BERLIN, Germany – 15 February, 2021 – SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future. 15-19 February, the virtual event connects industry leaders and stakeholders across the entire electronics design and manufacturing value chain for the latest developments, trends, and innovations in key areas of industry growth including smart mobility, smart medtech, and MEMS and sensors. Registration is open.

At the opening day Executive Forum, international technology leaders will offer insights into the future of smart technologies as industry stakeholders gather to help shape the digital future for societal and economic prosperity.

Innovations across smart technologies such as 5G, artificial intelligence (AI) and Internet of Things (IoT) and industries including healthcare and mobility are transforming the way people work and live. The summit enables connections and partnerships while highlighting market opportunities in the digital transformation.

“While the past year brought tremendous societal and geopolitical challenges, it showcased the important contributions technology is making to improve all our lives, keeping us connected and working while accelerating the path to vaccines,” said Ajit Manocha, SEMI president and CEO. “The SEMI Technology Unites Global Summit will share insights from some of the microelectronics industry’s brightest minds on technology trends critical to advancing social and economic prosperity – and to staying ahead of the pace of digital transformation.”

Technology Unites Global Summit Highlights

• Executive Forum
  • Global thought leaders will enable connections and partnerships and illuminate market opportunities for creating a smart, sustainable future. The executive forum will feature keynotes by executives from Infineon Technologies, imec, CEA-Leti, TEL, TSMC, NXP Semiconductors, Google, Umicore, JSR Corporation, Alibaba, Comet, Edwards Vacuum, AEM and UTAC.
     
• Global Reach
  • The digital international exhibition will showcase new products and technologies while inviting interactions with a global audience.
  • Easy-to-navigate platform with opportunities for attendees to select content matching their professional interests and connect with like-minded industry experts.
     
• Programs and Hosted Sessions
  • The Technology Unites Global Summit will highlight technologies and applications across key pillars of the next wave of microelectronics industry innovation and growth including mobility, advanced packaging, medtech, fab management, manufacturing, MEMS and sensors, advocacy, and diversity and inclusion.
  • Hosted sessions will provide the latest insights in start-up best practices, heterogeneous integration, smart manufacturing processes and standards, electronic systems design (ESD), advanced technologies, hardware for next-generation computing (NGC), ALD technologies, environmental sensors, and wet-chemical surface treatments.
     
• Networking
  • Attendees will have direct access to technology leaders for answers to pressing questions.
  • Attendees will also enjoy opportunities to network with speakers, participants and customers through meet-the-expert sessions, live chats and video meetings.
     
• Workforce Development
  • Those interested in careers in microelectronics will be able to tap current job vacancies in the industry.

Registration for the Technology Unites Global Summit for on-demand viewing of all content is open until March 26, 2021. The all-in-pass provides access to the entire event including forums, pavilions and the exhibition. Students, engineers, and startups can register at a special price.

Visit www.technologyunites.org or contact [email protected] for more information.

Follow #TechnologyUnites @SEMIEurope on LinkedIn and Twitter.   

  
Technology Unites Global Summit Premium Sponsors

Platinum 
ASE Group, CyberOptics Corporation, INFICON, Infineon Technologies, MADEin4, METIS, Picosun Oy, RENA Technologies GmbH, SPTS Technologies, a KLA company

Gold
AP&S International GmbH, Beneq Oy, Edwards Vacuum, EV Group, JSR Corporation, Merck KGaA, Darmstadt, Germany, Semics Inc., SÜSS MicroTec, Tokyo Electron Limited

Silver 
Comet, Evatec AG, FUJIFILM Electronic Materials, Okmetic Oy, SPEA Automatic Test Equipment, VAT Group 

Event sponsors: Advantest, Airspace, Applied Materials, CNW, DAS Environmental Expert GmbH, DB Schenker, Fraunhofer Institute for Photonic Microsystems IPMS, imec, Infinitesima, Lam Research, Max Group, PEER Group, Pfeiffer Vacuum, Posas GmbH, TRUMPF Hüttinger, Trymax Semiconductor Equipment BV, Watlow

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

• Read more about SEMI Technology Unites Global Summit Opens with Executive Forum, Digital Transformation, Security and Sustainability in Spotlight

ECM Lab Solutions is a new offer from the ECM Group, dedicated to laboratories, research centers and universities. This offer combines equipment from three companies and four brands: ECM Technologies, ECM Greentech, SEMCO Technologies & Cyberstar.

