MILPITAS, Calif. – October 10, 2019 – SEMI, the global industry association representing the electronics design and manufacturing supply chain, today announced the 2019 release of the Heterogeneous Integration Roadmap (HIR). Designed to stimulate pre-competitive collaboration in order to advance heterogeneous integration technology development and accelerate electronics innovation, HIR provides a long-term vision for the electronics industry, identifying future technology requirements and potential solutions. SEMI is among five HIR sponsors.

SEMI members across the global electronics supply chain integrate separately manufactured components into assemblies to enhance electronics system functionality across a multitude of applications. The heterogeneous integration of wireless and mixed signal devices, bio-chips, power devices, optoelectronics and microelectromechanical systems in a single package places new requirements on the electronics industry as these diverse components are introduced into System-in-Package (SiP) architectures for the tremendous array of industries where electronics are used.

The HIR offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of heterogeneous integration technology requirements to spur collaboration over the next 15 years. In addition, the HIR delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research and development timelines.

"The broad industry support for the HIR is a clear mandate for us to stay ahead of the innovation curve and identify barriers that could slow the pace of growth in the electronics industry,” said Ajit Manocha, president and CEO of SEMI. “SEMI is firmly committed to support and connect the HIR with our members worldwide for long-term technology guidance and industry validation.  HIR and other collaborations spanning the full supply chain are vital to identifying technology needs and ensuring the microelectronics industry thrives well into the future.”

“Today, we are seeing emerging technologies – such as AI, 5G, cloud, edge and data center, autonomous vehicles and wearable technology – that hold great promise for improving the lives of individuals across the globe,” said William Chen, chair of the Heterogeneous Integration Roadmap and ASE Fellow. “The HIR, with its broad input from industry and academia, represents an invaluable resource that sets the course for continued electronics industry growth, greater technology innovation and enhanced performance of devices across a wide variety of applications that can bring increased benefits to humanity.”

“When you consider the scope of the HIR, the numerous application domains it addresses, and the level of valued input from a wide range of global stakeholders, it’s clear that there is a strong commitment to advance the entire electronics ecosystem,” said Ravi Mahajan, Intel Fellow, High Density Interconnect Pathfinding, Intel Corporation, and IEEE, ASME Fellow. “Today’s innovators, as well as future technologists, are encouraged to leverage the extensive, informative guidance contained within the HIR and actively participate in its future evolution.”

The 2019 edition of the Heterogeneous Integration Roadmap includes 22 chapters and can be downloaded by visiting the SEMI HIR web page. Chapters currently under peer review will be made available upon final approval.

The HIR is sponsored by the IEEE Electronics Packaging Society (EPS), SEMI, the IEEE Electron Devices Society (EDS), the IEEE Photonics Society and The American Society of Mechanical Engineers (ASME EPPD Division). Stakeholders interested in contributing to the 2020 HIR can join the effort by visiting the roadmap’s member page.

Learn more about SEMI and the institutional sponsors of the HIR by visiting the organizations’ websites: IEEE EPS, IEEE Photonics, IEEE EDS, ASME, and SEMI.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about 2019 Heterogeneous Integration Roadmap Released; Identifies Long-Term Technology Requirements to Speed Innovation

GRENOBLE, France – October 1, 2019 –SEMI today announced Alertgy and Okmetic Oy as winners of the SEMI MEMS & Imaging Sensors Summit Technology Showcase. The Alertgy non-invasive glucose monitor was crowned the best imaging technology, and the Okmetic Oy silicon substrate manufacturing platform was the winning MEMS technology. Attendees voted for the top technology in each category among 10 finalists selected by a committee of industry experts.

“MEMS and sensors breakthroughs are delivering profound benefits, making cars safer, food healthier and air cleaner while providing numerous societal benefits through advances in healthcare," said Laith Altimime, president of SEMI Europe. "The electronics industry celebrates innovations such as those presented by Alertgy and Okmetic Oy as SEMI initiatives like the Technology Showcase help our members speed innovation through collaboration.”

The Technology Showcase honors standout applications enabled by MEMS and imaging sensors technology. SEMI recognized this year’s winners at the MEMS & Imaging Sensors Summit gala dinner at Chateau de Sassenage. The awards were presented by Altimime and Carmelo Sansone, director of the MEMS and Sensors Industry Group at SEMI.

