MILPITAS, Calif. – September 12, 2019 – Investments in new fab projects starting construction in 2020 is expected to reach nearly US$50 billion, up about US$12 billion from 2019, according to the latest update of the World Fab Forecast from SEMI. See figure 1.

Fifteen new fab projects with a total investment of US$38 billion will have started construction by the end of 2019 with 18 more fab projects forecast to start construction in 2020. Of the 18, 10 fab projects with a total investment value of more than US$35 billion carry a high probability and the other eight, with a total investment value of more than US$14 billion, are weighted with a low probability of materializing.

Figure 1: Total investments (construction and equipment) for new fabs and lines (greenfield, shell, new line) starting construction through 2020

Facilities that commence construction in 2019 will begin equipping as early as the first half of 2020, with some starting to ramp production as early as mid-2020. These new fab projects will add more than 740,000 wafers per month (in 200mm equivalents). Most of the additional capacity will be dedicated to foundries (37%) followed by memory (24%) and MPU (17%). Of the 15 new fab projects in 2019, about half are for 200mm wafer sizes. See figure 2.

Figure 2: Fab Count by wafer size for new fabs and lines (greenfield, shell, new line) starting construction in 2019 and 2020

The fab projects to begin construction in 2020 are expected to produce more than 1.1 million wafers per month (in 200mm equivalents). Most of these fabs and lines will begin equipping in 2021. The high-probability fabs will increase capacity by 650,000 wafers per month (in 200mm equivalents) while the low-probability facilities may add another 500,000 wafers per month (in 200mm equivalents). The bulk of the capacity will be for foundry (35%) and memory (34%) across various wafer sizes.

Published by the Industry Research and Statistics Group at SEMI, the World Fab Forecast covers new, planned and existing fabs as well as fab spending for construction and equipping, capacity expansion, and technology nodes by quarter and by product type with more than 1,300 front-end fab listings. All told, 192 updates have been made to the report, including the addition of 64 new facilities and lines since its previous publication in June 2019. The World Fab Forecast also includes projections for fabs and lines starting construction beyond 2020.

Learn more about SEMI fab databases. 

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Fabs Valued at Nearly $50 Billion to Start Construction in 2020

MUNICH, Germany ─ September 10, 2019 ─ Cutting-edge medical technology will highlight SEMICON Europa, 12-15 November, 2019 at Messe München, in Munich, Germany, as the SMART MedTech Forum gathers industry experts for insights into the latest developments and trends in medtech innovations driven by semiconductors. The SMART MedTech Forum is Europe's first event to foster collaboration across the semiconductor and medtech value chains. SEMICON Europa registration is open for visitors and exhibitors.

The SMART MedTech Forum takes the stage at the Inspiration Hub (Hall B2), where attendees will connect with companies behind medtech innovations, experience leading medtech products, and discover startups shaking up the healthcare scene. The forum features the following sessions focused on the critical role of semiconductors and medtech in enabling technology innovation and solutions to the world’s most pressing healthcare challenges.

Global Healthcare Solutions
Janssen Pharmaceutical Companies of Johnson & Johnson will kick off the forum with a discussion on global healthcare challenges and opportunities, followed by a MedTech Europe presentation on trends in healthcare, medtech and digital technology. imec and GE Research will explore how to bridge the gap between semiconductors and medical technologies to solve global healthcare challenges.

Digitization of Preventive Healthcare
More smart medtech device companies are focused on preventive medicine, setting the stage for a presentation by OnePlanet Connected Health Solutions on opportunities in digital health for tracking mental stress using wearable data and machine learning. Maxim Integrated will discuss the potential of sleep monitoring to prevent health problems and reduce healthcare costs, and how wearables can help prevent high blood pressure. And ams AG will examine how sensors can enable consumer health applications for preventative healthcare.

Revolutionizing Healthcare with Personalized Medicine            
Personalized medicine is on the rise as it aims to increase the efficiency and quality of care through customized patient management. Yole Developpement and Fraunhofer EMFT will introduce innovative solutions in precision medicine and drug delivery for personalized healthcare, while X-FAB will discuss how MEMS manufacturing is enabling breakthroughs in personalized medicine.  

The Digital Patient: The Future of Artificial Organs and Human Avatars          
Digital patients promise to prevent and cure disease and transform healthcare through personalized treatment. Experts from the EPFL Lausanne, Philips, Robert Bosch GmbH, and Bart's Heart Centre will discuss quantum leaps in personalized treatment, including the use of artificial organs, Organ-on-Chip, and human avatars as the next paradigm in healthcare.

