MILPITAS, Calif. — June 29, 2020 — SEMI FlexTech today announced the launch of three projects to accelerate sensor and sensor system innovations for new applications in industries including healthcare, automotive, industrial and defense. In collaboration with the U.S. Army Research Laboratory (ARL), FlexTech, a SEMI Technology Community, will fund half of the total $2.6 million for the projects aimed at maturing the flexible hybrid electronics (FHE) technology ecosystem. Organizations leading the projects include the University of Colorado (CU), University of Washington (UW) and University of California, Los Angeles (UCLA).

Project Snapshots
The University of Colorado project is focused on integrating soft actuators and flexible electronic control circuits to demonstrate a complete soft robotic system. The project includes a demonstration of synthetic muscular hydrostat integrating electronics and soft actuator modules capable of manipulating objects. The system will mimic muscular structures such as an octopus arm or elephant trunk and will use a human-machine interface for robotic manipulation. CU will be partnering with PARC, A Xerox company on this 18-month project.
Researchers at the University of Washington will focus on an 18-month project to improve and optimize sensor design with ultra-high-resolution printed structures using the novel piezoelectric material of a TMCM MnCl3 (trimethylchloromethyl ammonium trichloromanganese). Deliverables include demonstration of large area roll-to-roll printed electronics fabrication and integration, with compact signal conditioning and wireless data transmission. This project aims to bring the high performance of high-temperature, inflexible inorganic sensors to low-temperature flexible electronics through a low-cost, fully-printed process using low-toxicity materials. The project aims to develop a novel approach to creating flexible health monitoring sensors.
UCLA will develop and demonstrate a foldable, high-resolution microdisplay on PDMS substrates by developing an ultra-high yield, scalable and low-cost mass transfer process for assembly of high-quality GaN µLEDs at 100um size for a resolution of >200 pixels per inch (PPI). The prototype will be made using heterogeneous integration of mass-transferred GaN µLED with Si CMOS driver circuitry on a common flexible organic substrate using Fan-Out-Wafer-Level Packaging. In parallel, the project will explore testing strategies for electrical characterization of µLED and process scalability and limitation. UCLA will partner with Veeco on this 18-month project.

“These groundbreaking research projects target technology advancements that are too risky for corporate R&D funding but offer the potential for high payoff,” said Melissa Grupen-Shemansky, CTO of SEMI and Executive Director of SEMI-FlexTech. “ARL relies on the SEMI FlexTech Governing Council and Technical Advisory Council to select projects that drive leapfrog advances in flexible and printed electronics. Calling upon their deep technical knowledge and experience in the field, SEMI-FlexTech members of these councils vet projects based on technology gaps in the industry.”
For an example of a recently concluded SEMI FlexTech project, read this blog.
SEMI FlexTech is currently soliciting new project proposals via a white paper pre-proposal due July 10, 2020. Download the RFP and review the topics.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Soft Robotics, Sensor Design, Foldable Microdisplay – SEMI FlexTech Launches Three New Projects to Advance Flexible Hybrid Electronics

MILPITAS, Calif. – June 22, 2020 – Nano-Bio Materials Consortium (NBMC), a SEMI Strategic Association Partner, today launched a project with GE Research to develop a medical-grade wireless patch that monitors vital signs of medical patients during emergency air transport. The device promises to advance the state-of-the-art in medical care coordination, records management and patient outcomes in aeromedical evacuation while driving advances in consumer-based telehealth.

The 24-month project is funded at $4.22 million, with costs, research and development shared by NBMC, GE Research, the State of New York, State University of New York at Binghamton, DuPont, and UES, Inc. The project is designed to ensure reliable operation of the patch in austere environments and for single- or short-term use applications targeting the global healthcare monitoring market, estimated at $5.1 billion for 2019, according to MarketsandMarkets. The SEMI-NBMC program is funded through a cooperative agreement with the Dayton, Ohio-based Air Force Research Laboratory (AFRL).

“This project marks a crucial advance in aeromedical care, and accordingly, NBMC is funding another dream team of researchers with the collective expertise, creativity and diligence to drive this initiative to successful completion,” said Ajit Manocha, president and CEO of SEMI. 

