oxides before the reflow process. Additionally, this technology operates at ambient pressure and temperatures well within the window of traditional reflow processes.

The key advantages of this technology include:
• Truly Residue-Free: Enhanced reflow quality without flux-induced solder voids and wafer contamination. No post-reflow cleaning equipment is required and significantly less oven cleaning.
• In-line Process: Easily integrated into existing manufacturing lines without batch processing. The EA process occurs immediately before the reflow process.
• Environmental Impact: The EA flux-free process is entirely residue-free and environmentally benign with no organic vapors, hazardous residues, or CO2 emission.
• Ambient Pressure and sub-reflow temperatures: No vacuum requirements and safely processes substrates.

Sikama, as the exclusive global integrator of this technology and partner with AirProducts, views the technology and equipment commercialization as “a game-changer for this industry, as the need for advanced solutions to packaging evolutions in the semiconductor industry continue to evolve”, according to Herb Weigel, President and CEO of Sikama International.

The Sikama EA1200 Solder reflow oven is certified to EN 600204-1, SEMI S2/S8/S22/S23/F47/E6, is CE certified, and is verified to be compliant with NFPA79 in installed applications. Nearly 50 Worldwide Patents have been issued on this technology. The technology is well suited to provide significant benefits to small geometries in wafer bumping, copper pillar, and flip chip applications.

Established in 1982, Sikama International, Inc. designs and produces its products in Santa Barbara, California. Their reflow system offerings provide exceptional performance, with the fluxless systems set to redefine industry standards.

Reliable. Repeatable. Responsible. Reflow.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

Sikama International, a trusted provider of state-of-the-art reflow systems is proud to announce their new partnership with CMT, a global leader specializing in back-end semiconductor solutions.

CMT was formed in August 2010 by Mr. CW Kwak, who has over 30 years experience in the semiconductor industry. CMT offers both material and equipment solutions in the back-end semiconductor assembly market.

CMT is a unique global marketing and sales company. CMT focuses on a micro-level marketing working directly with clients and customers through offering specific projects, right beta sites, and global project management. CMT focuses on short-term projects to deliver sales on client’s current products, then offers mid-term projects for next 2-3 years, and long-term programs 5-10 years out to deliver continuous long-term growth and sustainability.

Sikama’s new partnership with CMT will enable both companies to expand their reach to provide customers with an expansive range of solutions on a global platform.

About Sikama
For over 40 years, Sikama International has offered highly reliable equipment and is the trusted option of manufacturers worldwide.

Wooptix SL, a company based in Tenerife, Madrid and San Francisco, has announced the signing of a 10-million-dollar Series B financing round. The round includes participation by: Bullnet Capital, CDTI (Centre for the Development of Technology and Innovation), Danobatgroup, European Innovation Council Fund (EIC), Fagor Automation, Intel Capital, Mondragón Promotion and Tel Ventures.

The company is focused on commercializing semiconductor metrology equipment incorporating wavefront phase imaging. “Phemet®, the system developed by Wooptix, measures the silicon wafer warpage, and its accuracy is a “significant advance in the industry,” affirms José Manuel Ramos, Founder and CEO of the company.

Wooptix's patented technology enables blank and patterned wafer-shape measurement in less time and with higher resolution than current systems being used in the industry. "Wooptix's wavefront sensor and its semiconductor applications are generating interest from key players in the semiconductor industry as evidenced by the Series B financing round,” explains Javier Elizalde, Co-founder and COO.

The company has been recognized as well by the EIC Accelerator Program through a 2.5M€ grant in addition to the equity investment. The grant and investment support Wooptix's product introduction and future technological innovation including the manufacture, delivery, and installation of three semiconductor metrology tools in Japan, the USA and the Netherlands this year.

"Keeping in mind that each Phemet® is only a metric ton weight, together with the sensitivity of the instrument components that enable measurements at the nanometer scale, Wooptix demonstrates a world-class engineering and operations capability,” continues Elizalde.

Next steps
Wooptix has a well defined roadmap for each product line to meet the needs of lab and fab customers. In the case of the semiconductor metrology business unit, the next step is to automate Phemet®. Enhanced automation will reduce risk of contamination of wafers under measurement and provide consistent reproducibility to the system. Due to the flexibility of Wooptix’s design, another step is to integrate Phemet® into existing semiconductor equipment platforms from tool vendors.

Phemet® and the Series B financing round demonstrate Wooptix’s growth and maturity as it begins initial tool deliveries to customers. "It is really valuable for us to transition now from an R&D company to become a product and manufacturing company. With this objective in mind, we are building the necessary infrastructure, including procedures and certifications to protocols and management teamwork, to support customers as we enter the market," explains José Manuel Ramos.

Semiconductor Equipment Industry in Numbers
According with SEMI (the global semiconductor industry association) the semiconductor equipment sales forecast for 2023 is $87 billion. "The semiconductor equipment market will see a strong rebound in 2024,” said Ajit Manocha, SEMI President and CEO. "Projections for robust long-term growth driven by high-performance computing and ubiquitous connectivity remain intact.”

