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27-01-2020 - 29-01-2020

3D&Syetems Summit

Expanding Application Space
 

Date and Time:

27 JAN | 16:00 – 21:00
28 JAN |  8:30 – 22:00
29 JAN |  7:50 – 14:30

Add to Calendar 2020-01-27 00:00:00 2020-01-29 00:00:00 3D & Systems Summit Expanding Application Space   Date and Time: 27 JAN | 16:00 – 21:00 28 JAN |  8:30 – 22:00 29 JAN |  7:50 – 14:30 DRESDEN HILTON HOTEL An der Frauenkirche 5 D-01067 Dresden Alemania SEMI.org contact@semi.org Europe/Berlin public
Location

DRESDEN HILTON HOTEL
An der Frauenkirche 5 D-01067
Dresden
Germany

3D&Syetems Summit

The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing.

The summit will focus on high reliability and high performance of disruptive applications like Mobile and IoT.  Invited distinguished global industry speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.

 

2020 Main Topics and Highlights

  • 3DIC Through-Silicon-Via (TSV) Technology
  • 2.5D, 3D FO-WLP/e-WLB
  • Heterogeneous Integration
  • Stacked Dies and Stacked Wafers
  • 3D Alternative Technologies
  • 5G Applications
  • uLED and Photonics Applications
  • Invited Speakers and Keynotes
  • Exhibition Area
  • Networking Opportunities

Agenda

Monday, 27 January 2020

4:00 pm - 4:45 pm

Registration and Welcome Coffee

4:45 pm - 5:00 pm
Laith Altimime
Laith Altimime
President, SEMI Europe

Opening Remarks by the SEMI Europe President

Click here for Biographies

Session 1: Market Briefing

5:30 pm - 5:40 pm
David Butler
David Butler
EVP and General Manager, SPTS Technologies

Opening Remarks by the Session Chair

Click here for Biographies

5:40 pm - 6:10 pm
Jan
Jan Vardaman
President and Founder, TechSearch International, Inc.

Keynote Presentation: A New Era for 3D

Click here for Abstracts and Biographies

6:10 pm - 6:35 pm
Amy
Amy Lujan
VP of Business Development, SavanSys Solutions LLC

Cost and Yield Considerations of 2.5D and Fan-out on Substrate Technologies

Click here for Abstracts and Biographies

6:35 pm - 7:00 pm
Romain Fraux
Romain Freux
CEO, System Plus Consulting

Latest Technology Trends in Advanced Packaging for Mobile Applications

Click here for Abstracts and Biographies

7:00 pm - 9:00 pm

Networking Reception

Tuesday, 28 January 2020

8:20 am - 9:50 am

Welcome Coffee

Session 2: Heterogeneous Integration

8:50 am - 9:00 am
Luke England
Luke England
ASIC Package Development Manager, GlobalFoundries

Opening Remarks by the Session Chair

Click here for Biographies

9:00 am - 9:25 am
Silke Traout
Silke Traut
Technology Management, Dectris AG

Application of 3D Technologies in X-ray and Electron Detectors

Click here for Abstracts and Biographies

9:25 am - 9:50 am
Eoin OToole
Eoin OToole
Technology Development Manager, Amkor Technology

Compatibility of Different FanOut Technologies with Systems and Applications

Click here for Abstracts and Biographies

9:50 am - 10:15 am
Moyra
Moyra McManus
Director, Technology Development Center Europe, ASML

ASML: Creating a New World One Nanometer at a Time

Co-presenter: Steven Steen, Director DUV 3D Memory and Application Product Management, ASML

Click here for Abstract and Biography of Moyra McManus
Click here for Abstract and Biography of Steven Steen

10:15 am - 10:45 am
Eelco Bergman photo
Eelco Bergman
Sr. Director, Sales & Business Development, ASE Group

