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Bridging the Gap Between Engineering and the Life Sciences

OVERVIEW

The Symposium brought together experts to share their work and identify gaps to accelerating the development of technologies and optimize health outcomes.  Topics covered included using AI in diagnostics and decision-making using AI; data fusion for real time diagnosis; and the impact of these technologies on rural and decentralized healthcare.

Layered on top was the topic of performance augmentation by reading biochemical markers, digital genomics, using new and proposed bio-sensors and wearables.  We heard about tools and technologies available to assess physiological markers that are correlated to health and wellness such as stress, fatigue, chronic disease and cognition. 

The forum focused on bringing together the players across the growing range of industries that are advancing human monitoring applications to:

  • share pre-competitive ideas that may be applied to product development
  • assess roadblocks in bringing human monitoring products to market
  • form partnerships that have become key in overcoming obstacles to successful manufacturing and product development

Symposium Planning Committee

  • Michael Brothers, PhD, UES
  • Dr. Andreas Caduff, Digital Medicine Society
  • Dr. Paul Chao, National Chiao Tung University
  • Caroline Desvergne, PhD, CEA-Leti
  • Doyle Edwards, Brewer Science
  • Dr. Johnsee Lee, Personal Genomics
  • Dr. Yi-Shao Liu, Helios Bioelectronics Inc.
  • Regina Shia, US Air Force Research Laboratory
  • Suren Uswatta, 1st Lt , US Air Force Research Laboratory 
  • Natalie Wisniewski, PhD, Profusa, Inc.
  • Dr. Tsung-Lung Yang, Quality Improvement Center, Kaohsiung Veterans General Hospital

Background on SEMI NBMC

The Nano-Bio Materials Consortium (NBMC) was founded to bring together scientists, engineers and business development professionals from industry, government and universities to collaboratively initiate research and development of electronic technologies to improve human performance health monitoring, diagnostics and performance augmentation. The goal is to proactively build an ecosystem that can drive healthcare and medical electronics innovation towards products that serve society faster. These innovations are laying the groundwork for new products in in digital health and personalized medicine enabling overall health protection.

Download the Agenda

United States

WEDNESDAY, JULY 28, 2021 (CST, CET & PDT) - SESSION 1: REALTIME CONTINUOUS DIAGNOSTICS

10:00 am - 10:05 am
Yi-Shao Liu
MODERATOR
Dr. Yi-Shao Liu
Chief Operating Officer
Helios Bioelectronics

Welcome

MODERATOR
Dr. Yi-Shao Liu
Chief Operating Officer, Helios Bioelectronics, Inc.

Click here for Session 1 Speaker Abstracts & Biographies

10:05 am - 10:35 am
Justin Reggi HumanFirst
Justin Reggi
Head of Partnerships
HumanFirst

Evaluating Digital Measures across Clinical Research and Virtual Care

10:35 am - 11:05 am
Sheng Xu UCSD
Sheng Xu
Principal Investigator
University of California San Diego

Plenty of Room Under the Skin: A Wearable’s Perspective

11:05 am - 11:35 am
Ben Carter B-Secur
Ben Carter
Co-Founder & Chief Commercial Officer
B-Secur
11:35 am - 12:05 pm
Joshua Hagen West Virginia University
Joshua Hagen
Director, Human Performance Innovation Center & Assistant Professor, Department of Neuroscience
Rockefeller Neuroscience Institute at West Virginia University

Human Performance Monitoring and Augmentation: Opportunities for Enhancing Health, Wellness, and Performance

12:05 pm - 12:35 pm

Live Panel Discussion

Chungyuan Standard Time (CST)

MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.

PANELISTS:
- Dr. Paul Chao, National Chiao Tung University

Central Europe Time (CET)

MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.

PANELISTS:
- Ben Carter, B-Secur
- Paru Deshpande, PhD, IMEC
- Dr. Golo von Basum, von basum consulting
- Dr. Paul Chao, National Chiao Tung University

Pacific Daylight Time (PDT)

MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.

