MILPITAS, Calif. — March 19, 2020 — North America-based manufacturers of semiconductor equipment posted $2.37 billion in billings worldwide in February 2020 (three-month average basis), according to the February Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI . The billings figure is 1.2 percent higher than the final January 2020 level of $2.34 billion, and is 26.8 percent higher than the February 2019 billings level of $1.87 billion.

“February billings of North American equipment suppliers extended a robust uptrend that began in December 2019,” said Ajit Manocha, SEMI president and CEO. “Despite continuing industry disruptions from the global spread of COVID-19, monthly billings for the year still remain above 2019 levels.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI ( www.semi.org ), March 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases . These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo .

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter .

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is April 23, 2020 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

• Read more about North American Semiconductor Equipment Industry Posts February 2020 Billings

MILPITAS, Calif. – March 17, 2020 – SEMI today announced the release of a central feature of its workforce development initiative, designed to grow the microelectronics industry’s talent pipeline, on the U.S. Department of Labor’s Competency Model Clearinghouse website. The Unified Competency Model (UCM) for Advanced Manufacturing identifies skill sets required across strategic industry sectors to strengthen connections among the microelectronics industry, workers, and education and training providers. SEMI led the development of the new UCM in partnership with the U.S. Department of Labor – Employment and Training Administration (USDOL-ETA).

The release of the updated Advanced Manufacturing Unified Competency Model by the USDOL-ETA comes one year after SEMI announced SEMI Works™, a comprehensive program to grow the electronics design and manufacturing industry talent pipeline. A key building block of SEMI Works™, the UCM will help ensure that job competencies the industry needs most are updated regularly to keep pace with its evolving workforce needs.

SEMI gathered industry insights for the UCM by forming working groups of industry experts and will drive the ongoing industry engagement necessary to update the job skill listings as technologies evolve and new job requirements are identified. The UCM will help align changing job skills sets with industry certifications, credential requirements and occupational licensing to help clear the way to career paths in advanced manufacturing and the microelectronics industry.

“As technology advances, ensuring access to talent is increasingly important,” said Mike Russo, vice president of Industry Advancement and Government Programs at SEMI. “The Unified Competency Model developed by SEMI and the USDOL-ETA team will help ensure training and education for industry jobs dovetail with skills requirements to help the microelectronics industry continue to innovate and grow. We are excited to partner with government and industry stakeholders to build out and sustain the UCM, a foundational component of SEMI Works™.”

“This new competency framework will improve signaling across our industry regarding the skills we need for our current and future workforce,” said Kathryn Garner, Talent Acquisition & Global Mobility at TEL, a UCM working group member. “This standard will provide greater transparency of skills and credentials from a diverse set of backgrounds including our military veterans. We are excited to be an integral part of this impactful effort.”

The development of the UCM is a milestone in SEMI’s ongoing work to deliver education and workforce development programs by facilitating collaborations within the public and private sectors. With SEMI Works™, SEMI has set its sights on solving a major industry issue – building a robust talent pipeline by attracting, developing and retaining critical microelectronics industry talent.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about New SEMI Job Skills Model for Growing Microelectronics Industry Talent Pipeline Released by U.S. Department of Labor

MILPITAS, Calif. – March 9, 2020 – Global fab equipment spending promises to rebound from its 2019 downturn and see a modest recovery this year before a sharp uptick drives record investments in 2021, SEMI reported today in the latest update of its World Fab Forecast report.

The report shows a slow recovery in 2020 – 3% year-over-year (YoY) growth to US$57.8 billion – owing in large part to an 18% expected slump in the first half of 2020 from the second half of 2019. The picture should brighten in the second half of this year as a recovery starts to take hold.

The Coronavirus (COVID-19) outbreak has eroded fab equipment spending in China in 2020, prompting downward revisions to the World Fab Forecast report published in November 2019. Despite continuing headwinds from the virus, China equipment spending will grow about 5% YoY to over US$12 billion this year and surge 22% YoY, or US$15 billion, in 2021. Investments by Samsung, SK Hynix, SMIC and YMTC will drive the growth.

Powered by TSMC and Micron investments, Taiwan will be the top region in spending in 2020 with nearly US$14 billion in equipment investments but drop to third in 2021 with over US$13 billion in spending, a 5% decline. In 2020, Korea will rank second in fab equipment spending on the strength of investments by Samsung and SK Hynix, logging 31% growth, to US$13 billion, before jumping to the top with a 26% advance, to US$17 billion, in 2021. Southeast Asia (mainly Singapore) will also register robust growth (33% YoY, to US$2.2 billion) in 2020 and 26% in 2021.

