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27-01-2020 - 29-01-2020

3D&Syetems Summit

Expanding Application Space
 

Date and Time:

27 JAN | 16:00 – 21:00
28 JAN |  8:00 – 22:00
29 JAN |  8:15 – 14:00

Add to Calendar 2020-01-27 00:00:00 2020-01-29 00:00:00 3D & Systems Summit Expanding Application Space   Date and Time: 27 JAN | 16:00 – 21:00 28 JAN |  8:00 – 22:00 29 JAN |  8:15 – 14:00 DRESDEN HILTON HOTEL An der Frauenkirche 5 D-01067 Dresden Alemania SEMI.org contact@semi.org Europe/Berlin public
Location

DRESDEN HILTON HOTEL
An der Frauenkirche 5 D-01067
Dresden
Germany

3D&Syetems Summit

The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D roadmap, Heterogeneous Integration and System-In-Package manufacturing.

The brand new agenda will focus on disruptive applications like Mobile IoT, High Reliability and High Performance.  Invited high-caliber speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.

 

2020 Main Topics and Highlights

  • 3DIC Through-Silicon-Via (TSV) technology
  • 2.5D, 3D FO-WLP/e-WLB
  • Heterogeneous Integration
  • Stacked dies and stacked wafers
  • 3D alternative technologies
  • 5G Applications
  • uLED and photonics applications
  • Invited speakers and Keynotes
  • Exhibition area
  • Networking opportunities

Agenda

Monday, January 27th

4:00 pm - 4:45 pm

Registration / Welcome Coffee

4:45 pm - 5:00 pm
Laith Altimime
Laith Altimime
President, SEMI Europe

Opening

Session 1: Market Briefing

5:00 pm - 5:25 pm
Jan Vardaman
President and Founder, TechSearch International, Inc.

TBD

5:25 pm - 5:55 pm

Keynote TBD

5:55 pm - 6:20 pm
Ami Lujan
VP Business Development, Savansys

Cost and Yield Considerations of 2.5D and Fan-out on Substrate Technologies

6:20 pm - 6:45 pm
Romain Fraux
Romain Freux
CEO, System Plus Consulting

Latest Technology Trends in Advanced Packaging for Mobile Applications

6:45 pm - 7:15 pm

TBD

7:15 pm - 9:00 pm

Networking Reception

Tuesday, January 28th

8:00 am - 8:30 am

Welcome Coffee

8:30 am - 8:40 am

Opening

Session 2: Heterogeneous Integration

8:40 am - 9:05 am
Eion Toole
Amkor Technology

TBD

9:05 am - 9:30 am

TBD

9:30 am - 10:00 am

Keynote TBD

10:00 am - 10:25 am

TBD

10:25 am - 11:30 am

Coffee Break

11:30 am - 11:55 am

CEA-Leti

11:55 am - 12:20 pm
Dan Smith
GF

GF and Arm Demonstrate High-Density 3D Stack Test Chip for High Performance Compute Applications

12:20 pm - 12:50 pm
Doug Yu
VP Integrated Interconnect &Packaging, TSMC

Keynote: SoIC - A Longtime Game Changer

12:50 pm - 2:15 pm

Lunch Break

Session 3: Mobile/IOT

2:15 pm - 2:45 pm

Keynote TBD

2:45 pm - 3:05 pm
TBD
STMicroelectronics

TBD

3:05 pm - 3:30 pm

TBD

3:30 pm - 3:55 pm

TBD

3:55 pm - 4:45 pm

Coffee Break

Session 4: High Reliability

4:45 pm - 5:10 pm

STMicroelectronics

5:10 pm - 5:35 pm

TBD

5:35 pm - 6:00 pm

TBD

6:00 pm - 6:25 pm

TBD

6:40 pm - 7:00 pm

Shuttle bus

7:00 pm - 10:00 pm

Gala Dinner

Wednesday, January 29th

7:45 am - 8:15 am

Welcome Coffee

8:15 am - 8:25 am

Opening

Session 5: Enabling Technology

8:25 am - 8:40 am

TBD

8:40 am - 8:55 am
Rozalia Beca
Dow

TBD

8:55 am - 9:10 am
Laura Mirkarimi
Xperi

TBD

9:10 am - 9:25 am

TBD

9:25 am - 9:40 am

TBD

9:40 am - 9:55 am

TBD

9:55 am - 10:10 am

TBD

10:10 am - 10:25 am

TBD

10:25 am - 10:40 am
Pieter Vandewalle
KLA

TBD

10:40 am - 11:20 am

Coffee Break

Session 6: High Performance

11:20 am - 11:45 am

TBD

11:45 am - 12:10 pm

TBD

12:10 pm - 12:35 pm

TBD

12:35 pm - 1:00 pm

TBD

1:00 pm - 1:25 pm

TBD

1:25 pm - 1:30 pm

Closing Remarks

1:30 pm - 2:30 pm

Lunch Break

REGISTRATION

Registration includes:

  • Access to all 3D & Systems sessions
  • Access to the exhibition area
  • All conference proceedings
  • Welcome reception, coffee breaks and lunch (gala dinner excluded)
  • B2B Matchmaking

The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. 

  • CTO’s hi tech companies
  • OSAT senior managers
  • Principals

Early-Bird - Before Nov 30th

  • SEMI Members: 600 EUR
  • Non-Members: 765 EUR

Early-Bird - After Dec 1st

    • SEMI Members: 700 EUR
    • Non-Members: 925 EUR

    After Jan 1st

      • SEMI Members: 825 EUR
      • Non-Members: 995 EUR

      *Conference fee price in Euro, VAT excl.

      • Conference attendees: 85 EUR
      • Guest: 85 EUR

      Gala Dinner ticket can be purchased beforehand. 

       

      Contact: Reviliani Gani at rgani@semi.org

      Floor plan

      Click here to check available booths!

       

      Reserve Your Exhibition Booth Now! 

       

      Pricing excl. VAT
       

      Before October 31

      • SEMI Members: 2,795 EUR
      • Non-Members: 3,250 EUR

      From November 1

      • SEMI Members: 3,080 EUR
      • Non-Members: 3,575 EUR

       

      Exhibition fee includes:

      • 1 booth
      • 1 free entry ticket* 
      • 1 discounted entry ticket* (600 €)
        *this include access to the exhibition and the summit. Promo codes will be sent to exhibitors by December 10.

      Booths have a structure of 2.3m height with back walls of 2m wide and side wall of 1m wide. Depth of the booth is 2m and are equipped with.

      Modular stand includes:

      • Carpet (2m x 2m)
      • 1 sign board with exhibitor name
      • 1 electric distribution
      • 1 table (approx. 1 X 0.6 m)
      • 2 chairs 
      • Exhibitors on corner positions may request that the side wall is removed.

       

      Contact:

      Reviliani Gani at rgani@semi.org

      VENUE

      Hilton Dresden

      Dresden Hilton Hotel

      An der Frauenkirche, 5
      D-01067 Dresden
      Germany
      Tel. 0049 (0)351 86420

      Booking Link: http://group.hilton.com/abrsemi

      Group Name: ABR SEMI

      Price: 99 EUR/Night, incl. Breakfast and VAT

      For more information about the venue please click here.

       

      FROM THE AIRPORT: 
      Follow airport road into town towards the city center. Keep straight and after the bridge “Carolabruecke” turn left, then left again towards the river Elbe and follow the signs for Hilton Dresden.

      FROM DRESDEN HAUPTBAHNHOF TRAIN STATION: 
      Pedestrian path along Prager street to Altmarkt, continue towards to Neumarkt, 20 minutes by foot. 25,00€ by taxi. 

      PUBLIC TRANSPORTS: 
      Tram 3/7/8/11; EUR 2,30 per person/ single trip

      For more information and direction, please check HERE

      Hilton Dresden

      Sponsors

      JSR MICRO

      Sponsorship Opportunities

      The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. 

      Sponsorship of 3D & Systems Summit provides various ways to enhance the presence of your company through Thought Leadership, On-site Visibility, Strategic Networking, and Targeted Marketing. SEMI members receive a 10% discount on all sponsorships. 

      Become a Sponsor for this event and take advantage of the multiple branding opportunities, Thank you to all our sponsors for your generous support.

       

      Contact:
      Reviliani Gani  
      Email: rgani@semi.org

      EVENT APP

      Download the event mobile app to make the most of your participation and maximize your networking experience!

      Event app

      MEDIA & ASSOCIATION PARTNERS

       

      Chip scale review
      Cleanroom magazine
      Date
      Epic
      i-micronews

       

      mems journal
      OES
      semiconductor packaging news
      silicon saxony
      silicon semi
      smart systems hub
      solid state
      3Dincities