PANELISTS:
- Justin Reggi, HumanFirst
- Sheng Xu, UCSD
- Adrian Condon, B-Secur
- Matthew Dalton, Air Force Research Laboratory, Materials and Manufacturing Directorate
- Azar Alizadeh, GE Research

12:35 pm - 12:40 pm

Break for Moving to Breakout Rooms

12:40 pm - 1:00 pm

Breakout Rooms for Smaller Discussion

THURSDAY, JULY 29, 2021 (CST, CET, PDT) - SESSION 2: DECENTRALIZED DNA SEQUENCING & MOLECULAR DIAGNOSTICS

10:00 am - 10:05 am
Yi-Shao Liu
MODERATOR
Dr. Yi-Shao Liu
Chief Operating Officer
Helios Bioelectronics, Inc.

Welcome

MODERATOR
Dr. Yi-Shao Liu
Chief Operating Officer, Helios Bioelectronics, Inc.

Click here for Session 2 Speaker Abstracts & Biographies

10:05 am - 10:35 am
Yi-Shao Liu
Dr. Yi-Shao Liu
Chief Operating Officer
Helios Bioelectronics Inc.

From Analog to Digital: A Portable Semiconductor-based Biosensor Platform for Molecular Diagnosis and Novel Therapy Development

10:35 am - 11:05 am
Hui Tian
Dr. Hui Tian
CEO & Co-Founder
Axbio

Clinical Sequencing with Bio-CMOS Chip

11:05 am - 11:35 am
Johnsee Lee
Dr. Johnsee Lee
Founder & CEO
Personal Genomics, Inc.

Leveraging Semiconductor Technology for Decentralized DNA Sequencing in Clinical Applications

11:35 am - 12:05 pm
Rashid Bashir UIUC
Rashid Bashir, Ph.D.
Dean, Grainger College of Engineering
University of Illinois at Urbana-Champaign

Microfluidics and Nanotechnology for Lab on Chip and Personalized Diagnostics

12:05 pm - 12:35 pm

Panel Discussion

Chungyuan Standard Time (CST)

MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.

PANELISTS:
- Dr. Hardy Chan, Helios Bioelectronics Inc.
- Dr. Johnsee Lee, Personal Genomics, Inc.
- Kevin Tan, Axbio

Central Europe Time (CET)

MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.

PANELISTS:
- Dr. Hardy Chan, Helios Bioelectronics Inc.
- Dr. Johnsee Lee, Personal Genomics, Inc.

Pacific Daylight Time (PDT)

MODERATOR:
- Dr. Yi-Shao Liu, Helios Bioelectronics Inc.

PANELISTS:
- Dr. Hardy Chan, Helios Bioelectronics Inc.
- Rashid Bashir, Ph.D., University of Illinois at Urbana-Champaign (UIUC)
- Dr. Yun He, Axbio

12:35 pm - 12:40 pm

Move into Breakout Rooms

12:40 pm - 1:00 pm

Breakout Rooms & Networking

WEDNESDAY, AUGUST 4, 2021 (CST, CET, PDT) - SESSION 3: DATA SCIENCE AND INFRASTRUCTURE - AI / DATA FUSION

10:00 am - 10:05 am

Welcome

MODERATOR (Chungyuan Standard Time (CST))
Yu-Chuan Li
Distinguished Professor, Taipei Medical University

MODERATOR (Central Europe Time (CET))
Michael Brothers
Technical Program Manager, UES, Inc.

MODERATOR (Pacific Daylight Time (PDT))
Dr. Andreas Caduff
Strategic Advisory Board Member, Digital Medicine Society

Click here for Session 3 Speaker Abstracts & Biographies

10:05 am - 10:35 am
Paul Chua Becton Dickinson
Paul Chua
CyberSecurity Officer, Greater Asia
Becton Dickinson
10:35 am - 11:05 am
Steve Steinhubl PhysIQ
Steve Steinhubl
Chief Medical Officer
PhysIQ

The Untapped Value of Individual Longitudinal Data: Lesson’s from COVID-19

11:05 am - 11:35 am
Matteo Lai Empatica
Matteo Lai
CEO & Co-Founder
Empatica

Digital Biomarkers and Their Use in Post-COVID Healthcare: A Case Study Example From Empatica

