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Speakers' Abstracts and Biographies of:






Laith Altimime, President, SEMI Europe



As President of SEMI Europe, Laith Altimime leads SEMI’s activities in Europe and Middle East and North Africa (MENA). He has overall responsibility for regional events, programs, membership, advocacy, and collaborative forums. Additionally, he manages and nurtures relationships with SEMI members in the region, as well as with local associations and constituents in industry, government, and academia. He provides support and services to SEMI members worldwide that have supply chain interests in Europe. Altimime has more than 25 years of experience in the industry, mostly in Europe. He has held leadership positions at Altis, Infineon, Qimonda, KLA-Tencor, Communicant Semiconductor AG, NEC Semiconductors, and imec. Altimime holds a BS from Heriot-Watt University, Scotland.



Claudia Levo, Executive Vice President, Integrated Marketing & Communications, STMicroelectronics



Claudia Levo is Executive Vice President at STMicroelectronics with responsibility for Integrated Marketing & Communications strategies and plans. Her responsibilities encompass corporate communications, including PR, media and industry analyst relations, marketing communications and digital marketing. Levo began her career with Marconi, a global telecommunications company, where she had responsibility for a number of management roles within the Communication function, including marketing communications and internal and external communications across wide geographies. In 2005, Levo managed the communication activities related to the integration of Marconi with Ericsson, and was subsequently appointed Vice President for Communications at the newly formed Ericsson Multimedia Business Unit. In 2008, Levo was appointed Vice President Communications at Italtel. In early 2009 she joined ST-Ericsson, the wireless joint venture between STMicroelectronics and Ericsson, as Senior Vice President and head of Global Communications. In this capacity, she has successfully built the function covering marketing and portfolio communication, public and media relations, investor relations and internal communication. She joined ST in 2011.






Sunil Acharya, Senior Director of Sensor Development Hololens, Microsoft



Sunil Acharya, Sr. Director, Silicon and Sensors Group, Microsoft, is an Engineering Leader with 15+ years of senior-level engineering experience and a background in system architecture, fail fast incubation, product development, hands-on design, and overseas manufacturing. At Microsoft, his teams responsibilities include architecture & HW/SW design of cameras and other hardware for sensing the world external to HoloLens and sensing the person wearing HoloLens. This includes sensors for enabling AI use cases, eye tracking, head tracking, color imaging, time-of-flight depth tracking, inertial motion, and hand tracking. Before Microsoft, he spent a decade at Canesta, a fabless semiconductor company specializing in CMOS based single chip 3D Time Of Flight sensors, driving platform architecture and development for automotive, industrial and consumer applications. He is an inventor on multiple patents and has a Master’s degree in EE from University of Minnesota.

Microsoft Hololens2, like its predecessor, is an untethered holographic mixed reality (MR) headset that transforms the way we communicate, create, and explore. This talk will focus on the algorithms and sensors we developed keeping the experiences in mind and gives a good preview of what’s under the hood that enables this magic. We will close with a few parting comment on what’s next.



Sean Ding, CTO of IOT BG, Alibaba Group



Sean Ding is the Chief Scientist of AIoT, Alibaba Cloud Intelligent. He is the expert on sensation and cognition, and has been devoted to IoT and AI for over 20 years. Prior to Alibaba, he was the director and Chief Scientist of Huawei Sensing Solution Lab. Before that, Sean has worked in Silicon Valley for 15 years, the companies served including STMicroelectronics, Bosch Sensortec, and Intel. Sean is currently the president of Context Computing of MEMS & Sensors Industry Group.

In China, Alibaba Cloud’s IoT now is accelerating the massive growth of IoT in city construction and management by the end-to-end solution, which include Cloud computing platform, including communication management, device management, data analytic platform. Alibaba Cloud’s IOT will also help sensor deployment(NBIOT and Lora), low power network deployment(Lora and NBIOT) in applications like traffic/pipeline network/environment/healthcare monitoring. On top of this platform city manager can build city operation center, helping city builder and regulator to significantly increase the efficiency of city governance with the minimum cost.
Meanwhile, Alibaba Cloud’s IoT is also providing the end-to-end solution toward smart home, smart car, smart community, and smart office to change and innovate people’s lifestyle in an intelligent and sustainable way. Alibaba Cloud’s IoT is providing end-to-end solution to smart city. Total solution including voice recognition, nature language processing, music service, and mobile edge computing which running edge computing, as well as including 200 kinds of ICA
certified smart sensor. Meanwhile, Alibaba smart city platform provide machine learning platform to build smart application, like smart lighting, smart irrigating, smart parking. With total software and hardware solution, city builder can enable smart city application within days.



Avi Strum, Senior Vice President and General Manager of Sensor Business Unit, TowerJazz



Dr. Strum was appointed Senior Vice President and General Manager of Sensors Business Unit in 2018, after serving as Vice President and General Manager (GM) of the CMOS Image Sensor Business Unit (BU) since 2005. Previously he was VP of Europe Sales and VP and GM of the Specialty Business Unit. He joined Tower in 2004 and served as GM of Tower’s design center in Netanya and Device and Integration Department Manager. In 2005, he was appointed GM of the CMOS sensor and non-volatile memory (NVM) BU. Prior to joining Tower, Dr. Strum served as President and COO of TransChip Inc. and previously served in various positions with Intel Corp., both in Israel and the US. He also served with Semi Conductor Devices (SCD) as R&D Manager and was in charge of all infrared detectors development. Dr. Strum received a Ph.D. and B.Sc. in Electrical Engineering from the Technion Israel Institute of Technology.

The talk will discuss the evolution of security features in the cellular market from a simple password through capacitive fingerprint sensors to optical, under OLED and under LCD displays, sensors as well as face recognition methods using structured light and time of flight (ToF) as a competing technology. Application as well as cost considerations will be discussed.



Antti Vasara, President & CEO, VTT



Dr. Antti Vasara is the President & CEO of VTT Ltd since 2015. VTT is a visionary research, development and innovation partner with over 2000 people and turnover exceeding 250 MEUR. He is president of EARTO (European Association of Research and Technology Organisations) and chairman of the board of Palta (Finnish Service Sector Employers). In addition, he is a non-executive director of Elisa Oyj (largest communications operator in Finland) and a board member at EK (Finnish Confederation of Industries). He has served on several high-level groups on industrial and innovation policy of the European Commission in addition to several groups in Finland on artificial intelligence and research policy. Previously, he has worked in the private industry for close to 25 years at Nokia, Tieto, SmartTrust and McKinsey & Company. Earlier in his career, he was a researcher in optical communications with 20+ peer reviewed articles and one international patent. Dr. Vasara holds a Doctor of Science (Technology) degree from Aalto University in Finland.

Sensor fusion, AI and new technological developments now enable a whole series of observation windows on the world and therefore constitute the basis of new solutions to global challenges and new business opportunities. This keynote presentation will review VTT’s  leading edge activities in some fields related to imaging and sensing. Topics like hyperspectral imaging and it’s growing affordability and use cases will be covered, as well as long distance materials active spectral sensing. New passive terahertz imaging solutions for security will be presented  as well as ultrafast uncooled nanobolometers opening the door to faster thermal or chemical imaging. Ultra-dense micron-scale SOI waveguides and their applications in communication, gas sensing, OCT or LIDAR will be covered. You will also see, among other things, how AI combined with mm wave imaging systems can monitor your health basics, without the need of any wearable, or how data fusion and communication enable autonomous cars to face arctic –like adverse weather conditions.







Sylvain Ballandrass, CEO, frec|n|sys SAS



Sylvain Ballandras joined the CNRS in 1991, after his PhD in Engineering Sciences from the Université de Franche-Comté (UFC). He worked then on SAW devices and for the development of micro-machining technologies. He also participated to a common laboratory between the TMX company and CNRS entitled LPMX. He joined TMX in 1997 for a one year industrial training project. He was promoted Research Director at the CNRS in 2003. In 2004, he created its own consulting office. In 2006, he was involved in the creation of the SENSeOR company devoted to RF sensors and acted as as a scientific adviser from 2009 to 2012. In 2008, he set the CoSyMA research group in the Time-Frequency Department of FEMTO-ST Institute. In 2013, he has created frec|n|sys, a company devoted to the design, fabrication and commercialisation of passive RF devices, exploiting industrial equipments owned by UFC. frec|n|sys was acquired by the SOITEC group in 2017 to accelerate the promotion of POI, a new standard for piezoeletric radio-frequency components developed and commerialized by SOITEC. Sylvain Ballandras is an IEEE-UFFC member and an elected member of the IEEE UFFC AdCom for the period 2011-2014.

Piezoelectric-on-Insulator (POI) wafers represent a breakthrough for the development of modern surface acoustic wave (SAW) devices for radio-frequency (RF) filters for new telecoms standards. However, it also allows for very innovative developments for sensor applications, more specifically for wireless sensor applications. In the proposed contribution, a new type of such sensor is presented, built on engineered substrates developed by SOITEC. The sensors are designed and manufactured to operate at 2.45 GHz. The POI wafer is composed of an oriented single crystal sub-micron LiTaO3 film bonded by molecular adhesion onto a (100) Si wafer using a silica layer. The resulting device is ultra compact (useful surface smaller than 1×0.5mm²). Several prototypes have been conditioned in various package (Kyocera SMPs, vacuum-sealed To-5 metallic package) and have been tested in wireless mode. These devices are used for temperature detection and follow-up. The possibility to accurately control the mode TCF and to achieve a differential measurement using a single device is particularly advantageous, yielding a very robust solution for sensor operation in difficult conditions such as closed metallic areas or for long distance interrogation. An read-out distance of 4 meters is demonstrated using directive antennas together with a reader acquired at RSSI-GmbH. A sensitivity better than 0.05°C is shown using the proposed devices with an accuracy of ±1°C on the range -20 to +120°C. the whole 2.45 GHz band can be used with such sensors but also smaller sub-bands, allowing for the operation of several sensors at once. Further work is on-going to validate the actual temperature range (probably much larger than what experienced until now), to extend this operating range to test other type of measurements.



