Shanghai
China
China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021年 SEMI 中日交流协作会 China SEMI.org [email protected] America/Los_Angeles publicChina
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-11-19 00:00:00 2021-11-19 00:00:00 2021 SEMI China-Japan Collaboration Conference China SEMI.org [email protected] America/Los_Angeles publicRegistration Details
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
About the Instructor
Dr. Toni Mattila is the Head of Sustainable Manufacturing at Business Finland, which is a governmental agency for R&D and innovation funding, business development and internationalization services. Toni leads a national business development program with the goal of transforming Finnish manufacturing industries towards sustainable development. Toni worked for fourteen years in academia as a researcher in the field of microelectronics. Toni is an active member of IEEE Electronics Packaging Society, and a frequent attendee of various electronics conferences.
United States
This Master Class was held live on December 1, 2021. It is still available On Demand.
Sustainability is more a way of thinking than a technological solution. To achieve sustainability, a company must develop a comprehensive approach that covers multiple levels and segments of its business.
Watch this course to develop an understanding of the essential components of industrial carbon footprint and discuss actions companies and industry can take to reduce theirs. Throughout the course, we paid particular attention to the electronics industry; what the sector has already contributed and what remains to be achieved.
The role of new technologies – e.g. FHE - was discussed and what role they play in reducing the carbon footprint so that ‘sustainability’ can become a sustainable business.
Watch this course to focus on a broader picture of sustainability in the electronics sector.
9:00 am - 11:00 am Off Add to Calendar Disabled America/Los_Angeles
Society has come to depend on the rapid, predictable, and affordable scaling of computing performance for consumer electronics, the rise of ‘big data’ and data centers, scientific discovery, and national security. The approaching end of lithographic scaling threatens to hinder continued health of the $2T electronics industry, impacting many related fields that depend on computing and electronics. By some projections, within a decade, the technological underpinnings for Moore’s Law will come to an end, as lithography gets down to atomic scale. At that point, it will not be feasible to create lithographically produced devices, with dimensions nearing atomic scale, where a dozen or fewer silicon atoms are present across critical device features and will therefore represent a practical limit for implementing logic gates for digital computing. In 2019, SEMI launched a special thought leadership initiative – SEMI Think Tanks – where the leading minds of our industry gather to address the challenges and opportunities for the semiconductor and broader electronics industries with a 20-30 year horizon. SEMI is honored to be the rallying force behind bringing together the industry stalwarts and thought leaders to share their prophetic views in our pioneering Think Tank series on The Future of Computing.
United States
Welcome Remarks and Speaker Introductions
What are SEMI Think Tanks? Concept, Scope and Deliverables
"It Takes a Village" Think Tank Leadership View on the Future of Computing
Progress Report on Active and Planned Think Tank Workstreams
Q&A
Closing
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China
Standards Workforce DevelopmentBIPV TASK FORCE MEETING
光伏建筑一体化(BIPV)屋顶抗风揭试验方法标准交流会

China
Standards Workforce Development会议邀请:4H-SiC同质外延片工作组线上会议
4H-SiC Homoepitaxial Wafer Task Force Meeting
Meeting:Link
Friday, September 17, 2021
10:00-11:30
10:00 am - 11:30 am Off Add to Calendar 2021-09-17 10:00:00 2021-09-17 11:30:00 4H-SiC Homoepitaxial Wafer Task Force Meeting 会议邀请:4H-SiC同质外延片工作组线上会议 4H-SiC Homoepitaxial Wafer Task Force Meeting Meeting:Link Friday, September 17, 2021 10:00-11:30 China SEMI.org [email protected] America/Los_Angeles publicRegistration
Registration is free for SEMI Members. Use your company email when registering for the system to recognize you as a member.
Non-Member fee = $49
Contact Paul Trio at [email protected] with any questions.
Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design? These continue to emerge in parallel to ever shrinking semiconductor device geometries.
While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes.
It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.
Join us for this session for speakers and discussion on tackling some of these industry challenges.
Virtual
United States
Welcome
IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools
Introduction to the Presentations
Contamination Control for PFA
Metrology: (Ideally) Enabling the What, When, How, and Where of Unknown Contamination Detection and Control
Challenges in detecting nanoparticle, NVR, native oxide, and trace metals for 5 nm and beyond processes
HMW Organic Contaminants: What, Where, How?
Advance Metrology for Particle Sizing and Identification in Ultrapure Liquids
On-wafer detection and characterization of organic defects with Unisers
Open Discussion
New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
Join us for this webinar-like session to discuss best-known methods from industry leaders
7:30 am - 10:00 am Off Add to Calendar Disabled America/Los_AngelesREGISTRATION
Complimentary for SEMI Members.
Use your corporate email address during login to be recognized as a SEMI Member.
$99 for Non-Members.
The semiconductor industry is expected to reach US$1 trillion by the end of the decade. The next big technology revolutions (AI, 5G/6G, VR/AR, qubit computing, and more) are driving the need to manage exponential amounts of data. Everything from cars to coffee machines are generating data that needs to be moved, stored, computed, secured, and converted to end-user information. To make this a vision a reality requires innovation throughout the semiconductor industry, from new materials to new and improved process equipment to new device architectures designed to perform at speeds and densities once thought unachievable. In this webinar, we will hear from industry experts on what the 10-year technology trends look like and how semiconductor material and equipment suppliers are responding to the trends.
Dr. Todd Younkin, President and CEO of Semiconductor Research Corporation (SRC) will discuss the evolving challenges and five “seismic shifts” that are driving advancement in the semiconductor industry.
Following Dr. Younkin’s talk, David Medeiros, Senior Director, CTO Office of Entegris, Inc. will address these challenges and describe how Entegris is driving materials innovation to overcome the obstacles faced by chip manufacturers.
United States
Session Introduction
Biography: Darron Jurajda is the Director of Semiconductor Business Operations at Brewer Science. He is an expert in materials and process research for anti-reflective materials, multilayer materials, and processes for lithography. He has a diverse background including photolithography, chemical operations, and laboratory research. Darron has published in several technical proceedings and publications including SPIE, IEEE, and Solid State Technology. He has been a member of multiple SEMI Committees over the last 10 years. Darron holds a BS in chemical engineering from the University of Texas at Austin.
Biography: Dr. Todd Younkin is a talented and seasoned executive with more than 20 years of experience in technology innovation. His extensive Research and Development experience spans Intel’s 0.18um to 5nm nodes with technical contributions in novel materials, nanotechnology, integration, advanced lithography, and integrated photonics. Most recently, he engineered, launched, and led all programmatic aspects of the five-year, $240 million JUMP research initiative. It has six multi-university, multi-disciplinary innovation Centers with 133 faculty, 835 students, and 360 industrial engineering liaisons. It emphasizes the advancement of Computer Science, Electrical Engineering, and Materials to secure continued U.S. thought leadership.
Todd brings a wealth of expertise with strengths in areas such as cultivating relationships with strategic partners, entrepreneurship and investment strategies, technology innovation, operational excellence, and talent management. He has spent much of his career working alongside young minds that are aspiring to influence the ever-changing world of smart and autonomous electronics. He has built programs from the ground up, leveraging his entrepreneurial leadership to drive new business development that has generated multi-millions in funding. He has been a key contributor in introducing new technology advances and starting new global research in the U.S., Europe, and Asia.
Dr. Younkin holds a Ph.D. from the California Institute of Technology in Pasadena, California. He completed his Bachelor of Science at the University of Florida in Gainesville, Florida. He aspires to continue to influence the next generation of technology and inventors, bringing ideas and investors together to drive heterogeneous electronic solutions that will deliver a smarter, shared future.
Biography: David Medeiros joined Entegris as a Senior Director of Engineering in the office of the CTO in April of 2021. His responsibilities involve developing an enterprise-wide lithography strategy, with a primary focus on the rapidly expanding field of EUV. Previously he spent six years at GLOBALFOUNDRIES (GF), first as the Senior Director of Patterning at Fab 8 in Malta, NY, and later as the Vice President of Central Engineering. Prior to GF, he spent seventeen years at IBM, starting as a Research Staff Member at T. J. Watson Research Center and culminating as the Director of Patterning R&D in the Microelectronics Division. His career began in the semiconductor industry as a synthetic chemist at Shipley Company, which is now part of DuPont. David holds a Ph.D. in Organic Chemistry from the University of Texas, Austin, where he was an Eastman Kodak fellow, and a B.S. in Chemistry from the University of Massachusetts, Amherst.
Q&A with Audience Input
EMG Overview & Wrap up

China
CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-09-24 00:00:00 2021-09-24 00:00:00 SEMI China Smart Mobility Webinar China SEMI.org [email protected] America/Los_Angeles public