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3D floorplan


*This will be updated as information is ready to be shared.

*Pricing excl. VAT 



  • 1 booth
  • 1 free entry ticket* 
  • 1 discounted entry ticket* 

Booths have a structure of 2.3m height with back walls of 2m wide and side wall of 1m wide. Depth of the booth is 2m and are equipped with.

  • Booth space (2m x 2m)
  • 1 sign board with exhibitor name
  • 1 electric distribution
  • 1 table (approx. 1 X 0.6 m)
  • 2 chairs 
    *Exhibitors on corner positions may request that the side wall is removed.

See photos of exhibition in 2020


Reviliani Gani at


Reserved Booths

Exhibitor Information



0eC SA

ZeroEC is the world leading expert in the use of free electrons for data transport, located in Vaumarcus, Switzerland, with a research and development office in Tel Aviv, Israel.

Founded in 2011, Frederic Geissbuhler and Erez Halahmi, with the support of world leading experts and universities, developed a unique technology that enables data transport with extremely high bandwidth at zero energy consumption. Our team developed a technology that can be applied in all types of semiconductor products using a physical principle that has been known for years, but until now, has never been considered viable in a commercial way. After solving the problems in using free electrons for commercial applications in 2019, the company started to develop a concept for 2.5D package integration which solves many of the most pressuring challenges in 2.5D integration. 

The 0eC Bridge Technology for 2.5D applications will be presented to the public for the first time in history at this 3D & Systems Summit in Dresden in January 2020. Our patented technology enables the biggest revolution in data transfer since the discovery of fibre optics and enables many additional benefits. 

Our vision is to build a world where data transport is done in the physically most effective way - without energy consumption and at a much higher bandwidth in comparison with today’s highly inefficient technologies.



AEMtec GmbH

AEMtec is a global acting specialist for the development and production of a variety of precision optoelectronic products, including components, subsystems, modules and complete systems.

AEMtec provides a wide technology portfolio including Wafer Back-End Services, Chip on Board, Flip Chip, 3D Integration and Opto Packaging  -  the right Partner for complex and reliable solutions in the sector of miniaturization.

Customer requirements from the Medical, Industry, Data- and Telecommunications and Automotive sectors are served.

The range of services includes design and development, industrialization, qualification, prototyping (NPI), testing, serial production as well as supply chain management and after-sales services. Please visit:


ASE Group

ASE is blazing new trails in device miniaturization and integration, as demanded by the ongoing transformation of electronics and lifestyles. And, so, alongside a broad portfolio of established technologies, ASE is delivering game-changing advanced packaging, System-in-Package and MEMS solutions to meet growth momentum across a broad range of end markets, such as automotive, 5G, AI, IoT, high performance computing, and more. To learn about our advances in Wire Bond, System-in-Package, Wafer Level Packaging, Fan Out, Flip Chip, MEMS & Sensors, and,2.5D & 3D technologies, please visit :



Besi is a leading supplier of semiconductor assembly equipment for the global semiconductor and electronics industries offering high levels of accuracy, productivity and reliability at a low cost of ownership. Besi develops leading edge assembly processes and equipment for the lead frame, substrate and wafer level packaging applications in a wide range of end-user markets including electronics, mobile internet, computer, automotive, industrial, LED and solar energy. For more information, please visit



Confovis is a high-tech company from Jena, Germany, offering 3D measurement metrology since 2009. The patented confocal technology “Structured Illumination Microscopy” (SIM) opens up new possibilities for industrial applications for a fast surface analysis to the single digit nanometer accuracy. With the measurement system WAFERinspect, Confovis creates a Swiss Army Knife for multi process optical defect detection as well as 3D and 2D inspection. The automated optical inspection (AOI) in combination with 3D and 2D measurements to the single digit nanometer range makes the instrument ideal for the complex structures of MEMS. In this way, Confovis offers industrial customers in the field of MEMS, microfluidics and semiconductors a time and cost saving solution for various inspection and measurement tasks.



DISCO is a total solution provider for Dicing (Kiru), Grinding (Kezuru) and Polishing (Migaku) technologies. We manufacture and sell precision dicing, grinding, polishing machines and also dicing blades and grinding/polishing wheels. We are also providing ablation laser and stealth laser cutting, and plasma dicing solutions. Dicing Grinding Service and Camtek optical inspection service are available at our Munich office.


EV Group

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at



Finetech from Berlin is a manufacturer of innovative sub-micron and high-precision bonders. The manual, semi-automated and full-automatic systems have a modular design for maximum process flexibility. Typical fields of use range from R&D and prototyping (high accuracy, low volume) to fully-automated production environments with high yield. Customers include numerous universities as well as companies from various industries. Finetech develops tailor-made equipment solutions according to specific requirements. With sales & service centers in the US, China, Malaysia and Japan, Finetech provides on-site application support and consultation in global core markets. It is also represented by a worldwide network of representatives.


