Additively Manufactured Flexible "Smart" Packaging and Reconfigurable On-Package Antenna Arrays for Next genergation 5G/mm Wave System on Package Designs
Abstract
In this talk, inkjet-/3D-printed antenna arrays, interconnects, “smart” encapsulation and packages, RF electronics, RFIDs microfluidics and sensors fabricated flexible substrates are introduced as a system-level solution for ultra-low-cost mass production of 5G+/Millimeter-Wave/sub-THz Modules and Metasurfaces for Communication, Energy Harvesting and Sensing applications. Prof. Tentzeris will touch up the state- of-the-art area of fully-integrated printable FHE-Enabled broadband wearable and deployable wireless modules covering characterization of additively manufactured interconnects up to D-band, computer-vision calibrated flexible modules as well as tile-based 4D shape-reconfigurable flexible phased antenna array modules.
Biography
Professor Tentzeris was born and grew up in Piraeus, Greece. He graduated from Ionidios Model School of Piraeus in 1987 and he received the Diploma degree in Electrical Engineering and Computer Science (Magna Cum Laude) from the National Technical University in Athens, Greece, in 1992 and the M.S. and Ph.D. degrees in Electrical Engineering and Computer Science from the University of Michigan, Ann Arbor in 1993 and 1998.
He is currently Ed and Pat Joy Chair Professor. From 2016-2023, he served as Ken Byers Professor in the area of flexible electronics with the School of ECE, Georgia Tech and he has published more than 850 papers in refereed Journals and Conference Proceedings, 5 books and 25 book chapters. He has served as the Head of the Electromagnetics Technical Interest Group of the School of ECE, Georgia Tech. Also, he has served as the Georgia Electronic Design Center Associate Director for RFID/Sensors research from 2006-2010 and as the GT-Packaging Research Center (NSF-ERC) Associate Director for RF research and the leader of the RF/Wireless Packaging Alliance from 2003-2006. Also, Dr. Tentzeris is the Head of the A.T.H.E.N.A. Research Group (20 students and researchers) and has established academic programs in 3D Printed RF electronics and modules, flexible electronics, origami and morphing electromagnetics, Highly Integrated/Multilayer Packaging for RF and Wireless Applications using ceramic and organic flexible materials, paper-based RFIDs and sensors, inkjet-printed electronics, nanostructures for RF, wireless sensors, power scavenging and wireless power transfer, Microwave MEM's, SOP-integrated (UWB, mutliband, conformal) antennas and Adaptive Numerical Electromagnetics (FDTD, MultiResolution Algorithms). He was the 1999 Technical Program Co-Chair of the 54th ARFTG Conference and he is currently a member of the technical program committees of IEEE-IMS, IEEE-APS and IEEE-ECTC Symposia. He was the TPC Chair for the IMS 2008 Conference and the Co-Chair of the ACES 2009 Symposium. He was the General Co-Chair of the 2023 IEEE Wireless Power Technology Conference and Expo (WPTCE) in San Diego and of the 2019 IEEE APS Symposium in Atlanta and the Chairman for the 2005 IEEE CEM-TD Workshop. He was the Chair of IEEE-CPMT TC16 (RF Subcommittee) and he was the Chair of IEEE MTT/AP Atlanta Sections for 2003. He is a Fellow of IEEE, a member of MTT-15 Committee, an Associate Member of European Microwave Association (EuMA), a Fellow of the Electromagnetics Academy, and a member of Commission D, URSI and of the the Technical Chamber of Greece. He is the Founder and the inaugural Chair of IEEE MTT-S TC-24 (RFID Technologies). He is one of the IEEE EPS Distinguished Lecturers and he has served as one IEEE CRFID DIstinguished Lecturer and as one IEEE MTT-Distinguished Microwave Lecturers (DML). His hobbies include basketball, swimming, ping-pong and travel.