This blog series explores how collaboration between industry and academia can empower the next generation of semiconductor innovators. Through insights from leaders, educators, and students, we’ll showcase effective strategies for bridging the talent gap, fostering innovation, and creating meaningful career pathways in the semiconductor industry.As innovation accelerates and new challenges emerge, the industry’s greatest breakthroughs will come from bold, curious students, young professionals, and lifelong learners ready to build what comes next. SEMI spoke with Professor Antonio Costa of the University of Catania about attracting the next generation to STEM, the emerging skills required in the semiconductor industry, and examples of impactful collaboration with local industry, along with many other insights.Costa shared his perspectives following his participation in the SEMI on Campus program, held on April 16, 2026, in Catania, Italy. SEMI: What emerging skills do you believe will be most essential for the next generation of semiconductor innovators, and how can industry and academia work together to nurture them?Costa: I firmly believe in the role of interdisciplinary skills. The next generation of semiconductor innovators will need a blend of deep technical expertise, cross-disciplinary thinking, and adaptability to rapidly evolving technologies specifically based on artificial intelligence. The future semiconductor innovator isn’t just a circuit designer. They’re a systems thinker, data scientist, and materials engineer rolled into one. The most successful ecosystems will be those where academia teaches fundamentals, and industry provides real-world constraints, tools, and scale. So, university and industry should work together to share their knowledge and technological infrastructures with the aim of supporting the next generation of semiconductor innovators. SEMI: In your work with young engineers and researchers, what approaches have you found most successful in nurturing creativity and sustaining curiosity in such a technically complex field? How do you think we can attract the next generation to enter the STEM studies?Costa: Curiosity and creativity are two major features for researchers and engineers in general. Over the years of teaching and coordinating research activity, I have been able to observe that students are increasingly drawn to challenges coming from the industrial world. In a way, one could say that complexity often stimulates curiosity, and when this happens, students are able to deliver their best performance in terms of creativity and quality of results. In my courses, students have always been required to tackle an industry-inspired project work to be eligible to pass the exam. Every year, I invite industry representatives from local manufacturing companies to present real case studies to the classroom, describing their key elements, constraints, and objectives. Students are then asked to solve the industrial case study by applying the problem-solving techniques learned during the course. Based on my experience, I believe that a greater intensity in the relationship between the industrial and academic worlds can further stimulate students' curiosity and the interest of new generations.SEMI: What do you believe are the most significant barriers for students entering the semiconductor industry today, and how can academia help bridge these gaps?Costa: As usual, the main barriers for students concern the gap between the theoretical study mindset developed during university courses and the demands of the industrial world in terms of teamwork skills, problem-solving abilities, and soft skills. Universities and industry should find greater opportunities for collaboration, for example by establishing shared laboratory activities or seminars during which managers from semiconductor companies, and beyond, illustrate the essential aspects of working life and the primary needs of the semiconductor industry. At the same time, it would be advisable to emphasize the employment and career opportunities that the semiconductor industry is currently able to offer. Hackathons, that have a competitive orientation, could also represent a valid stimulus that companies and universities could pursue jointly and on a regular basis.SEMI: How can universities and industry partners collaborate more effectively to create learning experiences that truly unlock students’ potential and prepare them for the sector’s evolving demands? Professor Antonia Costa, University of Catania and Daniele Pagano, STMicroelectronicsCosta: Shared laboratories, curricular and extracurricular internships scheduled on a continuous basis, and periodic seminars held by company representatives with diverse areas of expertise can make a positive contribution to rapidly and robustly unlocking the learning potential of today's students and tomorrow's new hires. In December 2021, the University of Catania and STMicroelectronics signed a framework agreement to strengthen collaboration in the field of power electronics, with a focus on advanced research and training. The agreement aims to support technological innovation and the development of professional skills in the semiconductor sector, including:Research and development: the launch of projects focusing on increasing power density, efficiency, and reliability of power modules. Training and talent: funds for students’ awards, mentorship programs, internships, thesis projects.Innovation: support for technological growth and the development of professional expertise in power electronics. Regional ties: consolidation of Catania's role as a hub for semiconductor research, with strong synergy between the university and the local ST production site. Curricular internships linked to Master’s degree theses, supervised by faculty members across disciplines, primarily within Engineering, Computer Science, Physics, and Chemistry programs.SEMI: Can you share other examples of collaborations? Costa: Over the past decade, the University of Catania has been an active partner in multiple European consortia, supporting the development of research projects funded through highly competitive national and European programs. Currently, the University of Catania is engaged in collaborative research with STMicroelectronics through two Horizon Europe projects.In the first project, HiCONNECTS, the Department of Engineering is developing a digital twin architecture aimed at optimizing wafer lot dispatching at STMicroelectronics’ manufacturing facility in Catania.The second project, GENESIS, brings together the Department of Engineering and the Department of Chemical Sciences to pursue an ambitious sustainability objective: the development of innovative methods to identify and reduce per- and polyfluoroalkyl substances (PFAS) generated by semiconductor manufacturing processes, thereby mitigating environmental impact."The role of universities is to help students recognize their potential and guide them toward fields where their abilities can truly flourish. Initiatives like SEMI on Campus are invaluable, as they inspire students through direct engagement with professionals, helping bridge the gap between theory and industrial practice." -- Professor Antonio Costa, University of Catania .custom-quote-block { border-left: 4px solid #d9d9d9; padding-left: 26px; margin: 24px 0; } .custom-quote-block blockquote { margin: 0; padding: 0; border: none; } .custom-quote-block p { margin: 0; font-size: 18px; line-height: 1.6; font-style: italic; color: #000; } SEMI: Looking ahead, what role do you see educators playing in shaping the future of semiconductor innovators? Costa: The role of educators, both in schools and, above all, in universities, is to help students recognize their own potential and develop the maturity needed to identify and pursue those fields of knowledge that best highlight their abilities.The SEMI on Campus initiative was immediately embraced by many universities and by myself, as it offers students from diverse academic backgrounds the opportunity to understand the key skills sought by players in the semiconductor industry, while also highlighting the employment and career paths available in this field.The opportunity to hear directly from prominent speakers who work daily in semiconductor design and manufacturing represents a powerful way to stimulate students’ curiosity and potential, while helping to bridge the gap between the theoretical knowledge acquired in university classrooms and the practical, results‑oriented approach required in an industrial environment.The benefits for students are broad and significant, as they can assess their own aptitudes and ambitions against the real demands of semiconductor companies, drawing inspiration and insight from firsthand accounts shared by industry professionals.Antonio Costa is a full professor at the University of Catania (DICAR Department). He teaches Production Planning and Control in the Master’s degree in Engineering Management, and Advanced Technologies for Manufacturing Processes in the Master’s degree in Mechanical Engineering.His research activities are mainly focused on production scheduling, supply chain dynamics, manufacturing process optimization and Statistical Process Control (SPC). He is area editor for Computers Industrial Engineering, member of the Italian Association of Manufacturing Technologies (AITeM) and leads several research collaborations with STMicroelectronics.Interested in bringing SEMI On Campus to your institution or welcoming an industry expert as a guest speaker?Reach out to [email protected]. Let’s work together to inspire the next generation of semiconductor leaders!Related Initiatives:SEMI 20 Under 30: The SEMI 20 Under 30 Awards recognize exceptional young leaders in the semiconductor industry who are making significant contributions and driving innovation. Nominations are open!ChipQuest: The ChipQuest Challenge promotes the microelectronics industry to students to build future talent. University and high school students can participate and win amazing prizes! Serena Brischetto is Director Marketing and Digital Engagement at SEMI Europe.