Keynote Presentation: Packaging Innovations for a Transforming World

Click here for Abstracts and Biographies

10:45 am - 11:10 am

Networking Coffee Break

Besi sponsor
11:10 am - 11:35 am
Markus Leitgeb
Markus Leitgeb
Programme Manager Mechanical Integration, AT&S AG

Heterogeneous Module Integration on Advanced Substrates

Co-author: Martin Schrems, Director Strategy & Business Development, AT&S AG

Click here for Abstracts and Biographies

11:35 am - 12:00 pm
Ruurd
Ruurd Boomsma
CTO, BESI

Advanced Bonding Technologies for Next Generation 3D and SIP Devices

Click here for Abstracts and Biographies

12:00 pm - 12:25 am
Severine
Severine Cheramy
3D Business Development and ITR 3D Director, CEA-Leti

3DVLSI : Wave for Innovation

Click here for Abstracts and Biographies

12:25 am - 12:50 pm
dan smith
Dan Smith
3D Packaging Integration Engineer, GlobalFoundries

GF and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications

Click here for Abstracts and Biographies

12:50 pm - 1:15 pm
Emilie
Emilie Jolivet
Semiconductor and Software Division Director, Yole Développement

Heterogeneous Integration : the Enabler of High Performance Computing

Click here for Abstracts and Biographies

1:15 pm - 2:15 pm

Lunch Break

Session 3: High Performance and Reliability

2:15 pm - 2:20 pm
thomas uhrmann photo
Thomas Uhrmann
Director of Business Development, EV Group

Opening Remarks by the Session Chair

Click here for Biographies

2:20 pm - 2:45 pm
Jawad Nasrullah
Jawad Nasrullah
Co-founder, President and CTO, zGlue

High Reliability in Custom Chips, From Design to Manufacturing

Click here for Abstracts and Biographies

2:45 pm - 3:10 pm
Bernd Waidhas
Bernd Waidhas
Principal Engineer Package Architecture, Technology Enablement Group, Intel

2.xD and 3D Package Architectures and Challenges

Click here for Abstracts and Biographies

3:10 pm - 3:35 pm
Andreas
Andreas Grassmann
Senior Director BE Technology, Infineon

Challenges in Systematic 3D System in Package Development

Click here for Abstracts and Biographies

3:35 pm - 4:00 pm

Networking Coffee Break

Besi sponsor
4:00 pm - 4:25 pm
Eric
Eric Beyne
VP R&D, Program Director 3D System Integration, imec

High Performance 3D System Partitioning and Backside Power Delivery: Progress in EDA and 3D Integration Technology

Click here for Abstracts and Biographies

4:25 pm - 4:50 pm
Benjamin
Benjamin Cook
R&D Director, Texas Instruments

Topic to be announced soon

Click here for Abstracts and Biographies

6:50 pm - 5:15 pm
Valeriy Sukharev photo
Dr. Valeriy Sukharev
Technical Lead, Mentor Graphics

Thermal-mechanical Phenomena in Device and Circuit Reliability for 3D IC Applications

Click here for Abstracts and Biographies

5:15 pm - 5:40 pm
dominique
Dominique Drouin
Research Chair, University of Sheerbrooke

Fluxless Assembly Thanks to Plasma Desoxydation, and Impact on Package Reliability

Click here for Abstracts and Biographies

5:40 pm 5:40 pm -

Closing Remarks and End of the Conference Day

6:40 pm - 7:00 pm

Shuttle Bus

7:00 pm - 10:00 pm

Gala Dinner

Wednesday, January 29th

7:50 am - 8:20 am

Welcome Coffee

8:25 am - 8:30 am
Frank
Franz Schrank
Senior Manager Process R&D, ams AG

Opening Remarks by the Session Chair

Click here for Biographies

8:30 am - 9:00 am
Dr. Douglas Yu
Dr. Douglas Yu
VP of Integrated Interconnect & Packaging, Taiwan Semiconductor Manufacturing Company Ltd.

