Moore’s Law continues to evolve - dramatically changing the Field Effect Transistor (FET). As FinFETs reach their performance limits, attention is turning to Gate All Around (GAA) architectures based on Horizontal Nanosheet technology. Such a fundamental shift in transistor architecture will create new challenges to processes and materials, presenting opportunities for companies well-positioned for this shift.
In this webinar, SEMI EMG brings experts to explain the technology trends driving the industry adoption of Gate All Around, how the major players are approaching this transition, and the implications this will have on the material supply chain
Gate All Around Transistors - Opportunities Abound
Position yourself for the next chapter of Moore's Law
10:00 am - 11:00 am
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America/Los_Angeles
9:00 am - 5:30 pm
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Add to Calendar2021-09-28 09:00:002021-09-28 17:30:00BIPV TASK FORCE MEETINGBIPV TASK FORCE MEETING
光伏建筑一体化(BIPV)屋顶抗风揭试验方法标准交流会ChinaSEMI.org[email protected]America/Los_Angelespublic
10:00 am - 11:30 am
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Add to Calendar2021-09-17 10:00:002021-09-17 11:30:004H-SiC Homoepitaxial Wafer Task Force Meeting 会议邀请:4H-SiC同质外延片工作组线上会议
4H-SiC Homoepitaxial Wafer Task Force Meeting
Meeting:Link
Friday, September 17, 2021
10:00-11:30ChinaSEMI.org[email protected]America/Los_Angelespublic
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
4:15 pm - 4:35 pm
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Add to Calendar2021-09-23 16:15:002021-09-23 16:35:00Session 1: Ultra Wide Band Gap Wafer and Heat Sink Diamond SubstratesSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Ultra Wide Band Gap Wafer and Heat Sink Diamond Substrates
Speaker: Xing Zhang, CEO of Compound Semiconductor Manufacturing(Xiamen) Co., Ltd
Thursday, September 23, 2021
16:30-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509ChinaSEMI.org[email protected]America/Los_Angelespublic
Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and Lidar
4:35 pm - 5:00 pm
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Add to Calendar2021-09-23 16:35:002021-09-23 17:00:00Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and LidarSEMI International Standards Program
Compound Semiconductor Technology Forum
Note: Forum language is mandarin, no simultaneous Interpretation provided
Session 2: Progress of VCSEL Technology and Its Applications in 3D Sensing and Lidar
Speaker: Qingwei Mo, Chief scientist of ZJEAGLE.Co., Ltd
Thursday, September 23, 2021
16:35-17:00
Wuhu, Anhui, China
Webinar Link: Click here
Event Contact information:
Ein Wu
SEMI China
Email: [email protected]
Phone: 86.21.6027.8509ChinaSEMI.org[email protected]America/Los_Angelespublic