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2026 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet David Coenen, Senior Researcher at imecFrom an early curiosity about how things work to leading advanced research in photonics and thermal management, David Coenen has built his career around understanding and improving complex technologies. His interest in engineering first led him to study aerospace engineering, where he was introduced to nanotechnology and semiconductor systems. What initially seemed abstract gradually became an area he wanted to explore in depth.This growing interest led him to pursue a PhD, where he developed a strong foundation in semiconductor research. Today, Coenen contributes to advancing technologies that support high-performance computing, data centers, and AI applications, working at the intersection of multiple disciplines to address some of the industry’s most demanding challenges. SEMI: What inspired you to join the semiconductor industry? Coenen: I’ve been fascinated by technology for a long time. Ever since I was little, I’ve been eager to learn how things work, from machines to cars and airplanes. This motivated me to study aerospace engineering. During my studies, nanotechnology and semiconductors kept appearing. At first, it felt almost like magic that a piece of silicon could run complex programs. Over time, I developed a deeper understanding and wanted to explore research further. In Belgium, imec is a well-known R D institute, and I decided to pursue a PhD there to give my career a strong foundation. I also believe the semiconductor industry will have a major impact on the future of society, and I want to contribute to that.SEMI: How did your early experiences and education shape your career path?Coenen: When I was around nine or ten years old, I visited imec during a school trip and learned about computer chips. That experience stayed with me. Later, during my engineering studies, I was mentored by teachers who were passionate about science and technology. Their guidance encouraged me to push my boundaries and try things outside of my comfort zone.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Coenen: I received the Best Paper Award for a conference paper submitted to iTherm and was later awarded the Harvey Rosten Award for Excellence for the same work. This is particularly meaningful to me because the initial draft received very negative feedback. I was told it was not innovative enough and advised not to submit it to my preferred conference. From this experience, I learned an important lesson: know your worth and do not assume someone is right simply because they have more experience.SEMI: As a young professional in the industry, what is your greatest challenge? Coenen: I work in photonics and chip thermal management, which is a rapidly evolving field. Keeping up with the latest technologies and developments can be challenging. These chips are used in data centers and large AI and machine learning systems, which are in high demand. Another challenge is finding master’s or Ph.D. students to join my work. My research sits at the intersection of electronics, photonics, thermodynamics, and machine learning, which makes it highly specialized. SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Coenen: Rome was not built in one day. Developing skills and building a deep understanding of complex technologies takes time. Enjoy your studies and choose something you are passionate about. When you are passionate, learning becomes enjoyable. Think about how you want to impact the world and make it a better place. That gives you strong motivation to work hard. SEMI: How do you envision future work environments?Coenen: From my experience, having flexibility in how I plan my day and organize my work helps reduce stress. Not having a rigid schedule allows me to take breaks and reset my mind. Combined with hybrid working, this makes work more enjoyable and sustainable.SEMI: What impact has the 20 Under 30 Award had on your career? Coenen: I was very honored to receive this award. There are many researchers equally deserving, which makes it even more meaningful. The award allowed me to connect with people inside and outside my organization whom I would not normally interact with. It also increased my visibility and associated my name with excellence.Following 20 Under 30 JourneysDavid Coenen’s story highlights the curiosity, resilience, and commitment to excellence that define the next generation of semiconductor researchers. His work contributes to advancing technologies that support the growing demands of data processing and AI systems.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. If this is of interest and you would like to explore further workforce related topics, we invite you to learn more about ChipQuest. SEMI ContactJames Lam, Business Development ManagerEmail: [email protected]

The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20 Under 30 Award for making a remarkable impact across the supply chain—whether in engineering, sales, marketing, or R D. Nominations for the 2026 20 Under 30 Award are now open, providing the opportunity to recognize and honor the next wave of industry trailblazers.The series spotlights these rising stars for their career achievements, commitment to innovation, leadership skills, and dedication to driving both business success and community growth.Follow their inspiring journeys and discover how they are thriving and paving the way for future generations in the semiconductor world.Meet Pascal Fasel, Project Manager Engineering at Comet X-rayPascal Fasel’s career in semiconductors has developed steadily through hands-on experience and continuous learning. Starting with an apprenticeship in 2012, he built his foundation across design, process, and project roles, gaining a practical understanding of how technologies move from concept to production.Over time, he discovered a strong interest in solving real-world problems and delivering reliable engineering solutions. Today, as Project Manager Engineering at Comet X-ray, Fasel focuses on guiding projects through complexity while balancing speed, precision, and quality in a fast-evolving industry. SEMI: What inspired you to join the semiconductor industry? Fasel: I did not have a single defining moment. I joined through an apprenticeship in 2012 and discovered semiconductors gradually. As my responsibilities grew, I realized that I enjoy solving problems and turning ideas into reliable solutions. Over the past three years, I have mainly worked on semiconductor projects, which confirmed this interest. I am motivated by the fast pace, the need for precision and quality, and the impact of bringing new technology into production. It is this combination that keeps me engaged.SEMI: How did your early experiences and education shape your career path?Fasel: My apprenticeship taught me hands-on skills and the importance of quality and safety. Working across design, process, and project roles helped me understand how systems fit together and where problems arise. I am currently studying industrial engineering part-time while working. My studies and work reinforce each other, with theory supporting practice and projects testing what I learn. These experiences keep me focused on preparing technology for production.SEMI: Can you share a professional accomplishment you’re most proud of, and explain why it’s significant to you?Fasel: The accomplishment that matters most to me is my steady growth at Comet. Since joining in 2012, I have worked across design, process, and project roles. Staying for over a decade has been less about titles and more about trust, learning, and supporting colleagues when challenges arise. This is important to me because it reflects consistency and shared responsibility. It has allowed me to contribute to projects from idea to production in a reliable way.SEMI: As a young professional in the industry, what is your greatest challenge? Fasel: My greatest challenge is balancing speed with quality in a changing environment while ensuring smooth handovers to production. Specifications can change, results can be unexpected, and timelines can shift. To manage this, I focus on learning quickly without cutting corners. I make changes small and reversible, identify risks early, and seek feedback regularly. The goal is to learn efficiently and reduce surprises. SEMI: What advice would you give to younger generations aspiring to make an impact in this industry?Fasel: Stay curious and build a habit of learning every day. You will not master everything at once. Projects move quickly, so remain flexible and start with small steps. Gain experience early through internships or student projects. Apply what you learn in practice. Ask clear questions, listen carefully, and stay open to different perspectives. Share credit when things go well and take responsibility when they do not. Be patient. Steady progress is more effective than big jumps. Focus on quality and safety, even under pressure, and build trust through consistency.SEMI: How do you envision future work environments?Fasel: I believe workplaces will become more flexible and people-focused. Clear goals, open communication, and early feedback will be essential. Collaboration will be hybrid, with time in the office used when it adds value. Teams will focus more on outcomes rather than hours, working in small, manageable steps to reduce risk and stay aligned.SEMI: What impact has the 20 Under 30 Award had on your career? Fasel: I am grateful for the recognition. It has not changed my daily work, but it has created opportunities to connect with others, learn from peers, and share experiences. It also provides a platform to encourage students and early-career professionals to explore this industry. For me, it is a reminder to stay consistent and continue supporting others.Following 20 Under 30 JourneysPascal Fasel’s story reflects the value of persistence, practical experience, and continuous improvement. His work highlights how steady progress and collaboration contribute to delivering reliable semiconductor solutions.The Rising Stars: 20 Under 30 blog series celebrates the exceptional talent and leadership driving the future of the semiconductor industry. Each of the young innovators honored is excelling in their respective fields while shaping the landscape of technology and business with their visionary approaches and dedication. Their stories exemplify the remarkable achievements and unwavering commitment that define the next generation of industry leaders. The series is intended to inspire and motivate future professionals to pursue their passions and embrace the opportunities within this dynamic industry. Stay tuned for more stories of rising stars who are paving the way for continued growth and innovation in the semiconductor world.Learn more about the SEMI Europe 20 Under 30 Award and the recipients honored at SEMICON Europa. If this is of interest and you would like to explore further workforce related topics, we invite you to learn more about ChipQuest. SEMI ContactJames Lam, Business Development ManagerEmail: [email protected]

