Kalispell, MT – April 14, 2021 – ClassOne Technology (classone.com), the global provider of advanced semiconductor plating and surface preparation systems, announced that it has received a multi-tool order from one of the largest Gallium Arsenide (GaAs) foundries in Asia. The order was for ClassOne’s Solstice® S8 systems and included proprietary GoldPro™ processing chambers for advanced gold plating. The announcement was made by ClassOne’s CEO, Byron Exarcos, and Senior Technology Director, John Ghekiere.

"This customer is using the Solstice S8 for high-volume HBT processes on 150mm GaAs wafers,” said Ghekiere. “They're producing advanced power semiconductor devices that involve several important gold processes, both frontend applications and backend vias. So, they were interested in our GoldPro chamber for a number of reasons: For one thing, it automatically adjusts to a broad range of substrate thicknesses, from nominal-thickness wafers to those that are mounted on thick substrates. So they don’t have to reconfigure for each substrate type.”

“Also, the GoldPro reactor is able to deliver exceptional gold plating uniformity together with high wafer throughput,” said Ghekiere. “In previous generations of gold plating systems, the user generally had to choose between plating quality and processing speed. However, GoldPro is designed to form highly stable flow structures that achieve extremely uniform feature shape without sacrificing plating rate.”

“All of this is producing a steady increase In Solstice sales, notably in high-volume fabs and in Asia," said Exarcos. “Partly it’s because of Solstice’s performance and flexibility, delivering both high-quality electroplating and surface prep processes on the same tool, which boosts production and ROI. But it’s also because of ClassOne’s high level of customer support in Asia. Many customers are just getting started in advanced electroplating technology, and they depend on us for the deep process experience and technical support they need to get from start-up to full production. For example, many of them count on our ability to provide pre-production sampling through our central Technical Development Center, which can shorten their time frames considerably. It’s this combination of world-class technology and world-class support that’s been driving many of the repeat orders we’ve been receiving across Asia and around the world.”

ClassOne’s Solstice S8 is an eight-chambered, fully-automated single-wafer production tool that delivers high-performance electroplating as well as wafer surface preparation for a range of processes, including cleaning, metal lift-off, resist strip, UBM etch and more. The Solstice series also includes the fully-automated S4 with up to four processing chambers and the semi-automated Solstice LT with up to three chambers for process development or lower-volume production.
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About ClassOne Technology
ClassOne Technology (classone.com) has become the semiconductor industry’s leading provider of advanced wet-chemical wafer processing equipment for ≤200mm wafers. ClassOne’s popular Solstice® plating and surface preparation systems include the S8 with up to eight chambers and the S4 with up to four chambers for high-speed fully-automated single-wafer production. The Solstice LT provides up to three chambers for process development or lower-volume production. Complementing the Solstice platform, ClassOne has developed a series of proprietary chambers, including the GoldPro™ and CopperMax™, to uniquely optimize specific types of processing. In addition, ClassOne offers the Trident™ product lines of advanced batch-processing spin-rinse-dryers and spray solvent tools. Headquartered in Kalispell, MT, the company has successfully brought new high-performance processing technology to compound semiconductor and many emerging markets that have long been underserved by the older equipment manufacturers. Hundreds of ClassOne tools are now at work in leading fabs and research facilities around the globe, producing many of the world’s most advanced devices, from microLEDs and VCSELs to next-generation RF and sensors.

• Read more about Major Asian GaAs Foundry Orders Multiple Solstice Electroplating Systems from ClassOne

ESPOO, Finland, 13th of April 2021 – Picosun Group has proved to significantly increase the production efficiency of its LED and OLED customers with the PICOSUN® P-300BV ALD system. Recent tests show that a reduced ALD process cycle time and an increased number of wafers deposited with the same film thickness resulted in almost 100% better throughput. A throughput of over 20 000 wafers per month can be reached with a wafer batch of 100 wafers*. At the same time, the process quality in terms of film thickness uniformity has remained on an excellent level (20000 WPM, About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Juhana Kostamo¬
Vice President, Industrial Business Area, Picosun Group
Tel: +358 50 369 9565
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun increases efficiency for LED and OLED production

YES (Yield Engineering Systems, Inc.), a preferred supplier of process equipment for the semiconductor advanced packaging, life sciences and display markets, today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd., one of the leading testing and bump houses in Taiwan. The system will be utilized for advanced packaging mass production processes such as copper pillar and WLP to support growth driven by 5G applications, cloud servers and data centers. Winstek received its first VertaCure XP in September of 2020; this repeat order is expected to be delivered in the 2nd quarter of 2021, in order to serve growing market demand.