Imaging Sensors Technology Winner

– Impedance/Dielectric Spectrum Imaging System for Non-Invasive Continuous Glucose Monitor (NICGM) for Diabetics. Alertgy combines proprietary dielectric materials and signal processing/extraction to detect unique chemical signatures related to blood glucose levels – all in a tiny, non-invasive platform suitable for integration in smart watches and other wrist-worn wearables. The technology was presented by John Hubert, VP of Engineering at Alertgy on behalf of Marc Rippen, founder and president of Alertgy.

MEMS Sensors Technology Winner Okmetic Oy – Industrial Patterning Platform for Value-added Si Substrate Manufacturing. The Okmetic platform advances the reliability, quality and performance of silicon-based devices. The platform is designed for MEMS, sensor and photonics applications requiring buried cavities, poly-Si filled through-silicon via (TSV) connections, or patterned multi-layer SOI design. The platform was presented by Päivi Sievilä, customer support engineer at Okmetic Oy.

The award and conference, organized by SEMI, are offered each year for companies across a range of sectors from Internet of Things (IoT) and consumer electronics to robotics and biomedical equipment. Winners receive a free exhibition booth for the following year’s event.
The MEMS & Imaging Sensors Summit returns to Grenoble, France, 23-25 September 2020.

Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #SEMIEurope

Premier Sponsors

• Platinum Sponsor: Beneq, STMicroelectronics
• Gold Sponsors: ASE Group, LAM Research and SUSS MicroTec Group
• Silver Sponsors: Amec, EV Group, SPTS Technologies and Ushio
• Event sponsors include: FujiFilm, Invest In Grenoble-Alps, JSR Micro N.V., Merck KGaA, Darmstadt, Germany, OnScale, SUSS MicroTec Group and Ushio

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Press Contact
Serena Brischetto/SEMI Europe
Email: [email protected]

• Read more about Alertgy and Okmetic Oy Win for Top MEMS and Imaging Sensors Innovations at Technology Summit

TOKYO – October 1, 2019 – Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.

Japan supplies one third of semiconductor equipment and more than half of all materials to the global semiconductor manufacturing industry. With Japan in the heart of the semiconductor supply chain, and leading-edge technologies such as artificial intelligence (AI), Internet of Things (IoT) and machine learning promising to transform the way we live and work, SEMICON Japan 2019 will focus on how chip advances are Enabling a Smarter World.

SEMICON Japan is the gathering place to connect the people, technologies and businesses across the electronics manufacturing supply chain. Representing segments stretching across the value chain, industry visionaries will present at SEMICON Japan’s SuperTHEATER in seven keynote forums, all with simultaneous English-Japanese translation.

Opening Keynotes

	Makiko Eda, Chief Representative Officer, World Economic Forum
	Nandan Nayampally, Vice President and General Manager, Immersive Experience Group, Arm

Semiconductor Executive Forum

	Terushi Shimizu, Representative Director and President, Sony Semiconductor Solutions
	Atsuyoshi Koike, President, Western Digital Japan

Manufacturing Innovation Summit

	Raman Achutharaman, Group VP, Head of Strategy for Semiconductor Products, General Manager for Etch Products, Semiconductor Group, Applied Materials
	Ben Tsai, CTO, EVP Corporate Alliances, KLA
	Kazuo Ushida, Representative Director and Chairman of the Board, Nikon
	Akihisa Sekiguchi, Deputy Division General Manager, Alliance Strategy GM, Corporate Innovation Division, Tokyo Electron
	Dan Hutcheson, CEO and Chairman, VLSIresearch (moderator)

Other SEMICON Japan 2019 Program Highlights

• SMART Connectivity Forum on 5G mobile communication innovations
• SEMI Market Forum on the semiconductor supply chain market recovery
• SMART Transportation Forums on the latest autonomous driving technologies and flying car research and development in Japan and the United States
• SMART Workforce TECH CAMP hackathon presentation

SEMICON Japan Sponsors

• Platinum sponsors include Disco, Hightec Systems, Hitachi High-Technologies, Screen Semiconductor Solutions, and Tokyo Electron.
• Gold sponsors include Advantest, Applied Materials, Ebara, JSR, Kokusai Electric, Lam Research, Nikon, Tokyo Seimitsu, and Tokyo Weld.
• Arena Stage Sponsors include Hitachi Chemical, THK and Tokyo Electron.