Alexis Bernard, Chief Technology Officer, Knowles



Alexis Bernard is chief technology officer, responsible for Knowles’ technology strategy, roadmap, and partnerships. Alexis’s experience in technology development and corporate strategy will further strengthen Knowles’ global technology vision.Alexis has over 15 years of experience in executive and functional leadership roles with industry-leading technology companies such as Audience, Nokia, and Texas Instruments. Prior to Knowles, he was the chief technology officer at Audience and enlarged its strategic scope beyond audio to include motion processing, multi-sensory intelligence and low-power always-on capabilities. Prior to that role, Alexis was vice president of technology strategy and business development at Nokia. He was responsible, with the CTO, for corporate technology strategy, Nokia’s research portfolio management and operational excellence, technology marketing, open innovation, and mobile ecosystem partnerships. He also spent five years at McKinsey & Company in the firm's telecom, media and technology practice in New York.  He consulted senior management of large companies, government leaders or private equity clients in the telecom and semiconductor sectors on strategy, corporate finance, marketing and operations matters.Alexis began his career as a researcher in speech coding and recognition, including five years in the DSP research and development center of Texas Instruments in Dallas. Alexis is an inventor on multiple patents and author of over 25 publications in the field of digital communications and speech technology. He holds an MSEE from the University of Louvain in Belgium, a PhD electrical engineering from UCLA.

The explosion of voice, audio and sound in a wide range of devices is creating new user experiences in how consumers interact with devices more intuitively from smart speakers, mobile phones, cars to industrial and consumer IoT devices. This is creating a demand for intelligent, always-on, context-aware devices, requiring specialized dedicated microphones, audio processors and advanced features for sound capture.  Processing audio at the edge of devices is becoming more important to deliver always-on capabilities, driving the need for low power consumption and improved privacy without comprising performance. This presentation will discuss multiple factors needed for audio design including more high performance mics, the benefits of edge partitioning for always-on algorithms and inference and learning capacity of edge devices, and other techniques for optimizing sound processing.



Ian Campbell, CEO, OnScale



Ian is a Georgia Tech trained engineer and serial entrepreneur, having founded two Silicon Valley high tech companies. The first, NextInput, broke records in getting a new MEMS technology to market in high volume applications like smartphones and wearables. The second, OnScale, is a Cloud Engineering Simulation platform backed by Intel Capital and Google's Gradient Ventures. OnScale Cloud combines advanced proprietary multiphysics solvers with cloud supercomputers and breaks performance and cost constraints for engineers optimizing Digital Prototypes of devices like next-gen MEMS, 5G RF filters, IoT devices, medical devices, and much more. OnScale massively reduces cost, risk, and time-to-market for R&D firms pushing the boundaries of new technology.

In the legacy desktop simulation era, MEMS engineers were constrained by expensive desktop engineering simulation licenses and limited local compute horsepower. As a result, MEMS engineers relied instead on expensive and time consuming physical prototyping to generate engineering insights about new MEMS designs. Today, in the era of Cloud Simulation, such practices are no longer sustainable and MEMS engineers at leading MEMS companies are more often turning to the power of cloud engineering simulation to analyze true Digital Prototypes - digital representations of MEMS devices that behave identically to physical prototypes but can be produced at a fraction of the cost and time as a physical prototype. Digital Prototypes are built from thousands of complicated multiphysics simulations executed in parallel on Cloud Supercomputers which completely define the behavior of a MEMS device over its intended operating environment. 



Dimitrios Damianos, Technology Market Analyst, Yole Développement

Yole development


Dimitrios Damianos, PhD joined Yole Développement (Yole) as a Technology and Market Analyst and is working within the Photonics, Sensing & Display division. Dimitrios is daily working with his team to deliver valuable technology & market reports regarding the imaging industry including photonics & sensors. After his research on theoretical and experimental quantum optics and laser light generation, Dimitrios pursued a Ph.D. in optical and electrical characterization of dielectric materials on silicon with applications in photovoltaics and image sensors, as well as SOI for microelectronics at Grenoble’s university (France). In addition, Dimitrios holds a MSc degree in Photonics from the University of Patras (Greece). He has also authored and co-authored several scientific papers in international peer-reviewed journals.

Despite a 2018 year when both automotive and consumer markets have stagnated, the MEMS market did not recess compared to 2017. Indeed, many signs show that the MEMS industry is still healthy. The MEMS microphones will grow in 2019/2020 thanks to the smart speaker application. More automotive applications are expected and TPMS is booming the pressure sensors market. After years of decline, the ink jet heads industry is growing again. RF MEMS continue to be driven by next gen networks. Microbolometers have passed the 1 million units. MEMS foundries did good performances thanks to industrial and medical applications, although the industrial landscape is changing with acquisitions. During our talk, we will review 2018 MEMS market dynamics and will give insights to the future trend. Players analysis will be provided as well as new applications coming that could be defined as "consumotive" and "prosumer".



Gaetano D'Aquila, Co-founder & CEO, GiPStech



MSc in in Computer Engineering in 2002. PhD in Science and Engineering of the Environment, Buildings and Energy 2017, University of Calabria, Italy. Worked as research Fellow from 2002 to 2004 at the CNR and as an assistant teacher at the University of Calabria. From 2003 to 2014 worked in the industry first as a security consultant for Telcos and Banking in Value Team S.p.A. and after as Project Manager in Infomobility S.p.A. where he coordinated the R&D and strategic activities in the automotive and car insurance. In 2014 he co-founded GiPStech and is its current CEO. He has published several papers in scientific journals and still continues to cooperate with the University and the CNR. He also filed for seven patents, three of which were already granted in US and Europe.

GiPStech, a spin-off of the Università della Calabria, develops a technology for the localization of users in indoor settings employing a commercial smartphone and/or other commercial/custom “smart” hardware. To achieve effective and precise localization, in the absence of adequate GPS signal, GiPStech combines complementary localization algorithms of inertial dead reckoning, geomagnetic signal fingerprinting and visual odometry. Inertial dead reckoning is performed using the MEMS accelerometer, magnetometer and gyroscope sensors to detect motion and estimate orientation. At the same time, geomagnetic signal is employed to provide an independent position estimate. If any RF signal is present inside the building where the system is employed, especially WIFI or Bluetooth signal, this signal can also be employed by the positioning system to improve its performance in specific conditions. In addition, since the most interesting localization applications target a “standard smartphone” as the device that makes available the localization technology to the final users and since this device is normally equipped not only with a 9 axis MEMS but also with an high-resolution camera, GiPStech extended its sensor fusion localization software platform to integrate even the camera vision and improve the overall position estimation provided by the technology stack. This work shows the results attainable with the GiPStech’s sensor fusion software stack provided in a custom configuration that mainly leverages on the MEMS inertial sensors informations fused with the camera vision in different system setup and applications.



Richard Dixon, Senior Principal Analyst, MEMS & Sensors, IHS Markit



Richard Dixon is Senior Principal Analyst for Sensors at IHS Markit, covering primarily automotive and industrial sectors. He is the author of more than 40 consulting and market research studies and an expert on all aspects of sensors used in vehicle safety, powertrain electrification, and other key applications, in addition to markets for industrial IOT, medical and aerospace sensing. As head of the sensor team, his responsibilities comprise the development of IHS Markit’s sensing coverage across an increasingly wide range of MEMS, magnetic, radar, temperature, inductive, light and other devices. His most recent automotive research includes sensing for electrification, exhaust sensors and sensors for future automated driving.  Condition monitoring and Internet of Things are another major focus for industrial sensing. Prior to IHS Markit, Richard Dixon was senior analyst at iSuppli with responsibility for MEMS and sensors in automotive and industrial sectors. He also worked as a journalist in the semiconductor industry and also has five years of technology transfer experience. Richard graduated from Greenwich University with a degree in materials science and earned a doctorate from Surrey University. 

Sensors are found in a wide range of applications and industry sectors and the market is as a result in good health overall. While consumer sensors are adopted rapidly and wax and wane rather more quickly as markets, new sensing applications quickly emerge to keep MEMS sensor suppliers busy. While smartphones still represent a huge market, commoditization has left it saturated in value terms, but growth has recently moved to other accessories like smart watches or wireless earbuds from leading suppliers like Apple. Such devices are becoming very smart, involving multiple accelerometers and silicon microphones per set, and potential further functionality on the way in the form of heart rate, even oxygen saturation and blood pressure. Talking of pressure, this sensor was recently adopted in e-cigarettes for flow rate monitoring. Other mainstays like automotive and industry on the other hand are subject to longer term trends like electrification and robotization of the car, as well as Industry 4.0, big data and condition monitoring. Meanwhile, autonomous cars or taxis are not the only market to watch: automation of many functions is taking place, e.g. in warehouses and logistics operations, in logistics and package tracking, in drones for surveying and mapping. Agriculture is also benefiting from sensors, drones are used for crop spraying, for example and other sensors are used to monitor other key metrics like acidity, etc. Robotics and automation implies many sensing devices including position, motion and pressure sensors. This presentation looks at the impact of these major market changes on MEMS and other silicon sensors.



Victor Fernandes, European Sales Manager, Marvin Test Solutions

Marvin test


Currently Marvin Test Solutions’ European Sales Manager, Victor Fernandes has over 39 years of experience in the ATE industry.  With an extensive background in Electronic Engineering, Victor has held previous positions in engineering, services/support, sales and management for U.S. and European based companies such as Fluke, GE Kaye, JTAG Technologies and others. In addition to leading the development and implementation of validation products and services in France for pharmaceutical companies, Victor has managed and developed teams, and directed the service of measurement instruments used in a wide range of process industries.  

The adoption of MEMS technology for MOX gas sensors has resulted in greatly reduced manufacturing costs. 
However, each of these sensors must also be tested, which presents a unique set of challenges when compared to the manufacturing and testing of typical semiconductor devices. 
Specifically, test or dwell time can be several tens of minutes due to the need to “soak” the sensor(s) with clean air and the target gas. Using a large, high performance semiconductor tester is not a productive use of that expensive resource.  
The solution requires a low initial capital cost for the test system. A PXI-based test system provided a focused test solution that offered the required accuracy, accommodated very large site counts, and matched the over-all throughput performance of high performance semiconductor test systems at a much lower cost.


Thomas Fries, Founder & CEO, FRT GmbH



Dr. Thomas Fries lives with his family close to Cologne. He is engaged in a variety of activities: as technical advisor to various ministries, supervisory board of PlanOptik AG, board and advisory board of IVAM, board member of COPT.NRW e. V., just to name a few. FRT supports many social projects as well as kindergartens and schools. Motorcycles and cars are still a great passion alongside his family.

