This course will stress the impace of the IC and End product requirements, i.e., smaller, better, cheaper" and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, attaching dies and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as well as emerging technologies, namely, 3-D and stacked die, and packaging reliability issues.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Engineers
Managers
Process Engineers
R&D Engineers
Sales and Application Engineers who supply packaging materials and tools
Learning Objectives
Identify the wide variety of package types and how they align with different application uses.
Understand chip interconnection technologies (such as wirebond, flip chip, or thin film) and chip encapsulation
Identify the materials and processes used in packaging.
Summarize the current state of the art packages, such as chiplets and heterogeneous packaging.
Gain a foundational understanding of what packaging is and its importance to the microelectronics industry.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
Who Should Attend
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
Learning Objectives
Upon completion of the course, participants should be able to:
Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
Identify and correctly use common semiconductor manufacturing terminology.
Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
Basic Electronics and Microelectronics
Process Nodes
Device Physics and Transistor Operation
Crystal Growth and Wafer Preparation
Advanced Transistor Technologies
Circuit Design and Layout
Wafer Processing
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Singapore: 3:00pm - 7:00pm
India: 12:30pm - 4:30pm
London: 8:00am - 12:00pm
Pricing
Members: $399
Non-Members: $449
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
Inside the Fab: An Introduction to Semiconductor Manufacturing
Virtual Training - Asia
3:00 pm - 7:00 pm
Off
Add to Calendar2026-08-17 15:00:002026-08-20 19:00:00Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia/EU)Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Singapore: 3:00pm - 7:00pmIndia: 12:30pm - 4:30pmLondon: 8:00am - 12:00pm Pricing Members: $399Non-Members: $449* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]SingaporeSEMI.org[email protected]Asia/Singaporepublic
Asia/Singapore
Register Now
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
Who Should Attend
This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.
Learning Objectives
Upon completion of the course, participants should be able to:
Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
Identify and correctly use common semiconductor manufacturing terminology.
Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
Module 1: Semiconductor Fundamentals
Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.
Module 2: Semiconductor Terminologies and Manufacturing Context
Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.
Module 3: Front-end and Back-end Semiconductor Manufacturing
Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.
Module 4: Transistors and Their Operation
Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
This course introduces key cybersecurity principles, practices, and strategies tailored for semiconductor manufacturing environments. Participants will explore foundational concepts in cybersecurity, risk management, and best practices to secure semiconductor manufacturing systems and data.
Who Should Attend
This course is designed for:
Engineers and technicians in semiconductor manufacturing
IT professionals managing manufacturing systems
System administrators are responsible for securing semiconductor equipment and networks
Individuals tasked with implementing cybersecurity strategies in industrial settings
Prerequisites
Basic understanding of semiconductor manufacturing processes
Familiarity with IT infrastructure (networks, computers, and systems)
Learning Objectives
By the end of the course, participants will:
Understand the basic principles of cybersecurity and their importance in a manufacturing environment.
Be able to assess and manage cybersecurity risks within the semiconductor manufacturing systems.
Learn practical strategies for implementing cybersecurity measures to protect critical infrastructure, devices, and data.
Gain insights into responding to and recovering from cybersecurity incidents.
Be prepared to develop and promote a strong security culture within their organization.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Unlock the secrets to safeguarding semiconductor manufacturing systems with this comprehensive cybersecurity course. Learn essential principles, risk management strategies, and best practices to protect critical infrastructure and data from cyber threats. Equip yourself with the knowledge to implement robust security measures and respond effectively to incidents in industrial environments.
Pricing
Members: $99
Non-Members: $129
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
Implementing Basic Cybersecurity Principles in Semiconductor Manufacturing
Virtual Training - Americas & EU
8:00 am - 12:00 pm
Off
Add to Calendar2026-07-13 08:00:002026-07-13 12:00:00Implementing Basic Cybersecurity Principles in Semiconductor Manufacturing (Virtual Training (Americas & EU) Unlock the secrets to safeguarding semiconductor manufacturing systems with this comprehensive cybersecurity course. Learn essential principles, risk management strategies, and best practices to protect critical infrastructure and data from cyber threats. Equip yourself with the knowledge to implement robust security measures and respond effectively to incidents in industrial environments.PricingMembers: $99Non-Members: $129* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Now
This three-day virtual workshop (4 hours a day) provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps. Some technical background from attendees will improve the workshop learning.
The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors.
The second day will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes.
The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics. We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung.
After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Process Technicians
Material Engineers
Process Engineers
Equipment Manufactures
Technical Marketing Engineers
Topics Included
Silicon wafer manufacturing
Basic operating principles of transistors and semiconductor devices
Planar, FinFET, and GAA transistor formation and design differences
Fab processes needed to form a semiconductor, including the following:
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Unlock the essentials of the semiconductor manufacturing process. We will cover science and engineering concepts needed to understand device manufacturing.
Pricing
Early Bird Pricing: $100 off
Members:$699 $599
Non-Members: $749 $649
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
Semiconductor Device and Assembly Manufacturing
Virtual Training - Americas/EU
8:00 am - 12:00 pm
Off
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America/Los_Angeles
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This course provides a practical introduction to atomic layer deposition, an essential technique in semiconductor manufacturing. You'll learn about ALD foundational concepts, including growth, advantages, measurements, and more, chemical precursors for use in ALD, selected ALD processes, area-selective deposition, and atomic layer etching. Overall, the applications and chemistry used in semiconductor processing, as they relate to ALD and ALE, are heavily discussed.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Engeineers
Managers
Process Engineers
R&D Engineers
Sales and Application Engineers who supply packaging materials and tools
Learning Objectives
Understanding foundational concepts of ALD.
