MILPITAS, Calif. – December 16, 2019 – Projected 2019 global fab equipment spending has been revised upward to US$56.6 billion on the strength of surging memory investments in the latter part of the year after a weak first half, SEMI reported today in its World Fab Forecast. SEMI data now point to just a 7 percent decline in fab equipment investments from 2018 to 2019, a marked improvement on the previously forecast drop of 18 percent. Rising investments in memory – particularly 3D NAND – leading-edge logic and foundries have powered the turnaround.

SEMI has also revised its 2020 fab equipment investment projections to a more upbeat US$58 billion.

The rebound snaps a global slowdown in fab equipment spending that saw total investments drop 10 percent in the second half of 2018 and 12 percent in the first half of 2019 as indicated by the yellow trend line in Figure 1. During the first six months of 2019, fab equipment spending for memory fell 38 percent, to below US$10 billion, as 3D NAND sector investments took an especially hard hit, plunging 57 percent from the second half of 2018. DRAM investments fell 12 percent in the second half of 2018 and another 12 percent in the first half of this year.

Figure 1: Fab equipment spending by half year and change rates of main investment contributors

The downtrend shifted abruptly toward the end of 2019. Investments in leading-edge logic and foundry are now expected to climb 26 percent in the second half of 2019, lead by TSMC and Intel, and 3D NAND spending will skyrocket more than 70 percent over the same period. While the decline in DRAM investments continued in the first half of this year, the descent since July has been more muted.

Lead by Sony, image sensors spending is expected to jump 20 percent in the first half of 2020 and soar by over 90 percent in the second half, peaking at US$1.6 billion. Investments for power-related devices, driven by Infineon, ST Microelectronics and Bosch, are projected to grow by over 40 percent in the first half of 2020 and another 29 percent in the second half, reaching nearly US$1.7 billion.

The latest World Fab Forecast report, published in late November 2019, covers quarterly spending for construction and equipment from 2018 to 2020. The report lists more than 1,340 fabs and lines and 135 facilities expected to start volume production in 2019 or later. The World Fab Forecast also provides quarterly totals for capacities, technology nodes, 3D layers, product types and wafer sizes.

Learn more about SEMI fab databases.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Fab Equipment Spending Rebounds in Second Half of 2019 with Stronger 2020 Projected, SEMI Reports

MILPITAS, Calif. ─ December 16, 2019 – Flexible hybrid electronics breakthroughs are driving the next wave of smart MEMS and sensing solutions for more personalized, portable electronics, setting the stage for the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) Feb. 24-27, 2020. Co-sponsored by SEMI FlexTech and SEMI MEMS & Sensors Industry Group, FLEX and MSTC will gather more than 100 global experts for market and technical presentations, tech courses, and more than 50 exhibit opportunities for connecting with industry visionaries at the DoubleTree by Hilton Hotel in San Jose, Calif. Registration is now open.

“Today’s pervasiveness of MEMS and sensors have given us an industrial nervous system where AI meets everything – on the person, on the farm, at sea, in the car, and in the factory,” said Dave Anderson, president of SEMI Americas and host of the conferences. “FLEX and MSTC will offer insights into how the enormous amounts of unstructured data collected by these field monitors will lead to groundbreaking applications that transform the way we work and live.”

Themed See the Future with 20/20 Vision, the FLEX 2020 will highlight cutting-edge flexible and printed electronics applications that deepen interactions between users and their surroundings to improve their daily lives. FLEX 2020 will showcase flexible hybrid and printed electronic products, equipment, processes and materials, and the applications they enable.

Themed Technologies Driving the Next Wave of Smart MEMS & Sensing Solutions, MSTC 2020 will spotlight MEMS and sensors advances and market opportunities stemming from artificial intelligence (AI), augmented reality (AR), machine learning, 5G mobile networks and blockchain.

Keynotes during the two events will highlight novel integration and market opportunities for flexible hybrid electronics (FHE), MEMS and sensors as the industry innovates to meet consumer demand for more user-centric solutions.