Of all regions, Europe/Mideast will show the strongest equipment spending growth with a surge of more than 50%, to US$3.7 billion, in 2020 and match that gain in 2021 on the back of investments by Intel, STMicroelectronics and Infineon.

In Japan, fab equipment spending growth will be negligible at almost 2 percent in 2020 and bump up to nearly 4% in 2021, with investments by Kioxia/Western Digital, Sony and Micron leading the way. 

Lagging the pack, the Americas will spend less in 2020 than in 2019, with fab equipment investments plunging 24% to US$6.2 billion, and extend the downturn with a 4% decline in 2021.

The latest update of the World Fab Forecast report, published in late February 2020, covers quarterly spending for construction and equipment from 2019 to 2021. The report lists 1,339 fabs and lines and 111 facilities (including low probability) expected to start volume production in 2020 or later. The forecast also provides quarterly totals for capacities, technology nodes, 3D layers, product types and wafer sizes.

Learn more about SEMI fab databases.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Global Fab Equipment Spending Poised for 2021 Record High

KUALA LUMPUR, Malaysia ─ 4 March 2020 ─ SEMI announced today that it is postponing SEMICON Southeast Asia 2020, the region’s premier event for the global electronics manufacturing supply chain, from 12-14 May 2020 to 11-13 August 2020. The postponement is due to concern surrounding the ongoing international coronavirus (COVID-19) outbreak. The venue for SEMICON Southeast Asia 2020 will remain the Malaysia International Trade and Exhibition Centre (MITEC).

“After close consultation with our stakeholders, which include partners, exhibitors, industry peers and the general community, we have made the necessary decision to postpone SEMICON Southeast Asia 2020,” said Bee Bee Ng, president of SEMI Southeast Asia. “We want to ensure that SEMICON Southeast Asia 2020 achieves its primary objective of forming connections and collaborations for exhibitors and visitors, both regionally and globally. It remains our mission and commitment to make the show highly successful and impactful.”

“While it is genuinely disappointing to postpone eagerly anticipated events, SEMI has always made the health and safety of our members, exhibitors, guests and employees our top priority,” said Ajit Manocha, president and CEO of SEMI. “We are very appreciative of the continued support of our stakeholders and are committed to working on behalf of the industry to facilitate business connections and accelerate innovation during this challenging time.”

For more details, please visit the SEMICON Southeast Asia website and connect with SEMI Southeast Asia on Facebook or LinkedIn

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Press Contact
Reshvinder Kaur
Email: [email protected]

• Read more about SEMICON Southeast Asia 2020 Postponed to 11-13 August 2020

SAN JOSE, Calif. – February 27, 2020 – Recognizing innovations and other outstanding accomplishments in Flexible Hybrid Electronics (FHE), SEMI-FlexTech, a SEMI Strategic Association Partner, yesterday presented the 2020 FLEXI Awards at the 19th annual FLEX 2020 Conference and Exhibition in San Jose, California. The FLEXI Awards spotlight FHE contributions in five categories: R&D Achievement, Product Innovation and Commercialization, Technology & Education in Leadership, Technology Champion and Industry Leadership.

R&D Achievement – Epicore Biosystems won the FLEXI for its world-class research of a soft, skin-interfaced bioelectronics platform with high commercial potential. The platform leverages microfluidics to capture biochemical/biophysical markers on fatigability in heart failure patients. Award criteria include research approach, originality and commercial potential for expanding the bounds of flexible or printed electronics.

“We are honored to receive this prestigious award for our multifunctional wearable systems and privileged to be an active member in this growing community of flexible hybrid electronics researchers and industry partners,” said Roozbeh Ghaffari, CEO and Co-Founder of Epicore Biosystems.

Product Innovation – PragmatIC won the FLEXI for product design and ingenuity in developing its ConnectIC family. The award recognizes an FHE product, announced over the past year, with significant potential or proven market adoption and revenue generation.

“PragmatIC is delighted that our ConnectIC flexible integrated circuits have won the FLEXI,” said Scott White, CEO at PragmatIC. “By bringing intelligence and connectivity to trillions of everyday objects, we see these products playing a pivotal role in improving our environment and daily lives.”

Technology Champion & Leadership in Education – NextFlex received the FLEXI for FlexPro, a program that immerses working professionals into the development, manufacturability, and applications that can benefit from FHE technology.

