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SEMI Press Release

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MILPITAS, Calif. – February 11, 2020 – Semiconductor industry veteran and SEMI president and CEO Ajit Manocha will be inducted into the Silicon Valley Engineering Hall of Fame on February 19, 2020. The Silicon Valley Engineering Council (SVEC) is honoring Manocha for championing industry collaboration and driving manufacturing efficiency in multiple leadership roles, as well as for his work as one of the pioneers of reactive ion etching and manufacturing process flows for logic and memory chips that serve as the foundation for modern microelectronics manufacturing.

semi logo

“Ajit Manocha is a welcome and deserving addition to the Silicon Valley Engineering Hall of Fame,” said Yuval Wasserman, president and CEO of Advanced Energy Industries Inc., who nominated Manocha. “He is well-respected for improving manufacturing efficiency, serving as a mentor, promoting diversity, and building partnerships to advance microelectronics. He has continued to serve the industry at SEMI with visionary programs to facilitate global collaboration and innovation.”

“Joining founders of the microelectronics industry such as Gordon Moore and Bob Noyce in the Silicon Valley Engineering Hall of Fame is an honor beyond compare,” said Manocha. “It has been a great privilege to help advance the industry and to continue to sow the seeds of innovation at SEMI. This honor is a humbling inspiration for me to continue to build on the legacy of every past inductee by supporting and mentoring current and future leaders to drive innovation for both societal and economic prosperity worldwide.”

At SEMI, Manocha has re-positioned the organization to address emerging challenges and opportunities for SEMI members around the globe. SEMI is broadening its reach across the electronics manufacturing and design supply chain, growing its global advocacy program to promote fair trade and strengthen its public policy influence, and expanding its workforce development and diversity programs and other initiatives to propel innovation across the industry.

In addition to the Silicon Valley Engineering Hall of Fame honor, VLSI Research very recently named Manocha a 2019 All Star of the Semiconductor Industry for expanding SEMI’s scope to represent the broader electronics supply chain. Both recognitions are rooted in his passion for enabling industry growth and innovation at SEMI and throughout his career.

Manocha began his career as a research scientist at AT&T Bell Laboratories, where he was granted over a dozen patents related to reactive ion etching and semiconductor manufacturing processes. He went on to hold senior global operations leadership roles at Philips Semiconductors (NXP) and Spansion before serving as president and CEO at GLOBALFOUNDRIES and, currently, SEMI. Manocha also served as an advisor to President Obama on the Advanced Manufacturing Partnership Steering committee and on the President’s Council of Advisors on Science and Technology (PCAST).

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

Association Contact

Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]

Forum Connects Students, Young Professionals with Semiconductor Companies to Help Build Talent Pipeline

SWANSEA, United Kingdom – February 10, 2020 – Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum , 6 March 2020 in Swansea, UK at the University of Swansea. Sponsored by SEMI , the industry association representing the global electronics manufacturing and design supply chain, and staged in partnership with European organizations including the University of Swansea , Edwards , Oxford Instruments , and SPTS Technologies , the event will also highlight how technology is reshaping the global workforce. Participation is free of charge and registration is open.

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The event will be held at the Great Hall, Swansea University Bay Campus, Fabian Way, Crymlyn Burrows, Swansea SA1 8EN, UK.

The SEMI Talent Forum is an ideal venue for semiconductor companies to promote their workforce development, diversity and inclusion initiatives to the next generation of industry talent. The forum targets young talent as the semiconductor industry presses ahead to build the workforce critical to innovations in cutting-edge technologies that are transforming how we work and live such as artificial intelligence (AI), Internet of Things (IoT), 5G, augmented/virtual reality (AR/VR), machine learning and quantum computing. Representatives from Swansea University and the Welsh Government will kick off the event with keynotes.

Talent forum logo

SEMI Talent Forum Key Topics

  • Technologies Addressing Global Challenges
  • Microelectronics Enabling AI, IoT and 5G
  • Technology Highlights from the CS Connected Cluster
  • Panel Discussion – Leading in the Digital Age: Technology, Diversity and Inclusion

Other Event Highlights

  • Tech Demo Zones – Interactive demonstrations of technologies such as VR
  • Career Café – Students and post-graduates will meet with industry leaders, learn about their companies’ work and culture, and participate in mock interviews and CV review sessions.
  • Professional Headshot Studio – Young talent will get a free professional headshot for their CV and business social media profiles.
  • Student Poster Exhibition – Local students will showcase their research.

For more details about the event, please see the full program .

