What are semiconductors? They are the brains that enable the apps, gadgets, and miracles of tomorrow. Learn about an industry that powers the modern world and how it will impact Ohio. Come and learn how microelectronics enable a smart future that is radically changing everyday life — from communicating on the go and commuting to work, to “printing” a hearty breakfast and conducting holographic heart surgery. The semiconductor industry is coming to Ohio….find out why Ohio continues to flip for chips!
Register today to jump start your career to the future! All Majors Are Welcome: Students with a background in Engineering, Business (Statistics, Analytics), Computer Science, Chemistry, Data Science, Materials Science, Mathematics, and Physics are strongly encouraged to attend.
Doors open at 12:00pm with a welcome and overview. Activities begin at 12:30pm
The Ohio State University Archie M. Griffin East Ballroom - The Ohio Union 1739 N. High Street Columbus, OH43210 United States
12:00 pm
Doors Open (lunch available)
12:30 pm
-
4:00 pm
Throughout this in-person event, connect and network with industry representatives. Sessions include:
• Ask an Expert
• A Day in Life and Tales from a Recent Grad
• Resume, Interviewing and Networking Skills
• Industry Exploration
And while you’re learning about why the semiconductor industry is the future, be sure to...
• Sign up speed mentoring
• Get your resume reviewed
• Learn interviewing tips
• Find out about internships
And grab a 'Semiconductor Day' t-shirt, and win prizes (including an Apple watch) by participating in these activities,
• Bingo Scavenger Hunt
• Coding Challenge
• Guess the wafer
• Lego Challenge
• Human Thermometer
• Semiconductor Sustainability Wheel
• All while enjoying food and music and getting swag!
12:00 pm - 4:00 pm
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Add to Calendar2024-04-09 12:00:002024-04-09 16:00:00Semiconductor Day at The Ohio State UniversitySemiconductor Day Is Back!The Ohio State University Archie M. Griffin East Ballroom - The Ohio Union 1739 N. High Street Columbus, OH 43210 United StatesSEMI.org[email protected]America/New_Yorkpublic
America/New_York
[IN-PERSON] Advanced Packaging Training Seminar 2023
Substrate and PCB fabrication processes and its key processes and materials such as ABF, BT, FR5, etc.
Build-up micro-via technologies with use of lasers, plasma, photo materials etc.
Registration and tolerances of substrate design in relation to substrate and PCB fabrication processes which includes via to pattern, pattern to resist etc, which can affect microelectronics assembly processes.
Materials, design and surface finishes (Cu, NiAu, ENIG , NiPdAu etc) with respect to assembly processes and parameters.
Substrate defects and package reliability including failure of fatigue, kirkendall voids and intermetallics.
Why should I attend?
Provides necessary technical knowledge for industry professionals
Enhance knowledge in manufacturing and R&D know-how in IC packaging
Case studies discussion
Networking Opportunity with industry peers
Who should attend?
Directors, managers, process engineers, R&D engineers working in the areas of microelectronics
Useful for sale or application engineers who supply packaging materials and tools to the industry
Malaysian International Trade & Exhibition Centre (MITEC) No. 8 Jalan Dutamas 2 50480Kuala Lumpur Kuala Lumpur Malaysia
MEET OUR TRAINER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
- Problem solving exercises on Assembly Challenges
4:00 pm
-
5:00 pm
Q&A Discussion
5:00 pm
End of Day 1
9:00 am
-
12:00 pm
Assembly Challenges and Defects
- Assembly differences in PCB and substrate
- Surface finishes for assembly
- Substrate surface finishes for packaging, soft Ni/Au for wirebonding, ball attach
- PCB surface finishes for 2nd interconnect, ENIG, NiPdAu and Cu with OSP
- Strip warpage
- Thermal stress and shrinkage affecting warpage
- Slots, Cu patterning and solder resist thickness impacting warpage
Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability
Substrate and PCB technologies are the building blocks for Microelectronics Packaging and surface mount packages.
Course Fee:
Member Rate: SGD 750
Non-member Rate: SGD 935
Register before 6 March 2023 to enjoy Early Bird rate of up to 15% off the rates above.
This workshop is HRDC Claimable, subjecting to terms and conditions.
Certificate of completion will be awarded at the end of the workshop.
Advanced Packaging Training Seminar 2023
Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability
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Add to Calendar2023-03-08 00:00:002023-03-09 00:00:00[IN-PERSON] Advanced Packaging Training Seminar 2023Interaction of Substrate and PCB to Microelectronics Packaging Assembly and Reliability
Substrate and PCB technologies are the building blocks for Microelectronics Packaging and surface mount packages.
