The semiconductor market will be $1.3 trillion in 2026, $1.9 trillion in 2030, and $3.7 trillion in 2035.
The high growth of the semiconductor market is changing from being driven by generative AI to being driven by agentic AI. Physical AI will also have strong growth in the future, which will further impact the semiconductor market.
New products being developed by semiconductor companies are also allowing AI to address new applications which result in demand for more semiconductors.
The presentation will provide more details on areas of growth, and what does it mean for the semiconductor and electronics industries. And it is also important to monitor the factors that can result in a down phase of the semiconductor industry.
United States
10:00 am
-
10:05 am
Joe Stockunas
President
SEMI Americas
Welcome Remarks
10:05 am
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10:50 am
Handel Jones, PhD
CEO
International Business Strategies (IBS)
How AI is Driving the Semiconductor Market and How Semiconductors Are Supporting Growth of AI Capabilities
Global Lead for Smart Data-AI Initiative & Strategic Technology Advisor
SEMI
Joe Stockunas
President
SEMI Americas
SEMI Smart Data-AI Initiative Update and Closing Remarks
This webinar will discuss how AI is driving semiconductor market growth and shaping the future of the semiconductor and electronics industries.
AI Driving the Semiconductor Supercycle
Rising AI Demand and the Semiconductor Innovation Loop
10:00 am - 11:15 am
Off
Add to Calendar2026-07-09 10:00:002026-07-09 11:15:00AI Driving the Semiconductor Supercycle This webinar will discuss how AI is driving semiconductor market growth and shaping the future of the semiconductor and electronics industries.United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Setting the Stage: Industry Drivers & SCC Initiative Context
• Semiconductor Industry Decarbonization Challenges
• The Need for Quantified Business Cases
• SCC Initiative Background & Development Journey
• Vision for Industry Adoption & Collaboration
• Tool Architecture & Methodology
• Key Inputs & Assumptions
• Understanding the Outputs & Metrics
• Live Demonstration & Example Scenario
• Current Limitations & Future Development Opportunities
9:36 am
-
9:50 am
Jeff Rudnik
Director of Environmental Sustainability & Net Zero
ASM
Industry Use Cases & Practical Applications
• Evaluating Decarbonization Projects
• Comparing Alternative Mitigation Strategies
• Supporting Internal Investment Decisions
• Lessons Learned from Early Applications
• Opportunities for Industry Collaboration
The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.
Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool. The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.
Building the business case for emission reductions
9:00 am - 10:00 am
Off
Add to Calendar2026-06-16 09:00:002026-06-16 10:00:00SCC: Cost Benefit Calculator WebinarThe semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.Join SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool. The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scope 1.SCC members can download the Cost Benefit Calculator Report here.SEMI United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Today!
This course will stress the impace of the IC and End product requirements, i.e., smaller, better, cheaper" and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, attaching dies and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as well as emerging technologies, namely, 3-D and stacked die, and packaging reliability issues.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Engineers
Managers
Process Engineers
R&D Engineers
Sales and Application Engineers who supply packaging materials and tools
Learning Objectives
Identify the wide variety of package types and how they align with different application uses.
Understand chip interconnection technologies (such as wirebond, flip chip, or thin film) and chip encapsulation
Identify the materials and processes used in packaging.
Summarize the current state of the art packages, such as chiplets and heterogeneous packaging.
Gain a foundational understanding of what packaging is and its importance to the microelectronics industry.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
Who Should Attend
Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.
Learning Objectives
Upon completion of the course, participants should be able to:
Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
Identify and correctly use common semiconductor manufacturing terminology.
Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
Basic Electronics and Microelectronics
Process Nodes
Device Physics and Transistor Operation
Crystal Growth and Wafer Preparation
Advanced Transistor Technologies
Circuit Design and Layout
Wafer Processing
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging.
Singapore: 3:00pm - 7:00pm
India: 12:30pm - 4:30pm
London: 8:00am - 12:00pm
Pricing
Members: $399
Non-Members: $449
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]
Inside the Fab: An Introduction to Semiconductor Manufacturing
Virtual Training - Asia
3:00 pm - 7:00 pm
Off
Add to Calendar2026-08-17 15:00:002026-08-20 19:00:00Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia/EU)Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Singapore: 3:00pm - 7:00pmIndia: 12:30pm - 4:30pmLondon: 8:00am - 12:00pm Pricing Members: $399Non-Members: $449* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]SingaporeSEMI.org[email protected]Asia/Singaporepublic
Asia/Singapore
Register Now
This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs.
This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices.
Who Should Attend
This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.
Learning Objectives
Upon completion of the course, participants should be able to:
Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior.
Identify and correctly use common semiconductor manufacturing terminology.
Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
Summarize back-end manufacturing processes, including assembly, packaging, and testing.
Topics Included
Module 1: Semiconductor Fundamentals
Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.
Module 2: Semiconductor Terminologies and Manufacturing Context
Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.
Module 3: Front-end and Back-end Semiconductor Manufacturing
Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.