11:35 am - 12:05 pm
Bobby Reddy Jr. Prenosis
Bobby Reddy, Jr.
CEO & Co-Founder
Prenosis

Sparking Precision Medicine for Sepsis and COVID-19

12:05 pm - 12:35 pm

Panel Discussion

Chungyuan Standard Time (CST)

MODERATOR:
- Yu-Chuan Li, Taipei Medical Universtiy

PANELISTS:
- Paul Chua, Becton Dickinson

Central Europe Time (CET)

MODERATOR:
- Michael Brothers, UES, Inc.

PANELISTS:
- Angelos Echiadis, GlaxoSmithKline Pharmaceuticals Ltd
- Andrew Carmody, The Health Data Exchange
- Philipp Tholen, Zühlke Group

Pacific Daylight Time (PDT)

MODERATOR:
- Dr. Andreas Caduff, Digital Medicine Society

PANELISTS:
- Steve Steinhubl, PhysIQ
- Bobby Reddy, Jr., Prenosis
- Matteo Lai, Empatica
- Joseph Jarvis, Airman Biosciences Division (RHB), 711th Human Performance, Air Force Research Laboratory

12:35 pm - 12:40 pm

Breakout Room Instructions

12:40 pm - 1:00 pm

Breakout Rooms & Networking

THURSDAY, AUGUST 5, 2021 (CST, CET, PDT) - SESSION 4: APPLICATIONS IN RURAL & DECENTRALIZED HEALTHCARE IN THE DIGITAL AGE

10:00 am - 10:05 am

Welcome

MODERATOR (Chungyuan Standard Time (CST))
Stephen Lee
Director for Early Innovation Partnering for North Asia, Johnson & Johnson Innovation

MODERATOR (Central Europe Time (CET))
Jerome Mouly
Team Lead Analyst, Sensing & Actuating, Yole Développement

MODERATOR (Pacific Daylight Time (PDT))
Regina Shia
Research Psychologist, Air Force Research Laboratory

Click here for Session 4 Speaker Abstracts & Biographies

10:05 am - 10:35 am
Maulik Majmudar
Maulik Majmudar, MD
Chief Medical Officer
Biofourmis

Digitally Enabled Care: The Time is Now

10:35 am - 11:05 am
Anh Bourcet Johnson & Johnson
Anh Bourcet
Director, ASPAC Market Access & HEOR
Johnson & Johnson

Can Digital Health Technologies Address the Gaps of Healthcare Access Inequity in Remote & Rural Areas?

11:05 am - 11:35 am
Kathleen Quinn PhD University of Missouri
Kathleen Quinn, PhD
Associate Dean for Rural Health, MU School of Medicine & Senior Program Director for Health and Safety, MU Extension and Engagement
University of Missorui

Using Health Care Workforce, Community, and Health Indicators to Inform Policy, Education Methods, and Programming for Rural Providers Through Technology to Improve Health Outcomes in Missouri

Click here for Session 4 Speaker Abstracts & Biographies

- Tracy Greever-Rice, Director, MC Center for Health Policy
- E. Rachel Mutrux, Sr. Program Director, Missouri Telehealth Network & Show-Me ECHO
- Dena Higbee, Director, Russell D. and Mary B. Shelden Clinical Simulation Centers at the University of Missouri School of Medicine, and the Essig Simulation Center, Sinclair School of nursing

11:35 am - 12:05 pm
Jean-Charles DRON Département de la Meuse
Jean-Charles DRON
e-Meuse santé COO
Département de la Meuse

E-Meuse santé, a Large-scale Transformation Project, Rooted in Territories, to Address Major Health Issues of the Population, Thanks to Digital, Organizational and Economic Innovations

12:05 pm - 12:35 pm

Panel Discussion

Chungyuan Standard Time (CST)

MODERATOR:
- Stephen Lee, Johnson & Johnson Innovation

PANELISTS:
- Anh Bourcet, Johnson & Johnson
- Yu-Chuan Li, Taipei Medical University
- Chris Winter, DC Medical
- Ray Zhang, Airdoc

