MILPITAS, Calif. — June 3, 2019 — SEMI, the global industry association representing the electronics manufacturing and design supply chain, today reported that worldwide semiconductor manufacturing equipment billings for the first quarter of 2019 dropped 8 percent from the previous quarter and 19 percent from the same quarter in 2018 to US$13.8 billion.

The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 80 global equipment companies that provide data on a monthly basis. The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:

Source: SEMI (www.semi.org) and SEAJ, June 2019

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports: the monthly SEMI Billings Report, which offers a perspective of the trends in the equipment market; the monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments; and the SEMI Semiconductor Equipment Forecast, which provides an outlook for the semiconductor equipment market. For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). More information is also available online: www.semi.org/en/MarketInfo/EquipmentMarket.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about First Quarter 2019 Worldwide Semiconductor Equipment Billings Drop 19 Percent Year-Over-Year

MILPITAS, Calif. – May 28, 2019 – SEMI, the industry association serving the global electronics manufacturing and design supply chain, announced today that AUDI AG, a leading German manufacturer of luxury vehicles, has become the first automotive OEM to join SEMI. SEMI membership will give Audi access to SEMI core competencies in developing international standards and harmonizing technology roadmaps and enable the automaker to leverage the global SEMI platform to promote industry alignment across supply-chain segments.

Audi is a founding member of the SEMI Global Automotive Advisory Council (GAAC). Anchoring the SEMI Smart Transportation vertical market platform, GAAC members address automotive technology issues such as device and system reliability and connectivity, promote industry standards, and align roadmaps of carmakers with adjacent industries to accelerate time to market. GAAC has chapters in Europe, the U.S., Japan and Taiwan.  

“We are excited to welcome Audi to the SEMI family,” said Ajit Manocha, SEMI president and CEO. “Now we can support advances in automotive electronics innovation from sand to systems through stronger collaborations with our semiconductor equipment and materials members and SEMI Strategic Association Partners including the Electronic System Design (ESD) Alliance and MEMS & Sensors Industry Group.”

“With rapid advances in automotive electronics technology, semiconductors now play a critical role in innovation and product differentiation,” said Dr. Klaus Buettner, executive vice president Development Electrics/Electronics, CarIT, AUDI AG. “In order to fulfill the promise of sustainable, connected-to-everything, highly automated mobility up to autonomous driving, we need to also align automotive requirements across the entire semiconductor value chain. With its global platform, SEMI is the right association to bring together supply chain stakeholders for the close collaboration critical to driving technology innovation.”

Under its leadership as a founding member of the GAAC, Audi has been instrumental in establishing priorities for the Europe chapter and helped grow the chapter to 17 companies representing the entire automotive electronics ecosystem including OEMs, device manufacturers, foundries, design companies and equipment and materials suppliers. Founding members of the GAAC Europe chapter include Audi, Volkswagen, Bosch, Cadence, imec, GLOBALFOUNDRIES and Synopsys.

Audi, a member of the Volkswagen Group, is headquartered in Ingolstadt, Bavaria, Germany.

Smart Transportation is one of five SEMI vertical market platforms designed to bring together players in critical industry segments to advance innovation and help drive segment growth.  

About Audi
In 2018, the Audi Group delivered to customers about 1.812 million automobiles of the Audi brand, 5,750 sports cars of the Lamborghini brand and 53,004 motorcycles of the Ducati brand. In the 2018 fiscal year, AUDI AG achieved total revenue of €59.2 billion and an operating profit before special items of €4.7 billion. At present, approximately 90,000 people work for the company all over the world. Audi focuses on sustainable products and technologies for the future of mobility.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

SEMI Contact
Michael Hall
Phone: 1.408.943.7988
Email: [email protected]

AUDIO AG Contact
Berthold Hellenthal
Email: [email protected]  

• Read more about Audi First Carmaker to Join SEMI; Membership to Advance Automotive Electronics

FLEX Taiwan 2019 Opens Tomorrow – Flexible Hybrid Electronics Innovations, Opportunities, Growth in Spotlight

Hsinchu, Taiwan — May 28, 2019 — The latest trends and opportunities in flexible hybrid electronics (FHE) take the spotlight at FLEX Taiwan 2019 starting tomorrow as industry experts and leaders gather to provide insights into flexible chips and batteries, Smart clothing, e-wear, precision sports and other flexible electronics innovations. May 29-30 at the Taipei International Convention Center (TICC), FLEX Taiwan 2019 also highlights the latest advances in flexible electronics manufacturing technology.