For more information and to register, please visit the SEMICON Japan website.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Mayumi Amagai
Phone: 81-3-3222-5801
Email: [email protected]

• Read more about SEMICON Japan 2019 to Spotlight Smart Technology, Innovation, Promise of Smarter World

MSIG MEMS & Sensors Executive Congress – October 22-24, 2019, Coronado, Calif.

MILPITAS, Calif. – September 30, 2019 – Highlighting the world’s first DNA search engine, 4D LiDAR for autonomous vehicles, wearable biosensors for healthcare and other innovations, MEMS & Sensors Industry Group, a SEMI Strategic Association Partner, today announced Technology Showcase finalists for the 15th annual MEMS & Sensors Executive Congress (MSEC), October 22-24, 2019 at Coronado Island Marriott Resort & Spa in Coronado, Calif.

Selected by a committee of industry experts, the Technology Showcase finalists will demonstrate novel MEMS and sensors applications in a competition for audience votes at MSEC, the premier North American business conference for executive decision-makers in the MEMS and sensors supply chain. Registration is now open with discounted pricing for SEMI members.

The MSEC Technology Showcase amplifies awareness of the latest MEMS and sensors technologies and applications to enable new business connections and deals for finalists.

“Winning the MSEC Technology Showcase in 2018 made a major difference in our business,” said Marc Rippen, founder and CEO of Alertgy. “The recognition generated significant interest in Alertgy, resulting in several strategic investors who are now tracking the company.”

MSEC 2019 Technology Showcase Finalists

MSEC Premier Sponsors

• Platinum: EV Group
• Gold: SPTS Technologies, a KLA Company
• Silver: LAM Research and ULVAC
• Bronze: AMEC and Applied Materials

Event sponsors include: GE, mCube, Microtech Ventures, Okmetic, OnScale, Rogue Valley Microdevices, Silex Microsystems, SUSS MicroTec and Teledyne DALSA

For more information, including the complete event agenda, please visit the MSEC website. 
Stay in touch on Twitter: @MEMSgroup @SEMI #SEMI_MSEC

About MEMS & Sensors Executive Congress
Hosted by MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner, MEMS & Sensors Executive Congress (MSEC) is the longest-running U.S. event where industry executives can exchange ideas and information about MEMS and sensors in commercial applications while networking with partners, customers and competitors.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Press Contacts
Michael Hall, SEMI
Email: [email protected]

Maria Vetrano, Vetrano Communications
Email: [email protected]

• Read more about MEMS & Sensors Executive Congress Technology Showcase Finalists Highlight Innovations in Automotive, Biomedical and Consumer Electronics

TAIPEI, Taiwan – September 30, 2019 – Energy Taiwan, the largest renewable energy event in Taiwan connecting the global green energy supply chain, will gather more than 60 experts from industry, government and academia for insights on the latest technologies and business opportunities in solar photovoltaic, offshore wind power, hydrogen energy, smart energy storage, and green finance and insurance. Hosted by SEMI and the Taiwan External Trade Development Council (TAITRA), Energy Taiwan is expected to draw more than 12,000 visitors and 10,000 buyers from Taiwan and abroad to the Taipei Nangang Exhibition Center, Hall I, October 16-18, 2019.

“The Taiwanese government is a critical partner as SEMI continues to support Taiwan's renewable energy industry through international exhibitions, forums, policy initiatives and business matching events,” said Terry Tsao, Chief Marketing Officer at SEMI and President of SEMI Taiwan. “Together, we are working to transform and grow Taiwan's green energy industry to protect and preserve the environment.”

Bringing together 165 exhibitors from 11 countries at more than 600 booths, Energy Taiwan will feature three theme pavilions:

• Pavilion of Standards, Testing and Certification
• Taiwan Premium Solar Power System Pavilion
• Green Finance and Insurance Pavilion

Three European pavilions – Germany, Denmark and the Netherlands – will promote the exchange of renewable energy technologies and resources between Taiwan's domestic suppliers and international players. The pavilions will be hosted by the German Trade Office Taipei, the Flanders Investment and Trade - Taipei of Belgium, and the Netherlands Trade and Investment Office.

