YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Prabhat Mishra will be the company’s new Vice President of Finance.

“Prabhat joined the company in August of 2019 as our Head of Finance,” said Ramakanth Alapati, CEO of YES. “Over the past two years, his efforts have been instrumental in helping us manage our rapid trajectory from small-scale manufacturer to preferred supplier for the world’s largest technology companies.”

Prior to joining YES, Mr. Mishra was Senior Director of Finance at Macom and Applied Micro, managing the Financial Planning and Analysis function of the company. Before that, he spent 10 years as a finance leader at Intel Corporation, supporting the Mobile Products Group, the Software & Services Group and the Technology & Manufacturing Group. He started his career as an engineer and was an engineering manager at STMicroelectronics, Sun Microsystems and Intel.

Mr. Mishra holds a bachelor’s degree in Electrical Engineering from the Indian Institute of Technology in Delhi, an MBA from Arizona State University, and Certification in Accounting from University of California, Berkeley.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit http://www.yieldengineering.com.

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West Chester, OH, June 23, 2021 -- OEM Group, a global manufacturer of new and remanufactured semiconductor capital equipment, announces its acquisition of Rite Track - a pioneer in innovative products and services for legacy markets for over 28 years. The combined team further announces the establishment of Shellback Semiconductor Technology. The new global entity is headed up by President & CEO Wayne Jeveli and the senior management teams from both OEM Group and Rite Track.

Regarding the news, Mr. Jeveli commented, “Rite Track has flourished for nearly thirty years in a demanding global market. They’ve created a brand that’s respected and loved across the industry and have become integral to our customers’ operations. Their expertise in Coat & Develop technologies is legendary, and their expansion into Wafer Carrier Inspection with the EAGLEi system is a game changer for fab productivity. Similarly, OEM has a 22-year track record of supplying iconic technologies from SEMITOOL, VARIAN and Applied P5000. We serve the same customers, and this union is symbiotic. We’ve respected Rite Track from afar for a long time for their complete focus on customer satisfaction. Now, we’ve got a chance to work together every day on the same team. Our industry is at an incredible inflection point where the need for chips is greater than it’s ever been. SHELLBACK will enable our customers to meet this challenge.”

Rite Track President and CEO Tim Hayden added, “I’m so proud of the team we’ve built over the past 28 years and excited about the opportunities this union will create for our employees, our partners, and most importantly our customers. We have seen the strategic relationships that Wayne and the OEM Group have built over the years and very much look forward to working with his team to grow Shellback into a market leading position within the semiconductor industry.”

With headquarters in Coopersburg, PA, Shellback Semiconductor Technology consists of approximately 150 employees around the globe. The company notably distinguishes itself by providing solutions for both front-end (FEOL) and back-end (BEOL) processing with a wide range of proprietary technologies, including SEMITOOL Spray Batch, STORM Wafer Carrier Cleaner, EAGLEi Wafer Carrier Inspection, and many more.

Shellback Semiconductor Technology will be making further announcements very soon. In the meantime, visit Shellback at www.shellbacksemi.com

ABOUT SHELLBACK SEMICONDUCTOR TECHNOLOGY:For over 400 years, intrepid mariners have embarked on long journeys into uncharted waters. Through a rite of passage, only the most experienced and storied adventurers would earn the honor of being called a “Shellback.” Taking on challenging endeavors, honing critical skills, and earning the trust of comrades, a Shellback enables the success of the voyage. In this tradition, Shellback Semiconductor Technology represents the union of two industry-leading proven semiconductor brands—OEM Group and RITE Track—with a combined 50-years of experience. Sharing a commitment to pioneering intellectual property and unparalleled customer service, Shellback provides new and remanufactured semiconductor capital equipment and services to enable emerging and legacy markets, such as LEDs, MEMS, Wireless, Power, Energy Harvesting, WLP, Data Storage, Analog, and Logic. With one of the industry’s largest installed bases of equipment at over 600+ customers world-wide, Shellback offers proprietary products from SEMITOOL, VARIAN, Applied P5000, SVG Track, and more, as well as a combination of best-in-class technologies for Wafer Carrier Inspection and Cleaning- the EAGLEi and STORM. Headquartered in Coopersburg, PA with facilities across the globe, Shellback was launched in 2021 and is led by President and CEO Wayne Jeveli. www.shellbacksemi.com

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ESPOO, Finland, 24th June 2021 – Picosun Group extends its global sales and service partner network further by signing a partner agreement with Hermes-Epitek Corporation Pte. Ltd. Hermes-Epitek Corporation, headquartered in Taiwan, is one of the world’s largest high-tech equipment distributors. The company provides equipment for semiconductor and optoelectronic manufacturing, as well as tech services and parts sales.