The SEMI Talent Forum is sponsored by Edwards, Oxford Instruments and SPTS Technologies (A KLA Company).

Follow SEMI on Twitter and LinkedIn : @SEMIEurope – #talentforum #digitalfuture


About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter .

Association Contact

Serena Brischetto
SEMI Europe
Email: [email protected]
Tel: +49 30 303080770
ww.semi.org/eu

MILPITAS, Calif. – February 4, 2020 – Worldwide silicon wafer area shipments in 2019 declined 7 percent from the 2018 record high while revenue remained above the $11 billion mark despite a global silicon revenue slip of 2 percent over the same period, the SEMI Silicon Manufacturers Group (SMG) reported in its year-end analysis of the silicon wafer industry.

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Silicon wafer area shipments in 2019 totaled 11,810 million square inches (MSI), while the industry logged shipments of 12,732 million square inches in 2018. Revenues in 2019 totaled $11.15 billion, edging down from the $11.38 billion posted in 2018.

“The 2019 decline in worldwide semiconductor silicon volume shipments resulted from memory market softness and inventory normalization,” said Neil Weaver, Vice President of SEMI SMG, and Director, Product Development and Applications Engineering, at Shin-Etsu Handotai America. “Despite the volume dip, silicon revenue remained resilient.”

Annual Silicon* Industry Trends

 

2008

2009

2010

2011

2012

2013

2014

2015

2016

2017

2018

2019

Area Shipments (MSI)

 

8,137

6,707

9,370

9,043

9,031

9,067

10,098

10,434

10,738

11,810

12,732

11,810

Revenues ($Billion)

 

11.4

6.7

9.7

9.9

8.7

7.5

7.6

7.2

7.2

8.7

11.4

11.2

Source: SEMI (www.semi.org), January 2020

*Total Electronic Grade Silicon Slices Excluding Non-Polished Wafers. Shipments are for semiconductor applications only and do not include solar applications.

*Shipments are for semiconductor applications only and do not include solar applications

All data cited in this release includes polished silicon wafers, such as virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped to end users.

Silicon wafers are the fundamental building material for semiconductors, which, in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin, round disks are produced in various diameters – from one inch to 12 inches – and serve as the substrate material on which most semiconductor devices, or chips, are fabricated.

The Silicon Manufacturing Group (SMG) is a sub-committee of the SEMI Electronic Materials Group (EMG) and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers such as cut, polished and epi. The group facilitates collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

For more information, please visit SEMI Worldwide Silicon Wafer Shipment Statistics.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.798
Email: [email protected]

MILPITAS, Calif. — February 3, 2020 — SEMI-FlexTech today announced the launch of six projects to accelerate sensor and sensor system innovations for new applications in industries including healthcare, automotive, industrial and defense. In collaboration with the U.S. Army Research Laboratory (ARL), FlexTech, a SEMI Strategic Association Partner, will provide more than $2.3 million in funding for the projects aimed at maturing the flexible-hybrid electronics (FHE) technology ecosystem. Organizations including the University of Texas El Paso, American Semiconductor, PARC, Tekscan, Alertgy and SAFI-Tech will lead the initiatives.

SEMI & FlexTech

“Flexible hybrid electronics give product designers new ways to use sensors to collect data and deliver actionable insights that improve how we work and live,” said Melissa Grupen-Shemansky, CTO of SEMI and Executive Director of SEMI-FlexTech. “This new round of projects epitomizes the wide range of applications enabled by innovations in flexible hybrid electronics. We expect this body of work to unearth new product roadmaps across the electronics industry.”

Projects

 

American Semiconductor, Inc., will develop 500 FHE ultra-thin, lightweight and configurable sensor systems with wireless capability for environmental sensing applications. ASI will partner with Boise State University, DuPont, HD Microsystems and ITN Energy Systems on the 15-month project.

American Semiconductor Logo

The University of Texas at El Paso will optimize structural and electrical performance and develop sculpted dielectrics for FHE 3D printing. The 12-month project will generate performance data and new algorithms for smarter 3D printing. A proof-of-concept, journal article and presentation will cap the project.

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Tekscan will develop a functioning sensorized glove made of a durable resin with flexible-conductive and pressure-sensitive inks. The glove advances the state of the art for FHE pressure and force measurements and analysis, critical in design evaluation for automotive, consumer, packaging, robotics and medical devices. The 18-month project includes examinations of novel substrates and materials, hardware integration strategies, and manufacturing methods.