To promote green energy government policy, SEMI and the Green Energy Industry Promotion Center will hold the Global Renewable Energy Supply Chain Summit. Green power industry experts and opinion leaders from the National Renewable Energy Certification Center, Taiwan Institute of Economic Research, Microsoft, and leading solar energy companies such as TSEC and Sinogreenergy will share insights on the future of green energy policies, market trends and application development strategies.

Energy Taiwan is held in conjunction with PV Taiwan, Wind Energy Taiwan, HFC Taiwan, and Smart Storage Taiwan during Renewable Energy Week, sponsored by the Bureau of Energy under the Ministry of Economics and SEMI. Renewable Energy Week will highlight the achievements of green energy policies implemented in 17 counties and cities in Taiwan.

Also during Renewable Energy Week, some of the most influential wind power developers in Taiwan including Swancor, Northland Power (NPI), Yushan Energy, Ørsted, Copenhagen Infrastructure Partners (CIP), wpd Taiwan Energy and Macquarie Capital will showcase their technical strengths in developing offshore wind power.

Demonstrating the power of the green movement worldwide, multinational technology giants including Apple, Samsung, 3M, Microsoft, Google, and Facebook have all joined RE100, a global corporate leadership initiative that brings together influential businesses committed to 100 percent renewable electricity by 2050.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Emmy Yi
E-mail: [email protected]
Tel: +886.3.560.1777 ext. 205

Eileen Lin
E-mail: [email protected]
Tel: +886.3.560.1777 ext. 288

• Read more about SEMI, Taiwan Government Team to Connect Global Green Energy Supply Chain at Energy Taiwan

MILPITAS, Calif. ─ September 30, 2019 ─ Total wafer shipments in 2019 are expected to decline 6 percent from last year’s historic high, with growth resuming in 2020 and shipments reaching a new high in 2022, according to SEMI’s annual semiconductor industry silicon shipment forecast.

Forecast demand for silicon units through 2022 shows polished and epitaxial silicon shipments totaling 11,757 million square inches in 2019, 11,977 million square inches in 2020, 12,390 million square inches in 2021, and 12,785 million square inches in 2022 (see table below).

“Silicon shipment volumes are expected to decline this year as the industry works through accumulated inventory and weaker demand,” said Clark Tseng, director of Industry Research and Statistics at SEMI. “The industry is expected to stabilize in 2020 and regain growth momentum in 2021 and 2022.”

2019 Silicon* Shipment Forecast (MSI = Millions of Square Inches)

*Total Electronic Grade Silicon Slices – Excludes Non-Polished Wafers
*Shipments are for semiconductor applications only and do not include solar applications.
Source: SEMI (www.semi.org), September 2019

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or chips are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers and epitaxial silicon wafers shipped by the wafer manufacturers to the end-users. Data do not include non-polished or reclaimed wafers.

More information on the SEMI Worldwide Silicon Wafer Shipment Statistics is available here.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Total Wafer Shipments to Drop 6 Percent in 2019, Resume Growth in 2020, Set New High in 2022, SEMI Reports

MILPITAS, Calif, and ALBANY and UTICA, NY – September 23, 2019 – SEMI, the global industry association representing the electronics manufacturing and design supply chain, and SUNY Polytechnic Institute today announced that they have been awarded a $6 million grant from the National Science Foundation (NSF) to fund workforce development initiatives for the microelectronics manufacturing industry. The funding, to be provided over three years, will support the development and implementation of a semiconductor workforce certification program designed to meet the industry’s most pressing needs.

The certification program will be part of SEMI Works™, SEMI’s groundbreaking, industry-driven initiative to grow the talent pipeline for the electronics manufacturing industry. The NSF grant will fund a pilot program that includes a unified competency model, course curriculum, web portal, and engagement with industry and training providers. The project is funded by the NSF’s Advanced Technological Education (ATE) program, whAich focuses on educating technicians for the advanced-technology fields that drive the nation's economy.