As competition within the semiconductor industry continues to intensify, the need for Europe to strengthen its current position within the global supply chain and develop new partnerships are more important than ever. How can Europe forge a unified semiconductor strategy amidst geopolitical tensions, fast‑moving technological change, and ongoing supply‑chain challenges? These dynamics set the stage for the 2026 Industry Strategy Symposium (ISS) Europe taking place in March in Sopot, Poland for the second consecutive year, bringing together leaders from across the semiconductor ecosystem to assess a rapidly shifting global landscape and define Europe’s path toward greater competitiveness and resilience.The symposium opened with a welcome speech featuring Lech Wałęsa, Nobel Peace Prize Laureate and former leader of the Solidarnosc movement which led Poland’ s resistance to its authoritarian Communist regime in the 1980s. Wałęsa shared a strong message on the importance of collaboration: “Old geopolitical structures and the bipolar world order have reached their limits, and as we transition toward a new global order, it is essential to rebuilding a system better suited to today’s realities”. In this uncertain moment, the Nobel Peace Prize called for peaceful dialogue and collective action to shape a new, more suitable world order rather than relying on conflict.Lech Wałęsa, Nobel Peace Prize LaureateAmidst geopolitical tensions, accelerating technological change, and intensifying global competition, a clear message emerged: semiconductors are now foundational to European economic security and technological leadership. As Laith Altimime, President of SEMI Europe, emphasized, “Semiconductors are the infrastructure of the modern world, and only through close collaboration can we master the challenges ahead and strengthen Europe’s technological leadership.”Laith Altimime, President, SEMI EuropeEurope plays a vital role in this industry, with global revenues expected to reach $2 trillion by 2035. As Altimime noted, “Europe has strong foundations, leading in manufacturing equipment and innovation. We must maintain this leadership while reducing dependencies.”A central theme throughout the symposium was how Europe can build on its leadership positions while strengthening its role across the value chain. As Leonard Hobbs, Director of Government Affairs at Intel Ireland, said, “No region controls the entire supply chain. Europe has to figure out how to differentiate itself within the various parts of the supply chain.” Marc Hijink, author of the book Focus – The ASML Way highlighted Europe’s deep supplier ecosystem, and explained that “more than 80% of the value in the products that ASML makes comes from suppliers who are mostly based in Europe.” Marc Hijink, Author of Focus – The ASML WayAt the same time, significant investments are reshaping Europe’s manufacturing footprint. Joerg Recklies, Executive Vice President Frontend at Infineon, drew the audience’s attention to Infineon’s upcoming Smart Power fab opening in summer 2026 “six months ahead of schedule.” Recklies added, “The new ESMC facility in Dresden is expected to produce 40,000 300mm wafers per month, and will provide the first FinFET capability in Europe.” Joerg Recklies, Executive Vice President Frontend, Infineon TechnologiesLooking at opportunities in advanced semiconductors, Cesc Guim, CEO of Open Chip, said, “25 years ago, the only way to learn how to do advanced chip design was in one of the large US companies. That’s no longer the case. Europe now has the capabilities, supported by RISC-V and a full supply chain backed by the wealth of hardware and software engineering talent in regions such as Pomerania.” Left to Right: Mikołaj Trunin, Deputy Director, Invest in Pomerania and Cesc Guim, CEO, Open ChipTo reinforce the sense of opportunity in a changing world, futurist Christian Kromme gave a whirlwind tour through the revolutions to come in technology and society. He described how each wave of technological change, from the internet to AI to autonomous machines, is arriving faster than the one before. “The internet wave commoditized media and knowledge. In the AI wave, we will see the same value compression, but this time squeezing out human skills such as problem-solving and system design,” said Kromme.Kromme urged delegates to “shift from hard skills to heart skills: imagination, empathy, curiosity and integrity, this is where the value of humans lies, because machines cannot do these things.”Christian Kromme, FuturistTrade tensions and international conflictGeopolitics and supply chain dynamics were central to the discussions. Martin Zech, Senior Director at FTI Consulting, described how the US’s approach to the semiconductor industry had shifted from incentives to restrictions. Zech warned that “a new section 301 investigation into the European semiconductor industry could lead to new tariffs.” Johan Rauer, Partner at McKinsey, added that the threat extends beyond tariffs. “Regions will apply a range of measures, including export controls and IP protection.”Martin Zech, Senior Director, FTI ConsultingJohan Rauer, Partner, McKinsey CompanyChristopher Frieling, Director of Advocacy and Public Policy at SEMI Europe, outlined the EU’s response, including its evolving economic security framework and the concept of “trusted chips,” reflecting a preference for products with strong European involvement.Christopher Frieling, Director of Advocacy and Public Policy, SEMI EuropeThe question of technological leadership was addressed by Carlos Pardo, CEO of KD, who stated, “If Europe wants a relevant position in semiconductors, it needs to invest more.” He added that even in automotive semiconductors, European players hold relatively limited shares. Carlos Pardo, CEO, KDProviding another perspective, Dr. Rafał Bugyi, CEO of TRUMPF Huettinger said, “We don’t need to cover the entire supply chain, but we must be indispensable.” Dr. Rafał Bugyi, CEO, TRUMPF Hüttinger GmbH Co. KGSpeakers also addressed how Europe could adapt to the new reality of supply chain dependency. Benoit Chassagne, End-to-End Supply Chain Manager at Edwards, presented a model of a systems response which his company has implemented to mitigate its exposure to supply chain volatility, while David Forrest, Director of Sustainability and Criticality at Vital Materials, emphasized the role of waste materials recovery, saying that “circularity is an industrial mechanism for supply chain resilience, not an environmental add-on.”Benoit Chassagne, End-to-End Supply Chain Manager, EdwardsDavid Forrest, Director of Sustainability and Criticality, Vital MaterialsCarl van Vugt Luning, Chief Commercial Officer at Resilicon, highlighted the need for greater resilience in polysilicon supply, noting Europe lacks dual sourcing. “Polysilicon is often seen as a commodity, but it is critical. Sovereign chips require a resilient polysilicon supply chain,” said van Vugt Luning.Carl van Vugt Luning, Chief Commercial Officer, ResiliconTurning innovation into commercial revenueIn the session ‘From lab to fab’, speakers examined how Europe can improve its track record in converting innovation into commercial success, for example, by companies such as NVIDIA and Qualcomm.An important part of the EU’s strategy was the creation of technology pilot lines. Jari Kinaret, Executive Director of the Chips Joint Undertaking (Chips JU), told the symposium that the pilot lines are an example of successful collaboration between the state and the private sector. Kinaret said, “The total cost of the NanoIC pilot line (for advanced semiconductor fabrication) is €2.5 billion, but this includes €1 billion of funding from ASML.”Jari Kinaret, Executive Director, Chips Joint Undertaking (Chips JU)The role and value of the pilot lines was the subject of a panel discussion at the symposium. Panelist Anne Van den Bosch, Vice President of Public R D Policies and Programs at imec, said the pilot lines “give the European semiconductor ecosystem faster access to advanced process technology.” Patrick Bressler, Director of Fraunhofer Mikroelektronik, agreed. “Pilot lines are a lab-to-industry scheme to give access to prototype manufacturing for SMEs, start-ups and fabless companies which would not otherwise be able to afford advanced manufacturing,” he said.Moderating the discussion, Laith Altimime asked, “How do we ensure that the products which emerge from innovations developed thanks to the pilot lines get manufactured in Europe? Are boutique fabs the answer?” Kevin Williams, Deputy Director of the PIXEurope pilot line, responded: “There are certainly opportunities in building new types of chips and new types of fabs. We have the know-how in the pilot lines, and the equipment for them is made in Europe.” Bruno Paing, Vice President Europe at CEA-Léti, added, “We need to aim for indispensability, replicating what we have with ASML in the EUV field. For instance, the world needs better memories and better interconnects. There are many opportunities in AI. It is not just about the GPU.”Left to Right: Moderator, Laith Altimime, President, SEMI Europe; Panelists: Anne Van den Bosch, Vice President of Public R D Policies and Programs, imec; Bruno Paing, Vice President Europe, CEA-Léti; Patrick