In FrontEnd metrology used to be straight forward. A metrology tool was clearly dedicated to a specific task, if possible using one single sensor and keeping things simple. Reliability, repeatability and following the roadmap were the key figures. Nowadays life is much more complex. In Advanced Packaging or MEMS manufacturing most tasks cannot be solved using a single sensor. There is no mainstream technology and also no roadmap yet. Life is changing all the time. Multiple tasks have to be solved, e.g. measurement of photo resist (PR) coatings and structuring, through silicon vias (TSVs) or trenches after etching, μ-bumps and Cu pillars, as well as measurement in thinning, bonding and stacking processes. By using a hybrid metrology concept these new multi-sensor metrology tools enhance the precision of measurements on samples where a single sensor or measuring principle is just not enough. Depending on the task, this may include measurements with different topography and (film) thickness sensors that are fully automated by a single recipe. Driven by a powerful software, it is possible to measure data that previously couldn’t be measured. The configuration of various measurement tasks using different sensors to run consecutively within a measurement sequence is simplified. Add to that, the software provides comprehensive capabilities, from manual measurement on the device to fully automated measurement with one button operation and integration into production control systems, e.g. via a SECS/GEM interface. The described wafer metrology tools allow for fully automated processing of 300 mm FOUPS/FOSBs and 300 mm/200 mm/150 mm open cassettes. The systems are be able to handle SEMI standard wafers, highly warped wafers (e.g. eLWB), bonded wafers, wafers on tape, TAIKO, bare and thinned wafers and even Fan-Out wafers.



Alex Gu, Senior Vice President, Shanghai Industrial uTechnology Research Institute (SITRI)



Dr. Yuandong (Alex) GU is currently a Senior Vice President of the Shanghai Industrial uTechnology Research Institute (SITRI), with overall responsibility for the Institute’s Technology and Products. Before SITRI, Dr. Gu was the Deputy Executive Director of the Institute of Microelectronics (IME), Singapore, overseeing strategic R&D programs including Advanced Optics, Sensor Actuators and Microsystems, and Miniaturized Medical Devices. His work bridges sensor design, micro fabrication, sensor/ASIC integration, and WLP/CSWLP/SIP packaging; notably in piezoelectric AlN acoustic sensors, 4G/5G RF MEMS filter, and monolithic ultrasound sensor/ASIC integration. Dr. Gu was the Project Manager of one of DARPA featured projects in 2013; the recipient of the 2014 Prestigious Engineering Achievement Award by Institution of Engineers Singapore; and the recipient of 2016 TALENT award by A-STAR. Dr. Gu is the author/coauthor of 50 peer reviewed journal papers; 90 top conference proceedings; and 20 granted patents. Dr. Gu received his M.E.E (2001) in Electrical Engineering and PhD in Pharmaceutics (2003), both from the University of Minnesota, Twin Cities. Dr. Gu served as the SEMI–SEA MEMS Session Chair for two consecutive years in 2015 and 2016.

Camera and optical facial recognition modules are two of the largest and fastest growing markets in mobile electronics, while lens assembly represents nearly 2/3 of the COGS of both modules due to the stringent and costly alignment and assembly process.  Metasurface based flat lens is shown to be an ideal alternative when one flat lens has the potential to replace the conventional multi-lens assembly. More recently, nanoimprint metasurface NIR-band DOE has been adopted in biometrics with great commercial successes. Exploration of other applications typically employs EBL, an approach that deemed non-economical for mass production.  In this talk, we show results of large area NIR flat lens fabricated on 12” wafer employing 193nm immersion lithography. Limitations of the litho approach for wide variety of lens applications will be discussed.



Konrad Herre, CEO, sensry GmbH


Konrad Herre is CEO and Co-founder of the Sensry GmbH in Dresden Germany. He studied Physics and hold several positions in research and development and management in the semiconductor industry. Prior to Sensry he was COO of the Plastic Logic group and CEO ZMD AG. He also worked as VP Fiber Optics, Infineon Technologies AG and COO, X-FAB Semiconductor Foundries GmbH.

Building the IoT System of the Future with Sensry Sensry develops a technological platform that allows smaller system vendors to shoulder the growing development and manufacturing efforts for next-generation electronics. As SMEs seek high-performing products tailored to their individual applications and services, their challenge is to create a highly integrated technical solution of limited quantity up to high volumes featuring smart, secure and networked systems. Since technological requirements and development costs are often too high, SMEs have a need for a new “Leading Edge” semiconductor for growing applications such as in IoT. Sensry offers an individual sensor node: An unprecedented, new chip with highly flexible and customizable hardware configurations with Sensors in a SiP (System in a Package) and adaptability to customer requirements. The extreme compact but also modular technology responds to the demand of SMEs. It will enable the use of future system architectures and production methods. As the importance of secure IoT Systems is growing each day, Sensry insures security by design with an integrated hardware crypto unit and a protective working mode. The features of the system lead to a Cyber-Resilient platform according Microsoft CyRepP. Sensry introduces a completely new way of hardware on-the-fly configuration including radio units and RISC-V based configurable core. The products will have key advantages as they will be · Flexibility to add standard available sensors easily to the system · Application core manufactured in the advanced 22nm IoT-enabled technology node leads to low power consumption with high calculation performance · Unique capacity for sensor data fusion and AI on chip due to the cluster architecture · Toolchain, Software SDK and several hardware specific APIs to support development and programming · Affordable technology which can scale for the expected billions of devices in IoT expected over the coming decades · Specifically built towards IoT and data ensuring security by design · Developed by and for the IoT community with both business and tech stakeholders Several technology demonstrators of the modular platform will be shown. 



Fumio Kita, Global Product Manager Core Resists, Merck


Dr. Fumio Kita is Global Portfolio Manager for photoresists and LED related products. He joined Merck through the acquisition of AZ Electronic Materials where he was Global Marketing Director for Lighting, Energy and Barrier products. During his career, he was responsible for New Business Development of optical films, head of Quality Systems of the German entity and in charge of the Active Ingredients business for lithographic products. Dr. Kita received a doctoral degree and a diploma in Organic Chemistry from the University of Wuerzburg and has an EMBA degree from the Kellogg School of Management.

The megatrends of mobile applications and smart cars are enabled by leading manufacturers of devices such as RF components, MEMS, Power ICs  - just to mention a few. Improvements in performance and integration requirements urge advancements in technology, in chip design, and manufacturing processes. Thereby, lithography plays a key role and new, process specific needs emerge that call for new solutions. This talk will provide insights into our recent developments in photoresist which are specifically designed to meet the needs of the More-than-Moore industry.



Juhana Kostamo, Managing Director, Picosun Oy



Mr. Juhana Kostamo is the Managing Director of Picosun Group. Mr. Kostamo has worked at Picosun since 2005, first as the COO, and as the Managing Director since 2006. He is a member of the Executive Team of the company. Mr. Kostamo’s ALD-related innovations at Picosun have led to 23 patents this far. Mr. Kostamo has M. Sc. Tech. degree from Helsinki University of Technology, Laboratory of Inorganic and Analytical Chemistry.

Atomic layer deposition is increasing its importance in MEMS manufacturing. Uniform and conformal coatings, moderate deposition temperatures and possibilities to reach challenging surface location e.g. in microchannels makes ALD an attractive choice for MEMS processing. However, as the technology is not as well known as “conventional” deposition technologies (e.g. PVD, CVD), the possibilities of ALD are often neglected by engineers when designing a MEMS device or a process flow. In our presentation we will show several possibilities how the ALD thin films can be used in MEMS manufacturing. The ALD films are used in MEMS devices for electrical insulators or conductors, for mechanical stress tuning, for chemical barriers, etching mask, optical coatings, humidity barriers, seed layers, diffusion barriers or adhesion promoters. The typical ALD films are metal oxides, metal nitrides or pure metals. Film properties can also be adjusted by doping or laminating different materials in a stack. The deposition temperatures vary from room temperature to ~500°C. We will also present how ALD can bring more freedom to MEMS designing by showing examples of coating of challenging structures, such as high aspect ratio trenches and insides of cavities or channels. Our presentation also includes results from a new ALD tool generation dedicated to MEMS volume production. The new tool is capable to deposit conformal thin films of metals, metal oxides or metal nitrides to very challenging structures in a batch. We hope that after the presentation the audience is convinced to consider ALD to be a part of their manufacturing flows.



Tomomi Kurita, USHO INC. 



She joined USHIO INC. in 2013 and started her career. She was in charge of the sales for UV curing systems and Excimer units until 2017. During that time, she was begging to relate to the business in Europe. Since 2017, she has joined the sales team for the photolithography tools (mainly aligner, UX-4). Currently, she is in charge of the customers in Europe and western side of Japan for the aligner.

USHIO provides various lighting solutions for customers. We don’t provide just only light source, but also industrial equipment. UX-4 is one of such machines which USHIO provide and we focus on this product for this session. UX-4 is USHIO’s full field projection aligner for photolithography. As it is equipped with a precise lens inside of the tool, it has various advantages such as high productivity and large depth of focus etc.



Gunar Lorenz, Head of Technical Marketing and Application Engineering Group for Consumer Sensors, Infineon Technologies



Dr. Gunar Lorenz is heading the Technical Marketing and Application Engineering Group for Consumer Sensors at Infineon Technologies. Gunar joined Infineon in 2016 to successfully coordinate and lead the launch of the first packaged Infineon MEMS Microphone for the open market. Before joining Infineon, he held an Engineering Director position at Coventor, where together with his group they invented and developed the MEMS/IC co-simulation design environment, MEMS+. Before this, Gunar also worked at Robert Bosch R&D Center, and obtained a PhD from the T.U. Bremen that would set the basis for MEMS+. He also graduated as a Mechanical Engineer from the T.U. Braunschweig.

Speech has been used as main method of communication between humans for millennia, and since the launch of the telephone and voice assistants, speech is largely used to communicate with machines, and is now seeing exponential growth in its adoption. Almost every device has now one or several microphones built in for active and passive audio pick-up. New use-cases are appearing and demanding continuous improvements in microphone performance, which existing technologies might not be able to reach. So what will the next generation of microphones need to deliver? What are the limitations of existing technologies, and what improvements are required to overcome them? In this session we discuss some high performance audio applications, and why better microphones are demanded to effectively fill the gap towards the next revolution in audio pick-up.


Becky Oh, President & CEO, PNI Sensor

PNI Sensor


Becky Oh is the President and CEO of PNI Sensor. Throughout her 17 years with the company, Ms. Oh has held a range of senior-level positions, from operations to technical business development. She received an M.S. degree in Electrical Engineering from Cornell University and a B.S. in Electrical Engineering and Computer Science from MIT. Her keen direction and technical knowledge have guided PNI Sensor’s successful integration of its magneto-inductive sensor and sensor fusion technologies into IoT, consumer, industrial, scientific, robotics, and military applications. These products range from IoT-enabled vehicle detection sensors, position sensors for TALON tactical robots, attitude heading reference systems for NOAA’s deep-water buoys, sensor fusion algorithms in mobile platforms, motion tracking in the WiiU Gamepad, and digital compasses found in Ford, GM and Chrysler automobiles. Ms. Oh holds multiple patents in the area of devices with multi-sensing and reporting capabilities.