Central Europe Time (CET)

MODERATOR:
- Jerome Mouly, Yole Développement

PANELISTS:
- Jean-Charles DRON, Département de la Meuse
- Lars Grieten, FibriCheck
- Gieri Cathomas, Swisspath Health

Pacific Daylight Time (PDT)

MODERATOR:
- Regina Shia, Air Force Research Laboratory

PANELISTS:
- Maulik Majmudar, MD, Biofourmis
- Tracy Greever-Rice, University of Missouri
- Joseph Devivo, Teledoc Health

12:35 pm - 12:40 pm

Move to Breakout Rooms

12:40 pm - 1:00 pm

Breakout Rooms & Networking

- FlexTech

The Global Smart MedTech Symposium was produced July 28-29, Aug 4-5, 2021, for a global audience with a wide range in international experts and panelists.  Overall focused on bridging the gap between engineering and life sciences.

 

Each day had a different technical focus, enabling shared roadmaps and direction:

  • July 28 - Realtime Continuous Diagnostics & Monitoring
  • July 29 - Decentralized DNA Sequencing & Molecular Diagnostics
  • August 4 - Data Science & Infrastructure - AI/Data Fusion
  • August 5 - Applications in Rural & Decentralized Healthcare in the Digital Age

Presentations from subject matter experts and the subsequent panel discussions are available for each of three regions:  Asia, Europe and North America.  

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Rochester, N.Y.—May 13, 2021—Dalian Linton NC Machine Co. Ltd. has opened a more than 70,000 square meter research and design center and manufacturing base in Xishan, Wuxi, China. This comes just eight years after obtaining the exclusive license to use the Kayex brand name and becoming the one and only owner of Kayex technology. The opening of the new facility brings the annual CZ grower equipment production capacity of Linton to more than 2,000 units per year.

“Over the years, we’ve taken the proprietary Kayex technology we were entrusted with and added engineering and service expertise, supported by a strong manufacturing infrastructure and sales team,” explains Ron Kramer, director of business development for Linton. “Since taking over the Kayex brand, we have tripled in size as a company and introduced nine new models of grower, as well as several updates and retrofits. The completion of this new facility in Wuxi enables us to conduct research, design and manufacturing of our CZ process growers under one roof, expediting product delivery to customers.”

Linton’s research and development is heavily customer-driven, aimed at both the development of new machines and technologies and supporting the Kayex technology still used in the marketplace. Among the most recent releases are retrofits to support the older Kayex growers. As the sole owner of the Kayex technology, Linton is the only company able to truly develop retrofits, upgrades or replacement parts for these machines. In the past couple of years, the company has developed a targeted retrofit image processing system, as well as a more comprehensive retrofit of the legacy consoles.

The Linton facility in Wuxi represents an investment of more than $432 million U.S dollars. Saws and other wafer processing equipment continue to be manufactured in the facility in Dalian, China, for efficient production of that line as well.

Linton Crystal Technologies is the world leader in the design, development and manufacture of equipment for producing monocrystalline ingots for the semiconductor and solar industries. The company specializes in silicon and produces equipment for materials such as germanium and gallium arsenide. They also provide technical support, process engineering support and replacement parts to help clients get businesses off the ground, improve productivity and continue to innovate.

For more information about Linton Crystal Technologies, visit www.lintoncrystal.com.

# # #

The new Beneq K.K. subsidiary is located in Yokohama and offers sales, marketing and customer support services across the country.

Yokohama, Japan – Beneq has opened a new wholly owned subsidiary in Japan. The local team consists of experienced sales, marketing and engineering professionals from semiconductor and other ALD customer markets. Beneq K.K. will act as the first point of contact for customers in Japan, and provide local field services, training, and other technical support.

In recent years Beneq saw rapidly increasingly demand for its Beneq TransformTM, C-series, and P-series equipment products and services in Japan. Manufacturers of power semiconductors, radio frequency (RF) devices, image sensors, and lithium-ion batteries find a growing number of applications using ALD. Beneq’s products are also used in coating large or complex shapes, such as semiconductor equipment parts and in optical coatings. With the addition of local presence, the company is in a stronger position than ever to serve customer needs and requirements.

