Alliance Unites Industry Partners to Strengthen Collaboration, Boost Supply Resilience, and Establish Technical Standards
【Sept. 11th, 2025 – Hsinchu】With surging demand for generative AI, high performance computing (HPC), memory, and heterogeneous integration, the semiconductor industry is confronting the limits of traditional scaling. At SEMICON Taiwan 2025, SEMI announced the launch of the 3DIC Advanced Manufacturing Alliance (3DICAMA), co-chaired by TSMC and ASE and joined by 37 leading companies, including All Ring, Chroma, Delta, Everlight Chemical, GMM, Grand Process, Scientech, and Unimicron, to advance cross-disciplinary collaboration, standardization, and the complete 3DIC ecosystem.
▲3DICAMA launches to drive standards, innovation, and yield breakthroughs across the semiconductor ecosystem
AI Era Drives 3DIC Growth
According to Yole Intelligence, the advanced packaging market is expected to more than double from US$38B in 2024 to US$79B in 2030 (12.7% CAGR), fueled by AI and high bandwidth memory (HBM) advancements. Rising demand for high-performance, low-power, high-density solutions positions 3DIC as a critical integration technology, though challenges in heterogeneous integration, thermal management, and interconnects remain. With its strong semiconductor ecosystem, advanced manufacturing, and contributions to global standards, Taiwan is playing an increasingly important role in 3DIC and advanced packaging.
3DICAMA Launches to Drive Cross-Domain Collaboration and Ecosystem Growth
Co-chaired by Dr. Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, and Dr. Mike Hung, Senior Vice President at ASE, 3DICAMA unites industry partners to strengthen supply chain collaboration, boost resilience, and establish technical standards across materials, processes, and design. The alliance will also advance 3DIC R&D to improve efficiency and yield, address thermal and interconnect challenges, and accelerate commercialization through enhanced testing, quality, software, and automation, building a complete and sustainable 3DIC ecosystem.
SEMI Unites Global Resources to Accelerate 3DIC Ecosystem
“3DICAMA highlights SEMI’s role in driving global collaboration,” said Terry Tsao, SEMI Global Chief Marketing Officer and President of Taiwan, SEMI. “By uniting global resources, fostering industry-policy dialogue, and accelerating commercialization, we aim to deliver faster, more efficient, and more competitive solutions for applications such as AI, HPC, and data centers.”
The launch ceremony underscored the industry’s commitment to innovation, with Dr. Chao-Chung Kuo, Director General of the Department of Industrial Technology, MOEA, highlighting the Alliance’s significance in advancing Taiwan’s packaging ecosystem and strengthening collaboration across industry, government, and academia.
▲TSMC, ASE, Chroma ATE, and Grand Process leaders discuss technology roadmaps and applications
Global 3DIC Summit Charts the Future of Advanced Packaging
The Global 3DIC Summit, themed ”Driving the Future of Advanced Packaging: Integration and Ecosystem Collaboration,” featured a keynote by Vince Hu, Corporate Vice President of MediaTek, and a panel moderated by Dr. Chao-Hsien (Jeff) Lin of ITRI with industry leaders including Dr. Jun He of TSMC, Dr. Mike Hung of ASE, Dr. I-Shih Tseng of Chroma ATE, and Ben-Li Shih of Grand Process Technology. The discussions focused on AI-driven 3DIC challenges, supply chain resilience, and automation, underscoring Taiwan’s strategic role in the global advanced packaging ecosystem.
For more information on SEMICON Taiwan 2025, visit the offical Website.
About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management, and other programs. Our SEMICON® expositions and events, technology communities, standards, and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services, and software, enabling smarter, faster, more secure electronics. Visit www.semi.org or join SEMI Facebook, and SEMI LinkedIn, and SEMI Official Line Account.