Keynote Presentation: SoIC - A Longtime Game Changer

Click here for Biographies

Session 4: Enabling Technology

9:00 am - 9:20 am
speaker icon small
Kim Arnold
Executive Director - Wafer Level Packaging Materials, Brewer Science

Innovative Materials Enabling Advanced Packaging Process Flows

Click here for Abstracts and Biographies

9:20 am - 9:40 am
Rafael Santos photo
Rafael Santos
Process Developer, LPKF

Laser Induced Deep Etching of Glass for Novel Fan-Out Applications

Click here for Abstracts and Biographies

9:40 am - 10:00 am
Laura
Laura Mirkarimi
VP 3D Portfolio and Technologies, Xperi Corporation

The Proliferation of Hybrid Bonding for 3D Integrated Circuits

Click here for Abstracts and Biographies

10:00 am - 10:20 am
Bernhard
Bernhard Hammerl
Group Leader Process Engineering, Siconnex

Making Process Engineers Live Easier for Wet Etch, Clean and Strip

Click here for Abstracts and Biographies

10:20 am - 10:40 am
Jeroen
Jeroen Hoet
Product Marketing Manager, KLA

How can Inspection and Metrology Solutions Enable a High Level of 2.5D and 3D Integration?

Click here for Abstracts and Biographies

10:40 am - 11:00 am
MW photo
Markus Wimplinger
Corporate Technology Development and IP Director, EV Group

Wafer Bonding Technology Enabling Next-Generation 2.5D and 3D Device

Click here for Abstracts and Biographies

11:00 am - 11:25 am

Networking Coffee Break

Besi sponsor

Session 5: Mobile and IoT

11:25 am - 11:30 am
steffen kroehnert photo
Steffen Kroehnert
President and Founder, ESPAT Consulting

Opening Remarks by the Session Chair

Click here for Biographies

11:30 am - 12:00 pm
Mustafa Badaroglu
Mustafa Badaroglu
Technical Director, Huawei Technologies

Keynote Presentation: 3D IC Opportunities for High Performance Computing

Click here for Abstracts and Biographies

12:00 pm - 12:25 pm
Francois
François Guyader
Senior Member Technical Staff, STMicroelectronics

3D Integrations for the Smart Image Sensors

Click here for Abstracts and Biographies

12:25 pm - 12:50 pm
speaker icon small
Joerg Siegert
Manager 3DWLI, AMS AG

Advanced Sensors Enabled by Photonic Co-integration

Co-author: Franz Schrank, Senior Manager, Process R&D, AMS AG
Click here for Abstracts and Biographies

12:50 pm - 1:15 pm
Ivan
Ivan Ndip
Department Head, Fraunhofer IZM

New Packaging Platforms for Heterogeneous Integration of 5G mmWave Components

Click here for Abstracts and Biographies

1:15 pm - 1:40 pm
Ayad Ghannam photo
Ayad Ghannam
CEO and Founder, 3DiS Technologies

3D-RDL and Conformal High Aspect Ratio Pre-formed TPVs for RDL-First Type FO-Packages: Enabler of Advanced 3D Wafer-level System Packaging for 5G Applications

Click here for Abstracts and Biographies

1:40 pm - 1:50 pm

Closing Remarks and End of the Conference

1:50 pm - 2:50 pm

Networking Luncheon

REGISTRATION

3D pic

Registration includes:

  • Access to all 3D & Systems sessions
  • Access to the exhibition area
  • All conference proceedings
  • Welcome reception, coffee breaks and lunch (gala dinner excluded)
  • B2B Matchmaking

The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and System-in-Package (SiP) manufacturing as well as applications. 

  • CTO’s hi tech companies
  • OSAT senior managers
  • Principals

Early-Bird 

    • SEMI Members: 700 EUR
    • Non-Members: 925 EUR

    After Jan 1st

      • SEMI Members: 825 EUR
      • Non-Members: 995 EUR

      *Conference fee price in Euro, VAT excl.