With more than 90 years of experience in manufacturing industrial equipment, this ECM Group offer highlights the diverse and flexbile nature of ECM's technology and expertise by transitioning from heat treating steels and automotive applications to a wide range of research and specialty fields.

With advanced technologies for crystal growth, vacuum heat treatment and chemical vapor deposition, ECM Lab Solutions offers reliable solutions for semiconductor, solar, medical and other mechanical applications.

• Read more about New offer dedicated to research from the ECM Group - ECM Lab Solutions

ClassOne Technology, global supplier of high-performance semiconductor electroplating and surface preparation systems, announced the sale of its Solstice® S8 system to South Korean chip manufacturer, Point Engineering Co. The eight-chambered Solstice plating tool will be installed at Point Engineering’s manufacturing facility in Asan City, South Korea. The announcement was made by ClassOne‘s CEO, Byron Exarcos, and PEC‘s CEO, Bum-Mo Ahn.

"Our products call for unique manufacturing approaches,” said Bum-Mo. “In addition to copper, we require plating of palladium cobalt alloy into highly variant features; and this plating is done on a proprietary substrate. We needed a volume-manufacturing platform that has the necessary flexibility without sacrificing reliability. The Solstice S8 covers these needs very well, and it also has a compact footprint to conserve fab space."

Exarcos pointed out that Point Engineering's new Solstice configuration includes a CopperMax™ processing chamber, a ClassOne-proprietary feature specifically designed to optimize copper plating. The chamber enables consistent high-quality, high-rate copper plating, while maximizing uptime and dramatically reducing bottom-line operating costs.

“Point Engineering has gained considerable respect in the industry for its semiconductor parts, which frequently go into probe pins and micro power inductors," said Exarcos. “In today’s semiconductor industry, we’re seeing that new product categories often drive the need for novel approaches in manufacturing. Point Engineering’s groundbreaking new products demand a process-experienced equipment provider and a flexible platform. We’re gratified that Point Engineering has chosen ClassOne and Solstice to partner with them on their next-generation products.”

The Solstice S8 is an 8-chambered system designed and built by ClassOne for high-performance, fully-automated electroplating and surface preparation, specifically for ≤200mm semiconductor wafer processing. The Solstice series also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, Solstice systems also provide Plating-Plus™ surface preparation capabilities, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility allows users to streamline wafer production and increase cost efficiencies by reducing the number of different processing tools required in the fab.

• Read more about South Korean Point Engineering Chooses ClassOne’s Solstice S8 for Advanced Semiconductor Plating

Villach, Austria, 20 Jan 2021 — mechatronic systemtechnik, a leading global supplier of automation equipment for semiconductor wafer handling, today announces the availability of the mWL.cs mechatronic calotte loader. A fully automated stand-alone system for transferring wafers between cassettes and calottes, the mWL.cs provides integrated device manufacturers (IDMs) an opportunity to increase yield and improve process traceability at a high throughput.

Evaporation process tools often utilize spherical carriers and rings to meet uniformity and defectivity targets. However, the design of these tools has made it challenging to introduce automated wafer handling in this step of the manufacturing process. IDMs invariably default to manual wafer loading, which has resulted in yield degradation and an increased risk for misprocessing.

“Automating the wafer loading and unloading system for evaporation type metal deposition is a step that bears much potential,” shared Stefan Detterbeck, Sales Director. “By eliminating human error from the equation, our system enables manufacturers to achieve higher yield and reduce damage to wafers. Enhanced process traceability also supports quality improvement measures to meet the conformity requirements of critical customer industries.”