Organized by SEMI-FlexTech, a SEMI Strategic Association Partner,
FLEX Taiwan 2019 will feature presentations by the following industry thought leaders on opening day. For the full speaker lineup, please see the agenda.

Flexible Hybrid Electronics Applications

	Satoshi Maeda, Senior Coordinator – Development and International Standardization of Garment Type Wearable Devices
	Reinhold H. Dauskardt, Professor – Human Skin: the “Seam” between Our Body and e-Wear Technologies
	Gillian Ewers, VP Marketing – Roadmap to Trillions of Smart Objects

Flexible Hybrid Electronics Manufacturing

	Dr. Vincent Lin, Director, Corporate R&D/Technology Development – New Generation RF & Si-Photonic Packaging Technologies
	Stan Yang, Regional Sales, Head-China & Taiwan Flexible Technology Group – Flexible Manufacturing Technologies

 
The global flexible electronics market is expected to be a major growth driver for the microelectronics industry. Powering this rapid expansion are key application areas including wearables, robotics, telematics and industrial automation. Flexible electronics are inspiring innovative solutions across agriculture, the environment, healthcare, transportation and other key areas to advance social good by combining high-performance semiconductor components with the lightness, scalability, softness and flexibility typical of printed electronics.

“Taiwan is a leader in the global microelectronics industry with cutting-edge manufacturing technologies and the densest semiconductor device supply chain community in the world,” said Terry Tsao, Global Chief Marketing Officer and president of SEMI Taiwan. “With its premier semiconductor and display manufacturing technologies, Taiwan is in a strong position to drive FHE innovation. SEMI-FlexTech complements Taiwan’s technology prowess, providing a key platform for promoting FHE collaboration and technology development across the industry to help drive growth.”

For the past 18 years, SEMI and FlexTech have championed the development of the FHE industry through conferences and exhibitions in major microelectronics manufacturing regions such as North America, Europe, Japan, Korea, Singapore and China. FLEX Taiwan provides a powerful platform for connecting with customers, suppliers, future partners, researchers and academia to drive collaboration and uncover new opportunities.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Press Contacts
Emmy Yi, SEMI Taiwan
[email protected]
Jamie Liao, SEMI Taiwan
[email protected]

• Read more about FLEX Taiwan 2019 Opens Tomorrow – Flexible Hybrid Electronics Innovations, Opportunities, Growth in Spotlight

MILPITAS, Calif. – May 23, 2019 – SEMI today began accepting SEMICON West 2019 exhibitor applications for the Best of West award recognizing innovative new products or services that are significantly advancing the electronics manufacturing supply chain or a particular manufacturing capability. The application deadline for the Best of West award, presented annually by Semiconductor Digest magazine and SEMI Americas, is June 14. Exhibitors can apply using the online submission form.

Best of West award winners will be announced July 10 at SEMICON West 2019, July 9-11, at the Moscone Center in San Francisco. Registration for the event is open.

“At SEMICON West, scores of companies exhibiting leading-edge processes, materials and technologies will demonstrate how they are helping to reshape electronics and drive the next generation of industry growth,” said Dave Anderson, president of SEMI Americas, organizer of SEMICON West. “We look forward to recognizing among the world’s top innovations with the Best of West award.”

New product and service innovations and upgrades or other improvements to existing products and services are eligible for the award. Semiconductor Digest editors will serve as judges: Peter Singer, Ed Korcynski, Shannon Davis, Dave Lammers, John Blyler, Lynnette Reese and Dick James.

SEMI will announce Best of West finalists prior to SEMICON West, the premier U.S. gathering of the global electronics manufacturing and design industry. Learn more at www.semiconwest.org.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]
Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Call for SEMICON West 2019 “Best of West” Award Applications

MILPITAS, Calif. — May 21, 2019 — North America-based manufacturers of semiconductor equipment posted $1.91 billion in billings worldwide in April 2019 (three-month average basis), according to the April Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 4.7 percent higher than the final March 2019 level of $1.82 billion, and is 29.0 percent lower than the April 2018 billings level of $2.69 billion.