“The VertaCure XP system’s enhanced capabilities make it especially well-suited for the demands of ‘Beyond Moore’ advanced packaging, and its ability to handle both 200 mm and 300 mm wafers is ideal for our WLCSP application,” said Cheng-Che Tsou, Director of Bumping Engineering at Winstek.

“This follow-on order validates the technology leadership and economic value associated with YES solutions,” said Alex Chow, Asia Sales President & General Manager at YES. “The VertaCure XP’s low vacuum curing environment reduces polyimide curing process time by more than 30%, and its outgassing performance has proven far superior to that of atmospheric ovens. This significant process time reduction in the PVD degas chamber improves both CoO and throughput, not only at the curing process step but also from a process integration prospective,” added Chow. “We greatly value our strong relationship with this strategic customer and look forward to supporting their capacity expansion efforts."

“We have shipped several VertaCure XP systems over the past year, with strong interest from relatively new customers such as Winstek as well as from longtime users of YES systems,” said Rezwan Lateef, President of YES. “We are pleased to have been able to demonstrate the VertaCure XP’s superior film performance and overall value during Winstek’s evaluation process. It has been very gratifying to see the growth of YES in Taiwan extending to this key customer.”

About YES
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing presence globally. For more information, please visit https://yieldengineering.com.

About Winstek
One of Taiwan’s leading wafer bumping and testing providers, Winstek Semiconductor Co., Ltd. was founded in 2000 and has offered automated solder bumping since 2005. Applications include 200 mm and 300 mm WLCSP, 300 mm Cu pillar, and others. Winstek's customers range from major corporations to smaller innovators, with end-market products ranging from communications to computers to consumer products. For more information, please visit https://www.winstek.com.tw

• Read more about Winstek Places Second Order for YES VertaCure™ XP

YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has received a volume purchase order for the VertaCure™ XP from Taiwan-based OSAT Powertech Technology, Inc. The systems, which will be utilized for flip chip and wafer-level-packaging in high volume manufacturing, will be delivered in the first half of 2021 to address growing production demands.

“In addition to the throughput benefits, excellent particle performance and complete, reliable curing that PTI can expect to achieve by using the YES vacuum process, these VertaCure XP systems will allow PTI to develop new applications that broaden the range of solutions they can offer to their customers,” explained Alex Chow, Asia Sales President & General Manager at YES. “As advanced packaging technology requirements evolve, OSATs will continue to play an important role in the supply chain,” Chow continued. “This major win further confirms YES’s ability to deliver operational flexibility, technology leadership and highest economic value for customers.”

“We are excited to partner with PTI to provide the consumer electronic market with new technologies that make products smaller and smarter,” added Rezwan Lateef, President of YES. “As the advanced packaging market continues to expand, YES remains focused on being the preferred supplier of material modification and surface enhancement solutions.”

About YES
YES (Yield Engineering Systems, Inc.) is a preferred supplier of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure systems, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com.

• Read more about YES Secures VertaCure™ XP Volume Purchase Order from Powertech Technology Inc.

ESPOO, Finland, 30th of March 2021 – Picosun Group reports strong growth and a positive operating profit from its fiscal year 1.1.2020-31.12.2020.

Fiscal year 2020 in short*
• Order intake grew by 48,4% and was €40,9M (€27,5M)
• Turnover grew by 38,6% and was €37,6M (€27,1M)
• Operating profit was €0,9M (€-0,3M), which is 2,5% (-1,1%) of the turnover

A bigger portion of the new order intake and turnover, compared to previous years, consisted of sales of machines meant for production in the industry and medical sector. The growth was especially strong in Asia and Europe. Service business represented 16% (12%) of 2020 order intake.