“Time is of the essence as medical personnel continuously measures and monitors vital signs of patients during emergency air transport,” said Melissa Grupen-Shemansky, CTO of SEMI and executive director of NBMC. “That critical data needs to be collected autonomously and wirelessly, communicated precisely when doctors and nurses need it, and delivered in an easy-to-use format. The monitoring patch will break new ground in the advancement of healthcare digital technology, helping to ensure that civilians and military personnel receive the highest level of urgent care and treatment.”

“The convergence of artificial intelligence (AI) and advanced wireless communication networks like 5G with advanced sensors and materials is spurring new applications in telehealth that will revolutionize patient monitoring and treatment,” said Azar Alizadeh, principal scientist at GE Research and project leader.

“Our vital signs patch will provide real-time data on a wide variety of key health indicators that will not only help clinicians treating patients in the air, but also enable medical staff on the ground to provide even better, more seamless care following transport,” Alizadeh added. “We’re proud to be partnering with SEMI-NBMC, the AFRL, the State of New York, Binghamton University, Dupont and UES, Inc. to assemble all the right technical pieces to develop this medical breakthrough.” 

GE is taking the technical lead with overall device design, fabrication strategy, prototyping, testing and algorithm development. Binghamton University will contribute fabrication, electrical and mechanical characterization strategies. UES will oversee patch performance assessment in simulated aeromedical evacuation environments. And the AFRL will provide operational testing for aeromedical evacuation, patch efficacy and performance assessment in simulated environments.

The design goals will focus on accuracy, clinical reliability, ease of use and wear, manufacturability, and low cost while supporting integration with the U.S. Department of Defense’s electronic health records systems. The patch will support autonomous decision making, an imperative for continuum of care in medical treatment. 

GE Research, SEMI-NBMC and AFRL representatives will offer more details at the upcoming Virtual Smart MedTech Workshop, Biomarker Sensing and Diagnostics for Telemedicine, Aug. 5, 12, 19 and 26, 10 a.m. to 12 p.m. PDT. Review the agenda and speakers.

About GE Research
GE Research is GE’s innovation powerhouse where research meets reality. We are a world-class team of 1,000+ scientific, engineering and marketing minds (600+ Ph. Ds), working at the intersection of physics and markets, physical and digital technologies, and across a broad set of industries to deliver world-changing innovations and capabilities for our customers. To learn more, visit our website at https://www.ge.com/research/.

About NBMC
SEMI NBMC was founded to bring together scientists, engineers and business development professionals from industry, government and universities to collaboratively initiate research and development of electronic technologies to improve human performance monitoring and performance augmentation. The goal is to proactively build an ecosystem that can drive healthcare and medical electronics innovation towards products that serve society faster.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about New SEMI-NBMC, GE Research Project to Advance Vital Signs Monitoring of Patients During Emergency Air Transport

BERLIN, Germany ─ June 22, 2020 ─ The latest healthtech innovations driven by microelectronics will be presented at the SEMI Virtual Healthtech Summit, Europe's first online event to explore the critical role of semiconductors in solving the world’s most pressing healthcare challenges including COVID-19. Registration is open for the July 16, 2020, summit. The unprecedented impact of the COVID-19 pandemic has pushed the healthcare and medical technology communities to new operational levels. From industry leaders to agile start-ups, the global technology community has answered the call by accelerating time-to-market of innovative solutions for faster point-of-care testing. Designed to stem the spread of COVID-19, the solutions are reshaping the healthcare industry.

Global Healthtech Challenges and Solutions
The SEMI Virtual Healthtech Summit will showcase microtechnology-enabled devices aimed at overcoming COVID-19 and highlight the critical importance of collaboration between the global healthtech and microtechnology communities for greater pandemic preparedness. Experts from the following industry leaders will present.

MedTech Europe will kick off the summit with a review of global healthcare challenges precipitated by the pandemic and the healthtech community’s response.
Yole Développement will explore the pandemic’s impact on the diagnostics industry and the use of microfluidic technologies in battling COVID-19.
imec will present novel solutions for remote care vital sign monitoring and new automated data processing applications to streamline the response of the medical community.
ON Semiconductor will introduce technologies powered by innovative semiconductor solutions to improve lives and enable life-saving medical devices for COVID-19 patients.

For more details, please visit the summit agenda and speaker details and connect with SEMI Europe on Twitter or LinkedIn @SEMIEurope (use #HealthTechSummit).