Bressler, Director, Fraunhofer Mikroelektronik; Kevin Williams, Deputy Director, PIXEurope.The symposium also highlighted examples of European innovation from two startups developing new technologies. Antonio Mesquida Küsters, Strategic Advisor to Euclyd, presented a processor system combining 16,384 cores with ultra-high bandwidth memory using advanced 2.5D and 3D packaging, offering an alternative to GPUs for AI inference. As he said, “We want to break the hyperscaler/cloud model of AI to build sovereign AI capability for Europe by 2030.”Antonio Mesquida Küsters, Strategic Advisor, EuclydJekaterina Viktorova, Founder and CEO of Syenta, introduced additive manufacturing technology enabling denser interconnects for advanced AI systems, noting, “Our roadmap is set to produce a 20x increase in bandwidth over the next 10 years.”Jekaterina Viktorova, Founder and CEO, SyentaNew strategies for competitiveness in semiconductor manufacturingIf these types of innovative products are to be manufactured in Europe, the region’s fab operations will need to combat the growing competition from China and elsewhere. Giovanni Notarnicola, Partner at Porsche Consulting, said, “Our position in Europe is under attack. The next threat is not from a new product, but from how chips are designed and produced.”Giovanni Notarnicola, Partner, Porsche ConsultingThomas Altenmüller, Vice President of Manufacturing Analytics at Infineon, highlighted the role of automation: “We get more automation in the transition from 8” to 12” wafers, which gives us an advantage in Europe because of our higher labor cost compared to China. But to compete, we still need more AI smart workflows to increase the automation.” Carina Lainer, Principal at Roland Berger, added, “Today we optimize operations with tools built for a human-centric process, which has reached its limit. We can instead use digitalization and AI to fundamentally change the way that semiconductor innovation takes place.”Thomas Altenmüller, Vice President of Manufacturing Analytics, InfineonLeft to Right: Carina Lainer, Principal, and Thomas Kirschstein, Partner, Roland BergerOded Tal, CEO of MAX Group, cautioned that the barrier to increased implementation of automation was not technical but social. “Humans can be very flexible, but leadership is crucial. “You have to give training and clear instructions. It’s about structure, making people’s roles and responsibilities crystal-clear,” he said.Oded Tal, CEO, MAX GroupThe symposium closed with a panel discussion about the implementation of AI and automation in the fab. Moderator Cassandra Melvin, Senior Director of Business Development and Operations at SEMI Europe, pointed out that “intelligence is moving beyond the tool to the control room, a development which is powered by AI.” The panelists were quick to acknowledge the radical impact that AI is having on fab operations. Dirk Drescher, Plant Manager at Bosch Semiconductor, said, “We built the Bosch fab in Dresden around a standardized data architecture, which is what enables us to implement AI. That is a contrast to a 20 year old fab, which can only see a patchwork of different data systems.”Thomas Richter, Senior Vice President and Managing Director at Infineon, added, “digitalization is about much more than just AI. We have had great success in getting rid of boring, routine tasks through digitalization. This makes a huge difference, and helps our fabs to stay competitive.”The panel also debated the potential impact of humanoid robots on the scale and impact of automation. Richter said, “In our fabs, I can see rooms in which it has never been possible to automate before, but humanoid robots give me hope that we can automate more in future.”Matthias Bonkass, Vice President of Advanced Manufacturing Engineering at GlobalFoundries, agreed. “By 2035, we will see collaboration between humans and humanoids. This wave is coming!” Going even further, Dirk Drescher looked forward to an era of total automation. He said, “We will see a lights-out fab by 2035. This is definitely a tailwind for the European semiconductor industry, making it faster, reducing cost, and giving us more opportunity to build semiconductors in Europe.”Thomas Morgenstern, Executive Vice President of Manufacturing at STMicroelectronics, concluded, “We must not let culture be a barrier to AI. Technical strategies to implement AI are all very well, but you need people to buy in. Morgenstern added, “The name of the game is productivity. The most advanced fabs have to be dark, with remote operating centers somewhere in the world, running clusters of fabs. I am extremely confident that by 2035, if not before, the first dark fab will be in operation.”Left to Right: Moderator, Cassandra Melvin, Senior Director of Business Development and Operations, SEMI Europe; Panelists, Dirk Drescher, Plant Manager, Bosch Semiconductor; Matthias Bonkass, Vice President of Advanced Manufacturing Engineering, GlobalFoundries; Thomas Morgenstern, Executive Vice President of Manufacturing, STMicroelectronics; Thomas Richter, Senior Vice President and Managing Director, Infineon.During the event, SEMI Europe announced recipients of the SEMI European Award and Special Service Award for 2025. Dr Peter O’Brien, Head of Research in Photonics Packaging and Systems Integration at Tyndall National Institute, was honored with the SEMI European Award and, Eric Beyne, Senior Fellow at imec, with the Special Service Award. Peter O’Brien, Head of Research in Photonics Packaging and Systems Integration, Tyndall National InstituteAnne Van den Bosch, Vice President Public R D Policies and Programs, imec receiving the award on behalf of Eric Beyne, Senior Fellow, imecOn behalf of SEMI, the SEMI Europe team and ISS Europe committee, we would like to thank all speakers, sponsors, and attendees for making the event a great success. ISS Europe 2027 will take place in Dresden, Germany from March 8-10.Serena Brischetto is Director, Marketing and Digital Engagement at SEMI Europe.

On October 03, 2025, as part of the European Chips Diversity Alliance, the recent "Why Inclusion Fuels Better Chips" panel discussion, hosted by Kartikey Srivastava, Senior Specialist, Communications at SEMI Europe, brought together three leaders from across the ecosystem to explore how inclusion is not just a social imperative but a strategic advantage.Martina Wolfgruber, Head of Talent Skills Funding at Infineon Technologies Austria: With over 15 years of experience in HR, Wolfgruber is responsible for funded projects aimed at promoting careers and cultivating talent within the microelectronics industry.Catherine Le Lan de Franssu at Synopsys: Le Lan de Franssu brings a wealth of experience in customer success management, training, and team management from her time at companies like LSI-Logic, Synopsys, and Texas Instruments. She now focuses on fostering collaborations for workforce development.Dr. Suzanne Lesecq, Research Director and European Programs Manager at CEA- Leti: A research director and former university professor, Dr. Lesecq focuses on data fusion and advanced control. She currently manages European programs at CEA-Leti/DSYS.The semiconductor industry is the backbone of Europe's digital transformation, but achieving excellence goes beyond technology alone. It's about bringing every perspective and every talent to the table.Inclusion as a Strategic ImperativeThe panelists all agreed that a commitment to diversity, equity, and inclusion (DEI) is essential for Europe to lead in the semiconductor sector. Wolfgruber posed a compelling question: can Europe truly afford to leave half of its talent pool untapped? She pointed to data from a Boston Consulting Group study showing that companies with diverse leadership are nearly 40% more likely to achieve above-average profitability, and diverse teams are almost twice as likely to be innovative. For Infineon, she noted, "inclusion is not just a value... it's a strategic advantage."Echoing this sentiment, Le Lan de Franssu emphasized that innovation depends on collaboration across institutions, disciplines, regions, and cultures. She believes that "breakthrough moments happen when talented people of every background feel valued, supported to their best self at work." Dr. Lesecq added that inclusion is "a matter of society" that goes beyond a single company's benefit.Fostering a Culture of InclusionThe conversation then moved to practical steps for building a truly inclusive environment. Dr. Lesecq, coming from the academic sector, highlighted the significant gender imbalance and the lack of inclusion for people with special needs. She stressed the need for a major effort to attract untapped talent to the emerging semiconductor domain.One effective solution discussed was mentoring. Le Lan de Franssu shared how a mentoring program can help make diverse talent more visible. She noted that companies working together, such as the collaboration between Synopsys and Infineon on a summer school, helps not only with their own hiring needs but for the broader semiconductor industry. Wolfgruber agreed, stating that a wide range of communities already exists to help companies widen their scope and influence culture; it's simply a matter of companies leveraging them.The Future of a Diverse EcosystemThe panel concluded with a shared vision for the future. The moderator, Srivastava, summarized the key takeaways: a need for greater collaboration between industry and academia, the importance of mentoring, and a continued focus on leveraging research that proves diverse teams produce the best results.Dr. Lesecq shared her hope that Europe will continue to keep this mindset and implement it, seeing inclusion as a societal change that everyone must push for to create a "place for everyone."This panel discussion, along with initiatives like the Spark Excellence Award, serves as a powerful reminder that while technology is at the heart of the semiconductor industry, its true strength lies in the diversity of its people.Learn more about the European Chips Diversity Alliance. For more information, contact Ana Isabel Billingslea at [email protected] or Kartikey Srivastava at [email protected] Isabel Billingslea is Communications Coordinator at SEMI Europe.