 

Tekscan Logo

PARC, A Xerox Company, will integrate a flexible and adaptable multi-sensor system (consisting of temperature, humidity, impact and gas sensors) with a single processor for data capture and both wireless and audio output capabilities. The system will target applications in the wearables, medical monitoring, Internet of Things (IoT), automotive and industrial markets. PARC will partner with Purdue University in this 12-month project.

PARC Logo

Alertgy will develop a curved, flexible and lightweight wrist-mounted FHE for non-invasive glucose monitoring. The wristband will incorporate electrical impedance spectroscopy (EIS), a transducer and a printed battery. The device interface will enable the integration of other sensors into its multipurpose design. A demonstration of the platform will culminate the 16-month project.

Alertgy Logo

will develop and demonstrate screen-printed, supercooled liquid metal particles for use in electrical interconnects at low temperatures as a replacement for electrically conductive adhesives (ECAs). Lower temperatures in electronics manufacturing can reduce heat generation, processing costs and thermal damage to components while enabling higher throughput for devices in defense, automotive, healthcare and other industries. SAFI-Tech will partner with Iowa State University on the18-month project.

SAFI Tech Logo

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter .

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

DRESDEN, Germany — 27 January, 2020 — The SEMI 3D & Systems Summit opens today in Dresden, Germany, with top experts in 3D integration and systems for semiconductor manufacturing applications providing the year’s first comprehensive outlook for advanced packaging and systems. Themed Expanding Application Space, the annual three-day summit features the latest developments and insights in artificial intelligence (AI), 5G, heterogeneous integration, 3D roadmap and System-In-Package (SiP) technologies.

3D Systems Summit Logo

With automotive expected to rank among the strongest growth markets for semiconductors and advanced packaging in the coming decades, opening keynote speaker, Jan Vardaman, president and founder of TechSearch International Inc., will highlight packaging types essential for AI chips in automotive. Vardaman will also explore AI’s vital role in emerging healthcare, mobile, fintech and smart home technologies.

“The SEMI 3D & Systems Summit highlights Europe’s prowess in developing the advanced packaging and manufacturing systems key to the rapid adoption of 5G, AI, AR/VR, quantum computing and other leading-edge technologies,” said Laith Altimime, president, SEMI Europe. “The ‘20s promise astonishing innovations as the semiconductor industry drives to make a smarter world a reality.”

According to a recent Yole Développement report, advanced packaging has entered an era of great promise fueled by the critical need for improvements in chip component integration in order for 5G, AI, IoT, Industrial Internet of Things (IIoT), and high-performance computing (HPC) to flourish. Emilie Jolivet, Semiconductor and Software Division Director at Yole Développement, will discuss how heterogeneous integration will enable new HPC applications.

With wafer-level packaging (WLP), 3D stacking and SiP key to meeting the stringent form factor, high-speed and power consumption requirements for mobile devices, Romain Freux, CEO of System Plus Consulting, will explore the latest advanced packaging trends for mobile computing.

The 3D & Systems Summit offers business-to-business matchmaking, networking for participants to explore new partnerships, an exhibition, and a gala dinner. Visit 3D & Systems Summit for more information.

Follow #3DSummit @SEMIEurope on LinkedIn and Twitter.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

MILPITAS, Calif. — January 23, 2020 — North America-based manufacturers of semiconductor equipment posted $2.49 billion in billings worldwide in December 2019 (three-month average basis), according to the December Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 17.5 percent higher than the final November 2019 level of $2.12 billion, and is 18.4 percent higher than the December 2018 billings level of $2.10 billion.

SEMI

“Monthly billings of North American equipment manufacturers reached a level not seen since June 2018,“ said Ajit Manocha, president and CEO of SEMI. “The December surge in equipment billings reaffirms the strength of leading-edge logic and foundry investments.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg.)

Year-Over-Year

July 2019

$2,031.9

-14.6%

August 2019

$2,001.8

-10.5%

September 2019

$1,959.1

-5.7%

October 2019

$2,080.8

2.5%

November 2019 (final)

$2,121.0

9.1%

December 2019 (prelim)

$2,491.7

18.4%

Source: SEMI (www.semi.org), January 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is February 20, 2020 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

HALF MOON BAY, Calif. – January 14, 2020 – The SEMI Industry Strategy Symposium (ISS) opened yesterday with the theme Data Driven Innovation and Growth. The annual three-day conference of C-level executives gives the year’s first comprehensive outlook of the global electronics manufacturing industry.