European MedTech Advisory Council

Companies applying microelectronics innovations to medical devices and healthcare solutions are invited to register their interest on SEMI’s medtech programs and initiatives, and our Nano-Bio Materials Consortium (NBMC). For more details, please contact Cassandra Melvin, Director of Operations, SEMI Europe at [email protected].

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Press Contact
Serena Brischetto, SEMI Europe
Email: [email protected]

• Read more about SEMI Virtual Summit Focuses on Microtechnology-Enabled Solutions to Healthcare Challenges

MILPITAS, Calif. — June 18, 2020 — North America-based manufacturers of semiconductor equipment posted $2.35 billion in billings worldwide in May 2020 (three-month average basis), according to the May Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 2.9 percent higher than the final April 2020 level of $2.28 billion, and is 13.6 percent higher than the May 2019 billings level of $2.07 billion.

"Despite COVID-19 headwinds and limited visibility to near-term macroeconomic conditions, May billings of North America-based semiconductor equipment manufacturers continue to demonstrate the semiconductor industry’s long-term resiliency,” said Ajit Manocha, SEMI president and CEO.

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.

Source: SEMI (www.semi.org), June 2020

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

The data contained in this release were compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

About SEMI

SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

Notes

Next SEMI Billings report is July 23, 2020 at 3:00pm Pacific.

For information on SEAJ Billings Express Report, visit www.seaj.or.jp.

• Read more about North American Semiconductor Equipment Industry Posts May 2020 Billings

MILPITAS, Calif. – June 12, 2020 – Facing a 50 percent decline in the U.S. share of global semiconductor manufacturing capacity over the past 20 years, Congress has introduced the Creating Helpful Incentives to Produce Semiconductors for America Act (CHIPS for America Act), highlighted by a federal investment tax credit (ITC) strongly supported by SEMI, the global industry association representing the electronics manufacturing and design supply chain. The bipartisan legislation would improve the competitiveness of semiconductor research, design and manufacturing in the United States, resulting in the creation of thousands of new jobs and bolstering national security.

Sponsored by Sen. John Cornyn (R-Texas) and cosponsored by Sens. Mark Warner (D-Va.), Jim Risch (R-Idaho), Kyrsten Sinema (D-Ariz.), and Marco Rubio (R-Fla.) in the Senate, and sponsored in the House by Rep. Doris Matsui (D-Calif.) and cosponsored by Rep. Michael McCaul (R-Texas), the Act’s 40 percent refundable federal ITC for semiconductor manufacturing facilities and equipment would quickly provide a significant, direct and transparent incentive to all companies investing in new and expanded semiconductor facilities in the United States.

“Semiconductors are the foundation of all electronics and information technology, and this vital supply chain accounts for approximately 240,000 high-skill and high-wage jobs nationwide,” said Ajit Manocha, president and CEO of SEMI. “SEMI members operate semiconductor supply chain facilities throughout the United States, with 25 states hosting at least one major facility. The ad-hoc incentive packages offered by some states have helped attract and sustain semiconductor manufacturing facilities, but individual governors and state economic development officials are often outmatched by whole-of-government initiatives from other nations. SEMI has long advocated for a tax credit to help level the playing field, and we strongly support the CHIPS for America Act to do so.”

While U.S.-headquartered companies account for nearly half of global semiconductor sales and world-leading market share positions in semiconductor manufacturing equipment, design software, and key materials, only 12 percent of global semiconductor manufacturing capacity is located in the U.S. The availability of robust incentives in other countries and the lack of a federal U.S. incentive have been key factors driving the location of semiconductor manufacturing facilities overseas. The CHIPS for America Act would be a significant step forward for the federal government to create incentives and public investments to support the semiconductor industry in driving innovation across sectors throughout the economy.
 

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Samer Bahou/SEMI
Phone: 1.408.943.7870
Email: [email protected]  

• Read more about SEMI Announces Support of CHIPS for America Act to Increase Semiconductor Manufacturing in the U.S.

MILPITAS, Calif. – June 10, 2020 – SEMI FlexTech today released a Request for Proposals (RFP) for advanced technology developments of flexible hybrid electronics (FHE) for sensors, power and other key electronic components. Review the full RFP for more information about the proposal submission process. Product demonstrations are required for award consideration. The RFP topics include:

• 
  Power and power integration
• Reliability
• Electronics environmental sustainability
• Advanced heterogeneous packaging for FHE
• Materials advances
• Soft robotics

SEMI FlexTech’s Technical Council will evaluate, prioritize, review and manage the proposals and their resulting projects. Funding granted by SEMI FlexTech for the projects must be matched with funds in the form of cash and in-kind contributions from the grant recipient to cover total project costs. On average, industry typically covers 60 percent of the funding for the development program.

