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BRUSSELS, Belgium — January 30, 2024 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, today announced the publication of the final Yearly Monitoring Report by market research firm DECISION - Études & Conseil, marking the conclusion of the Microelectronics Training Industry and Skills (METIS) project.

The Yearly Monitoring Report, conducted under the METIS framework, is an update to earlier versions of the Skills and Occupational Profiles for Microelectronics report. Among the Yearly Monitoring Report’s findings, data specialist last year became one of the top five critical jobs, joining software engineer, design engineer, process engineer, and maintenance technician.

Other key findings include:

  • The highest priority soft skills required by the semiconductor industry are teamwork, communication and creativity.
  • Critical skills across the various job profiles are primarily associated with digitization.

“In addition to newer job profiles such as machine learning engineers, emerging skills are becoming crucial for existing roles emphasizing the need for digital skills due to the rising importance of automation,” said Léo Saint-Martin, Senior Consultant and Associate at DECISION - Études & Conseil. “Companies are already collaborating and engaging more directly with universities and training authorities to better communicate their needs in the years to come and create a stronger talent strategy.”

The report considers the current skills gap in the microelectronics industry and provides a list of policy recommendations including:

  • Increase the involvement of the microelectronics industry in the education process.
  • Develop communications campaigns to improve the sector’s image.
  • Develop clusters and networks to encourage greater dialog between industry and education providers.

“The need of the hour is to favor intra- and extra-EU mobility and develop interdisciplinarity and joint degrees in microelectronics,” said Christopher Frieling, Director of Advocacy and Public Policy at SEMI. “The establishment of the European Chips Skills Academy, a successor to the METIS project, will assist in supporting skills development in Europe by supporting summer schools and internships and expanding teaching opportunities across the continent for professors.”

The European Skills Academy and the European Chips Skills Alliance – part of a long-term METIS action-plan led by SEMI Europe – will help deepen collaboration in the microelectronics industry. The Alliance will consolidate skills-related activities, share best practices, and build a network across Europe to address the talent shortage, strengthen Europe´s competitiveness in the microelectronics sector, and connect relevant stakeholders with ongoing initiatives.

To meet growing demand for skills and competences in the fast-evolving microelectronics labor market, the European Chips Skills Academy project will be established as a partnership among vocational education and training providers, higher education and the microelectronics industry. The Academy will support the growth and innovation of the European microelectronics ecosystem.

Funded by the European Commission, METIS featured a consortium of 18 partners from 11 countries, led by SEMI Europe. The consortium developed 88 courses focused on equipping existing and incoming chip industry workers with professional and occupational competences to help fill critical roles. The initiative ran from 2019 to 2023 as part of the European Union’s Erasmus+ programme for advancing education, training, youth and sport.

Visit SEMI Global Advocacy to learn more about its public policy efforts and developments, and SEMI Workforce Development for information on its work to address the microelectronics industry’s talent needs.

Europe Advocacy  

Discover how SEMI Europe Advocacy & Public Policy supports the microelectronics industry across trade, taxes, talent, and R&D or become involved by contacting [email protected].

About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

About DECISION Etudes & Conseil

DECISION Etudes & Conseil is a leading market research firm specialized in the study of electronics value-chain, from components to systems. DECISION provides market and technological insights to companies, industry associations and public authorities in the EU and the World, thanks to its network of economists and experts from the industry and research.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

BRUSSELS, Belgium — May 28, 2024 — SEMI, the industry association serving the global electronics design and manufacturing supply chain, invites key industry stakeholders to participate in a survey designed to assess job skills in highest demand in Europe's microelectronics industry in 2024. Responses are sought from professionals in various roles including senior engineers, professors, researchers and human resources representatives. The deadline for completing the survey is June 28. Results will be published in September 2024.

Supported by SEMI Europe and organized by DECISION - Études & Conseil, the survey was developed by the European Chips Skills Academy (ECSA), an EU-funded initiative launched by a consortium of 18 partners from 12 countries.

The survey builds on the METIS project’s in-depth analysis of skills in the European microelectronics sector from 2020 to 2023. The survey will enable the ECSA to evaluate relevant job profiles in the semiconductor industry, including new roles, positions in highest demand, and those with the highest skills shortage. DECISION Études & Conseil will use the survey to monitor hiring trends and craft public policy recommendations.

