downloadGroupGroupnoun_press release_995423_000000 copyGroupnoun_Feed_96767_000000Group 19noun_pictures_1817522_000000Group 19Group 19noun_Photo_2085192_000000 Copynoun_presentation_2096081_000000Group 19Group Copy 7noun_webinar_692730_000000Path
Skip to main content


Laith Altimime, President, SEMI Europe



As President of SEMI Europe, Laith Altimime leads SEMI’s activities in Europe and Middle East and North Africa (MENA). He has overall responsibility for regional events, programs, membership, advocacy, and collaborative forums. Additionally, he manages and nurtures relationships with SEMI members in the region, as well as with local associations and constituents in industry, government, and academia. He provides support and services to SEMI members worldwide that have supply chain interests in Europe. Altimime has more than 25 years of experience in the industry, mostly in Europe. He has held leadership positions at Altis, Infineon, Qimonda, KLA-Tencor, Communicant Semiconductor AG, NEC Semiconductors, and imec. Altimime holds a BS from Heriot-Watt University, Scotland.



Alain Bardoux, Head of Detection, French Space Agency



Jacques Cochard, Partner, Technology Transfer & Research Valorization, TEMATYS



Tom Doyle, CEO, Aspinity



Dr. Stijn Goosens, Research Engineer, ICFO


Over the last decade, the use of cameras has expanded from photography to sensing. Most of the camera-based sensing systems convert visible light images to actionable data. However, there is an untapped wealth of information hidden in the invisible parts of the light spectrum. This invisible light allows sensing systems to increase both the quality and quantity of actionable output data by reducing ambient light interference, defying adverse ambient conditions such as fog and darkness, removing eye safety limitations and extracting compositional information.

We are developing an image sensor technology that is sensitive to visible and invisible light (Vis – NIR - SWIR, 300 - 2000 nm). The technology is based on thin-film photodetectors (graphene and colloidal quantum dots) that we demonstrated to be compatible with a CMOS back-end-of-line process. The wafer-scale process will allow the sensors to be manufactured at high volumes, posing the technology attractive to mass markets. The in-pixel gain and controllability lead to high performance levels and will allow the technology to break traditional pixel scaling laws.



Dr.-Ing. Jan Grahmann, Head of Business Unit Active Microoptical Devices and Systems (AMS)



Bert Kaiser, Group Leader Research and Development, Fraunhofer IPMS

Fraunhofer IPMS logo 500px



Fumio Kita, Global Product Manager - Core Resists, Merck




Gioel Molinari, President, Butterfly Network, Inc.



Tetsuo Nomoto, Head of Sony Semiconductor Solutions Europe, Senior Vice President of Sony Europe BV

Sony Logo

Tetsuo Nomoto received the B.S. and M.S. degrees in applied physics from Tohoku University, Sendai, Japan, in 1988 and 1990, respectively.

In 1990, he joined Olympus Optical Corporation, Nagano, Japan, where he was involved in the development of charge modulation device image sensors. He joined Sony Corporation, Kanagawa, Japan, in 2001, where he has been engaged in the development of CMOS active pixel sensors. Since 2019, he has been Head of Sony Semiconductor Solutions Europe. 

He received Walter Kosonocky Award in 2007 and 2011. He also received IEEE SSCS Japan Industry Contribution Award in 2019.



John Phair, CTO, Pyreos Ltd.



Remi Poittevin, Head of R&D AI Systems & Applications, GrAI Matter Lab



Prof. Francesco Profumo, President, National Research Council (CNR), Italy


Born in Savona in 1953, he is an engineer and academic, Professor of Electrical Machines of the Politecnico Torino. He has been Italy's Minister of Education from 16 November 2011 to 28 April 2013 appointed by Prime Minister Professor Mario Monti. He has been President of the National Research Council (CNR) and had previously served as Chancellor of the Politecnico di Torino from 2005 to 2011. He is President of Business School ESCP - Campus of Turin, President of Collège des Ingénieurs - Campus of Turin, Chairman of Associazione di Fondazioni e di Casse di Risparmio SpA (ACRI), Chairman of Fondazione Compagnia di San Paolo since 2016 and Chairman of Fondazione Bruno Kessler (Trento) since 2014.  



Dr. Xavier Rottenburg, Scientific Director (Wave-based Sensors & Actuators), Imec

imec logo


Emmanuel Sabonnadiere, CEO, CEA-Leti

CEA Leti



Dr. Ralf Schellin, Vice President and Head of Product Area MEMS, Bosch Sensortec


MEMS sensors are playing a key role as the silent enablers of todays and future consumer electronics applications. With the growing relevance of social trends like safety, health and personalization, the complexity of daily-life use cases is increasing. To tackle the resulting challenges, new approaches are required in the MEMS sensor industry. In order to continue providing additional value to customers, a stronger focus on hardware-software co-design is required by using advanced algorithms and embedded AI. 