“NextFlex is extremely pleased to receive this prestigious recognition for FlexPro, our professional development education program,” said Emily McGrath, Director of Workforce Development Programs at NextFlex. “This program is central to our strategy of proliferating knowledge about flexible hybrid electronics throughout the advanced manufacturing sector in the U.S. Through our workforce development programs, we raise awareness of the benefits of FHE – thin, flexible, lightweight and fast to market – while improving collaboration throughout the manufacturing ecosystem, resulting in broader adoption and commercialization.”

Technology Champion – Dr. Meyya Meyyappan, Chief Scientist for Exploration Technology at the Center for Nanotechnology, NASA Ames Research Center, won the FLEXI for his technical leadership in printed and flexible electronics, outreach activities and tireless volunteering to promote the field.

“Applications for flexible and hybrid electronics have been picking up in every sector rapidly, and we can look forward to interesting developments in the near future,” said Dr. Meyyappan.

Industry Leadership – FlexTech Chairman Dr. Michael McCreary won a FLEXI for his dedication and involvement in the commercialization of FHE, unwavering efforts to forge an industry vision, and contributions to technical developments.

“I am honored to receive this award and privileged to have worked with the SEMI FlexTech leadership and its member companies on emerging flexible and printed electronics technology for almost two decades, including forming the alliances that gave rise to the current FlexTech organization,” Dr. Michael McCreary said. “I am gratified to see technology in the marketplace today that FlexTech enabled with R&D funding during its critical formative years. I look forward to seeing more collaborations and successes well into the future. “

About the FLEXI AWARDS

FLEXIs have been the industry’s premier award for distinguished organizations and individuals since 2009. The awards are sponsored by SEMI-FlexTech, an organization dedicated to the success of the FHE sector. See full list of past award winners.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI-FlexTech Announces 2020 FLEXI Awards Winners for Outstanding Achievements in Flexible Hybrid Electronics

MILPITAS, Calif. ─ February 24, 2020  – The latest advances in flexible and printed electronics take the spotlight at the co-located Flexible Hybrid Electronics Conference and Exhibition (FLEX) and MEMS & Sensors Technical Congress (MSTC) opening today. FLEX and MSTC 2020 feature keynotes, panels, technical sessions, deep-dive tech talks, networking opportunities and nearly 50 exhibitors with more than 400 attendees. See the full agenda for t he four-day events are at the DoubleTree by Hilton Hotel in San Jose, California.

Co-sponsored by SEMI FlexTech and SEMI MEMS & Sensors Industry Group (MSIG), FLEX Sees the Future with 20/20 Vision with cutting-edge flexible and printed electronics applications that deepen interactions between users and their surroundings. The event showcases flexible hybrid and printed electronic products, equipment, processes, materials and applications.

MSTC explores Technologies Driving the Next Wave of Smart MEMS & Sensing Solutions through advances in MEMS and sensors, and highlights market opportunities spurred by artificial intelligence (AI), augmented reality (AR), machine learning (ML), 5G mobile networks and blockchain.

Ajit Manocha, SEMI president and CEO, kicks off the events with his presentation Sensors, MEMS and FHE: Going Beyond Smart to Realize Imagination.

FLEX and MSTC 2020 Keynote Speakers

Four keynotes highlight novel integration and market opportunities for Flexible Hybrid Electronics (FHE), MEMS and sensors as the industry innovates to meet growing consumer demand for more user-centric solutions.

	Zhenan Continental Corporation
	Antti Vasara, President and CEO, VTT Technical Research Centre of Finland, Ltd. Blog – Flexible Hybrid Electronics Comes to Bio-Interfacing and Biodegradable Electronics
	Michael Wiemer, CTO and Co-Founder, Mojo Vision Blog – Next Generation of Mobile Devices Will Be Invisible
	Zhenan Bao, K.K. Lee Professor of Chemical Engineering, Stanford University Blog – More Than Skin Deep: Skin-Inspired Electronics for Smart Healthcare

Presentations also include Integrating MEMS Devices in FHE by Nathan Pretorius, printing technology engineer at NextFlex. See related blog MEMS-FHE Device Integration Gets Real .

Other FLEX and MSTC 2020 highlights include:

• Diversity – Women in Tech , a discussion today about diversity and mentoring in the electronics design and manufacturing industry
• Annual FLEXI Awards honoring organizations and individuals for innovation and commercialization, research and development, and education leadership
• University student poster session highlighting flexible electronics, MEMS and sensors projects
• NextFlex Technology Hub tour where attendees will witness design, prototyping and pilot-scale manufacturing of FHE next-generation electronics that bend, flex and stretch 

Platinum Partners are E Ink and NovaCentrix. Event sponsors are Brewer Science, Elantas, FlexEnable, Plastic Logic and UES.