Pioneering Research in Medical Technologies
With fundamental research key to healthcare innovation, leading research and innovation centers imec and the KU Leuven will examine how CMOS-compatible technologies and systems can be applied to life sciences to enable platforms for personalized medicine.

Other SMART MedTech Forum Highlights
The MedTech Startup Session will host some of the most innovative medtech startups, including Sensome and its breakthrough remote monitoring technology that can turn invasive vascular medical devices into connected healthcare devices. Onera Health and ChronoLife will introduce innovative diagnostic solutions, while PKvitality will present its health-monitoring smartwatches. IC’Alps will showcase its products and services for the design and supply of ASIC/SOC integrated circuits for medtech applications.  
In addition, leaders from ChronoLife, the European Commission and Siemens Healthineers will gather for the panel Key Drivers Transforming Healthcare: AI, Big Data and Cybersecurity, three areas central to medtech advances.

SMART MedTech Forum Sponsors

• imec
• imec.xpand
• GE Research
• Silver sponsor: KLA

SEMICON Europa Sponsors

• Atotech, DAS Environmental Expert, Ebara, Edwards, EV Group, Inficon, JSR Micro, Lam Research, Pfeiffer Vacuum, Rena Technologies, Screen, Siconnex Customized Solutions, Tokyo Electron

For more details, please visit the SEMICON Europa website and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (use #SEMICONEuropa).

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Press Contact
Serena Brischetto, SEMI Europe
Email: [email protected]

• Read more about SEMICON Europa: SMART MedTech Forum Focuses on Innovation, Future of Medical Technology

MSIG MEMS & Sensors Executive Congress to feature business leaders examining market opportunities, innovations and technology trends

MILPITAS, Calif. – September 4, 2019 – Senior executives from across the MEMS and sensors supply chain will gather at MEMS & Sensors Executive Congress (MSEC), October 22-24, 2019, in Coronado, Calif. for the latest innovations driving widespread adoption of these tiny smart devices. Recent MEMS and sensor leaps support more personalized user experiences in biomedical/healthcare, the food supply chain, and Internet of Things (IoT). MSEC is hosted by the MEMS & Sensors Industry Group (MSIG), a SEMI Strategic Association Partner. Registration is now open with early-bird pricing available until September 20, 2019.

MSEC comes as manufacturers plan to embed more than 50 billion MEMS and sensors in thousands of applications by 2024 to meet consumer demand for more intelligence and interactivity in electronic products, according to Yole Développement.1 Featured speakers at MSEC will examine the enabling role of MEMS and sensors in diverse intelligent applications.

MSEC Keynotes and Other Speakers

	Albert Pisano, professor and dean, UC San Diego, will explore how MEMS will enable development of large-scale sensor-driven systems in smart cities, spanning healthcare, transportation, retail and education.
	Stefan Finkbeiner, CEO and general manager, Bosch, will explain how software synthesis and artificial intelligence (AI) will enable MEMS-enabled consumer-electronic devices to automatically adapt to users.
	Pete Warden, staff research engineer, Google, will describe how low-power, low-cost machine learning (ML) will enable hundreds of billions of embedded devices to turn raw sensor data into actionable insights.
	Rachel Gabato, COO, ripe.io, will describe how sensors, AI, ML and blockchain technology underpin a radically transparent digital-food supply chain that maps foods’ journey from production and transportation to the dinner plate.
	John Smee, VP of engineering, Qualcomm, will explain enhancements to 5G Near Radio (NR) that will enable higher performance and more reliable connectivity in industrial IoT, vehicle-to-everything (C-V2X), and massive IoT devices (MIoT).