      • Conference attendees: 85 EUR
      • Guest: 85 EUR

      Gala dinner ticket can be purchased beforehand through the online registration.

      *Gala dinner price in Euro, VAT excl.

      Location

      The Pulverturm Dresden
      An der Frauenkirche 12, 
      01067 Dresden

      Originally built in 1565, the tower formed an important part of Dresden’s fortifications, and, as its name suggests, was used to store gunpowder safely in the ground – it was a pretty explosive place back then! You will find the restaurant in the historical centre of Dresden in the vaulted ceilings of the Coselpalais next to Frauenkirche. We look forward to welcoming you at the 3D & Systems Gala Dinner!

      Contact: Reviliani Gani at rgani@semi.org

      Floor plan

      Click here to check available booths!

       

      Reserve Your Exhibition Booth Now! 

      Pricing excl. VAT

      • SEMI Members: 3,080 EUR
      • Non-Members: 3,575 EUR

      Exhibition fee includes:

      • 1 booth
      • 1 free entry ticket* 
      • 1 discounted entry ticket* (600 €)
        *this include access to the exhibition and the summit. Promo codes will be sent to exhibitors by December 10.

      Booths have a structure of 2.3m height with back walls of 2m wide and side wall of 1m wide. Depth of the booth is 2m and are equipped with.

      Modular stand includes:

      • Booth space (2m x 2m)
      • 1 sign board with exhibitor name
      • 1 electric distribution
      • 1 table (approx. 1 X 0.6 m)
      • 2 chairs 
      • Exhibitors on corner positions may request in advance that the side wall is removed.

       


      Contact:

      Reviliani Gani at rgani@semi.org

      3D pic

      VENUE

      Hilton Dresden

      Dresden Hilton Hotel

      An der Frauenkirche, 5
      D-01067 Dresden
      Germany
      Tel. 0049 (0)351 86420

      Booking Link: http://group.hilton.com/abrsemi

      Group Name: ABR SEMI

      Price: 99 EUR/Night, incl. Breakfast and VAT

      For more information about the venue please click here.

       

      FROM THE AIRPORT: 
      Follow airport road into town towards the city center. Keep straight and after the bridge “Carolabruecke” turn left, then left again towards the river Elbe and follow the signs for Hilton Dresden.

      FROM DRESDEN HAUPTBAHNHOF TRAIN STATION: 
      Pedestrian path along Prager street to Altmarkt, continue towards to Neumarkt, 20 minutes by foot. 25,00€ by taxi. 

      PUBLIC TRANSPORTS: 
      Tram 3/7/8/11; EUR 2,30 per person/ single trip

      For more information and direction, please check HERE

      Hilton Dresden

      Sponsors

      Besi
      JSR MICRO
      KLA
      spts new logo
      SUSS_Logo_4C.jpg

      Sponsorship Opportunities

      The 3D & Systems Summit addresses the most relevant and controversial topics related to 3D integration and System-in-Package (SiP) manufacturing as well as applications. 

      Sponsorship of 3D & Systems Summit provides various ways to enhance the presence of your company through Thought Leadership, On-site Visibility, Strategic Networking, and Targeted Marketing. SEMI members receive a 10% discount on all sponsorships. 

      Become a Sponsor for this event and take advantage of multiple branding opportunitiesWe thank our 2020 sponsors for their generous support!

       

      Contact:
      Reviliani Gani  
      Email: rgani@semi.org

      EVENT APP

      Download the event mobile app to make the most of your participation and maximize your networking experience!

      Event app

      MEDIA & ASSOCIATION PARTNERS

      Chip scale review
      Cleanroom magazine
      Date20
      i-micronews

       

      mems journal
      OES
      semiconductor packaging news
      silicon saxony
      silicon semi
      smart systems hub
      3Dincities