IoT will allow for optimized efficiencies and provide opportunity for big growth, but it is still early.  As the IoT landscape continues to change and mature, how do you stay relevant?  The talk will discuss lessons learned deploying smart parking sensors and how we, as a sensor company, had to continue to evolve to take advantage of IoT’s potential revenue opportunity.



Andrea Onetti, AMS Group Vice President – MEMS Sensor Division General Manager, STMicroelectronics



Andrea Onetti joined STMicroelectronics as an IC designer in 1990. He later moved to Product Management and became a Division Manager responsible for the Company’s Audio products. Onetti‘s mandate was subsequently expanded to include Low-Power Analog and RF devices, and in 2016 he was appointed General Manager of ST’s MEMS Sensors Division, covering the broad portfolio of accelerometers, gyroscopes, digital compasses, inertial modules, pressure, humidity, and temperature sensors, and microphones. Andrea Onetti was born in Pavia, Italy, in 1965, and graduated with a Degree in Microelectronics from University of Pavia. He filed several patents for analog circuit implementations in the Audio domain.

If “data is the new oil” then sensors are the oil rigs, boring equipment and pumps that get that oil out of the ground. Sensors, through the data they provide, play a fundamental role in the evolution of applications and services today. Sensors bridge the analog and digital world and their deployment on a broad basis is enabling smarter homes, cities, factories and workplaces as well as smarter cars and personal devices. Sensor data can be used for immediate local interpretation and action, or can contribute to a more global service offering. This presentation looks at the latest evolution in MEMS sensors and explores how access to accurate, time-relevant, pre-processed data from such sensors can enable new business models for hardware makers and service providers.  It discusses some examples of  how companies can use the capabilities of sensors to provide services and solutions to enhance their traditional product offer and move up the value chain.



Amir Panush, Deputy General Manager & Chief Operations Officer, TDK InvenSense



Amir Panush joined InvenSense in April 2015 to head the company’s Strategy & Corporate Development where he drove strategic expansion and diversification,  ultimately leading to successful acquisition by TDK. Since the merger completion in 2017 and until 2019 he served as our VP & General Manager of the Motion and Pressure Business Unit, and now serves as Deputy GM & Chief Operations Officer (COO) of the MEMS Business Group. Prior to joining InvenSense, Amir served as Senior Director Product Management and Business development of IoE/IoT Client business at Qualcomm Inc. (NASDAQ: QCOM). Prior to that, he was Director of Automotive Product Management of Qualcomm Atheros division where he grew the business from inception to widespread adoption by tier 1 automotive customers. Prior to Qualcomm, Amir led strategic marketing and partnerships at Atheros Communications (acquired by Qualcomm). His earlier industry roles spanned software engineering and project management leadership at Texas Instruments and Comsys Mobile (acquired by Intel).

Car ownership patterns are transforming. The number of miles traveled, and the number of hours spent in a car are steadily increasing. At the same time, car design is changing at an increasingly profound pace. To thrive in this brave new world, autonomous vehicles are now interacting and communicating with humans and the world around them, driving with reduced or no human influence. To do so MEMS sensors replace and augment the five basic human senses: sight, hearing, smell, taste and touch. And similar to the sensing organs associated with each sense sending information to a humans brain helping us understand and perceive the world around us; MEMS sensors are enabling vehicles to interpret and mimic these same human senses, essentially sending sensory information about their surroundings, their navigation, and even their interactions to not just other vehicles but to other humans so as to react in a safe and effective manner. In this talk we will review how car design and car makers are changing, the trends that are fueling the change, and the MEMS sensors that enable this revolution.



Farzad Parsaie, CEO, SAND Microsystems GmbH

Sand Microsystems

Farzad Parsaie is an experienced engineer and entrepreneur working for more than 25 years in the area of Semiconductors and Sensor research and developmentIn his work he focuses on New Sensor Products (like MEMS, LiDAR). Farzad previously worked at the Institute of Microelectronics of the Technical University of Berlin, Philips Semiconductors, NXP Semiconductors, ams AG (austriamicrosystems AG) and Elesta GmbH. He has been in charge of CMOS Analog/Mixed-Signal and RF Design, Optoelectronics and Photonics, MEMS interfacing and industrial sensor from feasibility study and development to industrialization. As an expert in different areas he has worked with several leading semiconductor and product companies as customer developing novel MEMS and LiDAR products. 



Päivi Sievilä, Customer Support Engineer, Okmetic Oy



Dr. Päivi Sievilä is a professional in the field of silicon and SOI wafers with extensive experience in research, industrial process engineering and development. Currently she works as Customer Support Engineer in Okmetic’s global technical customer support. Her field of responsibility covers collaboration with European customers. She received her PhD from the Department of Micro- and Nanosciences, Aalto University in 2013. Her thesis focused on microfabrication technologies for silicon-based sensors.

There is a constant drive towards increased reliability, quality, and performance of silicon-based devices. As a response to this demand, we demonstrate an industrial patterning platform for value-added Si substrate manufacturing. Our solution enables fully customizable wafer design and material properties, combining embedded patterns and TSV structures with SOI layers of high thickness precision. These substrates, acting as a partially built component, not only enhance the profitability of user’s further processing but also improve the long-term reliability due to the state-of-the art fusion bonding quality. We present the process capability and quality results achieved with the recently started manufacturing line. The fully in-house patterning platform, designed to fit for volume production, combines bonded-SOI processing expertise with patterning and DRIE etching technologies. Thanks to our own crystal growth capability, the starting silicon properties such as orientation, resistivity and dopants can be freely adjusted. As a further advantage, integrated process scheduling enables reasonable cycle times as the approach decreases handling and transportations between foundries and critical process steps. In platform development, special attention has been paid to end users’ quality requirements in tool and process selection, as well as in associated measurements, inspections and control. We present examples of process lead times optimization, as well as a quality comparison between substrates processed with in-house patterning platform and by service contractor manufacturer.The patterning platform is advantageous for various MEMS, sensor and photonics applications requiring buried cavities, poly-Si filled TSV connections, or patterned multi-layer SOI design.



Markus Sonnemann, Vice President Engineering Sensors, Automotive Electronics, Robert Bosch GmbH



Markus is responsible for Innovation and New Business in MEMS at Bosch Automotive Electronics providing business ideas as well as advanced sensor concepts for automotive, consumer and multi-market applications. Markus studied physics at the University of Würzburg and at Northeastern University in Boston (USA) focusing on semiconductor technologies and quantum electronics. He started his professional career at Bosch in the MEMS development focusing on inertial sensors and held various management positions in Bosch electronics R&D as well as in business strategy. Today he is focusing on break-through innovation and the successful transfer of new technologies from research to volume production.

Automation – Electrification – Connectivity. These three trends are describing the fundamental changes that the automotive industry is facing in the next decade. Semiconductors are the pacemaker in this radical change and sensors are the key enabling technology behind the scenes. Innovative use-cases in Automotive push the performance of MEMS creating enormous challenges for design, technology and production of the components. At the same time, Consumer Electronics path the way towards efficient engineering, high-volume production and short Time-To-Market. Modern MEMS need to serve high-performance applications and they have to become even smaller with lowest power consumption. The continuing rise of complexity leads to an even stronger need for “first time right” design methodologies in general and more powerful and effective verification methods in particular. Pushing the limits of MEMS involves considering all relevant domains from the sensing element to ASIC and package in a system model on a suitable abstraction level. In his presentation, Dr. Markus Sonnemann, Vice President Engineering MEMS at Bosch Automotive Electronics, will explore the requirements from new MEMS use-cases, shed some light on the methods to deal with the increasing complexity and provide examples for a successful implementation of MEMS solutions in new applications.



Markus Ulm, CTO, Bosch Sensortec



Markus Ulm is Chief Technical Officer of Bosch Sensortec. He is responsible for research and development of sensors based on microelectromechanical systems (MEMS) for consumer electronics and related industries. Markus has a Master degree in Physics from the University of Oregon and a Diploma Degree in Physics from the Karlsruhe Institute of Technology. He continued his studies in the field of MEMS and graduated from the University of Stuttgart with a Dr. Ing. degree in Semiconductor Technology in 2003. During his career he held various positions in the field of MEMS, semiconductors and sensor research and development in the Bosch Group, such as Section Manager in the Bosch Research and Technology Center North America, Section Manager for Automotive Gyroscopes and IMUs, Director of Sensor Predevelopment as well as VP for Consumer Sensor Product Development.

MEMS sensors have become the heart of many consumer electronic devices like smartphones and wearables. Innovative sensing solutions create new applications and use cases ranging from hearables and smart clothes to robotic vacuum cleaners. However, each application has different requirements in terms of accuracy, power consumption, stability, memory and latency, resulting in varying needs for fused sensor data: while virtual reality headsets require lowest latency, robotic vacuum cleaners need high stability at varying temperatures. Applications like wearables require self-learning and orientation tracking at ultra-low power. Such adaptation of MEMS sensors is possible through a thorough analysis of use cases and the magic of software algorithms created with fusion among multiple MEMS sensors, and with peripheral units, such as GPS. In his talk, Markus Ulm, CTO of Bosch Sensortec, will introduce solutions at different complexity levels of sensor related software such as fusion, user features and deployment of modern self-learning AI techniques, and, most importantly, in conjunction with the respective enabling infrastructure.


Fabio Wörndl, Global Director Sales & Marketing, Siconnex customized solutions GmbH



Fabio Wörndl started at Siconnex in 2011 as Service Engineer. After a technical sales support role for the US market, he became Account Manager in 2016. Since July 2017, Fabio is Global Director of Sales & Marketing at Siconnex and manages the sales structure around the globe. Fabio has a degree in electronics and a diploma in industrial engineering and economics.

Siconnex offers a wide spectrum of wet process solutions for etching, stripping and cleaning applications helping device makers to save fab cost. With the developed SicOzoneTM technology, Siconnex helps to replace and save chemistries for cleaning and stripping tasks. Presented by Fabio Wörndl, Global Director Sales & Marketing.







Thalis Anaxagoras, Founder, ISDI



Dr Thalis Anaxagoras graduated in 2003 from Manchester University in Computing and Communication System Engineering. In 2003 he received a Queen’s Overseas Research Scholarship to continue his studies with a PhD in CMOS high dynamic range image sensors at Sheffield University, graduating in 2007. He continued working for Sheffield University as a research associate developing low noise pixels and imaging systems for scientific applications. In 2008 –2009 he worked at Sharp Laboratories in Europe developing displays for mobile phones. ISDI was formed in 2009 by a team of experienced semiconductor image sensor designers. For the last 10 years, ISDI has grown organically into a major player in the supply of x-ray image sensors. In parallel, ISDI has provided custom designs and products in various scientific, industrial and medical deployments. These include CMOS image sensors for UV, visible and NIR for niche applications such as spectrometers, proton therapy and electron detection.  Dr Anaxagoras is author or co-author of more than 100 scientific papers and holds multiple patents in CMOS imaging technology areas.