“In today’s global business environment, Beneq wishes to be locally present in all key markets including Japan. Beneq understands our Japanese customers’ preference to work with companies that offer local presence and long-term commitment.” says Jukka Nieminen, President of Beneq. “After decades of business experience in Japan through representatives, Beneq is committed to staying in the Japanese market with its 100% owned subsidiary Beneq KK. The office is dedicated to serving Beneq ALD customers locally in Japan.”

About Beneq
Beneq is the home of ALD, offering a wide portfolio of equipment products and development services. Today Beneq leads the market with innovative solutions for advanced R&D (TFS 200, R2), flexible high-volume manufacturing (BENEQ TransformTM), ultra-fast high precision spatial ALD coatings (C2R), roll-to-roll thin film coating of continuous webs (Genesis ALD), and specialized batch production for thicker film stacks (P400, P800). Headquartered in Espoo, Finland Beneq is dedicated to making ALD technology accessible for researchers and enabling technology mega trends through engineered ALD materials solutions.

Registration

Open to all. 

Not able to attend at that time? Register anyway. We'll send you a link to view the webinar at your own convenience. 

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Check out SEMI Products on these topics:

A Day Spent on Applying Digital Transformation Theories to your business 

SEMI Market Data Products for seeing the impact of Chip Demand

 

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Innovation for a Transforming World | July 13-14, 2021

Join us at the upcoming event, Innovation for a Transforming World Virtual Event
from July 13–14, 2021 to:

  • Explore how to garner a competitive edge in times of crisis.
  • Gain new strategies for customer engagement.
  • Build business resilience during disruption. 
  • Access mid-year market outlook, technology trends, market indicators, and drivers to help guide business decisions.
  • Hear expert insights from Altimeter | Bank of America, Merrill Lynch | Cornami | Dell Technologies | Deloitte | SEMI | TechSearch International and more.

United States

8:00 am - 8:10 am
Ajit formal photo Square 500px
Ajit Manocha
CEO and President
SEMI

Welcome & SEMI Survey Results

8:10 am - 8:20 am
Heidi Hoffman
Heidi M. Hoffman
Senior Director, Corporate Marketing
SEMI

SEMI Member Survey on COVID Response & Impact

8:20 am - 8:40 am
Sven Smit McKinsey
Sven Smit
Chairman & Director
McKinsey Global Institute

Leading Toward and Beyond the COVID Exit

8:40 am - 9:05 am
Jennie Raubacher, Wells Fargo
Jennie Raubacher
Global Head of Semiconductor, Clean Tech & Auto Tech Investment Banking
Wells Fargo Securities

Looking Ahead at Global & Industry Markets

9:05 am - 9:25 am

Q&A

9:25 am - 9:30 am

Closing Remarks

Standards Workforce Development

The demand for microelectronics surged this past year as the COVID-19 pandemic accelerated a digital transformation of the way many of us work and live.

Join your C-suite colleagues in a webinar, hosted by Ajit Manocha, President & CEO of SEMI, for an analysis of the emerging business landscape and what post-pandemic operations and opportunities will look like. Featured speakers from McKinsey & Co. and Wells Fargo Securities will share their insights on the impact of the surge and the economic policies being enacted to strengthen the worldwide economy.

This webinar is a timely forum to better gauge future demand and ongoing challenges – and how to adapt your business accordingly.

8:00 am - 9:30 am Off Add to Calendar Disabled America/Los_Angeles
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ESPOO, Finland, 29th of April 2021 – Picosun Group has appointed Kenneth Hörhammer as Vice President, Sales, and a member of Picosun Group’s Leadership Team as of May 1, 2021.

Kenneth Hörhammer has strong international business experience as well as passion and proven results in sales development and execution. Before joining Picosun, Kenneth Hörhammer has held multiple global business and sales leadership positions at Vaisala both in Finland and abroad in the past 17 years.

