Accelerating nanoelectronic device innovation through atomistic simulation–driven material screening
Geoffrey Pourtois, Fellow, Imec
Innovative AMC Filtration solutions for future semiconductor production challenges
Manfred Zoermer, Mann+Hummel Molecular GmbH
Advances in AlScN Thin Films Deposited by Lam Research Pulsed Laser Deposition Platform (NOT AVAILABLE)
Matthijn Dekkers, Director of Engineering, Pulsed Laser Deposition technique (PLD), Lam Research
Substrate engineering for the benefit of advanced devices and integration
Olivier Bonnin, Technology Development Sr Director, Soitec
"Materials, Innovations for Generations" (NOT AVAILABLE)
Michael Joerger, Head of Business Line Power Electronic Materials, Heraeus Electronics GMBH
How 3D integration can enable heterogeneous integration of materials and technologies?
Olivier Faynot, EVP & GM, Silicon Component division, Cea-Leti