Designing a wafer scale imager for x-ray applications presents many challenges, coming from the technical difficulties of using large die sizes and the need for cost optimization to allow economic use of CMOS in the medical x-ray market.  Over the last 10 years, wafer scale image technology has progressed from analogue output sensors, through on-chip 14bit ADCs, to the latest wafer-scale CMOS sensors used in real time imaging for surgery which typically having a pixel pitch of 100 µm and incorporate on-chip 16-bit column parallel ADCs.  These sensors provide multiple pixel full wells (gains) to support various X-ray operating modes and have a frame time of 10 ms or below. Although the fibre optic plate and scintillator block most of the X-rays, the image sensor itself should be tolerant of X-ray irradiation. Adding complexity in the pixel has an impact on radiation tolerance, but pixel design has evolved to combine radiation hardness with a low transistor count which avoids yield penalties. A unique two-gain pixel architecture offers both these properties, incorporating radiation-hard transistor geometry with novel circuit topology. This provides improved radiation tolerance in comparison to conventional two- or three-gain pixel designs. Further techniques are used to reduce pixel variability on large dice, to reduce the cost of the wafer by layer reduction and manufacturing yield improvement, and to operate with a demanding power budget.



Raphael Berner, Head of chip design, Insightness AG



Raphael Berner received his Master's degree in Electrical Engineering from ETH Zurich in 2006. Afterwards he was a PhD and postdoc at the Institute of Neuroinformatics at ETH Zurich and University of Zurich, where he was working on event-based vision sensors. During that time, he invented the DAVIS circuit (Dynamic and Active VIsion Sensor). In 2013, he joined ALi Technologies as an analog design engineer working on RF and base-band communication circuits. Since 2016 he is with Insightness, where he leads the chip design team, working on improved event-based vision sensors.

Event-based vision sensors have gained a lot of attention in recent years due to their promise of more efficient *computer* vision systems. Insightness presents SEES2, its latest vision sensor built in stacked technology. SEES2 outputs change events at a time resolution of up to 10kHz, and 10-bit gray scale frames at 30 FPS. The sensor has a resolution of 1024x768 in an optical format of 1/1.7", which allows *for the integration into* compact camera modules.



David Billon-Lanfrey, Chief Strategy Officer, Lynred


Mr. David Billon-Lanfrey has been appointed Chief Strategy Officer of LYNRED in 2018. He was previously the Chief Technology Officer of Sofradir since 2011. He formerly headed the R&D optronics characterization team at the company for five years. Before that, he served for 12 years as project manager for R&D and product development. Mr. David Billon-Lanfrey is a graduate of optronics at Joseph Fourier University in Grenoble.

Sofradir and its subsidiary ULIS have merged with Lynred as the new company name. Lynred was created to respond to a need for an all-inclusive infrared (IR) product offering to the global aerospace, defense, industrial and consumer markets. In response to increasing market requirements and competition, the company has attained a critical mass geared to shortening the time-to-market process of new products. Lynred will advance developments of next generation IR detectors with the 150M€ financial investment it is making in the Nano2022 project over the next five years. These IR devices will be designed to address trends in autonomous systems for smart buildings (workspace management, energy savings), road safety and in-cabin comfort of vehicles.  Developments also include the very large dimension IR detectors needed for space and astronomy observations as well as compact and light IR detectors that can be used in portable devices and on drones.



Antoine Bourely, Chief Technology Officer, PELLENC Selective Technologies S.A.S.



Antoine BOURELY was born In France in 1960. He studied Engineering Science at Ecole Polytechnique, Paris. He holds a Master’s Degree from the University of California, Davis, in Electrical and Computer Engineering, and a PhD in Automation from Montpellier University, France. From 1986 to 1991, he worked at CEMAGREF on several agricultural robot prototypes, as well as machine vision and spectroscopy. He headed the PELLENC S.A. Robotic Department from 1991 to 2001. He applied many of the high technology concepts to viticulture equipment, and also investigated new application markets, like sortation for recycling. He was one of the founders of the company “PELLENC SELECTIVE TECHNOLOGIES” created in April, 2001. The company offers a wide range of intelligent sorting equipment for recyclables: NIR and Visible spectrometry, induction sorting, a MIR thermal imaging for papers, MIR spectrometry for technical plastics, an X-Ray machine for technical plastics and metals, and a new software architecture to operate all these sensors jointly. Recent developments and future perspectives will be detailed in the presentation.

Pellenc ST is one of the leading manufacturers of optical sorting machines for the recycling industry. The most used technology is NIR spectrometry to recognize materials (plastics and cellulosic materials), followed by visible spectrometry for a fine color analysis, and more recently by MIR spectroscopy to recognize black objects, like technical plastics. Aside spectrometry, we also use dual energy X-Ray transmission and induction detection technologies to analyze metal objects. A typical machine works on a 2.8 m wide belt running at 3 m/s, and 100 % of that area must be scanned in real time. This translates into 100.000 spectra/sec, or more, for resolutions of 1 cm². We have traditionally designed our own spectrometers, together with the associated scanning systems, for a tailored performance at optimal cost. We will compare this approach with the current trend to use hyperspectral cameras with no moving parts. In practical implementations, the typical pixel size becomes 4 x 4 mm². Trade-offs will be discussed: decreasing pixel size in spectral analysis can cause a critical loss of signal quality, for instance on transparent objects. Recently, high resolution vision cameras have become fast enough and cost effective in our domain. They enable 1 mm² or 0.1 mm² pixel sizes on the belt. This high spatial resolution compensates for a comparatively poor chemical or color information. Especially, vision cameras fitted with AI can achieve impressive recognition of whole objects. We are developing and integrating these solutions as complements to the chemical information provided by our spectrometers.  Machine vision is also present in other applications with high traction: height detection (stereovision) and the detection of invisible markers (watermarks). We will present our multi-sensor approach, and discuss how it can provide the basis of the next sorting technologies.



Benjamin Bouthinon, Optics Manager, ISORG



Benjamin Bouthinon holds an engineering degree from Grenoble INP in micro-electronics and received his PhD degree in 2014. He has 8 years of experience in R&D and industrialisation of organic image sensor. He joined ISORG 5 years ago as process engineer where he was in charge of Near Infrared organic photodiode and material developments for large area image sensor. He is now actively involved in the development of fingerprint module for smartphone market and hybrid CMOS imager as Project Manager.

In the area of imaging devices, traditional amorphous silicon imagers and CMOS silicon devices are fully established due to their good efficiency and the mature technology. In this context, the introduction of imagers based on solution processed organic technology is not obvious. However, coating-based photodiodes have demonstrated cost effective process and compatibility with Flat Panel industry equipment or CMOS foundry making this solution viable for volume production. In addition, remarkable device performances have been obtained thanks to easily adjustable optoelectronic properties of the synthetized organic semiconductor. Recent development of low bandgap polymers gave the ability to address near-infrared application for CMOS imager. One of the key achievements of the technology was the QE reaching 60% at 940nm. Significant progress has been made on the fingerprint module especially with plastic based substrate enabling slim module design for smartphone display, overcoming CMOS silicon devices limitations in thickness and cost for large area. ISORG activities will be presented with the manufacturing ramp-up and the latest development of organic image sensors.



Martin Deterre, Engineering Manager, Pixium Vision

Pixium vision

Martin Deterre is Engineering Manager at Pixium Vision, France, a start-up specializing in the development of vision restoration systems. He is leading the development and production of the Prima Bionic Vision System, intended to treat blindness resulting from the degeneration of retinal photoreceptor cells, such as in AMD patients. Prima comprises a miniaturized wireless sub-retinal implant made by micro/nanotechnologies and electrically stimulating the nerve cells of the inner retina with hundreds of electrodes, and a wearable Visual Processor, implementing glasses with a camera, signal processing electronics and an IR projection system similar to AR devices. Martin Deterre was previously an Advanced Research scientific engineer at Sorin CRM, now Microport, for whom he developed microsystems that convert the mechanical energy of the heart into electricity to power leadless pacemakers without the need of a battery. Martin Deterre graduated with a Ph.D. in physics from Paris-Sud University, Orsay, for which he received the Chancellery of the Universities of Paris award, a Master of Science in Mechanical Engineering from the Massachusetts Institute of Technology (MIT), Cambridge, USA, as well as an engineering degree from the Ecole Polytechnique, Palaiseau. During his studies, he specialized in the development of micro and nano-systems for innovative implantable active medical devices. He has participated in several European projects, is inventor of more of a dozen patents, and is the author of several publications.

We present a new Bionic Vision System, PRIMA, including a photovoltaic implant part placed below the retina and an augmented reality system allowing to project patterns into the eye for its activation. The external part of the system uses a camera to capture the scene in front of the patient. The acquired images are processed by a pocket computer in order to extract useful information from the visual scene. The processed images are then sent back to the glasses where a miniaturized projector then projects the processed images using near infrared light on the Prima implant at the back of the eye under the retina. The photovoltaic cells on the implant convert the optical information into electrical stimulation to excite the nerve cells of the retina and induce visual perception. The system has been provided to 5 patients suffering from Age-related Macular Degeneration, with excellent results so far.



Morin Dehan, Technology Expert, Sony Depthsensing Solutions



Dr. Morin Dehan received his PhD. degree from Universite catholique de Louvain (UCLouvain), Louvain-la-Neuve, Belgium, in 2003. After one year as invited researcher in the IEMN institute in France, he joined IMEC, Belgium, in 2004, as RF Device Engineer working on the characterization and modelling of passive components in advanced CMOS technologies for analog and RF applications. Between 2009 and 2017, he was successively leading device modeling activities for technology exploration, PDK development and testchip design to support technology development in  IMEC, like CMOS FEOL (down to 5nm), BEOL (Down to 3nm), memory, 3DIC, lithography (Including EUV), silicon photonics, etc. In 2017, he joined SONY DEPTHSENSING SOLUTIONS, Belgium, as technology engineer, leading research activities in the field of range imaging. 

Solid state 3D Time-of-Flight technology made its research entrance in the 90’s and is now slowly starting to be adopted in a number of applications. Mobile platforms or VR/AR headset are today equipped with ToF technology for 3D sensing. In the industrial world, ToF technology is today mainly linked with robotics and safety/security vision systems, competing with established distance sensor solution based on structured light and stereo-vision. This talk aims to give an overview on 3d sensing technologies, and on what it takes to develop a ToF system, from designing the imager to developing the sensing solution highlighting challenges and opportunities.