“The survey is essential to analyzing key workforce trends in Europe’s semiconductor sector and giving us strategic insights that will enable the ECSA to update the EU Microelectronics Skills Strategy,” said Léo Saint-Martin, Senior Consultant – Associate at DECISION Études & Conseil. “The results will also help us implement and operationalize the EU Pact for Skills.”

The ECSA’s mission is to help integrate the work of industry, research, and academia to develop innovative training and curricula in order to better meet the skills needs of Europe’s chip sector.

“To increase its competitiveness and to achieve the ambitions of the EU Chips Act, the European microelectronics sector must overcome severe skills and talent shortages,” said Christopher Frieling, Director of Advocacy and Public Policy at SEMI. “The survey is part of a holistic initiative under the European Chips Skills Academy that aims to involve partners across the entire semiconductor value chain.”

The ECSA plans to repeat the survey in 2025, 2026 and 2027 to ensure that public policy recommendations reflect the semiconductor industry’s most pressing workforce needs.

Europe Advocacy  

Discover how SEMI Europe Advocacy & Public Policy supports the microelectronics industry across trade, taxes, talent, and R&D or become involved by contacting [email protected].

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

DRESDEN, Germany — June 5, 2024 —The SEMI 3D & Systems Summit, taking place from 12-14 June, 2024 in Dresden, will feature the forefront of technological integration. Themed Heterogeneous Systems for the Intelligently Connected Era, the summit will unravel the intricate web of collaboration among components driving the next wave of innovation. From artificial intelligence algorithms to sensor data processing, attendees will deep dive into the dynamic framework enabling decision-making and real-time applications in an increasingly connected world. Registration is open.

"SEMI Europe looks forward to welcoming leading experts in Dresden. With exceptional speakers and a brand-new exhibition, the Summit offers insights into cutting-edge heterogeneous integration innovations essential for semiconductor applications, driving the advancement of intelligent systems," said Laith Altimime, President of SEMI Europe.

This year’s SEMI 3D & Systems Summit will present a broad scope of topics including:

  • AI as a Driver to Grow 3D Technology Implementation
  • Accelerating the AI Economy through Heterogeneous Integration
  • Heterogeneous Integration for Photonics Applications
  • Technology and Market Updates for 2.5D & 3D Packaging for Heterogeneous Integration
  • Design and Technologies of Chiplet System Architectures
  • Hybrid Bonding Technologies for Advanced 3D Integration
  • Manufacturing Innovation for 3D Integration

Featured Speakers 

Global Leaders to Present 

3D & Systems Summit presenters include experts from global leaders:

  • Adeia
  • ANSYS, Inc.
  • ASE, Inc. 
  • CEA-Leti
  • Comet Yxlon
  • EPIC
  • European Commission
  • EV Group
  • Fraunhofer IZM
  • HEIDENHAIN
  • imec
  • KLA Corporation
  • Lam Research
  • MKS-Atotech
  • NVIDIA
  • PDF Solutions
  • Siemens EDA
  • Silicon Saxony
  • SPTS Technologies
  • STMicroelectronics
  • SUSS MicroTec
  • TechSearch International, Inc.
  • Tokyo Electron Limited
  • Yole Group

Networking 

This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise on the second day of the summit.

Networking Dinner Cruise registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form.

Exhibition

The most prominent names in 3D integration microelectronics manufacturing will showcase their latest products and technologies at the new exhibition area. Exhibitors include: Adeia, ASE, Inc., ASMPT AMICRA, Besi, CEA-Leti, Comet Yxlon, Confovis, European Chips Diversity Alliance, European Chips Skills Academy, EV Group, Fraunhofer IZM-ASSID, HEIDENHAIN, HiCONNECTS, Lam Research, ProSys, Renishaw, SET Corporation, Tokyo Electron Limited and Wooptix.

To reserve an exhibition space, contact [email protected].

3D & Systems Summit Premium Sponsors

For more details, please visit the 3D & Systems Summit 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#3DSummit).