“April billings of North American equipment manufacturers increased five percent when compared to the prior month,” said Ajit Manocha, president and CEO of SEMI. “While it is premature to call this upturn an inflection point in this cycle, the current improvement clearly reflects expenditures for advancing technology roadmaps.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), May 2019

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is June 20, 2019 at 3:00pm Pacific

For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp

• Read more about North American Semiconductor Equipment Industry Posts April 2019 Billings

SEOUL, Korea – May 21, 2018 – More than 200 industry experts and thought leaders from academia will gather June 19-20 at 2019 FLEX Korea for critical insights into the latest flexible hybrid electronics (FHE) technologies and market opportunities. Hosted by FlexTech, a SEMI Strategic Association Partner, 2019 FLEX Korea showcases wearables, foldable displays, sensors, flexible batteries, materials and other core FHE technologies and applications at the COEX Convention & Exhibition Center. Registration for the event is open.

The flexible and printed electronics markets are expected to reach $20 billion by 2022, with a compound annual growth rate (CAGR) of 22 percent from 2016 to 2022, according to Zion Research. Flexible hybrid electronics and printed electronics enable new form factors and economics for a diverse and often disruptive set of applications.

Highlighting the June 20 technical conference are three keynotes offering insights into technology drivers for flexibleelectronics and wearables:

Michael McCreary, E Ink – Expanding the Horizon of Flexible Reflective Displays
Jerry Kang, IHS Markit – Global Industry Trend & Market Forecast of Flexible (Foldable, Rollable) Display
David Burch, U.S. Air Force Research Laboratory (AFRL) – Wearables for State Assessment of Military Operators

2019 FLEX Korea will feature three sessions with 10 technology experts addressing three critical FHE areas:

• Disruptive Technologies
• Core Technologies Enabling Flexible Electronics
• SMART Devices

The event will also feature two short courses providing a comprehensive overview of inkjet technology and micro LED displays.

2019 FLEX Korea sponsors include E Ink, EXAX, KOLON Industries and NovaCentrix

For more information, visit FLEX Korea 2019.

An early-bird pre-registration discount is available to SEMI members until June 14. For more information, visit FLEX Korea 2019.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Jaegwan Shim
Phone: +82.2.531.7804
Email: [email protected]

• Read more about 2019 FLEX Korea Highlights Flexible Hybrid Electronics Technology Innovations and Opportunities

Seoul, Korea – May 14, 2019 – SMC Korea 2019, the region’s premier electronics materials conference, will gather more than 400 industry experts and top executives from every segment of semiconductor manufacturing on May 16 for the latest insights and trends in advanced materials – a critical enabler of semiconductor industry growth. Materials suppliers, equipment companies and chip makers will explore new business and innovation opportunities at the event at COEX in Seoul.

Top experts at SMC Korea 2019 hail from global industry leaders including Air Liquide, DuPont, Entegris, Samsung Electronics, Samsung SDI, SK hynix, SK Materials, Versum Materials and Wonik Materials.

SMC Korea 2019 Keynotes by Industry Leaders

Three Sessions to Highlight Critical Areas of Semiconductor Materials

• Advanced Materials – Latest material technology trends across semiconductor manufacturing processes such as wafers, exposure, and cleaning
  • Wet-chemical Process Challenges for Advanced Logic Device Fabrication – imec
  • Study of Removal Rate Control in Ruthenium CMP – JSR Micro
  • Trends of Wafer Technology – SK Siltron
  • Enabling Incoming Material Defectivity Qualification with Un-Patterned Wafer Inspection – KLA
  • Future of Quality in CMP Slurries – Versum Materials
• Quality Control – Pollution measurement and quality control
  • How the Materials Ecosystem Influences Semiconductor Manufacturing Performance– Entegris
  • Start-up Performance and Pattern Defectivity Improvement Using 2nm-Rataed Nylon   Filter Developed with Lithography Filtration Expertise – Pall
  • Advanced Metrology for Measuring Contamination and Managing Risk in                  Semiconductor Manufacturing – Particle Measuring Systems
• Collaboration – Material management for stabilizing overall semiconductor manufacturing process and future materials development
  • The Future of the Material Quality in Memory Volume Production – Samsung
    Electronics
  • Material Management for the Advanced Semiconductor – SK hynix

SMC Korea 2019 also features a networking session for attendees to explore new partnerships and business opportunities.