Marek Grzelak, Senior Vision Engineer at Emsys / VisionGeek     


Marek Grzelak is Machine Vision Research and Development Engineer at Emsys – Visiongeek, specialized in custom made machine vision solutions. Studies of Automation and Robotics, at AGH University of Science and Technology in Cracow gave him strong fundamental and more sophisticated knowledge, such as thermography based non-destructive testing and image processing. Wide range of automation duties in his previous engineering jobs, including programming PLC’s and designing electrical and automation projects for large sorting lines, allowed him to gain lots of experience. Since a very beginning, Marek got specialized in machine vision technologies, including the creation of state-of-art computer vision algorithms for industrial inspection machines together with individual vision hardware setup solutions. He also had the opportunity to take part in European Union technology innovation projects. Marek moved to Belgium where he took up a challenge of working for Emsys Visiongeek, located in Antwerp. In his free time, he loves sightseeing.

Line scan camera technology can be a powerful tool in machine vision solutions but can also become a nightmare. What are the benefits of line scan, that leads us to take the risk? Based on our experience with a wide range of line scan applications, we are going to find out what are the necessary premises, to make the journey with line scan projects a fairytale instead of unexpected horror.



Steven Groothuis, CTO, Samtec Microelectronics

samtec micro


Mr. Steven Groothuis is the Chief Technology Officer at Samtec Microelectronics and maintains the package technology roadmaps for Samtec’s microelectronic packaging products. He is involved in leading edge IC, MEMS, sensor, and optical/photonics package technology.  He is a market strategist and technology advisor.  He is involved in autonomous vehicles, biomedical, optical/photonics, and microelectronics sectors. Prior Samtec, he was a DMTS at Micron Technology providing advancements on the advanced Hybrid Memory Cube package technology development and path finding, and multiphysics simulations. Mr. Groothuis worked at ANSYS as a Multiphysics Industry Specialist on MEMS simulation initiatives. He started his career as a package technologist at Texas Instruments and later the Advanced Semiconductor Packaging Lab Manager. Mr. Groothuis received his BS Physics from Michigan State University and MS Physics from University of Texas at Dallas. He has coauthored over 50 technical papers, holds over 17 US patents, and is a Senior Member, IEEE.

The advent of glass interposers and glass-based Integrated Passive Devices (IPDs) has continued to aid in the miniaturization of semiconductor, MEMS, sensors, and biomedical packaging and products. To create disruptive technologies and products, companies must investigate new materials, processes, and equipment sets. Samtec is developing a new technology called Glass Core Technology (GCT), which provides avenues for new electrical, electro-optical, imaging, sensors, microfluidic, and biomedical applications. We will explore several of these applications and why they are so game changing for future device and package technologies. Samtec’s Glass Core Technology process leverages the performance benefits of glass to enable performance optimized, ultra-miniaturized substrates for next generation designs. Next generation microelectronics and sensors require increased performance and integration, advanced chip technology and miniaturization. Samtec’s extensive microelectronics and high-speed interconnect expertise, along with our proven methods for package integration, product miniaturization, wafer level processing, and signal integrity optimization, enable us to provide a unique level of support for advanced microelectronics applications. There is an increased requirement for advanced packaging technologies. Development programs are focused on using glass wafers as a material for wafer level packaging of devices and to keep the thermal budget during the assembly and packaging process as low as possible. In addition to discussing these wafer level packaging (WLP) processes, several examples will be given to demonstrate applicability and pros/cons of the selected Glass Core Technology concepts will be discussed.  In summary, Glass Core Technology provides innovative solutions for interconnecting chips, packages, modules, and systems throughout the electronics industry. In order to address such a large range of applications, GCT is proof that “Integration leads to Innovation.”



David Henry, Head of Packaging and Assembly Laboratory, Optics and Photonics Division,CEA-Leti

CEA Leti


David Henry is currently head of the packaging and assembly laboratory in Optics and Photonics division. In this lab, they are developing  wafer level packaging, assembly technologies for ultra-fine pitches applications and optical packaging, including curvature technologies for optical components (Pixcurve technology). Those technologies are developed for optics and photonics applications, including IR sensors, LED, micro-displays, visible imagers and photonics on silicon. They also develop skills on thermo-mechanical & thermal simulations and reliability.  He obtained in 2004 his Master’s degree in the field of materials science from the National Polytechnic Institute of Grenoble. He joined the Packaging & components integration laboratory in 2004 to manage projects around TSV developments for CMOS Image sensors and 3D Integration. Between 2005 and 2008, he managed an industrial project with ST Microelectronics that led to the first integration of an image sensors with TSV into a mobile and finished the project by a complete industrial transfer to the partner. In 2009, he started to manage the 3D integration activities in the packaging team. In April 2011 he launched the Open 3D™ initiative, an opening platform for 3D technologies service towards academics & industrial customers. He is the author or co-author of around 50 papers about Through Silicon Vias (TSV), 3D integration and packaging technologies for optics and photonics applications. He is also the author or co-author of 15 patents.

Over the recent years, a huge interest has grown for curved electronics, particularly for opto-electronics systems. Indeed, an imaging system always has some aberrations, specifically for off-axis rays with Petzval Field curvature and astigmatism aberrations, which bend the image focal plane. With a conventional flat sensor, the aberrations are usually corrected with a set of dedicated lenses for obtaining the whole scene in focus. The corrections are carried out at the expense of the resolution and make very challenging the miniaturization of the final systems. In contrast, a curved sensor allows a system miniaturization with no compromise on resolution. The benefits of a curved sensor fell into two categories, first related to the optical system design, second linked to the image quality:

Optical system:

  • Miniaturization of optical devices (volume, weight).
  • Simplification of the lenses alignment process (due to reduced number of lenses).
  • Suppression of expensive aspheric lenses.
  • Reduction of fabrication costs and therefore of the total cost.
  • Field of view enhancement.

Image quality:   

  • More homogeneous image quality (reduced noise).
  • Similar or improved resolution and higher sensitivity.
  • Corrected distortion occurring along the image edges.

In this presentation, we will introduce an innovative way for the manufacturing of curved components.  PIXCURVE technology developed at the CEA-Leti represents a global approach, including simulation, curvature technology, packaging, optical system manufacturing, and characterization. In this presentation, we will focus on a compact optical design based on a 1/1.8’ optical format CMOS sensor. PIXCURVE allows one to reach high performance with a very compact system (-50% compared to a standard system), with no degradation on dark current and photo-response. The Modulation Transfer Function (MTF) characteristics for conventional and curved sensors have been also compared and analyzed.The latest developments on a new collective curvature technology based on wafer scale approach will be showed and detailed. For applications point of view, the preliminary results obtained on curved micro-displays, targeting AR & VR applications, will also be introduced. Finally, the potential markets and applications for curved components will be presented and discussed.


John Hubert, VP of Engineering of Alertgy



John Hubert, VP Engineering of Alertgy has designed over 200 Monolithic Microwave Integrated Circuits helping to provide a paradigm shift that significantly reduced the size of military and commercial products. Lockheed Martin awarded him the coveted “APEX” award after his team successfully developed a MMIC based High-Power Quasi-Optic Microwave Amplifier for DARPA. John also participated in spinning out a startup commercial company from Lockheed Martin, producing MMIC based transceivers and radiometers. Throughout his career, he has co-authored several papers, patents as well as a textbook. John earned an accelerated MS degree in Electrical and Computer Engineering from UMass through an industry sponsored program.

Just like a MRI uses a strong magnetic field to look into the body and produce images of the body, Alertgy uses a very weak electromagnetic field generated by its wrist band sensor to look into the body to produce a real time image that provides an accurate measurement of the amount of blood sugar present in the wrist area of the body. The core sensing technology used by Alertgy, dielectric / impedance spectroscopy, has been clearly demonstrated and documented in numerous academic publications to be capable of measuring blood glucose, continuously, non-invasively, in a laboratory environment. Alertgy has transitioned that technology into a practical application, successfully demonstrating the excellent performance of its wearable Clinical NICGM product in several clinical trials. The Alertgy system uses proprietary dielectric materials and signal processing / extraction to significantly enhance performance in both selectivity and sensitivity for the blood glucose measurement and that enabled  the reduction in  size  of both the sensor and spectrometer necessary to allow for integration into existing smart watch  platforms.



Jochem Herrmann, President, EMVA



Jochem Herrmann is co-founder and Chief Scientist of the Dutch camera manufacturer Adimec. Within Adimec his prime responsibilities are in the field of the core technologies of Adimec with a horizon of 2-7 years ahead, collaborative development projects and partnerships. Because of his involvement in worldwide standards of EMVA, AIA (USA) and JIIA (Japan), he has been asked in 2012 to join the EMVA Executive Committee with standardization as primary focus area. Since June 2015 Jochem Herrmann has been serving as President of the EMVA.

Vision is playing an increasingly important role in our lives. This is not only true for consumer markets, but also for industrial and professional markets were Machine Vision is in the heart of e.g. many state-of-the-art production processes. EMVA supports the development of standards for vision and imaging technologies. These standards are considered to be essential to the productivity of the vision industry, promoting technological innovation and interoperability within the industry and creating a level playing field for all competitors. Future systems using Machine Vision will not only need higher performance, but must at the same time be much smaller, more cost effective, easier to install and train and be able to communicate to other systems on the factory floor. This presentation will give you an overview of the most important Machine Vision standards today and will then focus on several new standards initiatives that will help to meet the challenges of vision applications in the next decade.



Christian Herzum, Senior Director 3D-Sensing & Discretes, Infineon Technologies



Christian Herzum is heading a product line at Infineon Technologies and is responsible for 3D-sensing products for consumer applications in both radar and time-of-flight technology. Christian has more than 20 years of experience in the semiconductor industry and held various positions at Infineon and Siemens. He has a degree in physics from the T.U. München.

3D-Imaging has become a differentiating feature in smartphones, but is also finding its way into further consumer and automotive applications. This presentation will show actual and upcoming use-cases and will explain why Time-of-Flight has emerged as the most suitable technology. To achieve the desired user experience an optimized wafer process and specialized pixel technology is needed, which results in requirements that are largely different to conventional RGB or standard IR-pixel. A cost efficient wafer technology comprising elements from RF- and power semiconductors will address current challenges of 3D-Imaging and will enable an even wider proliferation of Time-of-Flight in various market segments.



Frederic Laune, Corning



Frederic Laune received a masters’s degree in physics and optics from University Pierre and Marie Curie (Paris) in 1995. After graduation, he spent the first eight years of this career developing novel active components for the optical telecom industry, until he joined Varioptic as an R&D engineer in 2003. At the time, Varioptic was a newly created start-up aiming to develop liquid lens technology for industrial applications. After designing the first two Varioptic commercial products, the Arctic 320 and Artic 416, Frederic stepped up as head of Varioptic’s R&D department to focus on product and performance improvements. In 2010, he was appointed sales and marketing lead for the company. Varioptic was acquired by Corning Incorporated in early 2017, and today, Frederic is the business manager, leading the Corning® Varioptic® Lenses business.

