SEMI 3D & Systems Summit to Spotlight Heterogeneous Integration as Key to Europe's Semiconductor Future

Industry Leaders to Gather in Dresden Next Week to Bolster Europe’s Industry Ambitions

DRESDEN, Germany — June 12, 2026 — The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in Dresden, will bring together the world’s foremost experts in advanced semiconductor packaging and heterogeneous systems integration. Themed Enabling Next-Gen Heterogeneous Systems Integration, the Summit will spotlight the latest breakthroughs driving innovation in AI hardware architectures, chiplet design, hybrid bonding, photonics, and AR/VR technologies. From geopolitical dynamics to system-level architectures, attendees will explore the critical role of 3D and heterogeneous integration in shaping Europe’s semiconductor future. Registration is open. 

“Dresden is reinforcing its position as one of Europe’s leading semiconductor hubs, and a central pillar driven by the European Chips Act and major investments from TSMC, Infineon, Bosch, and GlobalFoundries,” said Laith Altimime, President of SEMI Europe. “These investments are aimed at accelerating manufacturing of the next-generation semiconductor innovations in Europe advancing Europe's competitiveness, technological sovereignty, and supply chain resilience. As heterogeneous integration becomes a foundation for the future of our industry, collaboration across the value chain will be critical to ensuring Europe remains at the forefront of global innovation.”  

This year’s SEMI 3D & Systems Summit will present a broad scope of topics including:

• Market Trends and Europe’s Technological Positioning
• Advanced Packaging Capacity: From Lab Innovation to Fab Deployment
• Hybrid Bonding Technologies for Die-to-Wafer and Wafer-to-Wafer Integration
• Photonics at Scale: Co-Packaged Optics
• Design Leadership: Chiplets & System Architecture
• AR/VR & Wearable Intelligence

Featured Speakers

• Atsushi Nishikawa, Co-Founder and CTO, ALLOS Semiconductors
• Dirk Panter, State Minister for Economic Affairs, Labour, Energy and Climate Action
• E. Jan Vardaman, President and Founder, TechSearch International, Inc.
• Gamal Refai-Ahmed, Senior Fellow and Chief Thermo-Mechanical Architect, AMD
• Giorgio Cesana, Director, Heterogeneous Integration Transformation Program, Global Technology R&D, STMicroelectronics
• Harald Kuhn, Executive Director, Fraunhofer ENAS
• Jean-Marc Yannou, Vice President, Strategy & Innovation, Murata
• Nicolai Walter, Co-Founder and CEO, Pixel Photonics
• Nicole Tien, Senior Technical Program Manager, ASE Europe
• Rajesh Mandamparambil, Senior Technical Leader in Advanced Semiconductor Packaging and Heterogeneous Integration, NXP Semiconductors
• Shripad Gokhale, Senior Principal Engineer, Semiconductor Packaging R&D, Intel Corporation
• Volker Herbig, Vice President, BU Microsystems & Photonics, X-FAB

Networking

This year’s networking reception will take place at the Hilton Dresden Hotel on the first day of the event, and the Networking Dinner Cruise is set on a historic paddle steamer on the Elbe River, just a 5-minute walk from the Hilton Dresden Hotel.

Networking Dinner Cruise registration is reserved exclusively for 3D & Systems Summit 2026 participants.

Exhibition

The most prominent names in 3D integration and microelectronics manufacturing will showcase their latest products and technologies in the Summit's dedicated exhibition area. 

Exhibitors include: 3DiS Technologies, Adeia Inc., ASE, ASMPT, Carl Zeiss Microscopy Deutschland GmbH, Comet AG, Confovis, FAMES Pilot Line, Forschungsfabrik Mikroelektronik Deutschland (FMD), Fraunhofer IZM-ASSID, Hamamatsu Photonics Deutschland GmbH, Kistler Instrumente AG, Lam Research, LPKF Laser & Electronics SE, NanoIC Pilot Line, Plasmatreat, Precitec Optronik GmbH, SEMI Europe, SEMILAB, SET (Smart Equipment Technology), Syenta, W. L. Gore & Associates, Wooptix, and X-FAB Silicon Foundries SE.

Sponsors

Platinum: Adeia, ASE, Comet, Confovis, KLA, Lam Research
Gold: Evatec, Plasmatreat
Event: ASMPT, EV Group, imec, MKS Atotech

Call for Abstracts: 2026 Advanced Packaging Conference (APC)

Building on key topics at the 3D & Systems Summit, SEMI Europe has opened the call for abstracts for the 2026 Advanced Packaging Conference (APC), co-located with SEMICON Europa in Munich on November 10-13. Themed Power and Interconnects Innovations Enabling AI System Performance, APC 2026 will explore 2.5D/3D integration, chiplet architectures, co-packaged optics, advanced materials, AI-driven design flows, and next-generation thermal and power management across AI, HPC, automotive, and edge applications. Abstract submissions are open through July 1, 2026.

For more details, please visit the 3D & Systems Summit 2026 website and connect with SEMI Europe on LinkedIn or YouTube @SEMIEurope (#3DSummit).

About SEMI

SEMI® is the global industry association connecting over 4,000 companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.