“We look forward to cooperate as Picosun’s sales representative and external field service provider targeting both 8-inch and 12-inch ALD markets in all Southeast Asia countries”, states Teo Kim Leong, Director, Hermes-Epitek Corporation.

“Southeast Asia is one of Picosun’s important market areas, where the demand for industrial ALD solutions is constantly increasing. For almost ten years now, Picosun has successfully provided world leading ALD solutions to numerous customers and partners in both academies and industries in Southeast Asia. I’m happy that with the partnership with Hermes-Epitek Corporation we are able to serve our customers in the region even better”, says Edwin Wu, CEO, Picosun Asia Pte. Ltd.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Edwin Wu
CEO
Picosun Asia Pte. Ltd.
Tel. +358 40 480 3449
Email: [email protected]
www.picosun.com

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FREMONT, Calif. – June 14, 2021 – YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that it has become a member of the Silicon Saxony industry association. YES, which recently established a German presence in Dresden, expects the high-tech networking group to be a valuable resource in marketing advanced process equipment and solutions to an expanding customer base across Europe, particularly in Germany. In addition, the company plans to strengthen communication and alliances with fellow members of Silicon Saxony.

“Silicon Saxony brings together companies that are leading the electronics industry in Europe,” said Dragan Cekic, YES’s Vice President of Sales for Europe and the Americas. “We are excited to join their ongoing conversation about trends and technologies that will affect us all.”
“Change is a given in the markets we serve. The opportunities facing our industry are complex, and the rapid pace of technological developments is unprecedented. We look forward to participating in Silicon Saxony’s high-tech network with the aim of addressing today’s exciting semiconductor roadmaps,” said Rezwan Lateef, President of YES.

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit www.yieldengineering.com.

About Silicon Saxony
With more than 350 members, Silicon Saxony e. V. is the largest high-tech network in Saxony and one of the largest microelectronics and IT clusters in Germany and Europe. Founded in 2000, Silicon Saxony is a self-financed association linking manufacturers, suppliers, service providers, universities, research institutes, public institutions as well as industry-relevant start-ups. Its focus is on the technological trends of the present and future: artificial intelligence, robotics, automation, Internet of Things, sensor technology, energy efficiency, and neuromorphic and edge computing. As a high-profile information, communication and cooperation platform, the association promotes the regional, national and international networking of its members by participating in and organizing industry events.

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IC’Alps Builds a Secure Infrastructure for Ultimate Protection of Customers’ Data

Meylan, FRANCE – June 08, 2021 – In wake of the recently announced partnership with Tiempo Secure for silicon implementation of CC (Common Criteria) EAL5+ grade Secure Element IP, IC’Alps has deployed an infrastructure that complies with the highest security standards.

IC’Alps is a French semiconductor company specializing in the design and supply of exclusive and custom-made ASIC solutions (Application Specific Integrated Circuits). As part of the improvements, the company has set up a secure access management system including premises complementary access control, dedicated and secure design room, and an isolated and secure IT network. This revamp increases the security in IC’Alps’ Head Office as demanded by security-sensitive customers or partners, requiring such a high level of data protection and associated traceability.

IC’Alps successfully passed CC audit of secure room and associated IT infrastructure commissioned by Tiempo Secure, audit performed by a security evaluation labs (ITSEF) licensed by the ANSSI. The audit states that the silicon physical implementation work entrusted by Tiempo Secure to IC’Alps passed the very strict requirements.