For more than a decade liquid lens technology has transformed the imaging and sensor industry; creating new improvements in manufacturing, warehouse operations, and industry 4.0 technologies. As a market leader, Corning® Varioptic® Lenses has been a pioneer, applying Varioptic’s long history of industry success to build fast, reliable, and long-lasting products for today’s demanding industrial applications. This talk will focus purely on electrowetting enabled liquid lens technology. After briefly overviewing the basics of this technology and its main attributes, presenter Frederic Laune will concentrate on how the liquid lens can integrate with sensors to achieve a high-performance camera application. Several integration examples will be discussed, with explanations of pro’s and con’s to each integration type. To conclude the presentation, Frederic will share application examples.



Loïc Lietar, CEO & Co-Founder, GreenWaves Technologies



Loïc is a co-founder and the CEO of GreenWaves Technologies, a fabless semiconductor start-up developing GAP8, the industry first IoT application processor with a unique energy efficiency that enables unheard of battery powered applications around content understanding (image, sound and motion).

Prior to his recent entrepreneur journey, Loic worked 25 years for ST where he led several product divisions, has been the Chief Strategy Officer and co-founded and managed ST’s corporate venture fund.


The advent of AIoT requires a drastic reduction of installation and operation cost of sensors (image, IR, radar, …) without compromising the performance of the solutions.

This can only be achieved with system solutions that operate on a battery for years or on harvested energy, requiring a re-visit of all the value chain with energy, from the sensors (and how they are employed and combined) to the local processing and the wireless upload of the meta data in the cloud for their exploitation.



Jan Makowski, CEO, LuxFlux



Jan Makowski is a German entrepreneur and CEO of LuxFlux. He founded LuxFlux in 2016 to bring hyperspectral imaging from laboratory to factories. He has successfully built a company around building hyperspectral camera systems for multiple industries. He started his career at Bosch as a project manager for MEMS pressure sensors. He progressed holding several project manager positions for different automotive sensors. Jan Makowski holds a PhD in optical MEMS from the University of Minnesota.

Hyperspectral imaging is a powerful tool for wafer inspection because it combines spectroscopy with spatial resolution. A hyperspectral data cube will contain a full spectrum for every pixel in the image. The spectral dimension can contain information about the chemical composition as well as about geometric features through thin film interference and scattering processes. With its high spatial resolution compared to point spectroscopy, hyperspectral imaging allows for new insights into wafer production processes. Moreover, its high data acquisition rate enables high throughput scanning of wafers. This talk will focus on thickness measurements through white light interference in thin film. The talk covers the physical principle as well as the data analysis and discuss error sources and their impact of the measurement value.



Laurent Malier, Head of Technology Design Platform Development, STMicroelectronics



Laurent Malier has a PhD in chemical physics, on sol-gel materials and quantum dots for optics. After some years in academic research, he spent 5 years in French Department of Defense, in charge of infrared detectors and radiofrequency devices. He joined Alcatel Optronics in 2000, first in charge of new product development programs, then leading the semiconductor business unit, which he continued to drive within Avanex, at the merge of Avanex, Alcatel Optronics and Corning Optronics. In 2005, he joined CEA-LETI, the French technology research institute, in charge of strategy. He spent 9 years as CEO of LETI, from 2006 to 2014, pushing for stronger cooperation with industry and creation of start-ups. He is now in STMicroelectronics, as general manager of technology developments, covering digital, analog and imagers.”

With the constant increase of features embedded in mobile consumer products and the advent of Artificial Intelligence, the need for image sensors is steadily growing. Among them, the fastest-growing segment covers sensors whose function is not to capture and deliver images to the end-user, but to feed automatic interpreter providing information to the end-user, this one being human … or not. 
For such optical devices, technologies are partly leveraging the massive development done for visible CMOS image sensors, but also call for specific technologies, due to different key parameters devices. This paper will comment some of these trends.


Bastjan Prenaj, Co-founder & Growth, Eyeware Tech



Bastjan is the co-founder and business development responsible of Eyeware, executing their mission to enable consumer devices, cars, robots, and other smart machines to sense human attention and interact naturally based on 3D eye tracking with depth-sensing cameras. With a Master’s degree in Electrical Engineering from ETH Zurich, he has previously served as the Global Business Development Manager and Technical Project Manager of a groundbreaking electric city bus system (ABB TOSA) built from scratch in less than 22 months and currently deployed in Geneva, Switzerland.

We are moving towards an environment of devices and machines that are understanding us in more intuitive ways. The “awareness of things” has seen big advancements in voice recognition, emotion tracking and gesture tracking. However, mobile phones, laptops, cars and robots are currently unable to accurately sense human attention, mainly due to current restrictions in eye tracking technologies.With depth-sensing cameras entering mainstream markets (e.g. the iPhone X), Eyeware’s mission is to increase the input bandwidth of those sensors through its groundbreaking eye tracking software. Without any additional hardware requirement, 3D sensors can now perform accurate gaze tracking in 3D and enabling an integration of the user’s eye-gaze for a more natural human-machine interaction. This talk will cover the basics of eye tracking technology, the 3D sensor requirements and the many use cases that 3D eye tracking will enable in consumer devices, retail, automotive, robotics and more.



Patrice Roulet, Vice President, Technology & Co-Founder, Immervision



Based in Canada, Patrice heads Immervision’s engineering as well as, contributes to IP growth and the adoption of Immervision’s wide angle panomorph technology by global corporations. He has overseen the integration of wide angle imaging technology in numerous consumer electronics, surveillance, automotive, aerospace, medical and broadcast products. Recently, he has led the miniaturization of the panomorph wide angle technology for smartphones, tablets, wearables and IoT devices. Back in 2000 in France, after completing his Master’s degree in image processing and computer graphics, Patrice joined the INRIA and contributed to their research in robotic surgery simulation field. In parallel, he co-founded Immervision, a company dedicated to wide angle optics and imaging technology. With his conviction that wide angle technology could be applied everywhere, he contributed to the development of wide angle panomorph optical and imaging technology. Beyond technology, Patrice believes that innovation is propelled by human beings, partnerships and alliances - he has collaborated with a large ecosystem of partners in the optics industry like Fujifilm, CBC Computar, Tamron and Kolen, and in the silicon industry like Marvel, Intel, Qualcomm, Sony, Samsung, HiSilicon, NXP and OmniVision. In addition, Patrice is an avid surfer, international traveler and always seeks to make new connections.

Vision systems are a de facto feature on more and more smartphones, vehicles, robots, drones, and connected and intelligent devices. RGB cameras, IMU, GPS, and other sensors provide primary sense capabilities, and the smarter the device, the better it must see for it to fulfill its purpose.  Wide-angle cameras, now a main feature of flagship phones, increase the machine’s ability to see the world as humans do, and to then process and act accordingly. In this presentation, Immervision Co-Founder and Technology Vice-President Patrice Roulet will introduce key concepts for wide-angle vision, including challenges in design, manufacturing, integration and image processing. Discover how intelligent wide-angle vision technology helps increase humanity in machines through increased perception, sensor fusion, and machine learning so they can see more, smarter.



Bram Senave, Business Development Manager, Easics



Bram Senave began his career at On Semiconductor as a product engineer. He subsequently held various account and sales management positions at Alcom & Actility. Where he was driving sales of semiconductors, embedded computing and IoT connectivity solutions. In 2018 he joined easics, a System-on-Chip design services company targeting both ASICs and FPGA, as business Development Manager.  His prime focus is to help easics’ customers and partners to integrate the right technology in their embedded systems. An example is the recent developed easics’ IP for Deep learning (AI).

Easics uses its expertise in system-on-chip design to develop small, low-power and affordable AI engines that run locally, close to your sensors. This results in a low and predictable latency and runs with ultra low-power consumption.  Easics’ embedded AI solutions integrate tightly with novel and existing sensors such as image sensors capturing light inside and outside the visible spectrum (such as hyperspectral and thermal infrared), 3D scanning laser (LiDAR), Time-of-Flight (ToF) sensors, radar, microscopy, ultrasound sensors, and microphones. To create such innovative hardware, easics is developing the next generation of its embedded AI framework. This framework automatically generates hardware implementations of the deep neural networks that make your specific application smart. Easics maps these AI engines on custom ASIC technology and FPGA. The framework and technology offers enough flexibility in terms of different deep learning models and hardware to have a scalable AI engine that is ready is for the future. In this talk we will elaborate how we offer an easy integration path for image and other sensor manufacturers to add AI in their products.



Mikko Söderlund, Director, Technical Sales Europe, Beneq



Dr. Mikko Söderlund is the Sales Director for Beneq’s semiconductor business in Europe & Southeast Asia. He has more than 20 years of experience in product development, product management, technical sales and business development across Photonics, OLED, and Semiconductor industries. Mikko received his PhD in Micro- and Nanotechnology from the Helsinki University of Technology.

Backside Illuminated (BSI) CMOS Image Sensors (CIS) market continues to experience steady growth dominated by Smartphones, Automotive, Security and IoT. Other photodetectors and light sources based on III-V materials are fueling the photonics market driven by 3D sensing applications in Smartphones and Lidar applications for GaAs as well as Datacom and Telecom applications for InP. Critical to the performance of these devices are advanced thin-film deposition methods to extract best electrical performance such as maximum efficiency or low dark current and to guarantee operation meeting reliability specifications. High quality, dense and conformal layers deposited by Atomic Layer Deposition as well as processes mastering starting surface condition are addressing these challenges. This paper describes two leading edge ALD applications: (1) surface passivation and Anti Reflective Coating (ARC) for BSI CIS and (2) III-V surface passivation and encapsulation.



Manuel Tagliavini, Principal Analyst | MEMS & Sensors, IHS Markit

IHS Markit Logo


  • Principal Analyst, MEMS & Sensors
  • Mr. Manuel Tagliavini, a principal research analyst at Informa Tech, covers MEMS and Sensors technology
  • Manuel joined Informa Tech in 2019 as a part of a business exchange with IHS Markit, where he covered the same research area since 2017
  • His key areas of focus are MEMS and Sensors for Consumer and Industrial markets and he is responsible for the tracking of sensors in several applications (Consumer and Industrial IoT, handsets, tablets, laptops, sports and fitness products among the others)
  • Prior to IHS Markit, he spent over 10 years with STMicroelectronics working in various roles including product engineering, project management, marketing and business development in the company's MEMS division.
  • Manuel earned an Executive Master of Business Administration at SDA Bocconi School of Management, and his Master's of Science in Electronic Engineering from the University of Parma, both in Italy.