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

Initial Course Programs Designed to Meet Rising Industry Demand for Technicians

MILPITAS, Calif. — May 14, 2023 — Aiming to help the global semiconductor industry address its talent gap by training and upskilling workers, SEMI today announced that its SEMI University™ learning platform now offers online course certification programs designed to fast-track semiconductor career development. Tailored to help meet burgeoning industry demand for technicians, the first two SEMI University Semiconductor Certification Programs are designed for new talent seeking rewarding careers in the industry and experienced workers looking to keep their skills current.

“With semiconductor manufacturers investing heavily in new fabs backed in part by government incentives, SEMI projects the global industry will need 1 million new workers worldwide by 2030 to support the chipmaking expansion,” said Shari Liss, Executive Director of the SEMI Foundation, which drives the SEMI Workforce Development program. “Technicians are in the highest demand, accounting for roughly 40% of the semiconductor workforce worldwide. The SEMI University Certification Program will help meet the industry’s pressing need for a diverse range of training and certification programs to close the talent gap.”

“SEMI University’s new Semiconductor Certification Programs give the industry a fast way to train new talent while enabling current workers to keep pace with its expanding skills requirements,” said SEMI University Director Naresh Naik. “The first two certification programs address critical technician roles. We look forward to adding new certifications to support the industry’s growing workforce needs and career development for our learners.”

The SEMI University Semiconductor Certification Programs include:

  • The Semiconductor Technician Certification equips new semiconductor industry workers with the skills necessary to excel in chip manufacturing. The certification program provides comprehensive training in the semiconductor process and on-the-job tasks. Courses cover the function of semiconductors and their manufacture, how electrical circuits work and the physical laws that apply to electrical current, as well as the various applications of electrical testing equipment.
  • The Pneumatics/Hydraulics Technician Certification covers the use of vacuum technology in pneumatic systems and hydraulics theory. Courses address the properties of gases and vacuums, how various vacuum types are generated, and hydraulic systems and their components including actuators. The curriculum also compares hydraulic and pneumatic systems.

About SEMI University
The SEMI University learning platform offers more than 575 online courses tailored for the semiconductor industry, providing easy-to-use online training in multiple languages for employees ranging from recently hired facility operators to experienced technicians, engineers and non-technical staff. SEMI U also offers in-person trainings. See the SEMI University Course Calendar.

About the SEMI Workforce Development Program
SEMI has offered in-person training and technology trend for updates more than 50 years, and it hosts webinars covering SEMI standards, market dynamics and semiconductor manufacturing and design best practices. SEMI University builds on this experience and adds to the association’s holistic Workforce Development program offered by the SEMI Foundation.

The non-profit arm of SEMI, the SEMI Foundation works to increase awareness of semiconductor industry careers, connect member companies with university students for mentoring and internships, attract and train military veterans, and develop a more diverse and inclusive workforce. Learn more about semiconductor industry career paths at the SEMI Foundation Career Portal.

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

SEMI in Partnership with TechInsights MILPITAS, Calif. – May 14, 2024 – The global semiconductor manufacturing industry in the first quarter of 2024 showed signs of improvement with an uptick in electronic sales, stabilizing inventories and an increase in installed wafer fab capacity, SEMI announced today in its Q1 2024 publication of the Semiconductor Manufacturing Monitor (SMM) Report, prepared in partnership with TechInsights. Stronger industry growth is expected in the second half of the year.


In Q1 2024, electronic sales rose 1% year-over-year (YoY), with Q2 2024 forecast to register a 5% YoY increase. IC sales posted robust 22% YoY growth in Q1 2024 and are expected to surge 21% in Q2 2024 as shipments of high-performance computing (HPC) chips increase and memory pricing continues to improve. IC inventory levels stabilized in Q1 2024 and are expected to improve this quarter.

Installed wafer fab capacity continues to increase and is projected to exceed 40 million wafers per quarter (in 300mm wafer equivalent), rising 1.2% in Q1 2024 with an expected 1.4% uptick in Q2 2024. China continues to log the highest capacity growth among all regions. However, fab utilization rates, particularly for mature nodes, remain a concern with little signs of recovery expected in the first half of 2024. Memory utilization rates were lower than expected in Q1 2024 due to disciplined supply control.