“Despite the COVID-19 challenges we were able to continue on our growth path as planned. The pandemic led to increased investments in the medical sector. Also, remote work and the increased interest in entertainment applications grew the demand of production machines in electronics and semiconductor industries”, states Jussi Rautee, CEO of Picosun Group.

New investments in medical industry

Picosun has been involved in product development for the medical sector for some time. Protecting for example medical implants with ALD from the corrosive environment of the human body, and vice versa, is of utmost importance considering the safety, correct operation, and lifetime of the implant.

The company established a new business area, PicoMedical, in response to the increased interest and needs of the medical and healthcare ALD segments. PicoMedical’s order intake in 2020 constituted 10% of the company’s new order intake.

”We in Picosun believe that ALD will disrupt the medical industry the same way it did in the semiconductor industry. Our aim is to be the forerunner in this development”, says Jussi Rautee.

Almost a fifth of company’s turnover to research and development

During 2020 Picosun Group continued investing in its R&D functions. The company invested 18% of its turnover to various research and development activities. During 2020 Picosun filed 16 new patent applications at the European Patent Office, and 34 patent applications in various countries were granted to Picosun.

The company brought a number of significant new products to the semiconductor market. PICOSUN® Sprinter, a high throughput ALD production module for 300 mm wafers, was launched late 2020. PICOSUN® Morpher product family, designed for 200 mm wafers, grew with Morpher P (PE-ALD). For easy, intuitive and user-friendly operations of the whole PICOSUN® ALD cluster, the company launched its unified control software PicoOS™.

“Our commitment to meet our customers’ needs proactively and ensuring their future success resulted in the development work and launches that took place in 2020. This is part of ongoing work that we are continuing this year. We are also further developing ways to be in contact with our customers. Last year we took into use the leading remote support tools, taking advantage of e.g. augmented reality, that allow safe and on-time service delivery no matter the physical location of the customer”, says Jussi Rautee.

*Numbers in the brackets are 2019 non-audited consolidated numbers based on management reports.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:

Mr. Kustaa Poutiainen
Chairman of the Board
Tel: +358 400 424 506
Email: [email protected]

Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]

• Read more about Picosun Group demonstrates strong growth in 2020

BERLIN, Germany ─ March 30, 2021 ─ SEMI today announced its participation as an industry expert in a study by researchers in Coventry University’s Institute for Future Transport and Cities’ (IFTC) Systems Security Group (SSG) to examine drivers of computer hardware security adoption among businesses and consumers.

The UK government’s Economic and Social Research Council (ESRC)-funded Discribe (Digital Security by Design Social Science) Hub awarded SSG more than £100,000 last year for the project. Discribe aims to broaden the deployment of cybersecurity technology and help protect economies worldwide against cyberattacks. TechWorks, UK’s Deep Tech Hub, will also serve as an industry expert body in the project.

“With hardware security critically important to semiconductor innovation, SEMI is pleased to partner with the SSG team on this initiative,” said Laith Altimime, president of SEMI Europe. “The SSG cybersecurity project promises to arm the electronics value chain with best practices it can follow to strengthen the security of electronics.”

Professor Siraj Shaikh, Director of Research at IFTC and leader of SSG, will oversee the project with support by co-investigators Dr. Simon Parkin of TU Delft (Netherlands) and Dr. Muhammad Azmat of Aston University (UK). The project will promote commercial adoption of secure technology by identifying the greatest costs to businesses and understanding the reasons businesses choose not to implement cybersecurity. The findings promise to shed light on cybersecurity vulnerabilities for technology manufacturers, enabling them to better address security gaps in future designs.

“IFTC is committed to Discribe’s goal of mass adoption of cybersecurity by technology providers,” Shaikh said. “Digital security is vital to driving innovation in mobility and artificial intelligence (AI). We look forward to working to build public trust in these technologies to help ensure their widespread adoption.”

About Institute for Future Transport and Cities (IFTC)
The Institute for Future Transport and Cities develops pioneering mobility solutions. From accelerating the progression towards zero-carbon transport and developing inclusive design practices to ensuring the safe implementation of autonomous transport solutions, IFTC is central to solving global mobility challenges. IFTC works closely with industry to ensure that its research has real-world applications, maintaining close relationships with leading businesses within the transport sector.