Additional MSEC Speakers

• Alissa M. Fitzgerald, founder and managing member, A.M. Fitzgerald & Associates, LLC
• Dave Monk, vice president and general manager, Motion Sensors, NXP
• Michael O’Connell, chief analytics officer, TIBCO Software
• Philip Perconti, director, U.S. Army Research Laboratory
• Radislav Potyrailo, principal scientist, Micro and Optoelectronics, GE Global Research
• Rajendra Rao, general manager, IBM Food Trust

Other MSEC Highlights

• Technology Showcase where innovators will demonstrate leading-edge MEMS/sensors-enabled products and platforms
• Networking Events including receptions and evening dinner

Premier Sponsors

• Platinum Sponsor: EV Group
• Gold Sponsors: SPTS Technologies, a KLA Company
• Silver Sponsors: LAM Research and ULVAC
• Bronze Sponsors: AMEC and Applied Materials

Event sponsors include: GE, mCube, Microtech Ventures, Okmetic, OnScale, Rogue Valley Microdevices, Silex Microsystems, SUSS MicroTec and Teledyne DALSA

MSEC will take place at Coronado Island Marriott Resort & Spa in Coronado, Calif. For more information, including the full event agenda, please visit the MSEC website.

Stay in touch on Twitter: @MEMSgroup @SEMI #SEMI_MSEC

• Status of the MEMS Industry 2019 report (June 2019), Yole Développement

About MEMS & Sensors Executive Congress
Hosted by MEMS & Sensors Industry Group (MSIG), a SEMI technology community, MEMS & Sensors Executive Congress (MSEC) is the only US event at which industry executives can exchange ideas and information about MEMS and sensors in commercial applications, all while networking with partners, customers and competitors.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Press Contacts
Michael Hall, SEMI
Email: [email protected]

Maria Vetrano, Vetrano Communications
Email: [email protected]

• Read more about MEMS and Sensors Tap AI, Blockchain, Machine Learning to Boost Personalization in Biomedical, Food Supply, IoT

MILPITAS, Calif. — September 10, 2019 — Worldwide semiconductor manufacturing equipment billings reached US$13.3 billion in the second quarter of 2019, down 20 percent from the same quarter of 2018 and 3 percent from than the previous quarter, SEMI, the global industry association representing the electronics manufacturing and design supply chain, reported today.

The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from more than 80 global equipment companies that provide data on a monthly basis.

The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:

            Source: SEMI (www.semi.org) and SEAJ, September 2019

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI Billings Report, which offers a perspective of the trends in the equipment market
• Monthly Worldwide Semiconductor Equipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Total OEM Semiconductor Equipment Forecast, which provides an outlook for the semiconductor equipment market

For more information or to subscribe, please contact SEMI customer service at 1.877.746.7788 (toll free in the U.S.) or 1.408.943.6901 (International Callers). More information is also available online.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Second Quarter 2019 Worldwide Semiconductor Equipment Billings of $13.3 Billion Down 20 Percent from 2018, 3 Percent from Prior Quarter

MILPITAS, Calif. — September 3, 2019 — 300mm fab equipment spending will slowly recover in 2020 after the 2019 downturn and take off in 2021 to log a new record high topping US$60 billion, only to lag again in 2022 and rebound to an all-time peak in 2023, according to the SEMI Industry Research and Statistics group in its first edition of the 300mm Fab Outlook report.

Most of the surges in fab equipment investment over the five-year outlook will be driven by memory (primarily NAND), foundry/logic, and power. Korea will head the list of top-spending regions followed by Taiwan and China, though Europe/Mideast and Southeast Asia are also expected to show healthy increases between 2019 and 2023.

Offering projections through 2023, the 300mm Fab Outlook report details fab investments across construction and equipment, as well as fab capacities and technologies investment for DRAM, NAND, foundry, logic, and a host of other products manufactured on 300mm wafers.

Fab equipment spending and volume fabs/lines count 2012-2023 and high-probability fab projects

The number of semiconductor fabs/lines in operation is expected to jump more than 30 percent, from 136 in 2019 to 172 in 2023, and climb even higher, to nearly 200, when lower probability fabs/lines are included in the count.

The new SEMI 300mm Fab Outlook report shows facility details by quarter through 2023 and also includes projections for fab projects through 2030 with estimates of various probabilities. 

To learn more about the SEMI 300mm Fab Outlook report, click here.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about 300mm Fab Equipment Spending to Seesaw, Reach New Highs in 2021 and 2023, SEMI Reports

MILPITAS, Calif. — August 22, 2019 — North America-based manufacturers of semiconductor equipment posted $2.03 billion in billings worldwide in July 2019 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI . The billings figure is 0.4 percent higher than the final June 2019 level of $2.03 billion, and is 14.5 percent lower than the July 2018 billings level of $2.38 billion.