FLEX and MSTC 2020 Keynote Speakers

	Zachary Bolton, Head of R&D, North America, Continental Corporation
	Antti Vasara, President and CEO, VTT Technical Research Centre of Finland, Ltd
	Michael Wiemer, CTO and Co-Founder, Mojo Vision
	Zhenan Bao, K.K. Lee Professor of Chemical Engineering, Stanford University

FLEX 2020 will also feature the annual FLEXI Awards honoring organizations and individuals for innovation and commercialization, research and development, and education leadership, as well as the popular university student poster session highlighting projects related to flexible electronics or MEMS and sensors.

The co-located FLEX and MSTC events will be the second of eight conferences comprising SEMI’s second annual Technology Leadership Series of the Americas. Aligned from coast to coast throughout 2020, the series is designed to foster critical discussions on the short- and long-term influences and opportunities in the $2 trillion global electronics industry.

For information on registration and pricing, including early-bird rates and discounts for government, military and academia participants, click here.

FLEX Platinum sponsors include Eink and Novacentrix.

Follow FLEX 2020 on Twitter at: #SEMI_FLEX and @flextechnews. Follow MSTC 2020 on Twitter at: ##SEMI_MSTC and @MEMSGroup.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about FLEX and MSTC 2020 to Showcase Flexible Hybrid Electronics, MEMS and Sensors Innovations for More Personalized Applications

MILPITAS, Calif. — December 11, 2019 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, and VLSI Research, the leading semiconductor manufacturing market research firm, today unveiled the Semiconductor Manufacturing Monitor, a report covering the semiconductor manufacturing industry from materials to electronic systems. The inaugural report includes comprehensive 2018 and 2019 quarterly data for the semiconductor manufacturing supply chain, a one-quarter outlook, and semiconductor equipment forecast scenarios to 2020.

“The Semiconductor Manufacturing Monitor sets a new standard for semiconductor manufacturing by offering critical insights for making strategic business decisions and investments in our highly dynamic industry,” said Ajit Manocha, SEMI president and CEO. “The combination of SEMI’s leading benchmark data and VLSI Research’s semiconductor manufacturing expertise delivers an unparalleled breadth of market research spanning the entire semiconductor manufacturing supply chain.”

“The semiconductor industry has never been so rife with change,” said Risto Puhakka, president of VLSI Research. “More than ever, stakeholders across the industry need timely market scenarios and updates vital to decision-making. VLSI Research is excited to partner with SEMI and offer key semiconductor manufacturing data in the Semiconductor Manufacturing Monitor to meet this pressing need.”

Published four times each year, the annual subscription provides information on the following segments:

• Electronic systems sales
• IC sales by logic and memory
• Semiconductor manufacturing CapEx by memory and non-memory
• Leading foundry, fabless, OSAT and semiconductor equipment company revenues
• Silicon shipments
• Global wafer fab capacity
• IC inventory

This Semiconductor Manufacturing Monitor is ideal for companies requiring cost-effective, comprehensive industry data from trusted sources. For more information and to purchase the report, click here.

About VLSI Research
VLSI Research's unique combination of deep semiconductor industry contacts and data analytics with databases and information libraries reaching back seven decades, combined with its locations in the world's technology hotspots, make it perfectly suited for the development of the world's most distinguished semiconductor market research. VLSI Research information is selectively crafted by renowned semiconductor manufacturing market research analysts with over a century of combined experience. VLSI Research is the only market research firm to have won the SEMI Sales and Marketing Excellence Award. Visit www.vlsiresearch.com to learn more.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

VLSI Research
Phone: 1.408.453.8844
Email: [email protected]

• Read more about SEMI and VLSI Research Unveil End-to-End Semiconductor Manufacturing Industry Report

Global Semiconductor Equipment Sales Forecast – 2020 Rebound, 2021 Record High

TOKYO – December 11, 2019 – Global semiconductor manufacturing equipment sales will drop 10.5 percent to $57.6 billion in 2019 from last year’s historic peak of $64.4 billion but stage a 2020 recovery and set a new high in 2021, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today in its Year-End Total Equipment Forecast.