On September 16, 2025, the Inclusive Chips Forum organized by Platform Talent voor Technologie at the High Tech Campus Eindhoven convened changemakers from across Europe’s semiconductor ecosystem to share insights and strategies for building a more inclusive industry.This full-day program was designed to showcase practical strategies, inspiring case studies, and collaborative solutions aimed at strengthening inclusion, innovation, and resilience in the semiconductor industry. With Europe’s role in the global semiconductor landscape under intense focus, the forum highlighted why building a workforce culture rooted in equity and belonging is not just the right thing to do, it’s a strategic imperative.A Thought-Provoking Panel on Inclusive LeadershipA central question resonated throughout the conversation: What if inclusivity were treated as a core component of leadership development, as fundamental as financial management or strategic planning, rather than an optional module or one-off seminar?The discussion surfaced several critical insights for the industry and beyond:Awareness alone is not enough. While raising awareness about bias and stereotypes is important, research and experience show it rarely leads to behavioral change on its own. Lasting change comes from setting clear norms, leaders must define and model what is acceptable, expected, and celebrated in organizational culture. As Sahar Yadegari, Executive Director of Expertisecentrum voor haar technische ontwikkeling, emphasized:“Awareness is a starting point, not the finish line. Real change happens when inclusion is built into systems — not treated as an add-on.” – VHTOLeadership as connection. True leaders don’t just focus on profits or processes. They bring all perspectives into the room, connect diverse groups, and create conditions for others to thrive.Structural support matters. To avoid symbolic gestures, organizations must embed inclusivity into their leadership practices and accountability systems.Competitiveness through inclusion. By embracing diversity and inclusion, Europe can future-proof its semiconductor workforce, strengthening innovation capacity and securing its position in an increasingly competitive global market.Looking AheadThe Inclusive Chips Forum underscored a powerful message: embedding inclusion into leadership is not optional, it is essential for the sustainable success of Europe’s semiconductor industry.As participants engaged in lively discussions and networking throughout the day, one thing became clear: building a resilient, innovative, and inclusive semiconductor ecosystem will require collaborative effort, courageous leadership, and a commitment to turning awareness into action.A heartfelt thank you to all speakers, participants, and partners who made this event possible.For more information, contact Ana Isabel Billingslea at [email protected] or Kartikey Srivastava at [email protected] Isabel Billingslea is Communications Coordinator at SEMI Europe.

The GENESIS EU project is reshaping how Europe thinks about semiconductor manufacturing. Its goal is simple but ambitious: reduce usage of harmful chemicals from chip production, cut emissions and waste, and make the industry more circular and resilient.Launched on 1 May 2025, GENESIS – GENerate in Europe a Sustainable Industry for Semiconductor – is a research and innovation project co-funded by the European Union through Chips JU and its participating member states. In addition, Swiss partners are supported by the Swiss State Secretariat for Education, Research and Innovation (SERI).Coordinated by CEA-Leti in Grenoble, GENESIS brings together 58 partners from across the semiconductor value chain: materials and chemistry suppliers, equipment manufacturers, semiconductor fabs, research and technology organisations (RTOs), universities, small and medium-sized enterprises (SMEs), recycling specialists and communication experts. Together, they are working to build a resilient, circular and environmentally responsible microelectronics sector aligned with the European Green Deal and the European Chips Act.Mission and VisionGENESIS exists to future-proof the European semiconductor industry. The project focuses on:Eliminating or replacing per- and polyfluoroalkyl substances (PFAS) and other hazardous substances used in manufacturing processes;Reducing waste and greenhouse gas emissions throughout the production chain;Securing access to critical materials through smarter use, reuse and circular strategies;Deploying advanced monitoring and sensing solutions for gas and liquid environments in fabs.Six Work Packages, One Integrated ApproachTo reach its objectives, GENESIS is structured into six work packages.Work Package 1 – Management, Specifications, and MethodsLead: CEA-LetiWP1 keeps the project on track. It manages the technical, administrative and financial coordination of GENESIS and defines common specifications and methodologies. This includes setting technical recommendations and carrying out environmental impact assessments so that shared targets and consistent methods guide all subsequent work.Work Package 2 – Process, Monitoring Sensing Hardware and SolutionLead: CSEMWP2 develops real-time monitoring technologies capable of detecting and quantifying emissions from process gases such as NF₃, CF₄ or SF₆. By improving transparency and enabling process feedback, GENESIS contributes to the transition toward low-emission semiconductor fabs aligned with EU climate goals.Work Package 3 – Environmentally Friendly Materials AlternativesLead: imecWith global PFAS restrictions tightening, the semiconductor sector urgently needs high-performance, safe alternatives. GENESIS in WP3, is designing and qualifying materials for key manufacturing steps including lithography, etching, cleaning, deposition, and packaging, that reduce industry dependence on PFAS and higher GWP gases while ensuring compatibility with industry performance requirements.Work Package 4 – Minimisation of Waste and EmissionsLead: FraunhoferWP4 addresses the complexity of semiconductor waste streams and explores innovations to enhance abatement efficiency. GENESIS develops recycling, recovery, and closed-loop solutions for gases, slurries, and solvents, with the aim of significantly reducing waste across fabs.Work Package 5 – Materials Scarcity Impact MitigationLead: Università degli Studi di Roma Tor VergataEurope’s dependence on critical raw materials—including gallium, indium, and rare earth elements—represents both an environmental and strategic challenge. GENESIS in WP5 focuses on reducing CRM usage through process innovation and strengthening circularity to enhance supply chain resilience.Work Package 6 – Regulations, Dissemination, Communication and ExploitationLead: SEMI EuropeWP 6 is dedicated to ensuring that GENESIS creates meaningful and lasting impact beyond its technical achievements. It integrates regulatory monitoring, dissemination, communication, and exploitation activities to connect the project’s innovations with industry needs, European policy developments, and wider society. WP6 is coordinated by SEMI Europe, supported by expert partners across the consortium, and serves as the bridge between GENESIS’s scientific work and its real-world influence.Long-term strategyGENESIS is built with one goal in mind: making sure the work happening inside the project translates into real change across Europe’s semiconductor ecosystem. To support this, the project focuses on four key impact areas that help move ideas from research into industry, policy and long-term community engagement.Helping Industry Put Results to WorkA core part of GENESIS is understanding how each partner can use the project’s results in their own environment. Whether it’s new materials, smarter monitoring solutions or better waste-reduction approaches, partners define clear pathways for adoption so GENESIS innovations can move naturally into real industrial use.Staying Connected to Europe’s Policy AgendaSustainability and chemical regulations in Europe are evolving fast, and GENESIS stays close to these developments. The project brings technical insights to discussions around the Green Deal, PFAS regulation, and critical raw materials. This makes sure GENESIS is not only aligned with policy trends, but also contributes to shaping them.Making Knowledge Accessible and Future-FocusedOpen access is an essential part of GENESIS. The project shares its research outputs publicly and supports the creation of educational material for universities and training programmes. This helps the next generation of engineers and specialists build on GENESIS knowledge and carry it forward.Keeping GENESIS Visible and RelevantGENESIS maintains a strong presence across events, conferences, publications and expert discussions. This ongoing engagement ensures that project results remain visible, understood and connected to wider conversations on sustainable semiconductor manufacturing—helping extend the project’s influence well beyond its duration.Towards a Sustainable Semiconductor FutureGENESIS shows that high-performance chips and environmental responsibility can coexist. By uniting materials science, process engineering, monitoring technologies, environmental assessment and policy insight, GENESIS is helping define what responsible, future-ready semiconductor manufacturing will look like tomorrow.Jatin Mendiratta, Communications CoordinatorSEMI Europe Phone: +49 160 402 8899Email: [email protected]