SUNY Poly, with campuses in Albany and Utica, New York, will administer the grant and serve as the academic partner for the program. A recognized leader in semiconductor-related technology development and education, SUNY Poly brings to the program strengths in working with business to develop programs for training semiconductor industry technicians. The NSF funding will enable SUNY Poly to scale its high-tech-centered courses and bolster its support of technology companies in the Albany and Utica, New York region and beyond. The pilot will enable the region to better support STEM education and technology career pathways across K-12, higher education, and adult training.

The pilot program will first focus on SEMI’s efforts to engage industry in developing a talent competency model based on skills the semiconductor industry needs most. SUNY Poly will then leverage the model to build technician-level course curriculum for area community colleges and mechatronics programs. Students completing the courses will receive technician certifications as credentials, endorsed by SEMI, for working in the semiconductor industry.  

“The talent shortage is the most critical issue confronting the semiconductor industry today,” said Ajit Manocha, president and CEO of SEMI. “We are thrilled to partner with the NSF and SUNY Poly in this vitally important step to build a workforce that will continue to drive innovations that are transforming the world and our lives. Our engagement with SEMI members across the electronics manufacturing supply chain will ensure that job education and training meet the needs of advanced manufacturing. We look forward to establishing a regional talent development program that we can scale to grow the talent pipeline.”

“This award is just one part of NSF’s broad portfolio of programs helping to prepare the workforce of the future,” said Dr. Karen Marrongelle, head of the Directorate for Education and Human Resources at the NSF. “Providing well-trained technicians for advanced manufacturing of electronics is critical to maintaining U.S. leadership in the semiconductor industry. We are thrilled that SEMI has joined forces with SUNY Poly to provide direct industry input into this certificate program – a great way to keep technical education aligned with their industry’s workforce needs.”

“SUNY Poly is proud to partner with SEMI and the NSF to address persistent workforce concerns in the high-tech industry by enabling access to qualified talent that has the skills required for success in growing innovation-focused fields,” said Dr. Grace Wang, Interim President of SUNY Poly. “As the first region in the U.S. to develop this certification with SEMI, we are thrilled to work alongside industry and government to contribute to the health of the future talent pipeline in New York State, across the United States, and around the globe, while maintaining our region’s leadership in the development of a 21st century high-tech workforce.”

“We are very excited to be partnering with SEMI and the National Science Foundation on this program,” said Professor of Nanoscale Science Dr. Robert Geer, who leads the SUNY Polytechnic research project. “Working with SEMI on this first-of-its kind certification to strengthen the 21st century high-tech workforce will allow our region’s undergraduate college students to be perfectly positioned to pursue outstanding STEM-related careers. As a result, they will be highly sought after – and uniquely qualified – to thrive in cutting-edge semiconductor and electronics systems technology fields, including AI, power electronics, integrated photonics, and computer chip manufacturing at SEMI member companies, as well as others. We are pleased to pursue educational and workforce development solutions that will have a positive impact, reverberating around the world.”

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

About SUNY Polytechnic Institute (SUNY Poly)

SUNY Poly is New York’s globally recognized, high-tech educational ecosystem. SUNY Poly offers undergraduate and graduate degrees in the emerging disciplines of nanoscience and nanoengineering, as well as cutting-edge nanobioscience programs at its Albany campus, and undergraduate and graduate degrees in technology, including engineering, cybersecurity, computer science, and the engineering technologies; professional studies, including business, communication, and nursing; and arts and sciences, including natural sciences, mathematics, humanities, and social sciences at its Utica campus; thriving athletic, recreational, and cultural programs, events, and activities complement the campus experience. As the world’s most advanced, university-driven research enterprise, SUNY Poly boasts billions of dollars in high-tech investments and hundreds of corporate partners since its inception. For information visit www.sunypoly.edu.

About the National Science Foundation

The National Science Foundation (NSF) is an independent federal agency that supports fundamental research and education across all fields of science and engineering. In fiscal year (FY) 2019, its budget is $8.1 billion. NSF funds reach all 50 states through grants to nearly 2,000 colleges, universities and other institutions. Each year, NSF receives more than 50,000 competitive proposals for funding and makes about 12,000 new funding awards.