ISS Icon

For the nearly 300 attendees at ISS 2020, opening day highlighted market and technology opportunities and a reflection on the significant pricing and international trade challenges the semiconductor manufacturing supply chain faced in 2019. Deep discussions on technology disruptions, the future of mobility and 5G, and perspectives on the semiconductor industry in Asia will mark today, Day 2. Day 3 will feature presentations on advanced computing’s impact on the semiconductor industry and convene an expert panel titled Stock Wars: The Rise of SemiCaps to culminate the annual SEMI kick-off event for business leaders.

Opening keynote speaker Richard Gottscho, Executive Vice President and Chief Technology Officer at Lam Research, sees computational advances as one key to the semiconductor industry evolving from a little data world, marked by engineering teams taking several months to solve wafer etching problems, to one where big data is used to quickly and efficiently address issues. With etch recipes for wafers growing far more complex, the semiconductor industry needs a breakthrough in metrology technology to continue its virtuous cycle of positive, exponential feedback that has led to the increasingly faster pace of technology evolution. Gottscho compared data gathering by wearables to make general predictions on health to the potential use of metrology tools in collecting wafer data to predict fab health and avoid unscheduled downtime. Cost and time constraints still challenge the industry, yet Gottscho is optimistic that computational advances have brought the big metrology problem in a little data world close to resolution.

In the Economic Trends session, presenters took on macroeconomic trends and detailed industry-specific forecasts.

Daniel Niles, AlphaOne Capital, expects the semiconductor industry to resume growth in 2020 after five to six difficult quarters as semiconductor pricing stabilizes. However, he urged cautioned amid signs of economic risk, particularly how central banks worldwide are taking on debt, and a possible election-year surprise in the U.S. Industry tailwinds include an anticipated uptick in data center capital expenditures, improving inventory levels, progress in U.S.-Sino trade relations despite slow economic growth in China, and bullish secular trends in 5G, AI, IoT, AR, cloud, electric vehicles, autonomous driving and smart homes.

Michael Schallehn, Bain & Company, noted that the era of plentiful labor is nearing an end, posing a major challenge for economies worldwide as companies struggle to fill open positions. Robotics and automation could fill the employment gap to sustain economic growth as the cost of robotics falls and adoption of AI for customer service applications continues to rise. Workforce shortages offer a compelling business case for replacing human workers with robots, which can cut labor costs by 10 percent to 15 percent while boosting productivity as much as 30 percent. Over the next 10 to 20 years, Schallehn expects 20 percent to 25 percent of the global labor force to be displaced by robots, another significant challenge.

Kevin Anderson, IHS Markit, observed that the 2020 semiconductor revenue rebound will be led by memory, with growth exceeding 10 percent. Among 2020 industry growth drivers, 5G is the most promising, though its rollout will be phased. With development slower than forecast, autonomous driving will start to fulfill its promise after 2025. Mainstream AI applications were few in 2019 and the technology will only make a meaningful contribution to chip industry revenue once high-volume applications emerge. In its forecast for 2020, IHS Markit sees 5.5 percent annual growth for the global semiconductor industry with memory expanding at a 3.9 percent rate.

Bob Johnson, Gartner, pointed to TSMC’s outsize influence in the Gartner forecast for 5 percent CAGR in foundry revenue through 2023. Advanced nodes and rising demand for 5G 7nm chips will drive an increase in foundry capital expenditures over this period. In the equipment market, CapEx was down 6.9 percent year-over-year (YOY) in 2019 and is expected to improve slightly in 2020 with a 3.6 percent YOY decline. Johnson reported that more than 220 million 5G smartphones are expected to ship this year, but cautioned that the technology is at the peak of its hype cycle. Commercial applications are not yet available, most 5G phones will be using expanded 4G networks, and 5G usage in Korea recently underwhelmed – all signs that 5G is not ready for robust adoption, though the technology’s future is bright.

John West, VLSI Research Europe, highlighted the challenge to semiconductor equipment companies of navigating 5 percent CAGR in critical subsystem and component costs. Equipment makers must reduce costs without increasing risk. Their options include squeezing the profit margins of critical subsystem suppliers and turning to new models such as renting equipment, but he encouraged the manufacturers to analyze the segment before cutting costs. Pointing to a need for a risk heat map for the supply chain, West advised equipment manufacturers to consider several factors in evaluating critical subsystem supplier risk such as location given potential geopolitical instability, ability to deliver, financial strength, and current versus planned production capacity.

The afternoon session focused on Market Perspectives, on topics including intelligent surgery, biomedical 3D printing, and technology innovation.