Module 4: Transistors and Their Operation
Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
This course introduces key cybersecurity principles, practices, and strategies tailored for semiconductor manufacturing environments. Participants will explore foundational concepts in cybersecurity, risk management, and best practices to secure semiconductor manufacturing systems and data.
Who Should Attend
This course is designed for:
Engineers and technicians in semiconductor manufacturing
IT professionals managing manufacturing systems
System administrators are responsible for securing semiconductor equipment and networks
Individuals tasked with implementing cybersecurity strategies in industrial settings
Prerequisites
Basic understanding of semiconductor manufacturing processes
Familiarity with IT infrastructure (networks, computers, and systems)
Learning Objectives
By the end of the course, participants will:
Understand the basic principles of cybersecurity and their importance in a manufacturing environment.
Be able to assess and manage cybersecurity risks within the semiconductor manufacturing systems.
Learn practical strategies for implementing cybersecurity measures to protect critical infrastructure, devices, and data.
Gain insights into responding to and recovering from cybersecurity incidents.
Be prepared to develop and promote a strong security culture within their organization.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge.
Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Unlock the secrets to safeguarding semiconductor manufacturing systems with this comprehensive cybersecurity course. Learn essential principles, risk management strategies, and best practices to protect critical infrastructure and data from cyber threats. Equip yourself with the knowledge to implement robust security measures and respond effectively to incidents in industrial environments.
Pricing
Members: $99
Non-Members: $129
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
Implementing Basic Cybersecurity Principles in Semiconductor Manufacturing
Virtual Training - Americas & EU
8:00 am - 12:00 pm
Off
Add to Calendar2026-07-13 08:00:002026-07-13 12:00:00Implementing Basic Cybersecurity Principles in Semiconductor Manufacturing (Virtual Training (Americas & EU) Unlock the secrets to safeguarding semiconductor manufacturing systems with this comprehensive cybersecurity course. Learn essential principles, risk management strategies, and best practices to protect critical infrastructure and data from cyber threats. Equip yourself with the knowledge to implement robust security measures and respond effectively to incidents in industrial environments.PricingMembers: $99Non-Members: $129* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. United StatesSEMI.org[email protected]America/Los_Angelespublic
America/Los_Angeles
Register Now
This three-day virtual workshop (4 hours a day) provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps. Some technical background from attendees will improve the workshop learning.
The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors.
The second day will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes.
The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics. We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung.
After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Process Technicians
Material Engineers
Process Engineers
Equipment Manufactures
Technical Marketing Engineers
Topics Included
Silicon wafer manufacturing
Basic operating principles of transistors and semiconductor devices
Planar, FinFET, and GAA transistor formation and design differences
Fab processes needed to form a semiconductor, including the following:
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Unlock the essentials of the semiconductor manufacturing process. We will cover science and engineering concepts needed to understand device manufacturing.
Pricing
Early Bird Pricing: $100 off
Members:$699 $599
Non-Members: $749 $649
* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].
Semiconductor Device and Assembly Manufacturing
Virtual Training - Americas/EU
8:00 am - 12:00 pm
Off
Add to Calendar Disabled
America/Los_Angeles
Register Now
This course provides a practical introduction to atomic layer deposition, an essential technique in semiconductor manufacturing. You'll learn about ALD foundational concepts, including growth, advantages, measurements, and more, chemical precursors for use in ALD, selected ALD processes, area-selective deposition, and atomic layer etching. Overall, the applications and chemistry used in semiconductor processing, as they relate to ALD and ALE, are heavily discussed.
Who Should Attend
This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:
Engeineers
Managers
Process Engineers
R&D Engineers
Sales and Application Engineers who supply packaging materials and tools
Learning Objectives
Understanding foundational concepts of ALD.
Describe chemical precursors for ALD applications.
Identify selected ALD processes and their associated films and materials.
Explain area-selective deposition (ASD), and its uses.
Describe Atomic Layer Etching (ALE) concepts and understand it's relationship to ALD.
Important Information
Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge.
Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.
Discover how atomic-scale precision is revolutionizing semiconductor manufacturing with Atomic Layer Deposition (ALD) and Etching (ALE). Course topics include ALD foundational concepts, Chemical Precursors and Processes, and Advanced ALD Techniques.
Pricing
Early Bird Pricing $100 off
Members: $845 $745
Non-Members: $945 $845
* Group pricing for 20+ attendees: $9900 Any questions, please contact [email protected]
Fundamentals of ALD, ALE and Precursors Chemistries
Virtual Training - Americas/EU
7:30 am - 11:30 am
Off
Add to Calendar Disabled
America/Los_Angeles
Register Now
SEMI U
Off
Add to Calendar2026-05-11 00:00:002026-05-11 00:00:00ASMC - Advanced Semiconductor Manufacturing Conference SEMI-U TrainingsHilton Albany, NY United StatesSEMI.org[email protected]America/Los_AngelespublicRegister now