SMC Korea 2019 Sponsors

Event sponsors include Air Liquide, BASF, DuPont, Entegris, KCTech, Merck KGaA, Darmstadt, Germany, Pall, Particle Measuring Systems, Versum Materials and Wonik Materials.

For more information, visit the SMC Korea website.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Jaegwan Shim
Phone: +82.2.531.7804
Email: [email protected]

• Read more about SMC Korea 2019 this Week: Semiconductor Materials Trends, Opportunities in Focus

MILPITAS, Calif. – May 13, 2019 – Logging a second consecutive year* of strong growth, the silicon wafer reclaim market surged 19% to $603 million in 2018 on the strength of a record number of reclaimed wafers processed, SEMI, the industry association representing the global electronics manufacturing and design supply chain, reported today in its 2018 Silicon Reclaim Wafer Characterization Summary. Growth, however, is forecast to taper off with the market expanding to $633 million by 2021. The 2018 total is well below the $703 million market high set in 2007.

While Japan-based suppliers continued to dominate the reclaim market by maintaining the largest portion of large-diameter (200mm and 300mm) reclaim capacity, the region’s global capacity share of this wafer class declined 2% to 53 percent in 2018. Asia Pacific-based reclaim suppliers increased their global large-diameter capacity share to 31%, up from 30%in 2017, while companies based in Europe and North America maintained their relative capacity share of 16%. Global large-diameter wafer reclaim capacity increased 3% in 2018.

SEMI tracks a growing list of reclaim suppliers, now numbering 22. Nine are based in Japan, seven in Asia Pacific, and six in North America and Europe. The 2018 report now includes Advanced Silicon Technology, a Chinese supplier of 200mm silicon reclaim. Advanced Energy Technology Solution, a supplier of 300mm silicon reclaim in Korea, was added in 2017.

The recently published Silicon Reclaim Wafer Characterization Summary provides 2018 details, including regional reclaim pricing and capacity, on reclaimed silicon wafers in the global semiconductor market and a forecast to 2021. The SEMI report covers seven regions including North America, Japan, Europe, Korea, Taiwan, China, and Rest of World (ROW). Market estimates for reclaim wafers include the semiconductor equipment and IC manufacturing segments.

*The silicon wafer reclaim market increased 18 percent to $510 million in 2017, as SEMI previously reported.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Silicon Reclaim Wafer Market Logs Second Year of Strong Growth but Softening Ahead, SEMI Reports

SARATOGA SPRINGS, New York — May 6, 2019 — Celebrating its 30^th anniversary, the SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2019) kicks off today with more than 300 industry experts and executives delivering more than 30 hours of technical presentations on the latest advanced manufacturing strategies and methodologies. May 6-9, 2019, in Saratoga Springs, New York, ASMC 2019 is the leading international technical conference for improving the collective manufacturing expertise of the semiconductor industry. ASMC 2019 registration remains open.

Cutting-edge technologies such as artificial intelligence (AI), Internet of Things (IoT), 5G and machine learning are dramatically increasing demands on semiconductor manufacturing. Device makers, equipment and materials suppliers, and academics must respond by collaborating to develop new solutions. Technical presentations at ASMC highlight industry innovations with specific results and are published by IEEE, with select manuscripts republished in the ASMC Special Section of IEEE Transactions on Semiconductor Manufacturing. 

Part of the SEMI Technology Leadership Series of the Americas, ASMC 2019 features a panel discussion titled Time to Yield vs. Time to Productivity: What Matters Most in the Age of More than Moore? with experts from Applied Materials, Axcelis, GLOBALFOUNDRIES, SkyWater Technology and TechSearch International.