Fraunhofer IZM

The center “All Silicon System Integration Dresden – ASSID” of Fraunhofer IZM operates leading edge, industry-compatible 200/300mm 3D wafer-level packaging process line with process modules for TSV formation, TSV post-processing, pre-assembly, wafer-level assembly, stack formation. AS-SID is focusing on process development, material & equipment evaluation as well as R&D services for heterogeneous SiP solution.

web address:



FRT offers a comprehensive range of automatable, SEMI compliant 2D and 3D surface measuring systems for the non-destructive investigation of topography, profile, total thickness variation, film thickness, roughness, abrasion and many other properties. More than 500 reputable international companies from the semiconductor, MEMS, optics, photovoltaic and other industries equip their R&D and production departments with FRT metrology systems. FRT operates from Bergisch Gladbach, Germany and maintains subsidiaries in China and the United States. Additionally, FRT provides a distribution and service network in Asia, Europe and USA.



Imec performs world-leading research in nanoelectronics. Imec leverages its scientific knowledge with the innovative power of its global partnerships in ICT, healthcare and energy. Imec delivers industry-relevant technology solutions. In a unique high-tech environment, its international top talent is committed to providing the building blocks for a better life in a sustainable society. Imec is headquartered in Leuven, Belgium, and has offices in Belgium, the Netherlands, Taiwan, US, China, India and Japan. Its staff of over 2,080 people includes more than 670 industrial residents and guest researchers.


LPKF Laser & Electronics AG

LPKF Laser & Electronics AG is a highly specialized mechanical engineering company. We design and manufacture laser systems. A typical application for these systems is in the production of electronic components. Since these components need to be built into smaller and more compact devices - such as smartphones - the utilization of high-precision laser beams as tools is becoming increasingly relevant. LPKF has pioneered the use of lasers in micro material processing. Since our formation in 1976, we have created entirely new markets with our innovative ideas. Today, our technology is deployed in a wide range of industries - such as in the electronics sector, where LPKF systems are used to design or separate circuit boards. The automotive industry uses LPKF lasers for particulate-free welding of sensors or taillights. Solar cell manufacturers boost the efficiency of their modules by deploying LPKF laser scribers. Most recently, we started offering a laser-based glass processing method for microelectronics and a digital printing process for functional pastes.


OPTIM Wafer Services

Optim Wafer Services have been offering, high quality, reliable, value for money wafer processing services to our customers for over thirty years. As well as providing unrivalled technical support. We are dynamic and flexible to our customer’s requirements and take the time to really understand your needs to provide exactly what is specified. Optim Wafer Services is located in the south of France in the Rousset region where ~40% of French Semiconductor manufacturing takes place. Our business is in two main fields – The volume business is test wafer reclaim and test wafer supply. Either New/Virgin Test or Reclaimed wafers can be repolished to be used as test wafers. The other part of our business is to offer wafer processing and wafer process development services. By combining our state of the art equipment and 100+ man years of experience we work with our customers to design bespoke process steps or products to fit their needs. Therefore, if you need substrates thinned, polished, edge trimmed, diced, re-sized or almost any combination of the above we can usually find a solution.


Polyteknik AS

Polyteknik AS is an innovative technology based company with more than twenty years in business. An excellent platform of technology, a global reference list, and highly skilled personnel makes Polyteknik AS an appreciated partner on deposition technlogy. Our deposition systems are designed for production and R&D facilities within the semicon, MEMS and electronic industries. We supply high quality PVD systems covering DC/RF/HIPIMS sputtering, e-beam deposition, thermal evaporation, organic deposition (OLED/OPV)

FLEXTURA PVD - Bridging flexibility and robust industrial production!

  • Fully automatic standalone systems or cluster configuration
  • Proven safe and fast wafer handling - batch, single substrate or cassette-to-cassette
  • Proven 1000C high temperature substrate stage for epitaxial growth
  • Sputtering modules
  • Multi magnetron modules - for true co-deposition
  • Evaporation molules
  • Industrail scale Glancing Angle Deposition on up to 200mm substrates (GLAD)
  • Up to 200mm substrates


SPTS Technologies 

SPTS Technologies, a KLA company, designs, manufactures, sells, and supports advanced etch, PVD, CVD and MVD® wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED manufacturing.

SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific. For more information please visit

Find us on Twitter: @SPTS_Tech



Xperi Corporation (Nasdaq: XPER) and its brands, DTS, FotoNation, HD Radio, Invensas and Tessera, are dedicated to creating innovative technology solutions that enable extraordinary experiences for people around the world. Xperi’s solutions are licensed by hundreds of leading global partners and have shipped in billions of products in areas including premium audio, automotive, broadcast, computational imaging, computer vision, mobile computing and communications, memory, data storage, and 3D semiconductor interconnect and packaging.


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