In his keynote presentation, Dr. Ralf Schellin, Vice President and Head of Product Area MEMS at Bosch Sensortec, will illustrate the “silent” role of advanced algorithms, MEMS sensors and embedded AI by providing specific use case examples in the context of localization, environmental sensing and self-learning.

Ralf Schellin received his PhD degree in Electrical Engineering and his Master degree in Technical Physics at the Technical University of Darmstadt, Germany. Currently he is based in Reutlingen, Germany, where he is Head of the Product Area MEMS of Bosch Sensortec. Prior to this, he was Director of Product Management of Bosch Sensortec. From 2010 to 2014 he was leading a cross divisional project at Bosch on Tiny Wireless Sensors for the Internet of Things. From 2007 to 2009 he was leading an engineering group at Bosch Sensortec. Between 2001 and 2006 he held various positions in engineering and product management at Siemens in Munich, Germany, in the area of mobile devices based on IP technologies. Between 1996 and 2000 he was leading various projects in the automotive area of Bosch in Reutlingen working on safety relevant MEMS based sensors. Prior to Bosch he was holding a post-doc position in biosensors at University of Twente, Enschede, The Netherlands.



Alexey Toropkov, Development Director and Co-founder, Gyrolab LLC



Mikko Utriainen, CEO, Chipmetrics



Luca Vere, Co-Founder and CEO, Prophesee



Philipp von Schierstaedt, Vice President & General Manager of Radio Frequency & Sensors, Infineon Technologies




Sandra Vos, Director of Research and Development, NXP Semiconductors

NXP logo

MEMS & Sensor devices have been used for safety applications for 2 to 3 decades, but quality and reliability requirements continue to outpace capabilities. The electronics industry has not defined an advanced quality and reliability beyond the AEC Q100 and ZVEI Robustness Validation specifications.

NXP is proposing an "Above and Beyond" methodology intended to 1) produce higher body of evidence to enable lower ppm resolution of stress testing, 2) run serial reliability testing to better evaluate failure mechanisms and produce physico-chemical models of these mechanisms, 3) test reliability stress-to-fail to enable reliability modeling of failure mechanisms, and 4) reliability test corner lots to understand the design-process-manufacturing space with respect to quality and reliability.

In the presentation, NXP will propose a methodology for tailoring these four types of quality and reliability evaluation testing to MEMS/Sensor products and their intended use-cases: supply chain / assembly and end-user application.

Moreover, NXP will promote adoption of this methodology as a means of addressing the continuously stricter requirements particularly related to the security and safety of automotive applications.

Sandy Vos received her PhD from University of Minnesota in Materials Science and Engineering and has 20 years of industry experience in MEMS, microsystem, materials, component, composite and semiconductor technology and product development. She joined NXP in 2018 and is currently Director of R&D focused on inertial sensing, including automotive safety-critical devices.  Her work requires the incorporation of functional safety and advancements in the state-of-the-art quality to MEMS physical sensors, within the significant challenges of an aggressive automotive-focused market as it extends into the vision of autonomous vehicles. Dr. Vos was Director of MEMS Engineering and Sr Manager of Product Development at Knowles Corporation in their Consumer Electronics division. At Knowles she was also a technical and design lead for consumer and hearing health microphone development programs in acoustic MEMS sensors. She has worked in the fields of surface mount fuse and suppressor design and manufacturability at Littelfuse, Inc and plastic composite design and manufacturability at Azdel, Hanwha.



Steering Committee Members


  • Prashant Agrawalimec
  • BerndBuxbaum, PMD Technologies AG
  • Pierre Cambou, Yole Développement
  • Dimitrios Damianos, Yole Développement
  • Bernd Dielacher, EV Group (EVG)
  • MarcoFerrera, STMicroelectronics
  • Marc Hennemeyer, Suss MicroTec
  • Jean-Luc Jaffard, Redbelt Conseil
  • Gerhard Lammel, Bosch Sensortec
  • Eric Mazaleyrat, STMicroelectronics
  • Philippe Monnoyer, VTT
  • Marc Osajda, NXP
  • Philippe Robert, CEA-Leti
  • Markus Rossi, AMS
  • Matthias Schicke, Fujifilm
  • Uwe Schwarz, X-Fab
  • Peter Simkens, Expert
  • Francois Simoens, CEA -LETI
  • Manuel TagliaviniInforma
  • Dave Thomas, SPTS Technologies 
  • Ignas van Dommelen, Sencio
  • Marcus Verhoeven, Aspect Systems GmbH
  • Martina Vogel, Fraunhofer ENAS
  • Anna-Riikka Vuorikari-Antikainen, Okmetic
  • Roberto Zafalon, STMicroelectronics
  • Christophe Zinck, ASE Group
  • Mario Zotes, Infineon