In line with fab utilization trends, semiconductor capital expenditures remain conservative. After falling 17% YoY in Q4 2023, capital expenditures continued to pull back 11% in Q1 2024 before eking out an expected 0.7% gain in Q2 2024. Sequentially in Q2 2024, the trend is turning positive with an expected 8% increase in memory-related capital expenditures as they see slightly stronger growth than non-memory segments.

“Demand in some semiconductor segments is recovering, but the pace of recovery is uneven,” said Clark Tseng, Senior Director of Market Intelligence at SEMI. “AI chips and high-bandwidth memory are currently among devices in the highest demand, leading to increased investment and capacity expansion in these areas. However, the impact of AI chips on IC shipment growth remains limited due to their reliance on a small number of key suppliers.”

“Semiconductor demand in the first half of 2024 is mixed, with memory and logic rebounding due to surging generative AI demand,” said Boris Metodiev, Director of Market Analysis at TechInsights. “However, analog, discrete, and optoelectronics have experienced a slight correction due to the slow recovery of the consumer market coupled with a pullback in demand from the automotive and industrial markets.”

“A full-on recovery is likely to take hold in the second half of the year with the projected boost in consumer demand by AI’s expansion to the edge,” Metodiev said. “Additionally, the automotive and industrial markets are expected to return to growth in the latter part of the year as interest rates fall – providing consumers more purchasing power – and inventory declines.”

 

Memory IC Sales 2Q 2022 - 2Q 2024

 

Total IC Inventory Versus Utilization 1Q 2022 - 2Q 2024

 

Sources: SEMI (www.semi.org) and TechInsights (www.techinsights.com), May 2024

 

The Semiconductor Manufacturing Monitor (SMM) report provides end-to-end data on the worldwide semiconductor manufacturing industry. The report highlights key trends based on industry indicators including capital equipment, fab capacity, and semiconductor and electronics sales, and includes a capital equipment market forecast. The SMM report also contains two years of quarterly data and a one-quarter outlook for the semiconductor manufacturing supply chain including leading IDM, fabless, foundry, and OSAT companies. An SMM subscription includes quarterly reports.

Download a sample Semiconductor Manufacturing Monitor report

For more information on the report or to subscribe, please contact the SEMI Market Intelligence Team at [email protected]. Details on SEMI market data are available at SEMI Market Data.

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

The European Chip Skills Academy (ECS Academy) Connects Students with Microelectronics Studies to Help Build Talent Pipeline

BRUSSELS, Belgium – May 16, 2024 – University students will connect with professors to explore semiconductor learning paths and employment opportunities at the European Chip Skills Academy Summer School, August 18-23, 2024 in Bologna, Italy. Supported by SEMI and held in collaboration with AENEAS, EPoSS, and Inside, the event is integral to the European Chips Skills Academy, an EU-funded project coordinated by SEMI Europe. The event will be held at the University Residential Centre, University of Bologna, Bertinoro, Italy. Registration is open.

The ECS Academy, funded through the Erasmus+ program, aims to foster dialogue, strategic planning, and actionable steps to help grow the microelectronics industry workforce.

The Summer School will serve as a key initiative of the ECS Academy for 2024, offering insights into current microelectronics technologies and anticipated future applications across the semiconductor value chain.

Summer School Key Topics

  • Semiconductor Technology
  • Integrated Circuits Design
  • Digital Systems and Embedded Intelligence
  • Integration, including Packaging and MEMS Technology

Other Event Highlights

  • Networking Reception – Meet with peers and industry experts to explore semiconductor industry career paths.
  • Meet like-minded students – Interact with peers with similar interests and motivations.
  • Explore Bologna: Admire the city’s unique architecture, and in particular the red tiled rooftops.

Enrollment Criteria

The initiative is designed for STEM undergraduates’ students in the following categories:

The Summer School will be complimentary. Some participants may qualify for a travel reimbursement of up to 600 EUR.

Student selection will be based on the applicant’s CV, a motivation letter, recommendation letters, and academic transcripts. The selection process will take into account gender and geographical balance to ensure diverse student backgrounds.

Applications should be submitted by May 19, 17:00 CEST. Selected students will be notified on June 15, 2024.