As reported by SEMI, the wafer fab equipment segment is projected to account for the bulk of the recovery to $100 billion in 2024, generating $87.8 billion in sales, a 14.8% increase.

About Wooptix
Wooptix is a leader in semiconductor metrology through wavefront phase imaging, a technique derived from adaptive optics research in astronomy. With a multidisciplinary team, Wooptix aims to disrupt the semiconductor metrology industry with the highest lateral resolution and fastest measurement technique for inline fab measurements.

The company has developed Phemet®, a wafer shape lab tool for blank and patterned wafers, ahead of the upcoming fully automated fab tool, expected in 2024. Wooptix has already deployed Phemet® at several customer sites worldwide.

Wooptix is based at Tenerife, Madrid (Spain) and San Francisco (USA).

PENANG, MALAYSIA - AUGUST 2023 ViTrox, which aims to be the world’s most trusted technology company, is excited to announce its first-ever participation in ELEXCON Shenzhen 2023, one of the influential trade shows in Southern China, at Hall 9, Booth #9G17 in Shenzhen Convention & Exhibition Center (SZCEC), China from 23rd to 25th August 2023.

ViTrox will be showcasing its latest Back-end Semiconductor Inspection Solutions, which are the Tray-Based Vision Handler – TR3000i and the Post Seal Vision Handler – VR20i G2 during the event.

Introducing the Tray-to-Tape & Reel Vision Inspection Handler –TR3000i, the cutting-edge solution tailored for 5G, IoT, Automotive, and Industry 4.0 industries. Its high-resolution 6-sided vision system ensures comprehensive inspections, supporting sizes from 1.8x1.8mm to 130x130mm without conversion. The TR3000i's robust handling features auto-pitching, tape width conversion, 8 active approaches for Smart Taper Precision, and up to 3x14 pick-and-place nozzles. With additional hardware configurations like the Smart Reel Changer, Auto Nozzle Changer, AUX Tray, and Extended Track, it guarantees high efficiency and high throughput. Fully automated and A.I.-powered, it optimises production yield, setting new standards for efficiency, connectivity, and precision in emerging industries.

ViTrox’s Post Seal Vision Handler – VR20i G2 is a game-changer in reel-to-reel inspection. Designed for tape widths from 8mm to 32mm, it features advanced visual inspection capabilities and automated mechanisms for track and dummy reel width adjustment, ensuring precise component handling. The system supports various package types with multiple vision inspections, enabling comprehensive and high-quality results. With dual-track to improve productivity, it enhances throughput by processing over 130K UPH for a 2mm pocket pitch and 80K UPH for a 4mm pocket pitch, while fast changeovers for different carrier tapes minimise downtime. The VR20i G2 guarantees maximum efficiency, reduces human error, and greatly reduces the return on investment (ROI) period, making it the ideal solution to automate your final gate inspection.

Start your productivity-boosting journey with ViTrox's advanced solutions! Secure an appointment to meet our technical experts and experience live product demonstrations by clicking the registration link. If you want to know more about our solutions, feel free to reach out to us at [email protected]. Get ready to take your productivity to the next level!

Registration Link: https://wj.qq.com/s2/12764140/8c87/

About ViTrox Technologies
ViTrox is committed to being the World’s Most Trusted Technology Company and the leading solutions provider through the most innovative, advanced, and cost-effective machine vision solution of excellent quality to its customers by integrating ViTrox’s technologies, people, and strategic alliances.

ViTrox offers a full spectrum of solutions, ranging from Middle & Back-end Semiconductor Inspection Solutions, SMT PCB Assembly Vision Inspection Solutions, Electronics Communication Systems, and Industry 4.0 Manufacturing Intelligence Solutions. ViTrox is headquartered in Penang, Malaysia, with offices in Asia, Germany, and the United States and sales and support sites worldwide.

For more information about ViTrox’s products and services, please visit www.vitrox.com.

Dresden, 21 June 2023. On 19 June, Masao Hodai, Chief Operating Officer of EBARA Precision Machinery Company Tokyo, visited EBARA’s German site in Dresden-Weixdorf. After a welcome by Dr Reinhart Richter, Managing Director of EBARA Precision Machinery Europe, an informative tour followed, during which Masao Hodai inspected the Overhaul Centre for vacuum pumps, built in 2021, the warehouse, the training facilities currently being built, and representatives from the most important product divisions. A joint lunch with members of Dresden’s staff rounded off his visit.

Strong signal for the Dresden location
“The visit of COO Masao Hodai reinforces our location within the Silicon Saxony region and shows the significant status of the semiconductor industry in Dresden for EBARA’s headquarters in Japan. Our progress in terms of safety, quality, CO2 reduction and market acquisition has made a deep impression. All EBARA employees in Dresden feel very honoured by this visit from Japan”, said Dr Reinhart Richter, happily. In the afternoon, in-depth client meetings were on the agenda at the Dresden site before Masao Hodai returned home to Tokyo.