Advanced packaging is no longer operating behind the scenes. The technology of advanced packaging is helping to sustain the speed of the semiconductor industry’s improvement in power and performance, even as the Moore’s Law roadmap for wafer-level scaling comes under strain.At the Advanced Packaging Conference during SEMICON Europa 2025 in Munich, global experts examined the growth trajectory of this critical sector and Europe’s potential to lead in next-generation packaging solutions.Market Momentum Fueled by AI and HPCRomain Fraux, Chief Research Officer at Yole Group, forecasted that global revenues for advanced packaging will grow from $46.1 billion in 2024 to $79.4 billion by 2030. “Everything is linked to AI and high-performance computing (HPC),” said Fraux, while also emphasizing the growing relevance of automotive applications in driving demand.Romain Fraux, Chief Research Officer, Yole GroupThis demand is accelerating innovation across the supply chain. One emerging area is panel-level packaging, which breaks away from traditional round wafers. As Andreas Wocko, Sales Manager at Lam Research, observed, “Since the 1970s, the semiconductor industry has built on wafers. Now we are not just scaling, we are reshaping, building in a square format for the first time” – an innovation which substantially increases area efficiency and reduces device cost. Andreas Wocko, Sales Manager Europe, Lam ResearchTechnology Transformation from Lab to FabEurope is already investing in the foundational technologies that will power tomorrow’s packaging systems. Rolf Aschenbrenner, Deputy Director of Fraunhofer IZM, the home of the European Union’s APECS advanced packaging pilot line, discussed ongoing research into functional interposers, routing density, and organic interposers. “Our goal is to show how a new design philosophy incorporating chiplets can be brought to the industrial systems level,” said Aschenbrenner.Rolf Aschenbrenner, Director Deputy, Fraunhofer IZMThese breakthroughs are essential, as pitch sizes shrink and new materials emerge. Dr. Jessica Stubbe, Global Application Manager at MKS Atotech, described how interconnect densities have doubled in the past two years, with the industry moving to pitch sizes of less than 10µm. Stubbe said this new technology “will be enabled by a move from traditional solder-based interconnects to copper-to-copper hybrid bonding to provide higher density I/Os and lower resistance.” Jessica Stubbe, Global Application Manager, MKS AtotechInnovation Meets Real-World IntegrationThis increased density carries thermal risks with it. As Ram Trichur, Global Head of Semiconductor Packaging at Henkel Corporation, said, “New architectures enabled by advanced packaging are putting power devices on the backside, interposer or substrate, and this addition of more power delivery components in the package creates more local hotspots.”The reduced feature sizes inside the latest packages make it more difficult than ever to apply thermal interface materials. “At Henkel, we are now making 1µm-level fillers which enable the effective filling of gaps as small as 7µm,” said Trichur.Ram Trichur, Global Head of Semiconductor Packaging Market Segment, Henkel CorporationOne of the applications which stands to gain the most from the development of advanced packaging technology is silicon photonics. Dr. Himani Kamineni, Director for Advanced Packaging at GlobalFoundries, described how co-packaged optics (CPO) brings photonics directly inside the package, reducing connection lengths from centimeters down to millimeters, and providing higher bandwidth and lower latency at lower power. “Advanced packaging and CPO are foundational elements for AI and data centers to enable scalability to the next generation of compute,” said Kamineni. “But it will need a lot of packaging innovation: silicon interposers, copper-to-copper interconnects, and fiber-attach units for precise alignment.” Himani Kamineni, Director, Advanced Packaging, GlobalFoundriesReliability and Test Under PressureIn the transition to new packaging technology, it is crucial that the industry does not lose sight of the reliability standards which have made semiconductors so valuable in sectors such as automotive and aerospace. Amar Mavinkurve, Director of Materials and Labs Package Innovation at NXP Semiconductors, warned the finer spacing and smaller feature sizes in the latest packages posed a problem for reliability and long-term performance. He said, “We are dealing now not just with one failure mechanism, but with multiple. So, the way that we are used to describing behavior in models will not necessarily hold in future. Even industry standards might not hold.”Discussing new technologies such as copper-to-copper interconnects, Mavinkurve pointed out that failure would not be due to a single event, but to processes such as electromigration, corrosion, and thermomechanical effects. To model reliability properly in future, he said, “we need to move from a physics of failure to a physics of degradation.” Amar Mavinkurve, Director Materials and Labs Package Innovation, CTO, NXP SemiconductorsFabio Pizza, Business Segment Manager at Advantest Europe focused on quality and failure. With geometry scaling toward 1nm, early identification of known-good dies is essential to optimize cost and test coverage. Pizza said that, while device manufacturers need to keep time-to-market and the cost of test under tight control, they are also trying to figure out how to increase test coverage. “In a modern GPU, even a 100 DPPM quality process leaves 20 million transistors untested,” he said. Fabio Pizza, Business Segment Manager, Advantest EuropeEurope’s Position in the Global EcosystemThe conference concluded with a panel discussion about the prospects for Europe in the global advanced packaging market. According to Yole’s Romain Fraux, there is a strong ecosystem in Europe: “Europe’s strengths include specialized packaging service providers in the photonics and power market segments, as well as many packaging equipment manufacturers,” said Fraux. This resonated with the instincts of NXP’s Amar Mavinkurve and Advantest’s Fabio Pizza. Mavinkurve said: “We should focus on what we are already good at doing. It will be challenging to compete with advanced packaging providers elsewhere for AI and HPC business.”Ram Trichur of Henkel, however, urged the industry in Europe, “Do not take your foot off the gas on advanced packaging. You cannot do the full stack here, but in a technology such as CPO, there is a lot of innovation in Europe, and there is scope to add the manufacturing of these devices on top of the research capabilities.”Chris Scanlan, Senior Vice President of Technology at Besi, raised the idea of shifting production toward Eastern Europe. But Trichur cautioned that talent and infrastructure remain limiting factors in that strategy. From left to right: Chris Scanlan, Senior Vice President Technology, Besi;Amar Mavinkurve, Director Materials and Labs Package Innovation, CTO, NXP Semiconductors; Fabio Pizza, Business Segment Manager, Advantest Europe; Rolf Aschenbrenner, Director Deputy, Fraunhofer IZM; Ram Trichur, Global Head of Semiconductor Packaging Market Segment, Henkel CorporationCollaboration is the Path ForwardSpeakers throughout the conference echoed a common message: advanced packaging is reshaping the semiconductor landscape, and global collaboration will be essential to success. “It is impossible for one country or one region to do the entire stack,” Trichur concluded. “Innovation must be matched with strategic partnerships to bring advanced packaging from research to real-world impact.”On behalf of SEMI, the SEMI Europe team would like to thank the industry leaders whose expertise and enthusiasm made this conference a resounding success. SEMI ContactCassandra Melvin, Senior Director of Business Development and OperationsEmail: [email protected]