Key features of the mWL.cs mechatronic calotte loader include:
 Superior handling accuracy and repeatability — hand-off position measurement and auto-teaching capabilities (About mechatronic systemtechnik
mechatronic systemtechnik, headquartered in Villach, Austria, is a leading global supplier of automation equipment for semiconductor wafer handling. Founded in 1998, the company specializes in addressing the industry’s needs for reliable, safe, and fully automated handling of non-standard substrates — including stacked, thin, or warped wafers, and also eWLP, MEMS, TAIKO, bumped, and film frames. Through a modular approach, mechatronic offers its customers cost-efficient handling systems that feature its proprietary technology. These solutions are capable of accommodating a wide range of substrate types and their specific characteristics. Major OEMs and fabrication plants across the globe rely on mechatronic’s unique solutions for some of their most complex wafer handling needs.

For more information, please visit www.mechatronic.at or connect with us on social media:

LinkedIn: www.linkedin.com/company/mechatronic-systemtechnik
YouTube: www.youtube.com/user/MechatronicAustria

mechatronic systemtechnik is a subsidiary of Accuron Industrial Technologies.

Editorial Contact:

Ms Gracine Wee | e: [email protected] | t: +65 6220 4787

• Read more about mechatronic systemtechnik Unveils Proprietary Calotte Loader mWL.cs

HAYWARD, CA, JANUARY 06, 2021: Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and aerospace industries, announced today the appointment of Joseph Montano as President. Reporting directly to CEO Jeanne Beacham, Joe will serve a critical role in the company’s leadership team as Delphon continues to grow through new product innovations and future acquisitions.

Joe has spent more than 25 years in the electronics and electronic materials technology segments. He has an extensive technical and commercial background, with experience spanning from the R&D bench to executive management. Most recently Joe served as Sr. Vice President of Sales and Marketing at Intermolecular where he was instrumental in returning the company to profitability and orchestrating its acquisition by Merck KGaA, Darmstadt, Germany in 2019. Prior to working for Intermolecular, Joe was the Global Business Director for MacDermid Enthone’s Advanced Electronics division. Joe holds a Bachelor of Science degree in Chemical Engineering from Northeastern University in Boston.

“I am very excited to have Joe join us. As Delphon continues to grow and expand into new markets, I am confident that Joe’s extensive experience in semiconductor materials and business development will be an asset to our leadership team,” says Jeanne Beacham, Delphon CEO.

About Delphon
Delphon provides innovative polymer and adhesive solutions to the semiconductor, photonics, medical and aerospace industries. Through its Gel-Pak®, UltraTape®, and TouchMark divisions, the company has developed breakthrough products that provide solutions for manufacturing processes in a wide range of markets. Customers from around the globe know that they can trust these products even in the most critical environments.

For more information, please contact Jennifer Dossee Nunes, Sr. Director of Marketing, at [email protected] or visit www.delphon.com

• Read more about Delphon Announces New President Joe Montano

ESPOO, Finland, 16th December 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, has established a new business area, PicoMedical, for medical and healthcare ALD segments.

The newly established business area will reinforce and streamline Picosun Group’s activities in the medical field. These activities include product and solutions development for medical ALD applications, driving the profitable growth from the medical segment, and increasing the Picosun brand awareness in the healthcare and medical industries. PicoMedical will also manage the Group’s extensive medical ALD patent portfolio of 18 patent families, and coordinate and execute research activities and collaboration projects in the medical field.

Picosun has appointed Mr. Juhani Taskinen to lead the PicoMedical business area. The appointment was made in the Picosun Board meeting. Mr. Taskinen will start in his position 5th January 2021. Mr. Taskinen has extensive international career and background in the medical field, and proven track record in driving profitable business growth and leading successful collaboration activities in these industries. He has held various leading general management, sales and marketing, and business development positions in pharma, biotech, and healthcare companies such as Johnson & Johnson, Merck KGaA, Darmstadt, Germany, and Abbott.