Describe chemical precursors for ALD applications.
Identify selected ALD processes and their associated films and materials.
Explain area-selective deposition (ASD), and its uses.
Describe Atomic Layer Etching (ALE) concepts and understand it's relationship to ALD.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Discover how atomic-scale precision is revolutionizing semiconductor manufacturing with Atomic Layer Deposition (ALD) and Etching (ALE). Course topics include ALD foundational concepts, Chemical Precursors and Processes, and Advanced ALD Techniques.
Pricing
Early Bird Pricing $100 off
Members: $845 $745
Non-Members: $945 $845
* Group pricing for 20+ attendees: $9900 Any questions, please contact [email protected]
Fundamentals of ALD, ALE and Precursors Chemistries
Virtual Training - Americas/EU
7:30 am - 11:30 am
Off
Add to Calendar Disabled
America/Los_Angeles
Register Now
SEMI U
Off
Add to Calendar2026-05-11 00:00:002026-05-11 00:00:00ASMC - Advanced Semiconductor Manufacturing Conference SEMI-U TrainingsHilton Albany, NY United StatesSEMI.org[email protected]America/Los_AngelespublicRegister now
This course offers a solid foundation in semiconductor manufacturing, from basic concepts to advanced techniques, providing practical insights into the tools, processes, and technologies driving the industry.
Learning Objectives
Gain a comprehensive understanding of the semiconductor industry and manufacturing process, design, and eco-system of the semiconductor industry
Understand the jargon, tools, and materials used in the design and fabrication of an integrated chip
Effectively be able to communicate semiconductor manufacturing concepts with other associates and industry professionals
Course Topics
Basic Electronics and Microelectronics: Definitions of essential electronic terms/concepts and introduction to microelectronics and integrated circuits
Process Nodes: Process nodes and their impact on device performance and cost
Device Physics and Transistor Operation: Principles of device operation and transistor functionality
Crystal Growth and Wafer Preparation: Crystal growth techniques and wafer preparation processes
Advanced Transistor Technologies: FDSOI, FinFETs, and Gate-All-Around (GAA) transistors and their impact on device performance
Circuit Design and Layout: Introduction to circuit design, layout techniques, and tools
Wafer Processing: Mask Making and Lithography: Techniques and materials used in mask making and various lithographic methods (DUV, Immersion, EUV)
Clean Room Environments: Importance of clean rooms in semiconductor manufacturing and contamination issues
Etching and Cleaning Processes: Plasma and wet etching processes
Ion Implantation and Diffusion Techniques: Methods for doping and controlling diffusion in semiconductor fabrication
Deposition Techniques: RTP, CVD, ALD, and ALE techniques and their effect on device performance
Electroplating and Sputtering: Metal deposition techniques used in manufacturing
Packaging and Testing: Techniques such as wire bonding, die stacking, flip chip, and chiplets packaging, semiconductor testing processes
Metrology and Measurement Tools: Tools and methods used for precision measurement in semiconductor manufacturing
Semiconductor Industry Ecosystem: The major players in the industry
Who Should Attend
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
See what course participants had to say about this course!
"The expansive width of coverage with sufficient depth; well curated, relevant information with live references, and the open style of delivery which made the course more of a sharing than a lecture, was enjoyable."
"Denny's knowledge and ability to explain things in simplified ways was awesome!"
"I really enjoyed going over the topics and watching the in-depth videos. I also liked how we received the slide information prior to the class."
"The range of topics was perfect for an intro course."
"Denny did a great job explaining complex topics. The opportunity to ask questions directly was beneficial for the entire class. If a question couldn't be answered immediately, it was addressed by the next break at the latest."
"Thank you very much for the informative course. I appreciate the in-depth and in-detail insight in all aspects of Semiconductor Manufacturing!"
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.
Pricing
Early Bird Special - $100 off
Members:$995 $895
Non-Members: $1095 $995
* Group pricing for up to 20+ attendees: $12,900 Any questions, please contact [email protected]
Overview of Semiconductor Manufacturing
Virtual Training - Europe
8:00 am - 4:30 pm
Off
Add to Calendar2026-05-27 08:00:002026-05-28 16:30:00Overview of Semiconductor Manufacturing (Europe) Gain a comprehensive understanding of the semiconductor industry and the integrated circuit (IC) manufacturing process. This course is designed for new personnel in the field or anyone seeking a well-rounded knowledge of the tools, materials, and terminology used in semiconductor manufacturing.PricingEarly Bird Special - $100 off Members: $995 $895Non-Members: $1095 $995* Group pricing for up to 20+ attendees: $12,900Any questions, please contact [email protected]GermanySEMI.org[email protected]Europe/Berlinpublic
Europe/Berlin
Register Now
Join us for an interactive workshop focused on strengthening cybersecurity across the semiconductor manufacturing supply chain. This session will introduce the Semiconductor Manufacturing Cybersecurity Consortium (SMCC) and its standardized Semiconductor Supplier Cybersecurity Assessment (SSCA) framework, a streamlined approach to improving supply chain security assurance. Participants will gain insights into evidence mapping for compliance, explore best practices aligned with NIST’s cybersecurity functions, and engage in discussions with industry experts. Whether you are a semiconductor supplier, compliance professional, or part of the broader manufacturing ecosystem, this workshop offers a unique opportunity to shape future standards and enhance resilience in semiconductor security.
Prerequisite
Download the free SSCA framework document prior to the workshop.
Key Topics
Introduction to Semiconductor Manufacturing Cybersecurity Consortium (SMCC)