For more details, please visit the Summer School webpage and connect with SEMI Europe on X or LinkedIn @SEMIEurope and with ECSA on X and LinkedIn (#summerschool #ECSA #talent #microelectronics).


About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

MUNICH, Germany ─ May 21, 2024 ─ SEMI Europe today announced the opening of the Call for Abstracts for SEMICON Europa 2024, to be held November 12-15 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), Fab Management Forum (FMF), MEMS & Imaging Sensors Summit and during presentations on the show floor.

Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2024 will gather industry-leading experts and innovators to explore cutting-edge technologies, materials, and process advancements driving the digital transformation and growth in the semiconductor industry. The exhibition and conference will be co-located with electronica.

Call for Abstracts – Events

Advanced Packaging ConferenceChiplets and Heterogenous Integration: The Next Frontier in Performance and Efficiency

The emergence of new types of neural networks like ChatGPT and other AI applications is driving unprecedented demand for high-performance computing (HPC) and innovations in advanced packaging – including for chiplets – heat dissipation, miniaturization, material integration, and power optimization. Abstracts on topics including growth through innovation, developments in design, manufacturing efficiency, and testing systems are invited.

Fab Management ForumIndustry Meets Innovative Ideas

Geared for fab managers, the Fab Management Forum will focus on optimizing next-generation core technologies such as SiC, photonics, and quantum computing to support industry growth. The forum will explore advancements in smart manufacturing solutions that leverage AI-driven tools for efficiency gains to address Europe's environmental sustainability goals and mitigate semiconductor industry-related environmental risks.

MEMS & Imaging Sensors Summit MEMS and Imaging Young Talent

Entrepreneurs, start-up companies, and graduates will showcase their research and early-stage products to MEMS and imaging sensors technologists. Topics of interest include MEMS technologies, new applications and use cases, advancements in MEMS and sensors technology and materials, MEMS-photonics co-integration, and imaging technologies focused on new sensor applications, materials, and architectures.

Pre-recorded Innovation PresentationsInnovation and Collaboration: Powering Sustainable Exponential Growth

SEMI Europe will also highlight microelectronics and semiconductors innovations in short pre-recorded messages, pitches and product announcements by technologists. The videos will be aired on SEMICON Europa 2024 main stages during networking sessions and on the final day of the event.

Presentation abstracts, biographies and headshots must be submitted in English on the SEMICON Europa 2024 Call for Abstracts webpage by June 17, 2024. Selected presenters will be notified in August 2024.

For more details, please visit the SEMICON Europa 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#SEMICONEuropa).

SEMICON Europa Premier Sponsors

  • Platinum: Comet Yxlon, Edwards, Inficon and Siemens
  • Gold: KLA+, Schneider Electric and Synopsys
  • Silver: Adeia, Honeywell and Semilab
  • Event sponsors: ASE, Inc., IBM, MKS-Atotech, Screen and Watlow

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Maria Daniela Perez/SEMI Europe
Phone: +49 160 2562977
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

SEMI Talent Forum Connects Students, Young Professionals with Semiconductor Companies to Help Build Talent Pipeline

SWANSEA, United Kingdom – April 10, 2024 – Post-graduates and onboarding talent will connect with local companies to explore semiconductor industry career paths and employment opportunities at the SEMI Talent Forum, May 1, 2024 at the University of Swansea. Sponsored by SEMI, the event will also highlight how technology is reshaping the global workforce. Participation is free of charge for students. Registration is open.

Sponsored by organizations including Catapult, Comet Group, CS Connected, Edwards, KLA, Oxford Instruments, Swansea University, and the Welsh Government, the event will be held at the Great Hall on Swansea University Bay Campus, Fabian Way, Crymlyn Burrows, Swansea SA1 8EN, UK.

The SEMI Talent Forum 2024 is an ideal venue for semiconductor companies to promote their workforce development, diversity and inclusion initiatives to the next generation of industry talent. The forum targets young talent as the semiconductor industry presses ahead to build the workforce critical to innovations in cutting-edge technologies that are transforming how we work and live, including a focus on environmental sustainability. Representatives from Swansea University and the Welsh government will kick off the event.