“Total billings of North American equipment manufacturers for July were slightly up over June billings,” said Ajit Manocha, president and CEO of SEMI. “Demand for semiconductor equipment this year is being driven by leading-edge logic and foundry, though memory segment growth is soft due to weak market sentiment.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI ( www.semi.org ), August 2019

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases . These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo .

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter .

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is September 19, 2019 at 3:00pm Pacific

For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp

• Read more about North American Semiconductor Equipment Industry Posts July 2019 Billings

Innovators to Demonstrate Advanced MEMS and Sensor Products and Platforms to Win Audience Votes

GRENOBLE, France – 19 August, 2019 – SEMI Europe today announced finalists for the Technology Showcase for MEMS & Sensors and the Technology Showcase for Imaging Sensors at SEMI MEMS & Imaging Sensors Summit, 25-27 September, 2019 in Grenoble, France. The finalists are innovators of leading-edge MEMS and imaging sensors for applications spanning wireless sensor nodes in harsh environments, secure-by-design Internet of Things (IoT) devices, non-invasive wrist-worn blood glucose monitors, and 3D eye tracking that more naturally captures user attention in consumer devices. Registration is open now.

Selected by a committee of industry experts, Technology Showcase finalists will demonstrate new enabling products and platforms that are advancing MEMS and imaging sensors in biomedical, IoT, transportation, vision systems, and other consumer and industrial markets as they compete for audience votes. The Technology Showcases will take place during concurrent sessions on 26 September. Winners will be announced that evening during the gala dinner.
MEMS & Sensors Technology Showcase Finalists

frec|n|sys SAS: Wireless SAW Sensors at 2.45 GHz Built on POI Wafers — frec|n|sys’ Piezoelectric-on-insulator (POI) wafers represent a breakthrough for the development of modern surface acoustic wave (SAW) devices in wireless sensor applications, supporting sensor operation in difficult conditions such as closed metallic areas or for long-distance interrogation. Presented by Sylvain Ballandras, CEO, frec|n|sys SAS.
Marvin Test Solutions: Metal Oxide (MOX) Gas Sensor Testing — A precision test solution that accommodates very large site counts (512 devices) and matches the throughput of high-performance semiconductor test systems but at a lower cost. Presented by Victor Fernandes, European sales manager, Marvin Test Solutions.
Okmetic Oy: Industrial Patterning Platform for Value-added Si Substrate Manufacturing — The Okmetic platform advances the reliability, quality and performance of silicon-based devices. The platform is designed for MEMS, sensor and photonics applications requiring buried cavities, poly-Si filled through-silicon via (TSV) connections, or patterned multi-layer SOI design. Presented by Päivi Sievilä, customer support engineer, Okmetic Oy.
Sensry GmbH: Building the IoT System of the Future with Sensry — Sensry’s individual sensor node features a new secure-by-design chip with flexible, customizable hardware configurations in a system in package (SiP). The sensor node is scalable to support the billions of IoT devices expected over the coming decades. Presented by Konrad Herre, CEO, Sensry GmbH.
Siconnex customized solutions GmbH: Fab Cost Saving Programs with BATCHSPRAY® Technology — Siconnex offers a wide spectrum of wet process solutions for etching, stripping and cleaning applications to help device makers reduce fab costs. Siconnex’s SicOzone™ technology helps reduce chemicals use, minimize chemical waste, enhance product quality,  improve user safety and reduce cleanroom space requirements. Presented by Fabio Wörndl, global director of sales and marketing.

 Imaging and Sensors Technology Showcase Finalists

Alertgy: Impedance/Dielectric Spectrum Imaging System for Non-Invasive Continuous Glucose Monitor (NICGM) for Diabetics — Combines proprietary dielectric materials and signal processing/extraction to detect unique chemical signatures related to blood glucose levels – all in a tiny non-invasive platform suitable for integration in smart watches and other wrist-worn wearables. Presented by Marc Rippen, founder and president, Alertgy.
Eyeware: 3D Eye Tracking Software for Depth-Sensing Cameras — Leverages off-the-shelf depth-sensing cameras to enable 3D eye-tracking in consumer devices, computers and cars without requiring users to wear glasses. The cameras instantly and naturally track user attention and intent. Presented by Bastjan Prenaj, co-founder and growth, Eyeware.
Insightness AG: 7.2µm Pixel Event-Based Vision Sensor with Frame Readout — A stacked event-based image sensor that compresses visual information in smart pixels to enable vision sensors with low power consumption, fast response and high dynamic range. Providing 1024x768 resolution in an optical format of just 1 to 1.7 inches, the Insightness sensors support integration into compact camera modules. Presented by Raphael Berner, head of chip design, Insightness AG.