About EBARA
EBARA Precision Machinery Europe (EPME) GmbH, headquartered in Sauerlach near Munich, is the European sales and service company of EBARA Corporation Tokyo. EBARA is a leading global manufacturer of vacuum and semiconductor systems used to produce wafers, liquid crystals, solar cells and other high-tech products. EBARA Corporation was founded in 1912 by Issey Hatakeyama and employs over 19,000 people worldwide. With an annual turnover of 4.7 billion euros, EBARA is one of the largest companies in the industry. EBARA supplies 16 of the top 20 manufacturers in the chip industry.

About EBARA Precision Machinery Europe
The EPME portfolio includes dry and turbomolecular vacuum pumps as well as modern gas abatement systems for the chemical industry, for example. In addition, EPME distributes state-of-the-art CMP tools, wafer bevel polishing and substrate coating systems for chip manufacturing. In 2021 EBARA opened its second modern overhaul centre for vacuum pumps in Dresden. EPME has been operating a vacuum pump overhaul centre in Livingston (UK) since 1993. EPME employs over 250 people in Europe and Israel.
Photo: EBARA / Tommy Halfter

Virginia Beach, Virginia - Busch Vacuum Solutions, a leading provider of reliable solutions for SubFab Management, is proud to exhibit at this year's SEMICON West show and conference. As a reliable partner for vacuum pumps, gas abatement systems, leak detection and more, Busch provides the semiconductor industry with the highest quality solutions and services.

At SEMICON West, Busch is showcasing their comprehensive subfab management services. Critical SubFab systems are monitored and predictively maintained by Busch. Their SubFab management minimizes production downtime and enables energy-efficient operation and cost savings. Continuous monitoring extends maintenance intervals and the entire product life cycle. All Busch on-site service teams are certified to ISO9001:2016, ISO14001:2016 and ISO45001:2018 standards.

"We are proud of our comprehensive solutions for the semiconductor industry," said Mark Magill, Vice President of Medium High Vacuum at Busch Vacuum Solutions. "SubFab service capabilities and innovative products provide customers with reliable performance and maximum process safety to achieve optimal yields."

Magill also said they are featuring a new patented redundancy vacuum system at the show, “It uses an optimized combination of two pumps plus one booster to minimize changes in chamber pressure in case of pump failure.” This vacuum system eliminates wafer scrap and process excursion.

Visit Busch Vacuum Solutions at SEMICON WEST from July 11-15 in San Francisco, CA. Meet their experienced vacuum experts, exchange ideas and get valuable advice at booth #541.

About Busch
For more than 50 years, Busch has been an integral part of the global semiconductor industry by providing reliable solutions that enable manufacturers to produce advanced microchips. Their commitment to quality is in every product they offer and service provided. Continuous advancements ensure that Busch solutions are always state-of-the-art and used by hundreds of subfabs worldwide. www.buschusa.com | [email protected]

PEER Group® has announced an upcoming webinar designed to help semiconductor equipment manufacturers prepare for the increasing demand from backend factories for automation capabilities and SEMI® Standards compliance in assembly and test processes.

Taking place on June 22, 2023, at 1:00 p.m. ET/11:00 a.m. MT, the webinar, Standardizing the Assembly and Test Process, will feature an in-depth discussion between Jason Cicero, Micron Technology’s Senior IT Domain Architect, and PEER Group’s Director of Marketing, Doug Suerich.

Topics covered will include: why the backend, including assembly and test, needs more automation and standardization, how this will impact equipment design and integration, common issues faced by factories when integrating new tools, and how equipment suppliers can help solve these issues. There will also be a live Q&A for attendees to ask questions during the webinar.

“The SEMI Standards Program has been around for more than 40 years,” says Suerich. “During that time, these standards have evolved into the guiding principles which ensure compatibility and interoperability across suppliers and factories, improving manufacturing productivity, quality, and reliability, and reducing the cost and pain of integrating new equipment onto the factory floor. Universally adopted in the frontend, we are starting to notice increasing demand from factories to implement standards in the backend, including assembly and test processes.”

Evidence of this shift is seen as major players in the frontend enter the assembly and test market while established facilities announce major capital investments into their operations. This expansion introduces new, high-value processes to assembly and test and closer integration with the frontend – both of which are enabled through the application of standards. Meanwhile, the SEMI Advanced Backend Factory Integration task force continues to investigate and promote the adoption of SEMI Standards for assembly and test.

The webinar is scheduled to last 30 minutes followed by a 15-minute Q&A. All registrants will have the opportunity to access a recording of the webinar. For more information, including how to register, visit: https://bit.ly/3mq2yf3

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. A multi-award winning company, PEER Group has been named a Best Workplace by Great Place to Work Canada 11 times, and most recently was one of six recipients of Intel’s 2022 EPIC Outstanding Supplier Award, which recognizes the absolute top performers in the Intel supply chain. Follow PEER Group on LinkedIn and Twitter at @PEERgroup_Inc..