The semiconductor industry is expanding at an unprecedented pace. Global semiconductor revenues are now forecast to exceed $1 trillion annually by 2030, yet recruitment is struggling to keep pace with the demand for new workers. This is why talent development is a critical focus for SEMI and the SEMI Foundation.Young professionals and students are crucial stakeholders of future talent. Held during SEMICON Europa, Building the Talent Pipeline event provided a showcase for some of Europe’s most enthusiastic promoters of careers in the industry: the Student Ambassadors of the European Chip Skills Academy (ECSA). The session opened with Andra Bornea, a Master’s student of electrical engineering at the Technical University of Cluj-Napoca in Romania, who shared the inspiring story of her journey towards a career in electronics. “For me, it started when I attended the ECS Summer School in 2023 along with 39 other students. It was a life-changing experience,” Bornea shared.The Summer School is a week-long programme jointly organised by AENEAS, ECSA, EPoSS and Inside, bringing together lectures, demonstrations and interactive sessions that give students a first-hand glimpse into what a career in semiconductors can look like. For Bornea, the impact was immediate and decisive. “Attending the Summer School convinced me to shift the focus of my studies from telecommunications and pursue a Master’s in electrical engineering,” she added. Today, Bornea is one of 70 students across Europe who form the ECSA Student Ambassador Programme, a community she describes as “a vibrant network of motivated students working towards the goal of keeping Europe at the forefront of the global semiconductor industry.”Andra Bornea, Technical University of Cluj-Napoca The event also featured other ECSA student ambassadors who are actively promoting the semiconductor industry within their own academic communities. One of them was András Bálint Mészáros, an electrical engineering student at the Budapest University of Technology and Economics, who spoke about his determination to build a student electronics club despite facing administrative hurdles along the way. Reflecting on the process, Mészáros said, “ECSA provided good opportunities to start a community of students interested in observing how the microelectronics industry works.”András Mészáros, Budapest University of Technology and Economics A similar spirit of initiative was shared by Nassim Beladel, a Master’s student at ETH Zurich, who described founding Young Neuromorphs which is a student association focused on computational hardware design inspired by the structure of the human brain. Beladel outlined ambitious plans for the group, including an FPGA hackathon in 2026 supported by the Edge AI Foundation, as well as a proposal to present the association’s work at an IEEE event in Shanghai. Nassim Beladel, ETH Zürich These new initiatives supplement a vibrant network of clubs and events around Europe. Octavian-Constantin Axinte, a Master’s student at the Technical University of Cluj-Napoca, told the forum of a Romanian competition for electronics students which has its roots way back in 1992. The Technologies of Interconnections in Electronics (TIE) contest attracted 1,500 students to its final stage in 2025. Axinte said that the benefits of participation included “hands-on experience of professional work, interaction with teachers, and, if all goes well, a job offer!” Octavian Axinte, Technical University of Cluj-Napoca Pioneering Research Efforts of the Next Generation of Students The Building the Talent Pipeline event also gave ECSA student ambassadors an opportunity to describe the findings of research projects that they have undertaken. Laura Sondakh, a Master’s student at Ghent University, presented her research into the environmental and social impacts of tantalum and cobalt which are critical minerals used in electronic components such as capacitors. “These minerals mostly come from the Democratic Republic of Congo, a country which ranks very low on development indices,” she explained, noting that many mines are located in conflict-affected regions in the east of the country. Laura Sondakh, Ghent University Vuk Vulević, a Bachelor’s student of telecommunications and IT at the University of Belgrade, shared his work on the applications of quantum computing, highlighting its potential beyond classic engineering uses such as machine learning. He explained how quantum technologies could also be applied “in pharmacology, for simulating complex molecules and testing compounds virtually, and in finance, for performing risk analyses and Monte Carlo simulations at high speed.” Vuk Vulević, University of Belgrade Z Zainab, a Research Assistant at Hochschule Anhalt, shared insights from her research into how mechanical strain can be introduced during the wafer saw-dicing process which is a critical step in turning wafers into individual chips. Using Raman spectroscopy, her work helps identify how key process parameters influence wafer integrity, enabling manufacturers to better optimise dicing conditions and reduce hidden damage that can affect chip reliability and manufacturing efficiency.Z Zainab, Research Assistant, Hochschule Anhalt Future Plans for Building the Talent Pipeline The event concluded by looking ahead at how SEMI and its partners are scaling up programmes to support talent development worldwide. Victoria Cummings, Senior Manager for Workforce Development and EU Projects at SEMI Europe, introduced Reinforcing Skills in Chips Design for Europe (RESCHIP4EU), a Master’s program for training the next generation of semiconductor designers supported by SEMI Europe and STMicroelectronics. Outlining the project’s ambition, Cummings said, “The program has a broad curriculum, covering everything from silicon chips and SoCs to safety-critical software, how to run a team, and how to start a semiconductor business.” Victoria Cummings, Senior Manager, Workforce Development and EU Projects, SEMI Europe The focus then shifted towards engaging younger learners. Marco van Schagen and Tijl Bouman, co-founders of JuniorIOT, unveiled their newest workshop, Chips in Schools, which builds on their work to spark interest in electronics among younger students. During a hands-on demonstration, audience members of all ages were invited to examine LEDs under a microscope, learning how different chips can be identified and classified by function.The Chips in Schools workshop will soon be available on the ECSA e-learning platform as part of the ongoing collaboration between ECSA and JuniorIOT. Reflecting on the importance of early engagement, van Schagen noted: “When we talk about the talent pipeline, we need to ask where this pipeline really begins. For us, it’s so important that we reach out to children early to foster their sense of curiosity and discovery.”Marco van Schagen, Co-founder of JuniorIOT, demonstrating the Chips in Schools workshop with Victoria Cummings.Rounding off the session, Mike Glavin, Program Director for Workforce Development at the SEMI Foundation, spoke about efforts to significantly scale the foundation’s impact. He described how, despite hundreds of individual microelectronics education initiatives across schools and colleges in the United States, their collective impact has often been limited by fragmentation and a lack of coordinated promotion. To address this, Glavin introduced the National Network for Microelectronics Education (NNME), an initiative designed to unify and amplify existing programmes by connecting educators, students and regional partners. The goal, he explained, is to build scalable, sustainable talent pipelines: “We want to answer the questions, how do we train teachers to educate students about semiconductors? How do we connect to networks through which we can train educators at scale? And how do we develop resources so that a university can host its own semiconductor day, rather than requiring the SEMI Foundation to put it on?” Mike Glavin, Program Director for Workforce Development, SEMI Foundation From university labs to industry-aligned Master’s programs, the message at SEMICON Europa 2025 was clear: talent development is critical to sustaining Europe’s semiconductor ambitions. SEMI would like to thank its partners across academia and industry, as well as the vibrant community of ECSA Student Ambassadors, whose collaboration, commitment and creativity are helping to build a diverse, resilient talent pipeline and shaping the future of the global microelectronics ecosystem.SEMI Contact Jatin Mendiratta, Communications Coordinator, European Projects Email: [email protected]