SEMI Talent Forum Key Topics

  • Technologies Addressing Global Challenges
  • Microelectronics Enabling Transformative Technologies
  • Microelectronics Empowering a Sustainable Future
  • Panel Discussion: Exciting Career Opportunities in Microelectronics
  • Technology, Diversity and Inclusion

Other Event Highlights

  • Tech Demos – Interactive demonstrations of technologies such as virtual reality and augmented reality.
  • Career Café – Students and post-graduates will meet with industry leaders to learn about their companies’ work and culture.
  • SEMI University – Young talent will learn about SEMI University courses and receive free giveaways at the SEMI stand.
  • Student Pitches – Local students will pitch their research on stage.
  • Student Poster Exhibition – Local students will showcase their research.
  • Networking Reception – Students and industry experts will meet to explore semiconductor industry career paths.

For more details, please visit the SEMI Talent Forum 2024 website and connect with SEMI Europe on X or LinkedIn @SEMIEurope (#talentforum #digitalfuture)


About SEMI

SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

DRESDEN, Germany — March 26, 2024 — Leading experts in 3D integration and systems for semiconductor manufacturing applications will gather at the annual SEMI 3D & Systems Summit, 12-14 June, 2024, in Dresden for insights into the latest heterogeneous integration innovations for semiconductor applications enabling the future of intelligent and sustainable systems. Registration is open.

Themed Heterogeneous Systems for the Intelligently Connected Era, this year’s SEMI 3D & Systems Summit will feature a broader scope of topics including market trends, chiplet design, hybrid bonding, Co-Packaged Optics (CPO), high-bandwidth computing and environmental sustainability.

“We look forward to hosting the most prominent names in 3D integration microelectronics manufacturing to showcase their latest products and technologies at the 3D & Systems Summit,” said Laith Altimime, President of SEMI Europe. “With advanced packaging innovations critical to enabling environmental sustainability while increasing chip performance, we look forward to hosting experts who will discuss the microelectronics industry’s work to explore more eco-friendly alternatives to conventional materials.”

3D Summit Sessions

Session 1: Semiconductor Market Trends and European Impact
Executive leaders will analyze the dynamic relationship between global semiconductor trends and the European landscape, highlighting the implications for Europe’s economic expansion and technological progress.

Session 2: Chiplet System Architectures – Design and Technologies
Industry experts will delve into dynamic chiplet design, emphasizing innovative approaches, emerging trends, optimization strategies, and packaging solutions that drive chiplet innovations.

Session 3: Hybrid Bonding Technologies for Advanced 3D Integration
Specialists will spotlight the latest advancements in hybrid bonding technologies, focusing on recent developments, novel techniques, and emerging applications. Speakers will highlight hybrid bonding’s transformative potential for enhancing semiconductor performance and overall functionality.

Session 4: Manufacturing Innovation for 3D Integration
Visionaries will showcase the newest hybrid bonding advancements, emphasizing their potential to enhance chip performance, efficiency, and functionality through recent innovations and emerging applications.

Session 5: Co-Packaged Optics (CPO) – Innovations for High Bandwidth Computing
Leaders will explore CPO as an advancement in integrated photonics, highlighting its cost-effectiveness, enhanced integration, and potential to improve performance in data transmission and processing systems.

Session 6: Materials and Processes Supporting Environmental Sustainability
Experts will spotlight semiconductor industry efforts to prioritize environmental sustainability through collaboration, innovation, and a continued commitment to exploring eco-friendly alternatives and reducing the industry’s environmental footprint.

Global Leaders to Present

3D & Systems Summit presenters include experts from these global leaders:

  • CARIAD
  • CEA-Leti
  • EPIC
  • EV Group
  • Fraunhofer IIS-EAS
  • Fraunhofer IZM-ASSID
  • imec
  • KLA Corporation
  • MKS-Atotech
  • NVIDIA
  • Silicon Saxony
  • SPTS Technologies Ltd., a KLA company
  • STMicroelectronics
  • TechSearch International, Inc.

Exhibition and Business Networking

The 3D & Systems Summit will also feature business-to-business matchmaking and networking for participants to explore new partnerships and other business opportunities.

To reserve an exhibition space, contact [email protected].