“We invite proposals for leading-edge innovation,” said Melissa Grupen-Shemansky, executive director and CTO of SEMI FlexTech. “We look forward to fielding proposals that push the state-of-the-art of flexible and printed electronics to not only enable lighter and thinner electronics but advance device lifetime and robustness using environmentally sustainable processes and materials. FHE continues to transform electronics for industries including healthcare, transportation and communications.”  

SEMI FlexTech will support technical approaches that are revolutionary or have a significant element of risk, as well as approaches that are evolutionary improvements upon existing capability, which tend to be less risky and involve shorter development and delivery intervals. Research and development efforts funded by SEMI FlexTech are in the U.S. government’s Technology Readiness Level (TRL) 3-6 and Manufacturing Readiness Level (MRL) 1-3 levels.

SEMI FlexTech anticipates announcing multiple awards to teams or U.S. organizations with research and development capabilities. White paper proposals are due July 10, 2020 at 5:00 PM PDT.

During a webinar on June 17, 2020, at 9:00 am PDT, SEMI FlexTech will answer questions about the RFP. Register for the webinar. The recorded webinar will be available after the live event at www.flextech.org.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about SEMI FlexTech Invites Proposals for Funding Flexible Hybrid Electronics Advancements

MILPITAS, Calif. – June 9, 2020 – 2021 is poised to mark a banner year for global fab equipment spending with 24 percent growth to a record US$67.7 billion, 10 percent higher than the previously forecast US$65.7 billion, and all product segments promising solid growth rates, according to the second-quarter 2020 update of the SEMI World Fab Forecast report. Memory fabs will lead worldwide semiconductor segments with US$30 billion in equipment spending, while leading-edge logic and foundry is expected to rank second with US$29 billion in investments.

The 3D NAND memory subsegment will help power the spending spree with a 30 percent jump in investments this year before tacking on 17 percent growth in 2021. DRAM fab investments will surge 50 percent next year after declining 11 percent in 2020, and fab spending on logic and foundry, mainly leading edge, will trace a similar but more muted trajectory, rising 16 percent 2021 after an 11 percent drop this year.

Some segments will see lower fab equipment spending but impressive change rates nonetheless. Image sensors will notch an impressive 60 percent increase in 2020 and add a 36 percent surge in 2021. Analog and mixed signal will grow by 40 percent in 2020 and 13 percent in 2021. And power-related devices are forecast to register 16 percent growth in 2020 with a healthy jump of 67 percent in 2021.

The SEMI World Fab Forecast report also shows the worldwide fab equipment spending trough in 2020 shifting from the first to the second quarter (see figure below).

Figure: Fab equipment spending from 2019 by 2021 by quarter.

A review of quarter-over-quarter (QoQ) spending trends reveals the impact of the COVID-19 pandemic over the course of 2020. Global fab equipment spending QoQ declined 15 percent in the first quarter of 2020 – performance that was stronger than the 26 percent decline forecast in February. In March, some companies appeared to build up safety stock as a countermeasure to the spreading virus as shelter-in-place orders emptied offices, malls and schools worldwide. As the contagion grew, demand for IT and electronic products such as notebooks, game consoles and healthcare applications surged. Some stockpiling is expected to stretch into the second quarter, fueled by fear of restrictions – scheduled to take effect in late June – on semiconductor equipment sold to China.

While the World Fab Forecast report predicts rising investments in the second half of 2020, the year will mark the second consecutive yearly drop in fab equipment spending – 4 percent this year after an 8 percent dip in 2019.

And despite the bullish projections, threats from the pandemic still lurk. Pandemic-related layoffs, with more than 40 million workers idled in the United States alone (as of May), and company closures will trigger ripple effects in consumer markets and discretionary spending. For instance, rising unemployment will lead to falling smartphone and new car sales. Despite those downdrafts, digital transformation and the need to communicate will still drive industry growth as cloud services, server storage, gaming and health applications spur demand for memory and IT-related devices.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about Semiconductor Fabs to Log Record Spending of Nearly $68 Billion in 2021 After 2020 Lull, SEMI Reports

Keynotes for SEMI’s 50th anniversary to highlight technology’s potential to improve prosperity worldwide

MILPITAS, Calif. – June 3, 2020 – SEMICON West will occur in a virtual format for the first time in its 50-year history, featuring all the world-class talent and leading technologies that have come to symbolize the flagship microelectronics annual conference. Legendary inventors and futurists from around the world will help SEMI examine opportunities for the microelectronics industry to accelerate innovation over the next half century and drive improvements in the quality of human life worldwide.

