3rd EuroPAT-Workshop

 Organized by

In conjunction with:

Industrial Host: Swissbit Germany AG (Bitterfelder Strasse 22, 12681 Berlin, Germany.)

Theme: “Semiconductor Packaging Manufacturing in Europe – Growing or Vanishing?”

Join us for an insightful workshop focusing on manufacturing and supply chain for semiconductor packaging, assembly, and test in Europe. This event complements the IEEE Electronics System-Integration Technology Conference (ESTC), which is more academically inclined, focusing on the latest advancements in the field, research and development (R&D), and roadmaps. Together, they form the largest semiconductor packaging event in Europe for 2024.

There can be no digitalization without chips, and no chips without proper packaging. This workshop addresses the pressing question of Europe's role in the semiconductor packaging landscape amidst a backdrop of global disruptions. The recent pandemic, trade wars, geopolitical crises, and supply chain interruptions have starkly highlighted Europe's heavy dependence on other regions and the fragility of the semiconductor supply chain. Decades of outsourcing to Asia have made this particularly evident for packaging, assembly, and test manufacturing in Europe.

As the complexity of semiconductor technologies increases, collaborative Chip-Package-Board-System co-design is becoming a focal point for Integrated Device Manufacturers (IDMs) and Original Equipment Manufacturers (OEMs). Close cooperation with Outsourced Semiconductor Assembly and Test providers (OSATs) and Semiconductor Packaging, Assembly, and Test Service Providers (SPAT-SPs) is crucial for success.

In the European Chips Act, the European Union aims to more than double its current global market share in semiconductors to 20% by 2030. But what about electronics packaging, assembly, and test? This workshop will explore this question and disseminate the results of the Coordination and Support Action (CSA) Pack4EU in Chips Joint Undertaking (Chips JU).

Don't miss this opportunity to gain valuable insights into the challenges and opportunities facing the semiconductor packaging, assembly, and test manufacturing in Europe.
 

Key topics presented  

• Packaging, Assembly and Test Manufacturing in Europe
• The role of European OSATs and SPAT-SPs
• Semiconductor Packaging Supply Chain
• EU Chips Act for Packaging
• CSA (Coordination and Support Action) Pack4EU Chips JU (Joint Undertaking)
• European Markets and Applications Strengths and Weaknesses
• Technology Transfer from Pilot Lines in RTO and Industrial Pilot Lines
• Collaboration in Open Advanced Packaging Piloting Facilities

Who should attend

• Managers, Directors, VPs, SVP and C-Level of
  • Semiconductor Packaging, Assembly and Test industry and supply chain (Design, Materials, Equipment, Inspection, Metrology
  • Business Development
  • Responsible for company strategy
  • Customers with demand for Packaging solutions

Highlights 

• Attend the Industrial Host visit with presentations, meetings, and line tours on the afternoon of the first day.
• Participate in the full-day workshop featuring invited talks on the second day.
• Hear from high-level keynote speakers from industry and politics.
• Join the panel discussion on “The Future of Semiconductor Packaging in Europe.”
• Enjoy a Networking Dinner and other opportunities to connect with peers.
• Attend or meet participants of the IEEE Electronics System Technology Conference in the following three days at the same location.
• Visit the exhibition at IEEE Electronics System Technology Conference starting September 11, 2024.

Contact Person:

Steffen Kröhnert at [email protected]