Released at SEMICON Japan 2019, the forecast shows equipment sales registering a 5.5 percent increase to $60.8 billion in 2020 and continued expansion into 2021, with record revenues of $66.8 billion as leading device manufactures invest in sub-10nm equipment, especially for foundry and logic.

The SEMI year-end forecast shows sales of wafer fab equipment – consisting of wafer processing, fab facility and mask/reticle equipment – falling 9 percent in 2019 to $49.9 billion. The assembly and packaging equipment segment is on track to decline 26.1 percent to $2.9 billion in 2019, while semiconductor test equipment is forecast to drop 14.0 percent to $4.8 billion this year.

Taiwan will dethrone Korea as the largest equipment market and lead the world with 53.3 percent growth this year, followed by North America with a 33.6 percent uptick. China will maintain the second spot for the second consecutive year, and Korea will fall to third after throttling back capital expenditures. All regions tracked except Taiwan and North America will contract this year.

SEMI expects the 2020 equipment market recovery to be fueled by advanced logic and foundry, new projects in China, and, to a lesser extent, memory. In Europe, equipment sales will surge 45.9 percent to $3.3 billion. Taiwan is forecast to remain the top equipment market next year on the strength of $15.4 billion in sales, with China second at $14.9 billion and Korea third at $10.3 billion. More upside is likely if the macroeconomy improves and trade tensions subside in 2020.

In 2021, all sectors tracked are expected to grow and the memory spending recovery will hit full stride. China is expected to ascend to the top position with equipment sales of more than $16 billion, followed by Korea, and Taiwan.

The Year-End Total Equipment Forecast is based on SEMI's industry-recognized World Fab Forecast database and input from equipment manufacturers. Total equipment includes wafer processing, fab facilities, mask/reticle, total test, and assembly and packaging equipment.

The following results reflect market size in billions of U.S. dollars.

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI Billings Report, a perspective of equipment market trends
• Monthly Worldwide Semiconductor Equipment Market Statistics (SEMS), a detailed report of semiconductor equipment bookings and billings for seven regions and over 22 market segments
• SEMI Mid-Year Forecast, a semiconductor equipment market outlook

For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.). For more information online, please click here.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Semiconductor Equipment Sales Forecast – 2020 Rebound, 2021 Record High

TOKYO – December 10, 2019 – SEMICON Japan 2019, the largest and most influential gathering of the electronics manufacturing supply chain in Japan with nearly 55,000 attendees expected, opens tomorrow at Tokyo Big Sight to focus on growth opportunities in smart transportation and smart manufacturing and the critical importance of business continuity planning (BCP). Industry leaders and visionaries from across the electronics supply chain will gather December 11-13 at SEMICON Japan 2019 – themed Enabling a Smarter World – for insights into the latest technologies, innovations and trends in the electronics industry.

SMART Applications Zone
With their promise of greater manufacturing efficiency and social good, smart technologies are driving strong demand for semiconductors and related electronics, setting the stage for the SMART Applications Zone at SEMICON Japan 2019. The zone showcases advanced technologies and products in SMART Transportation and SMART Manufacturing while providing collaboration opportunities across the entire electronics supply chain. Key exhibitors include:

• SMART Transportation
  • Toyota, DENSO, Zuken, Tier IV, Renesas Electronics, Livox Tech, Deloitte Touche Tohmatsu and Solidray

• SMART Manufacturing
  • Advanced Industrial Science and Technology (AIST), Deloitte Touche Tohmatsu, Siemens, Sony Semiconductor Solutions, Chuo Denshi Kogyo (CDK) and United Semiconductor Japan (USJC)

Business Continuity Planning
Business Continuity Planning (BCP) has seen strong demand as companies in the semiconductor manufacturing supply chain work to deepen their cooperation with one another to sustain operations in the event of natural disasters and other emergencies. SEMICON Japan 2019 features an exhibition and seminar highlighting the importance of BCP to the electronics supply chain. Visitors will learn about earthquake countermeasures by stepping into the Seismic Isolation Experience Car.