The visionaries will highlight a multi-day online conference celebrating 50 years of the information age, July 20-23, conducted globally through both livestream discussions and on-demand presentations. More information and registration are available at www.semiconwest.org.

“This will be the deepest, most extensive online global industry event this year,” said Dave Anderson, president of SEMI Americas and host for the gathering. “As we embrace the cusp of the next industrial revolution, SEMI is gathering industry legends and future leaders for a powerful event headlined by A-list speakers and a full exhibition experience. All the content, interactions and networking opportunities of a physical show – without the associated costs and time of travel – will serve as an added bonus for all participants.”

According to the World Economic Forum, the value of digital transformations worldwide in the new industrial revolution is estimated at $100 trillion in the next 10 years alone. Among the many stunning outgrowths of this disruption, artificial intelligence (AI) is widely expected to have the largest societal impact across industries including automotive, medical, financial, agriculture and energy. Autonomous mobility, ubiquitous connectivity, novel materials and advanced manufacturing technologies will also be key drivers of innovation. The conference’s keynote speakers will explore how these advances will combine to shape next industrial revolution and the new world in which we live and work:

• Environmental advocate and former U.S. Vice President Al Gore will update attendees on the global challenges our industry can help solve by driving advances in the latest cutting-edge technologies, especially by increasing the energy efficiency of semiconductors and computing.
• Gary Dickerson, president and CEO of Applied Materials, will highlight the need for Sustainable AI and discuss actions that can be taken by companies throughout the semiconductor and computing value chain, both individually and collectively, to enable a better future.
• Futurist and author Steve Brown, formerly the futurist and chief evangelist for Intel, will identify six strategic technologies that will shape every business in the 2020s and present the semiconductor manufacturing industry with a roadmap for emerging stronger from the disruptions caused by COVID-19.
• Ambassador (Ret.) Nicholas Burns from the Harvard Kennedy School of Government will address the changing geopolitical landscape.
• Lea Gabrielle, special envoy of the Global Engagement Center for the U.S. State Department, will focus on strategic implications for future technologies gleaned from publicly available intelligence forecasts for the national economy.
• Predicting that the volume of global data will double every 12-18 months, Dr. John E. Kelly III, senior vice president and director, IBM Research, will describe an expected scale of growth that will dwarf previous eras of computing and produce “an enormous number of opportunities” for microelectronics and its wide range of markets.
• Paul Saffo, forecaster for large-scale and long-term technology change, will discuss “Chasing fire: a glimpse into our accelerating future.” He will look at how to address the gap between accelerating technologies and slower-moving cultural and institutional adaptation, which he views as the single greatest challenge facing society.
• Featuring lessons from the past half century, industry legend Tetsuro “Terry” Higashi, former Chairman and CEO of Tokyo Electron, navigated TEL through some of the equipment sector’s toughest days as he built a global powerhouse, partially due to his implementation of fully integrated co-development teams in Japan and the U.S.
• SEMI will announce additional featured speakers leading up to the event.

Co-located content will include the imec Technology Forum (ITF) and the SOI Consortium Forum. Attendees will have the opportunity to connect with exhibitors from SEMICON Southeast Asia in a regional pavilion. Additional sponsored pavilions will feature SMART Manufacturing, SMART MedTech, SMART Mobility, and SMART Workforce. Virtual exhibit booths throughout the detailed, interactive exhibit hall provide the opportunity to network and gather insights just like on a physical show floor – attendees can stop by SMART technology pavilions and exhibitors’ booths to view video content, download informative product information, and converse with supplier representatives.

Attendees can also join technical sessions, participate in one-on-one or group meetings, and interact with colleagues and industry representatives in networking areas. Recorded sessions and exhibitor booth content will remain available on demand 24/7 for weeks after the close of the SEMICON West 2020 Virtual event.