At SEMICON Europa 2025, the Executive Forum programs brought together experts from across the semiconductor value chain to address two critical challenges shaping the industry’s future in Europe: the transformation of the automotive sector and the pursuit of smarter, more competitive manufacturing.Smart Mobility in a Changing MarketKnut Krümmel, Senior Partner Automotive at Porsche Consulting, set the tone with a stark question, “Are we facing a Detroit scenario in Europe, especially in Germany?” – a reference to the decline since the 1990s of the famous “Motor City.” He pointed out that all three of Germany’s giant OEMs, Volkswagen, Mercedes-Benz and BMW, are rapidly losing market share in China in the face of a destructive price war, and have suffered large declines in reported earnings. Krümmel outlined four strategic imperatives for Europe’s auto industry: reduce complexity and increase standardization, become software-defined, design regulation that supports innovation, and build stronger partnerships across the ecosystem. He emphasized, “A new mindset is needed—people need to be hungry to win and prepared to suffer in pursuit of victory.”Knut Krümmel, Senior Partner Automotive, Porsche Consulting GmbHAndreas Aal, Head of Semiconductor Strategy at Volkswagen AG and Chair of Europe at SEMI Smart Mobility Global Automotive Advisory Council (GAAC), introduced a proactive approach to redefine the market. He shared Volkswagen’s vision for mobility-as-a-service, exemplified by its roboshuttle pilot in Hamburg. “It is very difficult for a traditional OEM to go into the full digital services world. But this is what we want to do,” said Aal.Andreas Aal, Semiconductor Strategy Volkswagen AG and Chair of Europe GAAC, VolkswagenJan-Philipp Gerhmann, Vice President of Marketing and Strategy for Automotive at NXP Semiconductors, added that the traditional value chain is being upended. The industry is shifting from a hierarchical supply chain to vertical integration, with companies like Tesla designing their own chips. Gehrmann introduced NXP’s CoreRide platform, a modular “skateboard” architecture enabling plug-and-play Advanced Driver Assistance Systems (ADAS) and infotainment features for future vehicles.Jan-Philipp Gehrmann, Vice President of Marketing Strategy, NXPA perspective on the future of semiconductors in autonomous vehicles was provided by Dieter Hoffend, Business Director for Automotive at imec: “For autonomous vehicles, you need a higher-end compute capability, which needs a transition to smaller nodes – and that is very costly. In fact, semiconductor companies will not want to commit volume to automotive customers for their most expensive leading-edge ICs. This means that a chiplet architecture will be the most cost-effective approach for vehicles, and will provide the greatest supply chain resilience. To support this, imec’s vision is of an open chiplet marketplace of heterogeneous chiplets which are interoperable.”Dieter Hoffend, Business Director Automotive Sector, imecAchieving End-to-end Manufacturing ExcellenceThe Executive Forum then shifted to a discussion of smart semiconductor manufacturing. Giovanni Notarnicola, Partner at Porsche Consulting, highlighted the untapped potential of AI in fabs. “AI requires massive amounts of data—but fabs often don’t own or control their data. And second, AI talent doesn’t typically reside in semiconductor companies,” said Notarnicola. His recommendation: “AI is not an IT issue—it’s a cross-functional technology. Isolating AI in the IT department is an old-fashioned view which will deter AI talent from joining the industry.”And Notarnicola encouraged the industry to leverage the new white paper, From Hype to Impact—Realizing AI's Potential in Semiconductors Manufacturing, produced by SEMI End-to-End Smart Manufacturing Group, which provides an in-depth report on the application of AI in semiconductor fabrication. Giovanni Notarnicola, Partner, Porsche ConsultingOliver Aubel, Corporate Lead for Automotive Solutions at GlobalFoundries, echoed the opportunity. “We have 1 billion sensors in a fab, but 30% of the signals are statistical noise. AI could help us make better sense of the data.”Oliver Aubel, Corporate Lead for Automotive Solutions at GlobalFoundriesA session on smart manufacturing brought to light other proven methods for improving the performance of fabs. Dr. Holland Smith, Director of Data Science at INFICON, described fab control technology that INFICON had helped STMicroelectronics to deploy. As Thomas Gimmig, Director for Industry 4.0 at STMicroelectronics, said, “Our model was a highway control room – a place where a single person controls 220km of road monitored by 400 cameras, and handles one alert every three minutes on average. This is only possible with a huge amount of automation.”Left: Thomas Gimmig, Director for Industry 4.0 at STMicroelectronics; Right: Dr. Holland Smith, Director of Data Science at INFICONAt STMicroelectronics, the new fab control room mimics this model, automating anomaly detection and problem solving. Smith described how the system will not be limited to detecting and handling anomalies which have already occurred. “There is a plan to look ahead at problems which could emerge in future, and to configure it to make proactive suggestions which will prevent anomalies from occurring in the first place,” said Smith. Jamie Potter, co-founder and CEO of Flexciton, showcased how intelligent scheduling tools based on real-time fab capacity are transforming operations. “In the modern fab decisions must be made more frequently, with more intelligence and with fewer people. And that is why fabs need to be made more autonomous,” said Potter.Jamie Potter, CEO Cofounder, Flexciton Ltd“Our tool is based on a dynamic capacity model of the fab, so WIP optimization is based on knowledge of what the fab can actually do now, rather than – as is normally the case in fabs today – on an abstract algorithm which is derived from operational results observed in the past.” Potter said. Robert Wallace, Solutions Architect at Seagate, which has deployed the Flexciton technology, confirmed the impact: “We increased throughput without increasing cycle times, and saw a 30% drop in deviations from forecast completion times.” Robert Wallace, Solutions Architect at SeagateAntoine Amade, President (EMEA) of Entegris, emphasized the importance of benchmarking to guide performance improvements: “We have a robust library of fab case studies. These benchmarks can become the foundation for best practices.” Antoine Amade, President (EMEA) of EntegrisRegulatory Burdens and Regional Challenges In a panel session, the discussion turned to the issues that European semiconductor manufacturing faces in particular. Herbert Blaschitz, Executive Vice President of Advanced Technology Facilities at Exyte, put a strong emphasis on the drag that European regulation imposes on the construction of new fabrication plants: “There is three times more paperwork to complete in Europe than in Asia.” Blaschitz made the contrast with Taiwan, “where they have standard codes of regulation specifically for a wafer fab. In Europe, we have regulations for skyscrapers, we have regulations for building family homes. But we have nothing for wafer fabs.”It could be worse for companies building all new fabs. According to Stephen Rothrock, President and CEO of ATREG, “We are affected by permits and politics most of all when trying to push through the repurposing of fabs.”From Left to Right: Mark Puttock, Sr. Director - Technology and Innovation, Entegris; Giovanni Notarnicola, Partner, Porsche Consulting; Stephen Rothrock, President/CEO, ATREG; Jean-René Lèquepeys, Deputy Director and Chief Technology Officer, CEA-Leti; Herbert Blaschitz, Executive VP of Advanced Technology Facilities, Exyte; Oliver Aubel, Corporate Lead Automotive Solutions, GlobalFoundriesSustainable Manufacturing Practices: A Source of Competitive Advantage?The forum ended with a debate on the value of and problems with Europe’s commitment to sustainability. As Mark Puttock, Senior Director for Technology and Innovation at Entegris, acknowledged concerns that sustainability practices could raise costs and reduce process efficiency. But Jean-René Lèquepeys, Deputy Director and Chief Technology Officer at CEA-Leti, countered: “sustainability can be a competitive advantage. For instance, the industry is under pressure to eliminate PFAS from its processes. CEA-Leti is working on this problem, and the whole world is looking for a solution.”The event concluded with a moment of celebration: Ilya Zabelinsky, Co-founder of the International Subfab Research Labs (ISRL), won a diamond prize sponsored by Nanores Lab,Left: Jakub GawczyńskiJakub Gawczyński, Head of Nanores Lab; Right: Ilya Zabelinsky, Co-founder of the International Subfab Research Labs (ISRL)On behalf of SEMI, we extend our sincere gratitude to the speakers, sponsors, and participants who contributed their expertise and vision to the programs at SEMICON Europa 2025.SEMI ContactAna Bernardo, Senior Manager of Technology Programs SalesEmail: [email protected]