“Since the company was founded, IC’Alps has invested significant financial and human resources into IT. We are proud to pass this CC audit for this customer’s project. This is an independent recognition of our commitment to providing the highest level of quality, data security and customer service”, said Jean-Luc Triouleyre, CEO of IC’Alps.

In addition to ISO 13485 (medical) and EN 9100 (aeronautics) certifications, joining an elite group of companies providing a design environment complying with the highest security standards, will strengthen IC’Alps’ business opportunities for silicon implementation of custom chips and hard macros targeted for security-sensitive markets such as, but not limited to, banking, defence, government and implantable medical devices.
 
ABOUT IC’ALPS
IC’Alps is your one-stop-shop ASIC partner. The company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. From its technical centre in France (Grenoble area), IC’Alps supports multiple projects in the demanding medical, industrial, transport, IoT, and mil/aero sectors. The highly qualified engineering teams cover every expertise needed and have a long experience of on-demand analog, mixed-signal and digital integrated circuits on technologies from 0.35 µm down to 16 nm. Moreover, IC’Alps has a proven track record of success with sensor/MEMS AFE interfaces, low power consumption designs, high-resolution converters, signal processing, multiprocessors architectures, hardware accelerators, to name a few. Being a partner of major semiconductor foundries, IP providers, as well as packaging and test houses, IC’Alps is well placed to support customers with full life-cycle solutions. We are proud to be Arm® approved Design Partner, a member of X-FAB’s design and supply chain partner network, as well as an Imec IC-link partner. These accreditations assure that we provide expert support and that we have the design expertise to create highly innovative ASIC designs. IC’Alps is ISO 9001, ISO 13485, EN 9100 certified, as well as Common Criteria ready. More information can be found at www.icalps.com

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An opportunity to boost development for Additive Manufacturing & Semicon industry.

Inventec Performance Chemicals, a global provider of Soldering, Cleaning & Coating solutions, acquired PUS (Pure Ultrasonic System) in April 2021. PUS’ main activities are the production of equipment (solder powder atomizers and sieving machines) and the production of solder powders, from its own process.

By acquiring PUS, Inventec saw an opportunity to create a synergy in the additive manufacturing industry. Inventec supplies the 3D market for high-tech application, with its cleaning, particle elimination & finishing products, while PUS provides sieving, recycling and depowdering, to provide a circular economy solution for this fast-developing market.

Furthermore, the addition of PUS will strengthen Inventec’s know-how in metallurgy, for the development of solder pastes, with ultrafine powders and specialty alloys for the semicon industry. Adapting to an evolving industry, this acquisition allows Inventec to innovate and meet worldwide customers’ needs.

ABOUT INVENTEC
INVENTEC PERFORMANCE CHEMICALS is a global provider of soldering, cleaning & coating materials for electronic, semiconductor and industrial applications.

For more than 50 years we have shown leadership in innovation by putting environment & health impact, sustainability and reliability at the core of our product development.

With iso 9001 & 14001 production sites in France, Switzerland, USA, Mexico, Malaysia and China we can guarantee a smooth and cost-effective supply chain. On top of this, all our production facilities are equipped with a cleaning application centre, where customers are invited to test our proposed cleaning solutions.

Inventec supplies to many industries and the excellent performance of our products in applications demanding high reliability, leads us to focus especially on the automotive, aerospace, semiconductor, automation & energy and medical industry.
For more information about Inventec Performance Chemicals, visit https://www.inventec.dehon.com/en/

ABOUT PUS
PURE ULTRASONIC SYSTEMS is a French expert for ultrasonic atomization and ultrasonic sieving. At its creation, PUS first specialized in atomization and sieving equipment, manufacturing devices for ultrasonic atomization of solder powder for electronic assembly. 10 years later, PUS is still innovating to develop new equipment and powders for the Additive Manufacturing Market.
For more information about PUS, visit https://www.pus-net.fr/en/

• Read more about INVENTEC ACQUIRES PUS (PURE ULTRASONIC SYSTEMS)

ESPOO, Finland, 2nd of June 2021 – Picosun Group has pending patent rights for an ALD enabled corrosion protection solution against plasma etch that will bring benefits in semiconductor fabrication processes in terms of throughput, film uniformity and conformality. With PicoArmour(TM) the corrosion protection can be achieved more efficiently compared with the industry solutions commonly used today.