Course Fee:
Member Rate: SGD 750
Non-member Rate: SGD 935
Register before 6 March 2023 to enjoy Early Bird rate of up to 15% off the rates above.
This workshop is HRDC Claimable, subjecting to terms and conditions.
Certificate of completion will be awarded at the end of the workshop.
Malaysian International Trade & Exhibition Centre (MITEC) No. 8 Jalan Dutamas 2 50480 Kuala Lumpur Kuala Lumpur MalaysiaSEMI.org[email protected]Asia/Singaporepublic
Asia/Singapore
[PDS] Professional Development Seminar—Massachusetts Institute of Technology
Registration
Event is FREE. Registration is required by October 3, 2022.
[PDS] Professional Development Seminar
—Organized by SEMI Northeast Chapter
—Collaboration with Massachusetts Institute of Technology
This in-person and livestreamed seminar with MIT will help students explore careers in the micro- and nano-electronics.
Attendance is FREE, however registration is required by October 3, 2022.
Professional Development Seminar—Massachusetts Institute of Technology
Thursday, Oct 6, 2022
4:30–7:30pm Eastern Time
IN-PERSON & VIRTUAL
4:30 pm - 7:30 pm
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Add to Calendar2022-10-06 16:30:002022-10-06 19:30:00[PDS] Professional Development Seminar—Massachusetts Institute of Technology[PDS] Professional Development Seminar
—Organized by SEMI Northeast Chapter
—Collaboration with Massachusetts Institute of Technology
This in-person and livestreamed seminar with MIT will help students explore careers in the micro- and nano-electronics.
Attendance is FREE, however registration is required by October 3, 2022. MIT | Building 4, Room 370 77 Massachusetts Avenue Cambridge, MA 02139 United StatesSEMI.org[email protected]America/New_Yorkpublic
America/New_York
SEMI Professional Development Seminar—San Jose State University
Registration
Event is FREE. Registration is required by September 8, 2022.
Connecting College Students to the Semiconductor Industry
Learn about career opportunities and skills set needed in high tech and acquire valuable, practical information that will help you choose career directions and plan for success.
Industry volunteers shared what the high tech industry looks for when they recruit for new graduates.
Topics include:
Job Opportunities in this Industry (job openings for internships and entry level)
Career Preparation
Semiconductor 101
Mock Interviews
Speed Mentoring
Academia to Industry
Day in a Life (of Computer Science, Biotechnology and Semiconductor Applications)
Networking with Industry Leaders, Hiring Managers, and Recruiters
Raffle Drawing & Prizes
San Jose State University, Student Union Ballroom (Level 2) 211 South 9th St San Jose, CA95192 United States
SEMI Professional Development Seminar
—Organized by SEMI Silicon Valley Chapter
—Collaboration with San Jose State University
This seminar with San Jose State University will help students meet the demands of today's high tech workforce and be successful in their careers.
Attendance is FREE, however registration is required by September 8, 2022.
Professional Development Seminar—San Jose State University
Friday, September 16, 2022
8:30am–1:00pm Pacific Time
IN-PERSON
8:30 am - 1:00 pm
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Add to Calendar2022-09-16 08:30:002022-09-16 13:00:00SEMI Professional Development Seminar—San Jose State UniversitySEMI Professional Development Seminar
—Organized by SEMI Silicon Valley Chapter
—Collaboration with San Jose State University
This seminar with San Jose State University will help students meet the demands of today's high tech workforce and be successful in their careers.
Attendance is FREE, however registration is required by September 8, 2022. San Jose State University, Student Union Ballroom (Level 2) 211 South 9th St San Jose, CA 95192 United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
[IN-PERSON EVENT] Advanced Semiconductor Technology Conference (ASTC) 2023 January
Advanced Semiconductor Technology Conference (ASTC) is supported through corporate sponsorship. Be recognized as part of the key players to this event that bridge the industry, leading the congregation of leaders and technologists to drive new development and adoption enabling advanced manufacturing landscapes.
Please contact our sales team for more information on Sponsorships.
New sensor technologies enabling dramatically reduced size, weight, power, and cost are creating exciting opportunities for future applications. ASTC 2023 presents to you a conference and exhibition that gathers companies, industry leaders, semiconductor experts, and academia to help gain insights on the latest development and trends, as well as challenges in design, manufacturing, integration, and applications. Visit the exhibition booths to find out the latest technologies, products, services, and solutions.