SEMI Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

SUNY Polytechnic Institute Contact
Steve Ference/SUNY Poly
Phone: 1.518.956.7319
Email: [email protected]

National Science Foundation Contact
Public Affairs
Phone: 703.292.7090
Email: [email protected]

• Read more about SEMI, SUNY Poly Awarded $6 Million National Science Foundation Grant for Pilot Program to Grow Electronics Industry Talent Pipeline

MILPITAS, Calif. — September 19, 2019 — North America-based manufacturers of semiconductor equipment posted $2.00 billion in billings worldwide in August 2019 (three-month average basis), according to the August Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.4 percent lower than the final July 2019 level of $2.03 billion, and is 10.5 percent lower than the August 2018 billings level of $2.23 billion.

“August billings of North American equipment manufacturers declined one percent relative to July levels,” said Ajit Manocha, president and CEO of SEMI. “However, even though the industry is facing headwinds, monthly billings levels have remained above $2 billion for the past four months.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), September 2019

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes
Next SEMI Billings report is October 22, 2019 at 3:00pm Pacific
For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp

• Read more about North American Semiconductor Equipment Industry Posts August 2019 Billings

TAIPEI, Taiwan ─ September 18, 2019 ─ With Taiwan expected to lead the world in semiconductor equipment investments in 2019, SEMICON Taiwan 2019 opens today, gathering the world’s top technologists, visionaries and innovators for insights into the latest trends and opportunities across smart vertical markets including manufacturing, automotive, healthcare and data. September 18-20 at Nangang Exhibition Center, Hall I, in Taipei, SEMICON Taiwan 2019 spans the entire semiconductor and microelectronics supply chain – from design through systems. Registration for the event remains open.

Taiwan is on track to boost semiconductor equipment investments 21.1 percent this year and vault past South Korea to top the world in equipment spending, an increase driven by advanced manufacturing processes and capacity, according to SEMI's latest market report. In addition, for the ninth consecutive year Taiwan is the world's biggest consumer of semiconductor materials with spending of US$11.4 billion.

At the SEMICON Taiwan 2019 opening ceremony, Premier SU Tseng-chang, Director of the American Institute in Taiwan (AIT), credited Taiwan’s rise in prominence in the global semiconductor industry to joint efforts by local government and industry. Tseng-chang also lauded Taiwan’s manufacturing sector for its enormous contributions to the global information and communication technology (ICT) industry while serving as a key growth engine in the region.

SEMICON Taiwan Debuts Electro-innovation Forum and Technology Think Tank Summit

•  Electro-innovation Forum – Experts from five of the world’s top research institutes and R&D centers examine innovation drivers and trends and prospects for the microelectronics industry. Participants include imec, CEA-Leti, Fraunhofer, the National Research Foundation (NRF), the Industrial Technology Research Institute (ITRI) and TSMC.
•  Technology Think Tank Summit – Co-organized with the Ministry of Economic Affairs (MOEA), the summit brings together industry leaders in SiP, IC design, memory, wafer fabrication, packaging and testing to explore the future of the industry. Participants include CEOs from Quanta Computer, Hon Hai Technology Group, TSMC, ASE, Etron Technology, Powerchip Semiconductor and Macronix International.

International Forums Spotlight Latest Industry Trends

Expected to draw an event record 50,000 visitors, SEMICON Taiwan 2019 features 19 other international forums spotlighting industry trends and the latest technologies. Themed Leading the SMART Future, SEMICON Taiwan showcases Artificial intelligence (AI), Internet of Things (IoT), 5G, machine learning, quantum computing and other cutting-edge technologies that are transforming the microelectronics industry and giving rise to a growing universe of smart applications.

The following SEMICON Taiwan forums, summits and pavilions offer the latest industry perspectives on key vertical markets and the talent critical to industry growth.