“Right now, ALD is disrupting healthcare technologies just like it did to microelectronics in the early 2000’s. Picosun is the trailblazer and spearhead in medical ALD solutions. I’m happy to start in my new position as the head of Picosun’s PicoMedical business area to speed this company into even greater success in the healthcare segment,” states Mr. Taskinen.

“It’s great to welcome Mr. Juhani Taskinen into our team. ALD has amazing possibilities to offer to the healthcare industries. We are sure that with Mr. Taskinen’s skills, background and expertise we can truly make several new breakthroughs in this field,” continues Mr. Jussi Rautee, CEO of Picosun Group.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

• Read more about Juhani Taskinen to lead Picosun’s new PicoMedical business area

Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® S8 electroplating system to a major semiconductor foundry service based in Taiwan. This is the second S8 to be purchased by the company. The 8-chambered Solstice platform is designed specifically for ≤200mm wafer processing. The new tool will be used to produce Heterojunction Bipolar Transistors (HBTs) and Vertical Cavity Surface Emitting Lasers (VCSELs). The announcement was made by ClassOne’s CEO, Byron Exarcos, and Senior Technology Director, John Ghekiere.

“This user is a high-volume semiconductor manufacturer,” said Ghekiere. "So they are interested not only in the Solstice's superior plating performance, but also in its reliable, fully-automated high throughput. The tool is being used for wafer level packaging processes, including copper pillar and solder bump electroplating.”

“This customer has been using our Solstice S8 electroplating equipment for several years now," said Exarcos. “The tool has been fully qualified for their processes and is meeting their aggressive performance goals. Now, their business is rapidly expanding, and they've chosen to bring in a second S8 to support that growth. We're actually seeing this pattern across the industry today. As Solstice is becoming embedded into customer processes, the repeat orders are coming in with increased frequency. We're very gratified by this vote of confidence in the Solstice and in ClassOne.”

Ghekiere noted that today’s HBT devices are used in many ultrafast circuits and those requiring high power efficiency, including next-generation RF power amplifiers, 5G cellular phones, etc. VCSELs are used in 2D and 3D imaging, facial recognition, smart-glasses, fiber optic communications, LiDAR, and much more.

The ClassOne Solstice S8 is an 8-chamber system for high-performance, fully-automated electroplating and surface preparation. The Solstice series, which was specifically designed for ≤200mm wafer processing, also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s special Plating-Plus™ capabilities enable it to handle a number of other surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

About ClassOne Technology
ClassOne Technology (classone.com) provides innovative wet-chemical equipment solutions, including electroplaters, spin-rinse-dryers, spray solvent tools and more. The company focuses on making advanced processing technology available to users of ≤200mm wafers, such as compound semiconductor and many emerging markets, who traditionally have been underserved by the larger equipment manufacturers. ClassOne Technology’s equipment has become known for its unique combination of advanced performance, flexibility and cost-efficiency Based in Kalispell, Montana, ClassOne Technology is built upon decades of experience from industry veterans creating high-performance semiconductor equipment. ClassOne Technology is a sister company to ClassOne Equipment (ClassOneEquipment.com), the industry’s premier provider of refurbished name-brand processing tools, with over 2,500 systems installed worldwide.

For more information, contact:
Byron Exarcos
ClassOne Technology
109 Cooperative Way
Kalispell, MT 59901
tel: +1 (678) 772-9086
email: [email protected]

• Read more about ClassOne Receives Repeat Order for its Solstice Electroplating System from Major Taiwanese Semiconductor Manufacturer

ST. PETERSBURG, Fla. (Dec. 3, 2020) — Plasma-Therm, a leading manufacturer of plasma-process equipment for the semiconductor industry, announced today the acquisition of OEM Group’s dry process equipment business.

With the acquisition, Plasma-Therm has acquired all original OEM licenses and intellectual property rights for SFI Endeavor, AG Heatpulse, MRC Eclipse, and Tegal brand equipment. Plasma-Therm will continue to support existing customers through spare parts and upgrades, while offering new and refurbished tools to the wider market.

