Horizon Europe ICOS (International Cooperation on Semiconductors): EU and Non-EU Strengths, Weaknesses, Dependencies, Opportunities for International Collaboration
Francis Balestra, Director of Research, CNRS-Grenoble INP-Sinano Institute
HiCONNECTS Introduction
Kartikey Srivastava, Senior Specialist, Communications, SEMI Europe
Demonstration of High-Speed Silicon Photonics I/O for Co-Packaged Pilot Line
Cheng-Jhih Luo, R&D Engineer, IMEC
Novel Interconnect Solutions for improved signal Integrity performance
Erich Schlaffer, Programme Manager, AT&S AG
Sharper scans, faster ramp up
Julius Hållstedt, Head of Segment - Semi and Electronics, Excillum
Advanced packaging industry trends driving the need for new eBeam based metrology and inspection solutions
Ralf Schmid, General Manager, ICT GmbH - Applied Materials
Wildfire suppression with real-time data flow
Mikko Himanka, R&D manager, Centria Research & Development