•  Smart Transportation Forum – The Compound Semiconductor Innovation Zone and Smart Car Zone for the first time showcase new electric cars from BMW (i3s, i8 Coupe) and Audi (e-tron). The forum features a wide variety of semiconductor applications for future smart vehicles.  
•  Smart Data Global Summit and Quantum Computing: A Window into Future Computing – Experts from Facebook, Mentor, ARM and Qualcomm focus on smart data applications and fulfilling the promise of a digital future through computing innovations and AI chip designs.
•  Smart MedTech Forum – Focuses on business opportunities inspired by AI-assisted medical technology and cross-sector collaboration. Experts from medical institutions, software suppliers, research institutes, and medical device start-ups will meet to discuss the future of smart medical technology and business opportunities.
•  Smart Manufacturing EXPO – Showcases complete smart manufacturing solutions for a wide range of high-technology industries such as semiconductor, touch panel, flat-panel display and PCB.
•  Smart Workforce Pavilion – Semiconductor industry insights, lectures, career coaching and job matching for prospective talent

Asia’s First Testing Ground for Self-Driving Vehicles, Taiwan’s Circular Economy

SEMICON Taiwan 2019 will launch two landmark events in collaboration with the Taiwanese government and various industry associations.

•  Hsinchu City will become the first testing ground for self-driving vehicles in Asia under a memorandum of understanding – Autonomous Driving System Platform in Open Fields – between SEMI, ITRI and the city government.
•  SEMICON Taiwan teams up with Taiwan Trusted Alliance for Sustainable Supply and Circular Economy in inviting 15 industry associations to launch the 15T Circular Economy Alliance. The alliance seeks to promote the results of Taiwan's circular economy efforts in the global market and explore more sustainable opportunities.

SEMICON Taiwan 2019 features:

•  21 theme areas and national pavilions
•  More than 300 speakers across 21 international forums
•  700 exhibitors from around the world
•  More than 2,300 booths

SEMICON Taiwan 2019 showcases the full suite of SEMI offerings spanning the full electronics supply chain to support industry growth including:

•  Vertical Application Platforms: Smart Manufacturing, Smart Transportation, Smart Medical and Smart Data
•  Workforce Development, Industry Standards, Think Tanks and Thought Leadership Platforms
•  Strategic Association Partners, such as R&D and innovation leaders imec, CEA-Leti and Fraunhofer, as well as MEMS & Sensors Industry Group and Electronic System Design Alliance

With the semiconductor industry working to extend silicon scaling beyond Moore’s Law, SEMICON Taiwan will also gather industry experts to explore heterogeneous integration opportunities and challenges across three events:

•  SiP Global Summit – Heterogeneous Integration NOW & FUTURE
•  Strategic Materials Conference Taiwan – Materials Leading the Smart Future of Semiconductors: Device Performance
•  Advanced Testing Forum New! – 5G and AI-assisted Testing

For more information, please visit the SEMICON Taiwan 2019 website or follow us on Facebook.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts
Emmy Yi
E-mail: [email protected]
Tel: +886.3.560.1777 ext.205

Eileen Lin
E-mail: [email protected]
Tel: +886.3.560.1777 ext. 288

• Read more about SEMICON Taiwan 2019 Opens with Smart Tech, Innovation, Digital Future in Spotlight

MILPITAS, Calif. — September 16, 2019 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today announced that semiconductor industry veteran Bee Bee Ng has joined SEMI as president of SEMI Southeast Asia, reporting to SEMI CFO Richard Salsman.

As president, Ng will develop strategies, objectives and global policies for achieving SEMI’s business goals in Southeast Asia. Based in Singapore, Ng will direct SEMI Southeast Asia sales and services; expositions and programs including standards, EHS, workforce development and advocacy; and administrative operations.

“We are delighted to welcome Bee Bee Ng to SEMI,” said Ajit Manocha, SEMI president and CEO. “Her extensive experience in the semiconductor industry, strong business relationships throughout Southeast Asia, and passion for driving business results are tremendous assets to SEMI. We look forward to Bee Bee’s leadership in working with SEMI members to grow the Southeast Asia market and uncover new opportunities that will help the $2 trillion global electronics industry reach its full potential.”

Ng brings to SEMI more than 25 years of experience in sales, marketing, distribution and logistics management in the Southeast Asia semiconductor, electronics and related industries. Previously, Ng held positions at Nissei Sangyo (Singapore) Pte. Ltd. (now Hitachi Hi-Tech) and more recently KLA-Tencor (Singapore) Pte. Ltd., where she won the President’s Award for Top Account Sales Manager.   

Bee Bee holds a bachelor's degree in Chemistry and Material Science from National University of Singapore.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Semiconductor Industry Veteran Bee Bee Ng New SEMI Southeast Asia President