“I am excited to join this fantastic team and company. The potential for ALD is almost limitless, and Picosun is spearheading this technology globally. Picosun is a bright example of Finnish high-tech innovativeness, and I am thrilled to become an integral part of this international growth story,” states Kenneth Hörhammer.

“I warmly welcome Kenneth Hörhammer to join our team. The professional background and global experience he brings to our team enable us to significantly strengthen our global sales management, build a stronger sales organization and enforce customer satisfaction,” concludes Jussi Rautee, CEO of Picosun Group.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

Meylan, FRANCE – April 27, 2021 – Tiempo Secure, a unique supplier of Secure Element IP cores and secure software libraries for semiconductor design companies and IC’Alps, expert in design and supply of application-specific integrated circuits (ASIC), today announced a strategic collaboration to widespread silicon implementation of Common Criteria (CC) EAL5+ grade Secure Element cores for IoT applications. Specifically, Tiempo Secure is relying on IC’Alps’ expertise in physical design implementation to develop the hard macro of its Secure Element named TESIC, from netlist to GDSII.

Tiempo Secure’s TESIC includes a secure MCU, secure cryptographic processors and hardware accelerators, security sensors, secure memories and standard interfaces for easy integration and test. While TESIC is already available on multiple silicon processes, including GF 55 and TSMC 40, the hard macro is now implemented by IC’Alps in GF 22 and TSMC 16 – with some other technology nodes considered in the coming months.

“By collaborating with IC’Alps for back-end implementation, Tiempo is now able to provide its customers with a wider choice in terms of technology”, said Serge Maginot, CEO of Tiempo Secure.

Serge Maginot said IoT applications are driving the demand for a new generation of Secure Elements. Indeed, with billions of IoT devices deployed, it is becoming crucial to secure our connected world with innovative and easy to implement solutions that protect sensitive data from external attacks. Tiempo Secure’s TESIC addresses this security concern with a tamper resistant hard macro designed for plug-and-play MCU or SoC integration. TESIC is delivered to the certified fab, with the guarantee chips integrating this macro will pass CC EAL5+ PP0084 and/or EMVCo security certifications.

IC’Alps provides a complete range of semiconductor design services. “We are extremely proud to be partnering with Tiempo Secure”, said Jean-Luc Triouleyre, CEO of IC’Alps. “We see a growing trend toward closer ties between IP developers and Design Houses. One reason is that few companies can afford the large investment in EDA software needed for physical implementation tasks.” The company offers customers the flexibility to choose an entry point into the ASIC/SoC implementation flow according to their needs, turnaround time, expertise and available EDA environment.


About Tiempo Secure
Tiempo Secure is an independent company headquartered in Montbonnot, near Grenoble, France, with customers in Europe, North America and Asia. It specializes in the development of security intellectual property (IP) in microelectronics and secure embedded software for securing connected devices. The company offers a wide range of Secure Elements IP cores (TESIC family) ready to be integrated into "System-on-Chip" (SoC) components, and allowing maximum security (Common Criteria EAL5+ PP0084 certified) of connected components: authentication on networks with integrated SIM, payment (EMVCo), government or private identification, web authentication (FIDO 2), smart car access, communication with autonomous vehicles (V2X HSM). More information can be found at www.tiempo-secure.com

About IC’Alps
IC’Alps is your one-stop-shop ASIC partner. The company provides customers with a complete offering for Application Specific Integrated Circuits (ASIC) and Systems on Chip (SoC) development from circuit specification, mastering design in-house, up to the management of the entire production supply chain. From its technical centre in France (Grenoble area), IC’Alps supports multiple projects in the demanding medical, industrial, transport, IoT, and mil/aero sectors. The highly qualified engineering teams cover every expertise needed and have a long experience of on-demand analog, mixed-signal and digital integrated circuits on technologies from 0.35 µm down to 16 nm. Moreover, IC’Alps has a proven track record of success with sensor/MEMS AFE interfaces, low power consumption designs, high-resolution converters, signal processing, multiprocessors architectures, hardware accelerators, to name a few. Being a partner of major semiconductor foundries, IP providers, as well as packaging and test houses, IC’Alps is well placed to support customers with full life-cycle solutions. We are proud to be Arm® approved Design Partner, a member of X-FAB’s design and supply chain partner network, as well as an Imec IC-link partner. These accreditations assure that we provide expert support and that we have the design expertise to create highly innovative ASIC designs. IC’Alps is ISO 9001, ISO 13485, EN 9100 certified, as well as Common Criteria ready. More information can be found at www.icalps.com

The revolutionary Genesis ALD platform enables next-generation battery manufacturers to scale up quickly.