Exhibitors in the BCP area include THK, DISCO, HORIBA STEC and Murata Machinery.

Representatives from Sony Semiconductor Manufacturing, THK, DISCO and Team Engineering Consulting will share lessons learned from disasters and discuss the vital importance of daily preparation.

The SEMICON Japan 2019 SuperTHEATER features seven sessions over three days:

• Opening keynotes – Creating the Next Era featuring Makiko Eda, Chief Representative Officer at World Economic Forum, and Yuzuru Utsumi, President at Arm
• Semiconductor Executive Forum – Executive Viewpoints from Top Two in the Era of Digitalization with thought leaders from IHS Markit and Sony Semiconductor Solutions
• SMART Connectivity Forum – Infinite World Brought by 5G Innovation with experts from Softbank and Nokia Solutions & Networks
• SMART Transportation Forum I – Front-line of Automated Driving (Part1) featuring speakers from Intel and DENSO
• SMART Transportation Forum II – Revolution of Sky Transportation, supported by the U.S. Commercial Service in Japan, with presenters from Ministry of Economy, Trade and Industry (METI), Subaru and Bell Helicopter
• Manufacturing Innovation Summit – Issues and Innovation: What will Drive Growth to 2030 featuring thought leaders from VLSI Research, Applied Materials, KLA, Nikon and Tokyo Electron
• Mirai Vision Forum – Future Relation of Technology and Body 2.0 with speakers from Leave a Nest, Ory Lab and Autonomous Control Systems Laboratory


Register now for SEMICON Japan. For a detailed agenda, please see the SEMICON Japan Schedule-at-a-Glance.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Mayumi Amagai/SEMI
Phone: 81-3-3222-5854

• Read more about SEMICON Japan 2019 Opens Tomorrow: SMART Transportation, SMART Manufacturing and Business Continuity Planning in Focus

MILPITAS, Calif. — December 3, 2019 — Worldwide semiconductor equipment manufacturers posted third-quarter 2019 billings of US$14.9 billion, a quarter-over-quarter increase of 12 percent but down 6 percent from the third quarter of 2018, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today.

The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from more than 80 global equipment companies that provide data on a monthly basis.

The quarterly billings data by region in billions of U.S. dollars, and quarter-over-quarter and year-over-year growth rates by region, are as follows:

        
Source: SEMI (www.semi.org) and SEAJ, December 2019

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI Billings Report, a perspective of trends in the equipment market
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Total OEM Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market

For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). More information is also available online.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Third Quarter 2019 Worldwide Semiconductor Equipment Billings Jump 12 Percent, SEMI Reports

MILPITAS, CA — December 2, 2019 — SEMI today announced that Mitsunobu (Nobu) Koshiba of JSR Corporation has won the SEMI Sales and Marketing Excellence Award, inspired by Bob Graham, for 2019. The 22nd recipient of the award, Koshiba will be honored for his role in developing and bringing to market multiple photoresist generations that have been critical to the semiconductor industry. He will be recognized during ceremonies at SEMICON Japan 2019, December 11-13, at Tokyo Big Sight in Tokyo.

Photoresist innovations have enabled the continued scaling of semiconductor dimensions and power profiles. Koshiba’s focus on 193nm dry, 193nm immersion and extreme ultraviolet lithography (EUV) resists – all vitally important to JSR Corporation customers –  accelerated their development. He served as a key bridge between JSR Corporation’s research and development initiatives and its customers in aligning the company with their needs. Koshiba also led the important pivot from 157nm to 193nm immersion.

“SEMI is proud and grateful to count Mitsunobu Koshiba among our most inspirational and progressive industry leaders,” said Ajit Manocha, president and CEO of SEMI. “His vision, resolve and innovative spirit have been instrumental in advancing our industry. Today, SEMI and its membership honor Koshiba-san for his major contributions to semiconductor manufacturing."