This year’s networking reception will take place at the Hilton Dresden on the first day of the event, and the annual networking dinner will be held on the Elbe River cruise.

Networking Dinner registration is reserved exclusively for 3D & Systems Summit 2024 participants. Guests may register their spouse for dinner by completing the spouse registration form

3D Summit premium sponsors: Adeia, ASE, Comet Yxlon, EV Group, Heidenhain, imec, KLA, Lam Research, and MKS-Atotech.

For more details, please visit the 3D & Systems Summit 2024 website and connect with SEMI Europe onX or LinkedIn @SEMIEurope (#3DSummit).
 

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.
 

Association Contacts

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]

VIENNA, Austria ─ March 7, 2024 ─ SEMI Europe today announced recipients of the SEMI European Award and Special Service Award for 2023 at the SEMI Industry Strategy Symposium Europe (ISS Europe 2024). Dallal Slimani, Chief Strategy Officer at Schneider Electric, was honored with the European SEMI Award and Dr. Ivo Raaijmakers, Corporate Vice President and Executive Advisor at ASM, with the Special Service Award.

Established more than 30 years ago, the SEMI European Award and Special Service Award recognize key players in the global manufacturing supply chain, highlighting their leadership excellence and strategic contributions that lead to critical advances in the semiconductor industry.

“We are honored to recognize Dallal Slimani and Dr. Ivo Raaijmakers for their outstanding leadership and tremendous contributions to the semiconductor community,” said Laith Altimime, President of SEMI Europe. “These extraordinary leaders have been instrumental in helping the semiconductor industry fulfill its ambitions and inspiring future generations to drive toward a sustainable future.”

“This award serves as a testament to the hard work, dedication, and collaboration of an incredible partnership with SEMI and all our partners,” said Slimani. “I am grateful for this remarkable acknowledgment. I firmly believe that by partnering and engaging in the Catalyze program, we can drive the necessary changes for our industry to contribute to a more environmentally sustainable planet. The Schneider Electric team takes pride in being part of this transformation.”

The SEMI European Award recognizes Slimani’s leadership in driving sustainability initiatives and implementing circular economy principles in Europe for Schneider Electric, which culminated with the Catalyze program, to help decarbonize the semiconductor value chain.

“It is exciting to see that ALD and PEALD, a little-known technology 25 years ago, turned into the critical deposition technology it is today,” said Dr. Raaijmakers. “Many teams at ASM contributed to this technology that today enables 3D devices with new advanced materials.”

Dr. Raaijmakers’ outstanding career and leadership was pivotal in the research, development and commercialization of Atomic Layer Deposition (ALD) and Plasma-enhanced ALD (PEALD) equipment and processes, technologies that shaped and continue to influence the semiconductor industry. The ingenuity of ASM’s Finnish ALD and Korean PEALD groups and integrating their innovations into a worldwide product portfolio drove the market success of the two technologies. Dr. Raaijmakers joined ASM in 1996 and served as CTO from 1999 through 2022.

Nominations for the 2024 SEMI European Award are open. Please see the award guidelines. Prior European SEMI Award recipients hailed from companies including Melexis, imec, Soitec, CEA-Leti, Technical University of Dresden, Catholic University of Leuven, STMicroelectronics, EV Group, Infineon, and the Fraunhofer Institute. See the list of past SEMI European Award recipients.

For more details, visit the SEMI European Award web page and connect with SEMI Europe onX or LinkedIn – @SEMIEurope, #SEMIEuropeAward.

About SEMI
SEMI® is the global industry association connecting over 3,000 member companies and 1.5 million professionals worldwide across the semiconductor and electronics design and manufacturing supply chain. We accelerate member collaboration on solutions to top industry challenges through Advocacy, Workforce Development, Sustainability, Supply Chain Management and other programs. Our SEMICON® expositions and events, technology communities, standards and market intelligence help advance our members’ business growth and innovations in design, devices, equipment, materials, services and software, enabling smarter, faster, more secure electronics. Visit www.semi.org, contact a regional office, and connect with SEMI on LinkedIn and X to learn more.

Association Contacts

Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

Michael Hall/SEMI US
Phone: 1.408.943.7988
Email: [email protected]