“The acquisition allows Plasma-Therm’s award-winning customer service teams to support the large and global install base,” said Abdul Lateef, CEO of Plasma-Therm. “Additionally, PVD and RTP technologies align perfectly with our etch and deposition products and process solutions, which will further support the manufacturing and R&D needs and requirements of our customers.”

Michael Correra, CEO of OEM Group, said, “We are delighted to have had these outstanding products acquired by Plasma-Therm, ensuring a strong path to market for our newly developed Endeavor M series PVD platform, and the continued availability and support of the MRC Eclipse, AG Heatpulse, and Tegal products. This acquisition allows OEM Group to strategically focus on our wet chemical process and ion implant technologies.”

About Plasma-Therm
Established in 1974, Plasma-Therm is a manufacturer of advanced plasma processing equipment for specialty semiconductor markets, including advanced packaging, wireless communication, photonics, solid-state lighting, MEMS/NEMS, nanotechnology, renewable energy, data storage, photomask, and R&D. Plasma-Therm offers leading etch and deposition technologies and solutions for these markets. Sales and service locations throughout North America, Europe, and Asia-Pacific meet the diverse needs of Plasma-Therm’s global customer base. Visit www.plasmatherm.com for more information.

About OEM Group
Established in 1999, OEM Group is a semiconductor capital equipment manufacturer and innovator in new and remanufactured 75mm – 300mm tools, spare parts, upgrades, and services. We serve the LED, MEMS, Wireless, Power, Energy Harvesting, WLP, Data Storage, and Logic markets. OEM Group's current portfolio of products includes the Semitool & Cintillio Spray Ozone Tool, Spray Acid Tool, and Spray Solvent Tool, Spin Rinse Dryer and Storm, Varian Implant, and AMAT P5000 CVD & Etch.

• Read more about Plasma-Therm Announces Acquisition of OEM Group PVD, RTP and Etch Business

ESPOO, Finland, 2nd December 2020 – Picosun Group, leading provider of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for industrial manufacturing, presents PicoOS™, the new, full stack operating system and process control software for PICOSUN® ALD equipment.

“PicoOS™ brings PICOSUN® ALD equipment control to the modern era. It is designed for wafer fabs and industrial environments where transition to Industry 4.0 is ongoing. Data-driven PicoOS™ enables future production solutions where machine learning, artificial intelligence, internet-of-things, and other new digital inventions are utilized for optimum industrial efficiency,” says Dr. Jani Kivioja, CTO of Picosun Group.

Picosun’s proprietary PicoOS™ software combines individual ALD module, wafer handling and transfer system, and instrumentation control under one common graphical HMI (human-machine interface). This ensures easy, intuitive and user-friendly operation, maintenance, and configuration of the whole PICOSUN® ALD cluster.

PicoOS™ enables full factory integration via SECS/GEM protocol, process and system data logging down to 20 ms rate, and real-time export of all data for continuous monitoring and further analysis.

PicoOS™ operating system is specifically developed by Picosun’s own in-house software team for the company’s fully automated production ALD systems Morpher and Sprinter, and it will be implemented in all future PICOSUN® ALD tool platforms.

“PicoOS™ is designed to ensure the highest control precision and accuracy, the fastest service times, and the best user experience for our customers. Having in-house control over all features and sub-components of our PICOSUN® ALD solutions is a key part of our holistic service model,” continues Kivioja.

PicoOS™ has freely configurable and scalable editor for ALD process recipe and processing job creation and storage, and recipes can be edited or new ones created any time during the ALD system operation. Configurable user levels and safety logic, instrumentation and interlocks guarantee safe use in day-to-day operations, and allow full access for tool management in maintenance situations. Maintenance procedures are sped up by specific clean-up and maintenance sequences inbuilt in the software.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Dr. Jani Kivioja
CTO, Picosun Group
Tel: +358 50 321 1955
Email: [email protected]
Web: www.picosun.com

• Read more about Picosun launches PicoOS™, a unified control software for PICOSUN® ALD modules and clusters