The SEMI Sales and Marketing Excellence Award was inspired by the late Bob Graham, the distinguished semiconductor industry leader, who was a member of the founding team of Intel. Graham also helped establish industry-leading companies such as Applied Materials and Novellus Systems. The award was established to honor individuals for the creation and/or implementation of marketing programs that enhance customer satisfaction and further the growth of the semiconductor equipment and materials industry.

Eligible candidates are nominated by their industry peers and selected after due diligence by the SEMI Sales and Marketing Excellence Award Committee. Previous recipients of this award include: Luc Van den hove (2018), Toshio Maruyama (2017), Jim Bowen (2016), Terry (Tetsuro) Higashi (2015), Winfried Kaiser (2014), Joung Cho (JC) Kim (2013), G. Dan Hutcheson (2012), Franz Janker (2011), Martin van den Brink (2010), Peter Hanley (2009), Richard Hong (2008), Richard E. Dyck (2007), Aubrey (Bill) C. Tobey (2006), Archie Hwang (2005), Edward Braun (2004), Shigeru (Steve) Nakayama (2003), Jerry Hutcheson and Ed Segal (2002), Jim Healy and Barry Rapozo (2001), and Art Zafiropoulo (2000).

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email:[email protected]

• Read more about Mitsunobu Koshiba of JSR Corporation to Receive SEMI Sales and Marketing Excellence Award

ISS 2020 kicks off SEMI’s 50th anniversary year with insights into business, economic and technology trends

MILPITAS, Calif. – November 25, 2019 – SEMI announced today that Industry Strategy Symposium (ISS) 2020 will take place January 12-15 at the Ritz-Carlton in Half Moon Bay, Calif. with the theme Data Driven Innovation and Growth. ISS is the year’s first executive check-in, offering perspectives from leading analysts, researchers, economists, and technologists on forces impacting the semiconductor industry. The annual symposium provides insights into growth opportunities and industry intelligence to help inform company business plans and forecasts based on current market conditions. Registration is now open.

The proliferation of smart connected devices continues as vast amounts of data is generated by the explosion of electronic devices, driving significant growth across all semiconductor segments. This hyper-connectivity is being fueled by innovations in Internet of Things (IoT), artificial intelligence (AI), 5G, machine learning and other advanced technologies. Connecting and collaborating across the expanding technology ecosystem has never been more important as the world turns to innovation to tackle some of its most pressing challenges.

“Top visionaries and other thought leaders will gather at ISS to deliver insights into the latest electronics industry developments and trends that will shape business planning for 2020,” said David Anderson, president of SEMI Americas and host of ISS. “Among the most popular of SEMI’s conferences for the C-suite, ISS gives senior executives from across the industry an intimate, first-hand look at what to expect in the year ahead.”

ISS 2020 is the first of eight conferences comprising SEMI’s second annual Technology Leadership Series of the Americas. Aligned from coast to coast throughout 2020, the series is designed to foster critical discussions on the short- and long-term challenges and opportunities in the $2 trillion global electronics industry.

ISS 2020 highlights include:

Keynotes

• Richard Gottscho, Executive Vice President and corporate Chief Technology Officer at Lam Research
• Simon Segars, Chief Executive Officer at Arm

Economic trends and market forces shaping the electronics industry

• Executives and economists from AlphaOne Capital, Bain & Company, Gartner, IHS Markit, Jefferies and VLSI Research

Insights into market and application drivers

• Top executives from Avrio Institute, Cabot, Entegris, Ericsson, Ford Motor Company, Google, International Business Strategies (IBS), Intuitive Surgical, Jiangsu Changjiang Electronics Technology, Lyft, Oxford Performance Materials, Qualcomm and Robert Bosch