Shawn DuBravac, Avrio Institute, highlighting CES 2020 product introductions, discussed how AI is driving down the cost of predictive applications and, along with cameras and sensors, has spawned a broad range of innovations. Examples include autonomous positioning and temperature regulation for beds to keep people asleep longer and reduce snoring, refrigerators that select recipe options based on available food, digital exoskeletons that make users 20 times stronger, self-driving wheelchairs, and robots for last-mile deliveries. He also pointed to a new age of virtual reality immersion that includes devices such as suits that provide tactile feedback to help train outdoor workers to perform tasks in a virtual weather environment of wind and rain.

Jonathan Sorger, Intuitive Surgical, focused on the many benefits of robotic surgical tools that follow a surgeon’s movements to extend innately human capabilities, reduce variability in surgical skills, help surgeons refine their skills through simulation, and provide surgeons with performance data for other improvements. For patients, robotic devices decrease wound infection and blood loss while requiring fewer incisions and open surgeries, accelerating recovery.

Severine Valdant Zygmont, Oxford Performance Materials, noted how data-driven processes have improved medical applications. One example is 3D printing of bone reconstructions using PEKK polymers to enable bone implants that are better personalized for patients. Concerns include how the medical industry will manage the newfound wealth of available data while protecting patient information.

Bradley Horowitz, Google, explored how companies can remain innovative as they grow, age and become susceptible because of complacency to rapid, disruptive innovation that can threaten their businesses. He highlighted four pillars of Jeff Bezos’ business philosophy: stay focused on customers, concentrate on results not process, look outside the company, and make decisions quickly. He also pointed to Google’s work as a startup incubator to enable innovation not otherwise possible and keys to success including mentorship, access to capital, and a sense of community.

Days 2 and 3 at ISS will delve deeper into the industry with presentations by Western Digital, ASML, JCET Group, Ford Motor Company, Bosch, Lyft, ASE, Qualcomm, Qorvo, Ericsson, International Business Strategies (IBS), Stratfor, Cabot Microelectronics, Arm, Entegris, Intel and Headgate Partners.

The SEMI Industry Strategy Symposium (ISS) examines global economic, technology, market, business and geo-political developments influencing the global electronics manufacturing industry along with their implications for your strategic business decisions. For more than 35 years, ISS has been the premier semiconductor conference for senior executives to acquire the latest trend data, technology highlights and industry perspective to support business decisions, customer strategies and the pursuit of greater profitability.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Michael Hall/SEMI
Email: [email protected]
Phone: 1.408.943.798

DRESDEN, Germany – 14 January, 2020 – Top experts in 3D integration and systems for semiconductor manufacturing applications will gather at the SEMI 3D & Systems Summit, 27-29 January, 2020, in Dresden, Germany, for the latest developments and insights in 5G, High-Performance Computing (HPC), Heterogeneous Integration, 3D Roadmap and System-In-Package technologies. Global thought leaders from ASE Group, Huawei Technologies, TSMC and TechSearch International will headline the event with keynotes. Event registration is open.

The 3D & Systems Summit will showcase prominent players in 3D integration for microelectronics manufacturing while offering business-to-business matchmaking, networking for participants to explore new partnerships, an exhibition, and a gala dinner.

SEMI 3D & Systems Summit Keynotes

Jan Vardaman
Jan Vardaman President and Founder, TechSearch International Inc.
TechSearch Logo
Vardaman will kick off the summit with her keynote A New Era for 3D. Vardaman will discuss the latest developments and trends in areas including three-layer image sensors, Samsung’s three-layer stack, new packaging technologies with active interposers, Foveros 3D integration technology for heterogeneous system integration, 3D and SoIC face-to-face stacking, Wafer-on-wafer (WoW) and High Bandwidth Memory (HBM).
Eelco Bergman photo
Eelco Bergmann Senior Director, Strategic Sales and Business Development, ASE Group
ase group logo
Leading day two with his keynote Integration Technologies Transforming the World, Bergmann will explore how System-in-Package (SiP) technologies are delivering on their promise of miniaturization, power efficiency and high performance. The timing of his keynote is ripe as the electronics industry, largely driven by semiconductor innovation, is enabling life-changing applications from health to mobility and from virtual reality to AI.
Dr. Douglas Yu
Dr. Doug Yu Vice President of Integrated Interconnect and Packaging, TSMC
TSMC Logo
In his presentation SoIC - A Longtime Game Changer, Yu will present research and development of advanced packaging and system integration solutions, System on Integrated Chips (SoICTM) and their derivatives, TSMC’s wafer-level system integration technologies, Chip on Wafer on Substrate (CoWoS®), and Integrated Fan-Out (InFO).
Mustafa Badaroglu
Mustafa Badaroglu Technical Director, Huawei Technologies
Huawei
In his talk 3D IC Opportunities for High-performance Computing, Badaroglu will explore trends in intelligent data connectivity, HPC, how sensors are driving energy-efficiency for computing, connectivity bandwidth, and new assembly and integration schemes such as 3D integration for energy-efficient machine learning computation.