ITE College Central Theatre@illuminITE College Central, Level 2 Blk A 2 Ang Mo Kio Drive 567720 Singapore
17 Jan 2023 (Day 1)
8:30 am
Registration @ Theatre@illuminITE at 2nd Floor
9:30 am
Singapore Electronics Week Opening, Arrival of GoH: Minister Gan Siow Huang, Minister of State, Ministry of Education and Ministry of Manpower
at Tay Eng Soon Convention Centre 4th Floor
9:40 am
Welcome Speech by Ms Low Khah Gek, CEO of ITE
at Tay Eng Soon Convention Centre 4th Floor
9:50 am
Opening Address by Ms Jennifer Teong, Chairman of SSIA
at Tay Eng Soon Convention Centre 4th Floor
10:00 am
Launching of Semiconductor Active Youth (SAY) Ambassador Program
at Tay Eng Soon Convention Centre 4th Floor
10:15 am
Signing of MOU between SSIA and ITE
at Tay Eng Soon Convention Centre 4th Floor
10:20 am
Tea Break | Networking
at Tay Eng Soon Convention Centre 4th Floor
10:45 am
Semiconductors: The "Intelligent Steel of the 21st Century" | Mr. Francois Guibert | Former EVP and President | STMicroelectronics Greater China and South Asia
at Tay Eng Soon Convention Centre 4th Floor
11:20 am
Panel Discussion: Why the Electronics Sector is still a Beacon of Light?
at Tay Eng Soon Convention Centre 4th Floor
Moderator:
Mr. Chan Si En | Process Support Engineer | Applied Materials
Panelists:
Mr. Goh Ru Gene | Senior Director | AMD
Mr. Foo Kuo Yang | HR Director | STMicroelectronics
Prof. Kelvin Fong Xuanyao | National University of Singapore
Mr. Teo Zhi Sen | Student | National University of Singapore
12:00 pm
Networking Lunch
at Theatre@illuminITE College Central, 2nd Floor
12:30 pm
ASTC Registration
at Theatre@illuminITE College Central, 2nd Floor
1:05 pm
SEMI SEA Regional Advisory Board Member
Dr. John Nelson
President & CEO
UTAC
Welcome Address
1:15 pm
SEMI SEA Regional Advisory Board Member
Mr. Terence Gan
Executive Director
A*Star: Institute of Microelectronics (IME)
Opening Keynote
1:30 pm
Presentation of SEMI-MSIG Global Emerging Young Leader Award
1:35 pm
Dr. Tim Brosnihan
Executive Director
MSIG
MEMS Market Outlook and MEMS & Sensors Industry Group update
1:55 pm
Prof. Vincent Lee
Associate Professor
National University of Singapore
AI-Enhanced Sensors - Leveraging the Cloud Computing Towards AIoT Enabled Smart Home, Digital Twin and Metaverse Applications
2:15 pm
Dr. Piotr Kropelnicki
Vice President of Engineering and Founding Member
Meridian Innovation
Thermal Imaging Using a CMOS Compatible, Hybrid MEMS Structure
2:35 pm
Dr. Wu Jie
Head of Application Engineering
Henkel
Adhesive Solutions to Enable MEMS and Sensor Packages
2:55 pm
SEMI SEA Advanced Packaging Technical Committee Member
Dr. Lee Teck Kheng
Director
ITE Technology Development Centre
A Glimpse into MEMS Packaging and its Future
3:15 pm
Plaque Presentation & Lucky Draw
3:30 pm
End of Day 1
18 Jan 2023 (Day 2)
9:00 am
Registration |Coffee & Tea| Networking
9:30 am
Mr. Anton Hofmeister
Group Vice President and General Manager, R&D and Strategy
STMicroelectronics
Opening Keynote
9:50 am
Dr. Zhu Yao
Head of MEMS
A* Star IME
Dr. Lennon Lee
Deputy Director
A*Star IME
New Piezoelectric and Infrared Technologies for Emerging Opportunities
10:10 am
Mr. John West
Senior Division Director, Semiconductor Subsystems and Test
Yole Group
MEMS Manufacturing Equipment Market
10:30 am
Dr. Koukou Suu
President and CEO
ULVAC Technologies, Inc
Advanced MEMS & Sensor as functional device Fabrications enabled by thin film sputtering technologies
10:50 am
Fireside Chat | Moderated by Tim Brosnihan | Executive Director, MSIG
Anton Hofmeister; Zhu Yao; Dr. Koukou Suu
11:40 am
Plaque Presentation
11:50 am
Lunch Break | Networking | Exhibits
12:35 pm
Dr. David Lacey
Director, Advanced Development & Services, R&D
ams Osram
How the Semiconductor Industry is Driving Future Healthcare
12:55 pm
Mr. Alastair Attard
Director of Business Development - MEMS & Sensing Applications
UTAC
Image Sensor Solutions for Automotive Imaging Applications
1:15 pm
Mr. Glen Siew
Director of Strategic R&D
Amkor Technology
The New "SIP" Sensor in Package for Sensor Fusion & IoT
1:35 pm
Mr. Jackson Seah
Senior Technical Consultant
DISCO Hi-Tec
Stealth Dicing for MEMS
1:55 pm
Dr. Shen Li Ming
Principal Engineer, BB Process Engineering
Kulicke & Soffa
Ball Bonding Process Optimization on MEMS Devices
2:15 pm
Plaque Presentation and Lucky Draw
2:25 pm
Mr Travers Lim
Associate Director, Program & Business Development
With MEMS and Sensor innovations driving an explosion of automotive, consumer electronics, healthcare, mobile, industrial space, and Internet of Things (IoT) applications, the stage is set for the SEMI Southeast Asia ASTC Conference & Exhibition focusing on MEMS & Sensors.
Visit the exhibition booths to discover the latest technologies, products, services, and solutions. This event will also provide many opportunities for delegates to engage and network with other semiconductor peers.
NOTE: ASTC is a paid conference. Visitor registration for the exhibition is free.
Held in:
ASTC 2023 Conference Materials is available on demand here.
17 - 18 January 2023
Venue: Theatre@illuminITE College Central, Singapore
9:00 am - 5:00 pm
Off
Add to Calendar2023-01-17 09:00:002023-01-18 17:00:00[IN-PERSON EVENT] Advanced Semiconductor Technology Conference (ASTC) 2023 JanuaryAdvanced Semiconductor Technology Conference (ASTC) 2023
With MEMS and Sensor innovations driving an explosion of automotive, consumer electronics, healthcare, mobile, industrial space, and Internet of Things (IoT) applications, the stage is set for the SEMI Southeast Asia ASTC Conference & Exhibition focusing on MEMS & Sensors.
Visit the exhibition booths to discover the latest technologies, products, services, and solutions. This event will also provide many opportunities for delegates to engage and network with other semiconductor peers.
NOTE: ASTC is a paid conference. Visitor registration for the exhibition is free.
Held in:
ASTC 2023 Conference Materials is available on demand here.ITE College Central Theatre@illuminITE College Central, Level 2 Blk A 2 Ang Mo Kio Drive 567720 SingaporeSEMI.org[email protected]Asia/Singaporepublic
Asia/Singapore
EMG Webinar Overcoming Worker Shortages and Enhancing Sustainability
Two overarching business issues face the industry today – how to responsibly create sustainability strategies and how to find and train strong workers. Both issues are challenging management teams to think creatively and change fundamental processes of their business.
SEMI members are looking to SEMI to provide industry-wide guidance and support to share best practices, build grassroots processes, and guidebooks that both large and small companies can use to improve their efforts.
Attend this webinar to get an update and insights, with a special tilt toward the materials industry, on how you can incorporate SEMI guidebooks for hiring qualified and diverse DEI and Veterans hiring, as well as other efforts toward strengthening your workforce. On the Sustainability topic, hear how the industry is coming together to help each other in Scope 1,2, and 3 measuring and reporting mechanisms, and more!
Overcoming Worker Shortages and Enhancing Sustainability
10:00 am - 11:00 am
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Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits.
8:00 am - 10:00 pm
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Add to Calendar2026-02-24 08:00:002026-02-26 22:00:00FOA Summit (Q1 Collaborative Forum)Join your fellow members for the FOA Annual Collaborative Forum - live and in-person - for informative new case studies, networking, dinners, and exhibits. This event is for FOA Members only. To learn more about becoming an FOA member, email [email protected]. Visit the FOA web pages.Austin Marriott South 4415 South IH-35 Austin, TX 78744 United StatesSEMI.org[email protected]America/Chicagopublic
America/Chicago
Workforce Shortage—Meeting Challenges for the Semiconductor Industry
As demand for semiconductors is increasing, foundries and other makers of chips are expanding their manufacturing capacities. With new fabs that will bring thousands of new jobs to the US, Arizona and Texas are poised to gain many of those positions. Where will we find the talent to fill the upcoming surge of engineering and technical personnel needed to support our existing infrastructure, but also support the new fabs coming in just two-four years?
The SEMI Arizona and Texas Chapters will explore this topic by hearing from Arizona and Texas-based leadership on the current market conditions, trends and outlook. We will also hear from the semiconductor industry, experts from industry, universities/colleges and military who will provide insight into preparing a new workforce to meet our current workforce needs and needs of our not-to-distant future.
Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET). As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.
In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain
Gate All Around Transistors - Opportunities Abound
Position yourself for the next chapter of Moore's Law
10:00 am - 11:00 am
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America/Los_Angeles