SEMI Golden Anniversary
The year 2020 marks SEMI’s golden anniversary. For half a century, SEMI has brought the industry together to connect, collaborate and innovate, helping to transform the world with technologies that have profoundly enhanced many aspects of human lives. The golden anniversary celebration will honor legends of the past 50 years and innovators who will lead the electronics design and manufacturing industry into the next 50. The event will be held during SEMICON West 2020 at the Moscone Center in San Francisco, July 20-23.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org and follow SEMI on LinkedIn and Twitter.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Scott Stevens, for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Industry Strategy Symposium 2020 to Highlight Data-Driven Innovation and Growth

TOKYO – November 26, 2019 – Smart mobility, smart manufacturing and business continuity planning (BCP) will come into sharp focus at SEMICON Japan 2019 as players from across the electronics supply chain gather December 11-13 at Tokyo Big Sight for the latest technology developments and innovations fueling a smarter world. Registration for SEMICON Japan 2019 is open.

SMART Transportation
Automobiles are growing in technical sophistication thanks to increasing silicon content, adding connected navigation systems, Lidar, and other connected-car features including internet radio, mobile search and cloud-based content. According to IHS Markit, microcomponent ICs will grow the fastest over the coming years among all semiconductor device categories, driven by automated driving and the rising number of sensors.

In the SEMICON Japan 2019 SMART Applications Zone, the SMART Transportation Forum will highlight next-generation usage models such as Mobility-as-a-Service (MaaS), electrification and autonomous driving. Device manufacturers will showcase the latest research and development and software platforms, and market researchers will offer insights into automotive technology trends. The area will also feature an automobile equipped with autonomous driving software.

Key SMART Transportation exhibitors include TOYOTA, DENSO, ZUKEN, Tier IV, Renesas Electronics, LIVOX TECH, Deloitte Touche Tohmatsu and Solidray.

SMART Manufacturing
The SMART Applications Zone will also feature the SMART Manufacturing Forum, where Advanced Industrial Science and Technology (AIST) will demonstrate remote control of a Minimal Fab System, and Deloitte Touche Tohmatsu will take visitors on tour of a semiconductor manufacturing fab using augmented reality (AR) and virtual reality (VR).

Other key SMART Manufacturing exhibitors include SIEMENS, Sony Semiconductor Solutions, Chuo Denshi Kogyo (CDK) and United Semiconductor Japan (USJC).

Business Continuity Planning
Business Continuity Planning has seen strong demand as companies in the semiconductor manufacturing supply chain work to deepen their cooperation with each other to sustain operations in the event of natural disasters and other emergencies. SEMICON Japan 2019 will feature an exhibition and seminar highlighting the importance of BCP to the electronics supply chain. Visitors will learn about earthquake countermeasures by stepping into the Seismic Isolation Experience Car.

Exhibitors in the BCP area in West Hall 4 include THK, DISCO, HORIBA STEC and Murata Machinery.

Representatives from Sony Semiconductor Manufacturing, THK, DISCO and Team Engineering Consulting will share lessons learned from actual disasters and discuss the vital importance of daily preparation for disasters on December 12 in the Conference Tower, room 608.

For registration and other information, please visit the SEMICON Japan 2019 website.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Mayumi Amagai
Phone: 81-3-3222-5801
Email: [email protected]

• Read more about Smart Applications, Business Continuity Planning in Focus at SEMICON Japan 2019

MILPITAS, Calif. — November 19, 2019 — North America-based manufacturers of semiconductor equipment posted $2.11 billion in billings worldwide in October 2019 (three-month average basis), according to the October Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 7.7 percent higher than the final September 2019 level of $1.96 billion, and is 3.9 percent higher than the October 2018 billings level of $2.03 billion.

“Monthly billings of North American equipment manufacturers registered their first year-over-year increase since October 2018 and are at their highest level since December of last year,” said Ajit Manocha, president and CEO of SEMI. “Equipment billings are accelerating on the strength of memory inventory drawdowns and foundry investments in leading-edge equipment.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), November 2019

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is December 19, 2019 at 3:00pm Pacific.

For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp

• Read more about North American Semiconductor Equipment Industry Posts October 2019 Billings