The session will provide an overview of the Image Sensor market, describing the actual scenario of suppliers, OEMs and end applications. Then the presentation will highlight how the latest depth sensing functions are impacting the suppliers ranking, the OEMs adoption and how they are enabling new use cases and applications.



Reinhard Voelkel, CEO, SUSS MicroOptics SA

Suss MicroOptics


Reinhard Voelkel received his Diploma in Physics in 1989 and his PhD in 1994 from the University of Erlangen-Nuernberg, Germany, where he worked at the Applied Optics Institute (Prof. Adolf W. Lohmann, Prof. Johannes Schwider) on holographic optical elements for optical interconnects and backplanes. After his PhD he joined the Institute of Microtechnology (Prof. René Dandliker, Prof. Hans Peter Herzig) at the University of Neuchatel, Switzerland, working on micro-optics for biosensors, optical interconnects, photolithography systems, miniaturized imaging and camera systems. Reinhard Voelkel is co-founder and CEO of SUSS MicroOptics SA, a leading supplier of micro-optical components and systems located in Neuchâtel, Switzerland. He is a member of the German Optical Society (DGaO), the Swiss Optical Society (SSOM), the European Optical Society (EOS), SPIE and the Optical Society of America (OSA). He was nominated SPIE Fellow in 2018.

Imprint lithography allows manufacturing thousands of refractive microlens arrays, diffractive optical elements (DOE), gratings, beam-splitters, phase plates (free-form) and other planar Photonics components on one wafer. Wafer-stacking allows manufacturing complex systems or modules in parallel. The presentation will provide an overview of the status of wafer level imprint technology and gives an outlook of future technology developments in the field of imprint lithography for wafer level optics (WLO) applications and processes. The presentation also gives a perspective of the critical importance of optical system design, mastering, stamp manufacturing, process industrialization, wafer stacking, wafer-level packaging (WLP), metrology and inspection when manufacturing Photonics components. SUSS MicroOptics SA is a world-leading manufacturer for Photonics components on wafer-level (8’’). Founded in 1999 in Neuchâtel, Switzerland, SUSS MicroOptics started to evaluate Microlens Imprint Technology (SMILE) for disposable endoscope cameras in 2005. SUSS MicroOptics achieved automotive qualification (IATF 16949:2016) in 2018. SUSS MicroOptics SA is part of the SUSS MicroTec SE group, a leading supplier of equipment and process solutions for semiconductor and mems industry.







Mustafa Badaroglu, Technical Director, Huawei Technologies



Dr. Mustafa Badaroglu is the Technical Director working on chipset and technology planning of products in the domains of mobile processors, networking, automotive, and wearables. He had various assignments for the execution and management of chipset design from concept to volume production, process technology pathfinding, and design-technology co-optimization. He received his Ph.D. in Electrical Engineering and holds a Master of Industrial Management, both from the Catholic University of Leuven. He holds more than 50 published patents and he has (co)-authored over 100 publications in scientific journals/proceedings. He is the chair of More Moore section in International Roadmap for Devices and Systems (IRDS). He is a senior member of IEEE.

We are living in a connected world with access to data in vast amounts. We now need to make this data connectivity more intelligent and accessible by making use of more sensors and by enabling more energy-efficient computation and networking. This could for instance include more intelligent sensors bringing people closer to the computation in a more natural and accessible way. This could also include new assembly and integration schemes, such as 3D integration for the energy-efficient machine learning computation, enabling more connectivity bandwidth and energy-efficient computation. In this talk we will present a landscape of technologies enabling this goal of intelligent connectivity and computation



Carmelo Sansone, Director of MEMS and Sensors Industry Group, SEMI



Highly accomplished marketing professional with a strong engineering background and 15+ years of experience overseeing the full product lifecycle for both startups and Fortune 1000 corporations. Expert in integrating technology, build products and solutions that sell and have a large impact in the market place. Adds value to an organization gaining a deep understanding of market and customer requirements, and position companies to exceed customer expectations and meet both near-term and long-term product objectives.
Core Competencies: Product Launch & NPI Strategy, NPD, Product management, Outbound marketing, Mass market and vertical segment strategies, Project Management leadership, Training and Global Sales enablement, Engaging presentations delivery, Broad SW & HW technical expertise, Low power technologies, IoT/Saas/Cloud, ML technologies, Automotive products and SW solutions and Sensors and sensor fusion processing



Rob van Schaijk, Principal Architect Thin Film/MEMS, Philips Innovation Services



Rob van Schaijk joined Philips Innovation Services in 2017, in the MEMS and Micro Devices department as principal architect.  His main responsibility is MEMS process development in the Philips MEMS foundry with a focus on CMUT technology.  With 20 years of experience in semiconductors, MEMS, and IC technology in various positions, from senior scientist to R&D manager.  From 1999 until 2007, he worked for Philips Research, Philips Semiconductors, and NXP on topics in the area of silicon processing.  From 2007 until 2017, he worked for IMEC in the Holst Centre, as principal researcher and R&D manager with a focus on the development of energy harvesters and sensors for use in wireless sensor nodes.  He obtained a Master’s degree in applied physics from the Technical University of Eindhoven in 1995 and a PhD degree from the University of Amsterdam in 1999 in semiconductor physics.

Philips Innovation Services operates a state-of-the-art 2650 m2 pure-play MEMS Foundry on the High Tech Campus in Eindhoven, the Netherlands.  This MEMS Foundry is specialized in low to medium volume custom MEMS manufacturing. We provide creative solutions from prototype to production for a wide range of applications and for many different companies. One example is our ultrasonic platform based on capacitive micro-machined ultrasonic transducers (CMUT).  
Currently the ultrasound market almost exclusively consist of bulk piezo-electric elements. This technology has the main disadvantage that it is not compatible with high volume and low cost manufacturing. Especially, for the portable and handheld market high volumes, low cost are important, and this market is predicted to grow fast in the coming 5 years. Capacitive micro-machined ultrasonic transducers (CMUT) are MEMS based structures that can accommodate the high volumes and low cost manufacturing. On top of this, CMUT has advantages over piezo-electric as small form factor, large bandwidth resulting in superior imaging resolution, easy fabrication of large arrays and integration with driver circuitry: CMUT-on-CMOS. Philips developed a CMUT platform, which requires a relative low number of mask steps and gives the freedom to design multi-purpose transducers due to its flexibility in frequency. The combination of processing CMUT devices with flexible foils results in easier and cheaper integration in e.g. catheters.  During this presentation, the process flow and performance of the CMUTs will be demonstrated, showing the freedom of the CMUT platform. The focus will be on our low frequency CMUT design, with a center frequency of 3MHz. In addition, the high frequency variant will be discussed with center frequency of 40MHz and its integration in catheters.  



Verena Vescoli, Senior Manager Device & Systems R&D, ams AG



•    Education: Master of Physics at Technical University Graz, PhD in Physics at ETH Zürich
•    2000 - 2008 Senior Engineer Device R&D, ams AG
•    2008 - 2015 Product Manager & Program Management for Particle Measurement at AVL List GmbH
•    2015 Senior Manager Device R&D, ams AG 
•    2016 Senior Vice President of Research & Development, ams AG

24/7 remote health monitoring for permanent body tracking is the next step to ensure sustainable health care systems. Connected devices measure heart rate, blood pressure, stress level, arterial elasticity, physical resilience to blood pressure or cholesterol levels. Measurement is embedded into a wide variety of form factors. Folded grating-based optics, all in one modular solution, visible and NIR range to MIR spectroscopy allowing to „see more” – these are just some trends. Smart sensors are key in developing mobile health monitoring devices and contribute to a more health conscious society.



Benjamin Vullioud, Sr Manager, Sensing Technologies, Logitech


Over 17 years of R&D experience, Benjamin is an experienced technology leader, an innovator and a design thinker capable of dealing with the ambiguity of breakthrough innovation. An engineer by trade, Benjamin has cultivated his entrepreneurial spirit at Logitech and in several other international companies and covered many roles spanning from product development to industrialization, front-end innovation and entrepreneurship. His area of expertise are robotics, metrology industry, medical devices, digital printing technologies and consumer electronics. Benjamin joined Logitech in 2017 to lead an Innovation groupe focusing on Optical and Sensing technologies, incl. human sensing, contextual sensing and data science . He is also the leading new innovative experiences which people love to use at home, at work and on the go. Benjamin holds a Degree in Microtechnology from the University of Applied Sciences of Western Switzerland and his Certified Projects Director IPMA Level A®

Logitech designs products that have an everyday place in people's lives, connecting them to the digital experiences they care about. More than 35 years ago, Logitech started connecting people through computers, and now it’s a multi-brand company designing products that bring people together through music, gaming, video and computing. All our products are using sensors to collect contextual and human centric data. Benjamin will present you Logitech challenges to stay at the edge in terms of technology and user experiences. In addition, this presentation is a call for every technology suppliers as we are always looking for collaboration / co-development. Brands of Logitech include Logitech, Logitech G, ASTRO Gaming, Ultimate Ears, Jaybird and Blue Microphones. Founded in 1981, and headquartered in Lausanne, Switzerland, Logitech International is a Swiss public company listed on the SIX Swiss Exchange (LOGN) and on the Nasdaq Global Select Market (LOGI).


Steering Committee Members


  • Frederic Breussin Yole Développement
  • Marco Ferrera STMicroelectronics
  • Marc Hennemeyer SUSS MicroTec
  • Gerhard Lammel Bosch Sensortec
  • Philippe Monnoyer VTT
  • Marc Osajda NXP Semiconductors
  • Eric Pabo EVG
  • Philippe Robert CEA-Leti
  • Uwe Schwarz X-FAB
  • Manuel Tagliavini IHS Markit
  • Dave Thomas SPTS Technologies
  • Ignas van Dommelen Sencio
  • Martina Vogel Fraunhofer ENAS
  • Anna-Riikka Vuorikari-Antikainen Okmetic
  • Roberto Zafalon STMicroelectronics
  • Christophe Zinck ASE Group
  • Mario Zotes Infineon Technologies AG


  • Jean-Luc Jaffard (Chairman) Redbelt Conseil
  • Andreas Braeuer Fraunhofer-Institut IOF
  • Bernd Buxbaum pmd Technologies ag
  • Pierre Cambou Yole Développement
  • Eric Mazaleyrat STMicroelectronics
  • Philippe Monnoyer VTT
  • Markus Rossi Heptagon Microoptics
  • Matthias Schicke Fujifilm
  • Peter Simkens Innovation Expert
  • Francois Simoens CEA-Leti
  • Marcus Verhoeven aSpect Systems GmbH