The MEMS & Imaging Sensors Summit returns to the WTC in Grenoble, France.
Stay in touch on Twitter @SEMIEurope: #SensorsSummit #MEMS #Imaging #IoT #AI #SEMIEurope
Premier Sponsors

• Platinum Sponsor: Beneq, STMicroelectronics
• Gold Sponsors: ASE Group, LAM Research and SUSS MicroTec Group
• Silver Sponsors: Amec, EV Group, SPTS Technologies and Ushio
• Event sponsors include: FujiFilm, Invest In Grenoble-Alps, JSR Micro N.V., Merck KGaA, Darmstadt, Germany and Ushio

For more information including the full event agenda, please visit the SEMI MEMS & Imaging Sensors Summit website.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Press Contact
Serena Brischetto/SEMI Europe
Email: [email protected]

• Read more about SEMI Unveils Technology Showcase Finalists for MEMS & Imaging Sensors Summit

SEMI Technology Think Tank Summit and Electro-Innovation Forum debut. Top research institute experts and tech leaders to help lay foundation for future of innovation and microelectronics.

TAIPEI, Taiwan ─ August 13, 2019 ─ Spanning the entire semiconductor and microelectronics supply chain – from design through systems – SEMICON Taiwan 2019 will gather the world’s top technologists, visionaries and innovators for insights into the latest trends and opportunities across smart vertical markets including manufacturing, automotive, healthcare and data. September 18-20 at Nangang Exhibition Center, Hall I, in Taipei, SEMICON Taiwan 2019 will mark the debut of the SEMI Electro-innovation Forum and Technology Think Tank Summit. Registration for SEMICON Taiwan is open.

•  
  
  Electro-innovation Forum – Experts from five of the world’s top research institutes and R&D centers will examine innovation drivers and trends and prospects for the microelectronics industry. Participants will include imec, CEA-Leti, Fraunhofer, the National Research Foundation (NRF), the Industrial Technology Research Institute (ITRI) and TSMC.
•  Technology Think Tank Summit – Co-organized with the Ministry of Economic Affairs (MOEA), the summit will feature industry leaders in SiP, IC design, memory, wafer fabrication, packaging and testing exploring the future of the industry. Participants include CEOs from Quanta Computer, Hon Hai Technology Group, TSMC, ASE, Etron Technology, Powerchip Semiconductor and Macronix International.

International Forums for Insights on Industry Trends

The two events are among 21 international forums on industry trends and the latest technologies at SEMICON Taiwan 2019 featuring renowned speakers from diverse disciplines. Themed Leading the SMART Future, SEMICON Taiwan will spotlight Artificial intelligence (AI), Internet of Things (IoT), 5G, machine learning, quantum computing and other cutting-edge technologies that are transforming the microelectronics industry and giving rise to a growing universe of smart applications. AI alone spans energy, agriculture, manufacturing, logistics, healthcare, construction, transportation and nearly every other industry – a defining role that promises to fast track the fourth Industrial Revolution.

The following SEMICON Taiwan forums, summits and pavilions will offer the latest industry perspectives on key vertical markets and the talent vital to industry growth.

•  Smart Transportation Forum – Covers issues including 5G and AI for Future Mobility, Mapping for Autonomous Driving, and Next-Generation Communications in the Self-Driving Era
•  Smart Data Global Summit – Latest electronics system design technologies
•  Smart MedTech Forum – Explores the future of smart medical technology and business opportunities
•  Smart Manufacturing Show – Showcases complete smart manufacturing solutions for a wide range of high-technology industries such as semiconductor, touch panel, flat-panel display and PCB
•  Smart Workforce Pavilion – Semiconductor industry insights, lectures, career coaching and job matching

One of the world’s largest and most influential high-technology events, SEMICON Taiwan will feature:

•  21 theme areas and national pavilions
•  More than 200 speakers across 21 international forums
•  700 exhibitors from around the world
•  More than 2,200 booths

SEMICON Taiwan 2019 showcases the full suite of SEMI offerings spanning the full electronics supply chain to support industry growth including:

•  Vertical Application Platforms: Smart Manufacturing, Smart Transportation, Smart Medical, Smart Data and IoT
•  Workforce Development, Industry Standards, Think Tanks and Thought Leadership Platforms
•  Strategic Association Partners such as R&D and innovation leaders imec, CEA-Leti and Fraunhofer as well as MEMS & Sensors Industry Group and Electronic System Design Alliance

Record-Setting Attendance

SEMICON Taiwan is expected to draw an event record 50,000 visitors as Taiwan remains atop the world in semiconductor equipment spending at US$11.4 billion and a 21.1 percent CAGR on the strength of the region’s advanced manufacturing capabilities. A global hub of wafer production and IC packaging, Taiwan claims the top spot in semiconductor equipment spending for the ninth consecutive year.

With the semiconductor industry working to extend silicon scaling beyond Moore’s Law, SEMICON Taiwan will also gather industry experts to explore heterogeneous integration opportunities and challenges across three events:

•  SiP Global Summit – Heterogeneous Integration NOW & FUTURE
•  Strategic Materials Conference Taiwan – Materials Leading the Smart Future of Semiconductors: Device Performance
•  Advanced Testing Forum New! – 5G and AI-assisted Testing

For more information, please visit the SEMICON Taiwan 2019 website or follow us on Facebook.

About SEMI

SEMI^® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts

Emmy Yi
E-mail: [email protected]
Tel: +886.3.560.1777 ext.205

Eileen Lin
E-mail: [email protected]
Tel: +886.3.560.1777 ext. 288

• Read more about Smart Tech, Innovation, Industry Future in Spotlight at SEMICON Taiwan 2019

MILPITAS, Calif. — July 25, 2019 — North America-based manufacturers of semiconductor equipment posted $2.01 billion in billings worldwide in June 2019 (three-month average basis), according to the June Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 2.5 percent lower than the final May 2019 level of $2.07 billion, and is 19 percent lower than the June 2018 billings level of $2.48 billion.

“June billings of North American equipment manufacturers fell nearly three percent when compared to the prior month,” said Ajit Manocha, president and CEO of SEMI. “While billings weakened for the most recent month, total global billings of suppliers based in North America for the most recent quarter are stronger than their first-quarter 2019 billings.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes Next SEMI Billings report is August 22, 2019 at 3:00pm Pacific For information on SEAJ Book-to-Bill Report, visit www.seaj.or.jp

• Read more about North American Semiconductor Equipment Industry Posts June 2019 Billings

Milpitas, Calif. — July 29, 2019 — With advanced materials now a critical enabler of semiconductor growth applications, the stage is set for Strategic Materials Conference (SMC 2019), the premier event offering the latest market insights into drivers of advanced materials in the microelectronics supply chain. September 23-25, 2019, in San Jose, Calif., SMC will highlight opportunities and demand for key enabling materials in every segment of the electronics supply chain. SMC 2019 registration is open.

Themed Year of Transition, Material Opportunities and Challenges, SMC gathers top executives from every segment of semiconductor manufacturing to provide the latest developments in areas of advanced materials including:

• Economic and Market Trends
• Silicon and Alternative Substrates
• More than Moore
• Emerging Materials and Applications
• Automotive IC Drives Material Growth
• Fabs of the Future

SMC 2019 Keynotes

	Dragos Maciuca, PhD, Executive Technical Director, Palo Alto Research and Innovation Center
	Carlos H. Diaz, PhD, Senior Director, Corporate Research
	Bertrand Loy, President and CEO

Industry leaders presenting at SMC 2019 also include:

• Applied Materials
• Advanced Semiconductor Engineering (ASE)
• DuPont
• GLOBALFOUNDRIES
• IBM Research
• IMEC
• Intel Corporation
• Micron Technology
• ON Semiconductor
• PowerAmerica
• Siltronic Corporation
• Wolfspeed, A Cree Company 

Part of the SEMI Technology Leadership Series of the Americas, this year’s event, at the Double Tree by Hilton, also features exclusive business networking for exploring collaboration opportunities in the extended electronics ecosystem and the pre-conference welcome reception, Monday, September 23, 5:30pm - 7:00pm. More event information is available at SMC 2019.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Scott Stevens, Cardinal Communications for SEMI Americas
Phone: 1.512.288.4050
Email: [email protected]

• Read more about Strategic Materials Conference 2019 Highlights "Year of Transition, Material Opportunities and Challenges"