Follow us on Twitter:

• FLEX 2020 –  #SEMI_FLEX and @flextechnews
• MSTC 2020 – #SEMI_MSTC and @MEMSGroup

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org   to learn more, contact one of our worldwide offices, and connect with SEMI on  LinkedIn   and  Twitter .

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about FLEX and MSTC 2020 Open Today as Flexible Hybrid Electronics Drive Next Wave of Smart MEMS and Sensors

MILPITAS, Calif. — February 24, 2020 — Covering topics from yield management to metrology in the era of artificial intelligence (AI), more than 100 industry experts will deliver 35 hours of technical presentations on the latest advanced semiconductor manufacturing strategies and methodologies at SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2020), May 4-7, 2020, in Saratoga Springs, New York. Registration is now open.

Drawing an expected 400 attendees, ASMC 2020 will feature the panel discussion Exascalers, Hyperscalers: Computing at the Edge – Different Modes, Different Nodes with experts from industry leaders including Applied Materials, Binghamton University, Corning, IBM Global Think Labs and Tercero Technologies.

Back for its fifth year, the Women in Semiconductors program – May 4 in conjunction with ASMC 2020 – will highlight the importance of workplace diversity as the global semiconductor industry works to grow its talent pipeline. Joanne Kamens of Addgene will keynote the event. Registration is complimentary for ASMC attendees.

ASMC is the premier event for industry professionals to network and share insights into best practices for semiconductor manufacturing. The conference is co-chaired by Fred Bouchard of SpareTech and Armando Anaya of Northrop Grumman.

ASMC 2020 Keynotes

	Thomas Sonderman, President, SkyWater Technology Sonderman will highlight requirements for manufacturing leadership in the AI era.
	Jesus del Alamo, Ph.D., Donner Professor, Professor of Electrical Engineering, MIT del Alamo will discuss nanoscale III-V for sustained CMOS innovation.
	Robert Maire, Semiconductor Advisors Maire will explore future market trends.

ASMC 2020 technical sessions include:

• Advanced Equipment Processes and Materials
• Advanced Metal Structures
• Advanced Process Control
• Contamination-Free Manufacturing
• Defect Inspection
• Factory Optimization
• Novel Metrology Techniques
• Optical Metrology and Machine Learning
• Patterning and 3D Metrology
• Smart Manufacturing
• Yield Enhancement/Yield Methodologies

ASMC also features an interactive poster session (including student presentations) and receptions for presenters and conference attendees to network.

ASMC 2020 is the fourth of eight conferences comprising SEMI’s second annual Technology Leadership Series of the Americas , a series that fosters discussions to uncover opportunities in the $2 trillion global electronics manufacturing and design supply chain.

For more conference details, contact Margaret Kindling at [email protected] or 1.202.393.5552. The media should contact Scott Stevens (for SEMI Americas communications) at [email protected] for registration information.

SEMI Golden Anniversary

The year 2020 marks SEMI’s golden anniversary. For half a century, SEMI has brought the industry together to connect, collaborate, innovate, and help transform the world with new technologies.

Join us at SEMICON events around the world as we celebrate 50 years of growth in global electronics manufacturing and kick off the next 50 years by highlighting the latest developments, trends and innovations in smart technologies.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter .

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Advanced Semiconductor Manufacturing Strategies in AI Era to Highlight ASMC 2020

MILPITAS, Calif. — February 20, 2020 — North America-based manufacturers of semiconductor equipment posted $2.34 billion in billings worldwide in January 2020 (three-month average basis), according to the January Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI . The billings figure is 5.9 percent lower than the final December 2019 level of $2.49 billion, and is 23.6 percent higher than the January 2019 billings level of $1.90 billion.

"January data marked a solid start to 2020 with strong year-over-year billings growth for North America-based semiconductor equipment manufacturers,” said Ajit Manocha, SEMI president and CEO. "We expect the equipment market to recover from the soft 2019 though growth prospects may need to be tempered with the potential industry impacts of the Coronavirus outbreak.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI ( www.semi.org ), February 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases . These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo .

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter .

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is March 19, 2020 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp

• Read more about North American Semiconductor Equipment Industry Posts January 2020 Billings

BRUSSELS, Belgium – February 18, 2020 – Leading executives, analysts, economists, and technologists will gather 1-3 April, 2020, at the SEMI Industry Strategy Symposium Europe (ISS Europe) in Brussels, Belgium to highlight opportunities to meet Europe’s most pressing strategic, social and economic needs through technology innovation. Registration is open.

“ISS Europe is a powerful forum for identifying collaboration opportunities to strengthen Europe’s competitive advantage in the digital economy,” said Laith Altimime, president of SEMI Europe. “With the emergence of 5G, artificial intelligence (AI), augmented reality/virtual reality (AR/VR), quantum computing and other leading-edge technologies, the semiconductor industry is well-positioned to help drive the digital transformation for Europe’s societal and economic prosperity.”

ISS Europe 2020 will focus on technology’s role in solving key global challenges, how Europe can hone its expertise in technology areas essential for its competitiveness and security, and the vital role of collaborative innovation. The symposium will kick off with the executive panel Innovations Strengthening European Sovereignty in the Digital Economy and include a discussion about the critical importance of talent, mentoring and diversity in fueling semiconductor industry growth in Europe and internationally.

Executives will network at the opening reception, and on the second day of the event SEMI will announce the 2019 European SEMI Award recognizing the individual or team who has made a significant contribution to the European semiconductor industry.

Sponsors of the symposium are DAS Environmental Experts, Ebara, Edwards, Tokyo Electron, and Watlow.

For more information about ISS Europe 2020, please see the program online or contact Pantelitsa Markus at [email protected]. For sponsorship opportunities, contact Cassandra Melvin at [email protected].

About SEMI

SEMI^® connectsmore than 2,100member companies and 1.3 millionprofessionals worldwidetoadvance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, morepowerful, and more affordable electronic products.Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA)and theMEMS& Sensors Industry Group (MSIG) are SEMI Strategic Association Partners,defined communities withinSEMIfocused on specific technologies. Visit www.semi.orgto learn more, contact one of our worldwide offices, and connect with SEMI onLinkedInandTwitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

• Read more about SEMI Industry Strategy Symposium Europe to Explore Tech’s Role in Meeting Region’s Most Pressing Needs

MILPITAS, Calif. – February 18, 2020 – SEMI today announced the appointment of Timothy Brosnihan as Executive Director of the MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner. A skilled electronics industry executive and seasoned technologist, Brosnihan brings to MSIG extensive MEMS and sensors, product development and manufacturing experience. In his new role, he will direct MSIG global activities including its research and development, standards, and technical programs. Brosnihan will also spearhead MSIG executive conferences and develop new services for the MEMS and sensors industry.

“SEMI is excited to welcome Tim Brosnihan and looks forward to his leadership of the vibrant MSIG community as it drives innovation across every imaginable industry to transform the way we work and live,” said Ajit Manocha, president and CEO of SEMI. “Tim brings superb technical depth, extensive industry contacts, and high energy to this central role as chief evangelist for the $50 billion MEMS and sensors industry.”

“The MSIG Governing Council strongly endorses the selection of Tim Brosnihan to lead SEMI-MSIG,” said John Chong, MSIG council chair and CEO of Jib Technology. “Tim has exceptional leadership qualities and a proven skill set that are readily applicable to MSIG. We are confident that Tim will be a successful advocate for our members and their products.”

Brosnihan began his electronics industry career at Analog Devices and later assumed engineering director roles at Pixtronics and Qualcomm. Most recently, he served as director of MEMS Development at Cirrus Logic. He holds 20 patents and has presented at prestigious conferences organized by IEEE, Transducers, SPIE and other professional societies. He holds a B.S. degree in Mechanical Engineering from Worcester Polytechnic Institute and M.S. and Ph.D. degrees from the University of California at Berkeley.

"I’m honored at the SEMI-MSIG appointment to this unique role,” said Brosnihan. “Our members are true drivers of innovation in mobility and connectivity, with products in virtually every electronics platform. SEMI-MSIG delivers a wealth of industry services and connections worldwide that are enabling the growth and prosperity of our member companies. I look forward to working with SEMI-MSIG to bring new value to the industry.”

About MSIG

MEMS and sensors are integral to billions of electronic devices. From the smartphone to the smart living room, MEMS and sensors are the essential enabling components that allow us to experience the world around us in fundamentally new ways. More than 130 companies and industry partners comprise the MEMS & Sensors Industry Group, a SEMI Strategic Association Partner.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Veteran Technologist Tim Brosnihan Appointed Executive Director of SEMI MEMS & Sensors Industry Group