Wafer fabrication process flows include several steps where plasma etching is necessary. An inevitable consequence of using etching chemicals is that the tool itself will be etched. A common industrial solution for reducing the tool damage is applying a corrosion-resistant coating to the etch tool using for example PVD or spray coating with Y2O3. Compared to only using Y2O3, PicoArmour(TM) enables an up to five times faster and a more cost-effective way of producing the coating. Compared to Al2O3, the coating can be five times more durable.* Also, the maintenance interval of etch tools can be increased which also translates to significant reduction of manufacturing costs.

“Picosun’s approach with PicoArmour(TM) is to combine the highly-etch-resistant Y2O3 ALD process with more robust ALD processes. A high performance ALD corrosion barrier combining the speed and convenience of Al2O3 process with the durability of Y2O3 can be achieved by carefully controlling the film composition. With ALD, the protective effect can be achieved with thinner films, which in turn leads to material savings and a more environmentally friendly process”, states Juhana Kostamo, VP, Industrial Business Area of Picosun Group.

To learn more about PicoArmour(TM) and a study Picosun has done related to protective coatings against plasma damage, join Picosun talk at the virtual ALD 2021 conference on June 29 at 10:25 am EDT.
Register here: https://ald2021.avs.org/register/

*Values dependent on deposition and etch parameters

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
www.picosun.com

• Read more about Picosun’s PicoArmourTM reduces semiconductor manufacturing costs

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced a strategic alliance with SPEC (Semiconductor Process Equipment Corporation) of Valencia, California. Under the terms of the agreement, YES will market, distribute and support SPEC’s cleaning, etching, stripping and plating equipment worldwide. Furthermore, YES plans to expand SPEC’s process expertise by investing in technologists and demo capabilities to help customers implement faster cycles of learning. In addition, YES and SPEC expect to develop a variety of new products drawing on each other’s core technical expertise.

The agreement leverages the strengths of both companies to meet the growing demands of emerging markets such as 5G, autonomous driving, augmented reality, and other computationally-intensive applications.

“In bringing together our two companies’ combined seven decades of engineering and process development expertise, YES will create new process technologies for a variety of semiconductor, life science and optical coating applications, and will offer broader, more complete integrated solutions to our customers,” said Rezwan Lateef, President of YES.

“We look forward to combining our knowledge base with YES’s large and ever-growing repository of process expertise to address customer needs,” said Kevin McGillivray, co- founder of SPEC. “In addition, YES’s established global sales and service network will enable more companies around the world to utilize SPEC’s cost-effective, production-proven automated wet-process solutions.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred provider of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit http://www.yieldengineering.com.

About SPEC
SPEC (Semiconductor Process Equipment Corporation) is a highly experienced supplier of surface conditioning wet process equipment. Since 1986, SPEC has designed and manufactured wafer-level and device-level wet process equipment for acid and solvent surface modification (cleaning, etching, stripping), electroplating, and electroless (chemical) plating for all industries requiring a high level of process cleanliness. SPEC’s products are used for polysilicon chip, chunk and ingot cleaning; crucible cleaning, cavity cleaning for particle accelerators, chemical mixing and delivery, hard drive component cleaning, and quartzware cleaning. SPEC systems are engineered to match the unique requirements of the end user. For more information, please visit http://www.team-spec.com.

• Read more about YES (Yield Engineering Systems, Inc.) and SPEC (Semiconductor Process Equipment Corp.) Sign Strategic Alliance Agreement

The IOSS WID120 Wafer ID Reader is the latest generation of advanced Wafer ID Readers. It was designed to close the gap between easy usability and highest flexibility. With up to 18 different light modes, the IOSS WID120 decodes OCR, Barcode, DataMatrix and QR-Code markings on any kind of wafer, regardless of the wafer material. Thanks to its fully automatic light control and intelligent configurations handling, the IOSS WID120 is able to tweak itself and improve your read rates drastically. The guided teaching process makes it very easy for everyone to setup the camera. Already known functions as master/slave functionality and database connection are still available with this new model. Picture export via FTP is now also possible.

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