Visit 3D & Systems Summit for more information. Follow #3DSummit @SEMIEurope on LinkedIn and Twitter.     

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter. 

Association Contact

Serena Brischetto
SEMI Europe
Email: [email protected]
Phone: +49 30 3030 8077-11
 

SEOUL, South Korea – January 14, 2020 – Semiconductor industry innovators SK hynix, Intel, imec and Graphcore will kick off SEMICON Korea 2020 with keynotes focusing on the future of artificial intelligence (AI) as an estimated 500 companies and 55,000 visitors gather February 5-7 at the COEX in Seoul for the latest microelectronics developments, innovations and trends powering the next wave of industry growth.

Themed Design the Smarter Future, SEMICON Korea 2020 will feature more than 30 technology programs offering leading insights into semiconductor manufacturing, AI, MEMS and sensors, mobility, and metrology and inspection. The event also includes a 2020 market outlook and a workforce development program to educate university students about career opportunities in semiconductor manufacturing as the industry works to fill its skills gap.

SEMICON KOREA 2020 Keynote Speakers

Jinkook Jim Photo
Jinkook Kim Executive Vice President, SK hynix
SK Hynix Logo
Information and communications technologies (ICT) are enabling a smarter world that is spawning vast amounts of data requiring advanced memory. In his presentation Semiconductor Technology for the Future ICT World, Kim will discuss how SK hynix is developing solutions to meet computing’s growing demand for low-power, high-capacity, high-speed memory to process this data.  
Mike Davies Photo
Mike Davies Director, Neuromorphic Computing Lab, Intel
Intel Logo
Delivering faster speeds and lower power than traditional semiconductors, neuromorphic chips are key for on-device AI data processing. With Intel transforming into a data-driven company with a keener focus on technologies such as AI, Davies will explore Neuromorphic Computing for Future Breakthroughs in AI while revealing more about Intel's shift in strategic direction.
Jan M Rabaey Photo
Jan M. Rabaey CTO of the System-Technology
Co-Optimization (STCO) Division, imec
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While the bulk of the interest and investment in AI has centered on cloud AI, excitement is growing around the promise of edge computing. Rabaey of imec, the world's largest semiconductor research institute, will discuss success pathways for edge computing and recommend ways to fulfill its potential in his presentation The Cognitive Edge.
Nigel Toon photo
Nigel Toon CEO and Co-founder, Graphcore
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The amount of compute required to train complex AI models has grown by 300,000x since 2012. Compute gains have been a key component of AI progress and the industry is now preparing for the implications of systems far outside today’s capabilities. Toon will identify drivers of the huge appetite for more AI compute and describe how Graphcore’s IPU technology scales to meet this demand.

Admission to the keynote speeches is complimentary with event pre-registration by Wednesday, January 29, 2020. The keynotes will be held at the COEX Auditorium in Seoul.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Jaegwan Shim
SEMI Korea
Email: [email protected]
Phone: 82.2.531.7804

MILPITAS, Calif. —December 19, 2019—North America-based manufacturers of semiconductor equipment posted $2.12 billion in billings worldwide in November 2019 (three-month average basis), according to the November Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 1.9 percent higher than the final October 2019 level of $2.08 billion, and is 9.1 percent higher than the November 2018 billings level of $1.94 billion.

“Monthly billings of North American equipment manufacturers increased for a second consecutive month,” said Ajit Manocha, president and CEO of SEMI. “This improvement in equipment billings reflects industry expectations for a stronger close to 2019.”

The SEMIBillings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg.)

Year-Over-Year

June 2019

$2.026.1

-18.4%

July 2019

$2,031.9

-14.6%

August 2019

$2,001.8

-10.5%

September 2019

$1,959.1

-5.7%

October 2019 (final)

$2,080.8

2.5%

November 2019 (prelim)

$2,121.1

9.1%

Source: SEMI (www.semi.org), December2019

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is December 19, 2019 at 3:00pmPacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp