Printed RF Passive Sensors for High-Temperature Applications in Aerospace
Abstract
Precisely measuring temperatures of up to 1000 ℃ and monitoring materials strain in the same environment is a critical task at developing and operating hypersonic aerospace systems. Most off-the-shelf devices available today for these applications are ruggedized versions of low-temperature thermocouples and strain gauges. Although very useful, such devices are still relatively bulky and heavy, and require complicated installation and wires to operate. In this walk, an overview of a SEMI-FlexTech funded program meant to address these limitations will be provided. The collaboration between GE Aerospace, Binghamton University, and the Georgia Institute of Technology focus on developing wireless, RF-based sensors that are fabricated via conformal, 3D additive manufacturing methods. The use of additive electronics will enable fabrication processes that are compatible with non-flat form-factors and that allow for on-part device manufacturing. This is expected to lead to lower-profile, lower-weight, less intrusive device geometries, and to afford better interfacing between sensors and the surface being probed. In addition, the use of radiofrequency (RF) transducing as sensing mechanism will allow for wireless detection, which will greatly simplify data acquisition via interrogators in cooler areas of the system. The project team will explore state-of-the-art printing technologies with sub-5 µm resolution capability for miniaturized devices, alongside the use of aerosol jet for RF device modelling and fabrication. The final goal of the program is to develop additive electronic manufacturing processes to fabricate printed RF device arrays for distributed sensing with improved technology readiness levels (TRLs) and demonstrated applicability in hypersonics.
Biography
Dr. Felippe Pavinatto is a Material Scientist and Engineer that has been working with additive electronics manufacturing for over 10 years in academia and industry. His expertise is centered on advanced materials, electronic inks formulation and panel-based and roll-to-roll (R2R) printed electronics technologies. Along the years, Dr. Felippe has used his additive manufacturing specialization for developing scalable fabrication processes for flexible hybrid electronic (FHE) in the fields of bioelectronics, energy devices, and wearable electronics. Since joining GE Aerospace in early 2023, his research focus has been on high-temperature electronic materials, inks, and devices; conformal direct-write 3D printing manufacturing; and additive electronics packaging. Dr. Felippe has been committed throughout his career to generating innovative technologies and solutions to meet industrial demands via collaborative and multi-disciplinary research projects.