Beneq, a leading ALD equipment manufacturer, today announces a strategic partnership with E+R to design and commercialize innovative roll-to-roll ALD systems for R&D and volume production. The companies have together developed a revolutionary roll-to-roll ALD system.

The new ALD platform – named Genesis ALD – is targeted at various industrial R2R ALD applications, including:

- Passivation of cathodes and anodes for various types of lithium-ion and solid-state batteries
- Conductive layers and encapsulation for flexible solar cells
- Moisture barriers for flexible electronics

“Bringing Beneq’s unique roll-to-roll ALD technology together with Emerson & Renwick’s deep experience in roll-to-roll vacuum and web handling is good news for the battery industry,” says Sami Sneck, Business Executive at Beneq.

“The partnership allows us to offer state-of-the-art atomic layer deposition technology for enhancing li-ion and other next-generation batteries, where we expect to see strong market demand. There is a lot of potential for this technology in other application areas too, but the market for those end-products is yet to mature,” says Sneck.

“We have worked very well with Beneq and both companies have a good grasp of the potential markets available,” says Andrew Jack, Sales Director at E+R Group. “ E+R offers a wide range of high-end R2R vacuum equipment. This collaboration makes it easier to integrate R2R ALD with other techniques where necessary.”

The partnership is effective immediately. The new Genesis ALD system is available by inquiry for customers globally.

BERLIN, Germany ─ April 20, 2021 ─ SEMI today announced the appointments of Luc Van den hove, president and CEO of imec, as chair and Paul Boudre, CEO of Soitec, as vice chair of the SEMI Europe Advisory Board. The SEMI Europe Advisory Board is the senior industry executive board that plays a critical role in the development and growth of Europe’s semiconductor industry.

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SEMI Europe Advisory Board members provide strategic guidance and represent the collective interests of all SEMI members to help foster the growth and profitability of the European microelectronics industry.

“We are honored to collaborate with a diverse group of executive leaders that epitomize both the technological and competitive advantages of Europe’s microelectronics industry,” said Laith Altimime, president of SEMI Europe. “Together, we will work to advance the European microelectronics ecosystem to drive future growth and promote European strategic initiatives and partnerships in order to strengthen Europe's technological sovereignty and leadership in the digital age.”

“We thank Kevin Crofton, CEO of Comet, for his strategic leadership and valuable support to SEMI Europe as a chair over the past years and continued member of the board,” Altimime said.

Luc Van den hove, president and CEO of imec

“I am extremely honored to be appointed chair of the SEMI Europe board and consider this a recognition of the key position that imec has established over the years being one of the leading R&D centers in Europe. I am looking forward to taking up my role and leverage my expertise and knowledge to further strengthen SEMI Europe’s efforts in connecting and supporting its members and drive innovation and growth in Europe by protecting its core competencies while strengthening global supply chains."
Luc Van den hove, president and CEO of imec

Paul Boudre, CEO of Soitec “Our world and societies are facing major changes and disruptions. This creates significant opportunities for the semiconductor industry and for Europe as a whole. SEMI is a key motor of this transformation, because it drives the development of our ecosystem, up and downstream, and helps us to bolster Europe’s leadership and sovereignty.”
Paul Boudre, CEO of Soitec


SEMI Europe Advisory Board includes:

 

SEMI Europe has consistently broadened its diverse representation that now consists of female and male leaders representing the entire value chain across the semiconductor industry. To learn more about the European board, visit www.semi.org/eu/semi-organization/european-advisory-board.