SEMICON West is organized by SEMI Americas to connect more than 2,300 SEMI member companies representing 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMICON West is celebrating its 50th year as the flagship event for the semiconductor industry. Find more at www.semiconwest.org.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact

Scott Stevens, Cardinal Communications for SEMI Americas
Email: [email protected]
Phone: +1.512.288.4050

• Read more about Tech Visionaries to Explore the Future of Innovation at Virtual SEMICON West 2020

MILPITAS, Calif. – June 2, 2020 – Worldwide semiconductor manufacturing equipment billings contracted 13 percent to US$15.57 billion quarter-over-quarter in Q1 2020 but increased 13 percent year-over-year, SEMI, the global industry association representing the electronics design and manufacturing supply chain, announced today in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.
The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from over 80 global equipment companies that provide data on a monthly basis. The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter and year-over-year change by region are as follows:

Source: SEMI (www.semi.org) and  SEAJ (www.seaj.or.jp), June 2020

The SEMI Equipment Market Data Subscription (EMDS) provides comprehensive market data for the global semiconductor equipment market. A subscription includes three reports:

• Monthly SEMI Billings Report, a perspective on equipment market trends
• Monthly Worldwide SemiconductorEquipment Market Statistics (WWSEMS), a detailed report of semiconductor equipment billings for seven regions and 24 market segments
• SEMI Semiconductor Equipment Forecast, an outlook for the semiconductor equipment market.

For more information or to subscribe, please contact the SEMI Industry Research and Statistics Group at [email protected]. More information is also available online.

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Michael Hall/SEMI
Phone: 1.408.943.7988
Email: [email protected]

• Read more about First-Quarter 2020 Global Semiconductor Equipment Billings Up 13 Percent Year-Over-Year

SHANGHAI – June 2, 2020 ─Marking the first major semiconductor industry event of the year with on-site exhibitions and conferences plus live webinars for those unable to attend in person, SEMICON China 2020 will gather industry leaders and visionaries June 27-29 at SNIEC in Shanghai for insights into the latest developments, innovations and trends in the electronics industry. Smart manufacturing, Smart mobility and talent will come into sharp focus as the industry targets these and other growth drivers in the post-virus era. Registration for the webinars is now open. SEMICON China is concurrent with FPD China 2020.

With the health and safety of all exhibitors, speakers and visitors a top SEMI priority, SEMICON China 2020 is implementing all health and safety measures in accordance with government regulations and requirements to protect the well-being of everyone at the event.

SEMICON China 2020 comes as China launches its New Infrastructure post-virus economic stimulus plan to drive growth of artificial intelligence (AI) and 5G networks, improve transportation systems and data centers, build out the electric vehicle (EV) charging infrastructure, and upgrade its electrical grid – all technologies powered by semiconductors. The event will bring together players key to advances in these and other critical semiconductor industry segments. SEMICON China will again feature theme pavilions focused on IC manufacturing, compound semiconductors, the local IC Materials Industry Technology Innovative Alliance (ICMTIA) and workforce development.

The event also coincides with the start of a healthy rebound in China fab investments in the second half of 2020. According to SEMI market research, memory and foundry fab spending will drive a 30 percent increase from the first half of the year.

SEMICON China 2020 On-Site and Online Events

• Grand Opening Keynote
• China Semiconductor Technology International Conference (CSTIC) – Plenary Session
• SEMI Workforce CXO Talent Forum

SEMICON China 2020 Online Only Events

• SEMI MSIG Smart Mobility Forum
• Workforce Development Training Course
• China Semiconductor Technology International Conference (CSTIC)

SEMICON China 2020 On-Site Only Events

• 2020 China Display Conference – OLED or Micro LED
• New Technology Release Conference
• SIIP China: SEMI Innovation and Investment Forum
• Advanced IC Manufacturing Forum
• Advanced Packaging Forum
• Power & Compound Semiconductor International Forum
• Green High-Tech Facility Forum
• Smart Manufacturing Forum
• Memory Strategic Forum
• SEMI PV Shingled Technology and Equipment Developing Trend Seminar
• SEMI Standards PV and PV Materials China Joint TC Chapter Spring Meeting 2020

About SEMI
SEMI® connects more than 2,100 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contacts
Cherry Sun
SEMI China
Email: [email protected]
Phone: +86.21.6027.8548

Michael Hall
SEMI Headquarters
Email: [email protected]
Phone: 1.408.943.7988

• Read more about China IC Industry on the Rebound with SEMICON China Leading the Way