ASMC 2019 Keynotes

Robert Czetina, Infineon Technologies Austria

Christine Dunbar, GLOBALFOUNDRIES

Robert Maire, Semiconductor Advisors

ASMC 2019 technical sessions include:

• Advanced Metrology
• Advanced Process Improvement
• Advanced Materials and Photonics
• Advanced Process Control
• Contamination Free Manufacturing
• Defect Inspection
• Factory Optimization
• Materials Integration and Photonics
• Yield Management

ASMC 2019 also provides powerful networking opportunities including an interactive poster session (including student presentations) and receptions.

The conference is co-chaired by Chris Ebert of Linde and Dr. Franz Heider of Infineon Technologies Austria. 

Back by popular demand, the third year of Women in Semiconductors program – held May 6 in conjunction with ASMC 2019 – will underscore the critical importance of workplace diversity as the global semiconductor industry works to grow its talent pipeline. Registration is complimentary for ASMC attendees. Ellie Yieh, corporate vice president for Advanced Product Technology Development at Applied Materials, will keynote.

ASMC 2019 is presented by SEMI with technical sponsors including Institute of Electrical & Electronics Engineers (IEEE), IEEE Electron Devices Society (EDS), and IEEE Electrons Packaging Society (EPS). Corporate sponsors include Applied Seals, Edwards, GreeneTweed, Inficon, KLA and NOVA.

For conference details, contact Margaret Kindling from SEMI at [email protected] or 1.202.393.5552. Qualified members of the media should contact Scott Stevens for SEMI Americas at [email protected] for media registration information.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Scott Stevens/SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about ASMC 2019 Highlights Latest Advanced Manufacturing Strategies

KUALA LUMPUR – May 7, 2019 – Poised to draw an event record of more than 9,000 visitors, SEMICON Southeast Asia (SEA) 2019 opens today with global electronics manufacturing pillars Smart Manufacturing, Internet of Things (IoT) and Workforce Development in the spotlight. May 7-9 at the Malaysia International Trade and Exhibition Centre (MITEC) in Kuala Lumpur, SEMICON SEA 2019 gathers industry experts from around the world for critical insights into the semiconductor ecosystem, new business opportunities and collaboration.

The region’s premiere global electronics manufacturing supply chain exposition and conference, SEMICON SEA this year is themed “Think Smart, Make Smart.” The event features three themed pavilions, five global pavilions, insightful keynote presentations and a host of technology forums to address key issues in the electronics manufacturing supply chain.

The Smart Manufacturing Pavilion for the first time showcases a live, full-fledged Smart factory, allowing attendees to tour the entire end-to-end microelectronics supply chain – from design and materials, and front-end patterning, packaging and test to final board and system assembly. Each area on the Smart factory line mixes virtual displays with equipment on the floor. The pavilion also features an augmented reality (AR) interactive human-machine interface to give visitors an immersive experience in Smarter manufacturing processes.

The World of IoT Pavilion showcases applications and technologies enabling the IoT revolution. Companies from across the region will demonstrate technologies that enable Smart lifestyles as start-ups showcase pioneering and disruptive products and applications powered by IoT.

The new Workforce Pavilion addresses the critical industry shortage of skilled workers. The pavilion is designed to attract the young talent critical to sustaining industry innovation and growth. College students will meet with industry experts to explore career paths in microelectronics and attend tutorials to enhance their understanding of semiconductor manufacturing and opportunities. An electronics industry career fair will be held May 8-9 at the pavilion to help fill more than 200 vacancies at 20 leading high-technology multinational companies.

Through the exclusive SEMICON SEA 2019 Hosted Buyer Programme, a business matching platform, buyers in the electronics manufacturing supply chain will connect with international solution providers for collaboration and business opportunities.

SEMICON Southeast Asia 2019 sponsors include the following:

Learn more about SEMICON SEA 2019, the program speakers and sponsors.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

This news release is issued on behalf of
SEMI by Acendus Communications Sdn Bhd
For further enquiries, please contact Michael Poh at 012 395 5202 or
Reshvinder Kaur at 017 275 7985

• Read more about Smart Manufacturing, IoT, and Workforce Development Take Spotlight at SEMICON Southeast Asia 2019