About IFTC’s Systems Security Group (SSG)
The Group’s core mission is to research and engineer secure and resilient cyber-physical systems for the automotive and transport industry, working in collaboration with partners in industry, academia, and government. The SSG does this by detecting and modelling emerging threats, validating novel solutions for automotive security and resilience.

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

• Read more about SEMI Joins UK Initiative to Promote Cybersecurity Adoption

ClassOne Technology, global provider of advanced semiconductor plating tools, announced the sale of a second Solstice® S8 system to i3 Microsystems (i3M), a wholly-owned subsidiary of defense industry supplier i3 Electronics headquartered in Binghamton, NY. The eight-chambered Solstice S8 configuration includes ClassOne’s proprietary CopperMax™ chamber for advanced copper plating. The announcement was made jointly by ClassOne CEO, Byron Exarcos, and i3 VP/General Manager, Robert Nead.

"We brought in the first Solstice S8 to replace our wet benches and automate our plating processes,” said Nead. “And the tool’s high performance and flexibility have served us extremely well. With eight chambers, the Solstice is able to handle both plating and surface preparation processes. We’re now adding solvent strip and UBM etch capabilities to our first Solstice, and we are configuring our second Solstice to match. Bottom line, we've been very pleased with the Solstice and also with ClassOne's customer service, both of which are strongly supporting our ongoing growth.”

“A key feature of i3M’s Solstice S8 configuration is that it includes our proprietary CopperMax™ electroplating chamber,” said Exarcos. “This unique chamber is designed to deliver class-leading copper plating quality while at the same time reducing plating consumables costs. It gives users the ability to routinely achieve exceptional levels of copper plating feature quality and also cut copper chemistry additives costs by as much as 95%.

Solstice presently serves many of the world’s leading defense contractors and is emerging as the electroplating and wafer surface preparation system of choice for meeting the exacting requirements of the defense and aerospace industries.

The ClassOne Solstice S8 is an eight-chambered system for high-performance, fully-automated electroplating and surface preparation. The Solstice platform also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s unique Plating-Plus™ capability also enables it to handle many surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

• Read more about Defense Industry Supplier i3 Microsystems Places Repeat Order for ClassOne’s Solstice Electroplating System

SANTA ROSA, Calif., – March 23, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, has announced new Dismounted Soldier Tracking (DST) technology that determines a soldier’s precise location, even when GPS is compromised or denied.

PNI has spent seven years of internal research and development perfecting the highest-accuracy, lowest-power sensor fusion algorithms for wearables and smartphones. DST is the result of this combined expertise. DST location technology stays accurate over time and through a wide range of conditions, so its data can be trusted to deliver precise results in mission-critical scenarios.

Ubiquitous Tracking - PNI’s advanced DST inertial tracking technology provides unparalleled accuracy and offers step-by-step tracking for soldiers, both indoors and outdoors.

Unmatched Direction of Motion - DST technology determines direction of motion independent of the soldier’s body pose or dynamic movement in any direction (forward, backward, sideways).

Self-contained - No additional infrastructure required and optimized for low size, weight, power, and cost (SWaP-C). The DST module can be body worn.

“PNI has operated in the soldier-portable domain for more than thirty years and our compass technology is used in U.S. Army laser rangefinders, enhanced night vision goggles, and other mission critical applications that require high accuracy, consistency and reliability in the field,” said Robin Stoecker, vice president of sales and marketing at PNI Sensor. “We are committed to delivering world-class positioning, navigation and timing capabilities that enhance combat overmatch for modern warfighters.”

Evaluation Kit Availability
DST technology is made in the U.S.A, ITAR-free, and fully customizable to mission specifications. Engineering samples are available now. To purchase a DST evaluation kit, please contact PNI Sales or your regional PNI representative.
For product specifications and more information, visit Dismounted Soldier Tracking.

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and other mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

• Read more about PNI Sensor’s New Dismounted Soldier Tracking Technology Provides Precise Location in GPS-denied Environments