 

About SEMI

SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

 

Association Contact

Serena Brischetto / SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat™ monolayer coating system at EVG’s NILPhotonics® Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor, life science and optical coatings (AR/VR) customers. EV Group is a major supplier of capital equipment for these markets.

“At YES, we aim to be the preferred technology solutions provider for material modification and surface enhancement. Achieving that goal means giving our customers, wherever they are located, what they need in order to create leading-edge products. We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthrough products in the semiconductor, life science and AR/VR markets, and will also help us to anticipate what those companies will require to support their roadmaps,” said Rezwan Lateef, President of YES.

“Within the framework of the NILPhotonics® Competence Center, EVG partners with customers to develop efficient and differentiating manufacturing solutions for new cutting-edge markets and applications. We welcome YES’s participation in our process flow and look forward to providing a seamless, high performance process flow including YES’s solutions,” said Markus Wimplinger, Corporate Technology Development & IP Director at EVG.

Based at EVG headquarters in St. Florian, Austria, EVG’s NILPhotonics® Competence Center and Heterogeneous Integration Competence Center™ provides world-class process development services and serves as an open access innovation incubator for customers and partners across the microelectronics supply chain. Through its centers of technology excellence, EVG helps customers to accelerate technology development, minimize risk, and develop differentiating technologies and products through the implementation of nanoimprint lithography and heterogeneous integration, respectively, while guaranteeing the highest IP protection standards that are required for working on pre-release products.

About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit http://www.yieldengineering.com.

About EV Group (EVG)
EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at http://www.EVGroup.com.

Meylan, FRANCE – April 19, 2021 - IC’Alps, fast-growing French expert in the design and supply of application-specific integrated circuits (ASIC), has announced a strategic collaboration with KAL for the commercialization of their ASIC services on the Israeli marketplace. Besides, IC’Alps head office is actively recruiting.

To sustain its growth objective, IC'Alps leverages two assets: the expansion of its sales force and the strengthening of its team.

“With the Covid-19 pandemic, we had to rethink the way we do business, and online meetings have their limits”, said Jean-Luc Triouleyre, IC’Alps’ CEO. “We strongly believe that customer proximity and providing face-to-face (when possible) support and sales is crucial to the success of our international expansion. Having local Sales Representatives sharing the same culture, language and time zone helps ensure that the customers’ requirements are well understood and that the sales process runs efficiently.”

KAL provides Semiconductor services since 2003 in Israel for Fablesses, Chip Makers, Foundries, Design Houses, and EDA vendors. The company joins the growing list of IC’Alps Sales Representatives including:

• Redtree Solutions Ltd
• Running Springs Technology

Each of these companies has the expertise to carry out a premium sales experience with customers in a variety of European, Asian, and North American markets including IoT, Industrial, MedTech, and Automotive which match IC’Alps’ areas of strength.

To sustain the pace of new projects brought in by its sales force, IC’Alps has recently hired experimented engineers in the field of physical implementation and analog design. And IC’Alps is still looking for new talents to continue its fast-growing ambition. The team is very active on design areas such as on demand analog blocks, sensor/MEMS interfacing, hardware accelerators and (multi)processors systems based on ARM or RISC-V cores, always with a low power approach. Talent acquisition and recruiting have always been challenging for a SME. “With an unprecedented period of expansion of the semiconductor industry in the decade ahead, another big focus for IC’Alps this year is to remain competitive in the talent market through strong corporate culture, attractive work environment, and employee benefits package”, added Jean-Luc Triouleyre.

Thanks to these efforts, IC’Alps offers a complete ASIC realization service of taking a custom chip through all the stages of specification, design, test, and manufacturing to the final logistics of delivery to customers. This leaves customers free to focus on the final device and sales where their expertise lies.

For more information, please visit IC’Alps “Sales Representatives” page on https://www.icalps.com/asic-soc-design-supply-custom-chip-services-netw…

To discover why IC’Alps is a great place to work, please visit IC’Alps “Careers” page on https://www.icalps.com/careers-opportunities-alps/ and follow us on LinkedIn