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Training

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Training
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United States Understanding Training

Course Description

The first part of the course provides a brief overview of semiconductor design and fabrication steps, encompassing IC design techniques, all wafer processing steps, assembly, and packaging. It delves into semiconductor jargon in laypeople terms, and various substrate types such as Si, SiGe, FDSOI, GaAs, SiC, GaN. Additionally, it discusses different types of transistors like pMOS, nMOS, Bipolar, BiCMOS, CMOS, FinFets, and GAA and their evolution and what applications they are used in.
 
The second part of the course focuses on semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.  Addresses the fastest-growing semiconductor markets based on geographic locations and applications, identifies semiconductor competitors/customers, and discusses major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Digital TV, Radio, Automotive, MEMS, and Emerging Technology & Impact on Industry.

Learning Objectives

  • Understand the fundamental principles and theories semiconductor technology.
  • Communicate with other associates and understand wafer processing steps.
  • Understand semiconductor business aspects such as silicon economics, wafer processing costs, semiconductor revenue forecasts, driving forces in the industry, top semiconductor IDMs, market competitors based on market share, OEMs, foundries, top tool vendors, and Fabless companies.
  • Review the semiconductor eco-system as it relates to design and fabrication of a semiconductor device.
  • Gain knowledge of major semiconductor markets like Automotive, PC, Mobile, Memory, Wireless, Cell phones, Consumer, Gaming, AI, IoT, Automotive, MEMS, and Emerging Technology & Impact on Industry.
  • Demonstrate effective communication skills through written reports, presentations, and discussions related to semiconductor subjects.
  • Collaborate effectively with peers in group projects or discussions regarding semiconductor subjects.
  • Analyze and evaluate research literature in semiconductor technology.
  • Develop critical thinking and problem-solving skills applicable to semiconductor technology.

Who Should Attend

This course is suitable for anyone seeking a better understanding of the semiconductor industry, market leaders, terminology, business, and the semiconductor ecosystem.

Instructor

Denny Frye 

PT International, LLC

Instructor Bio
 

Testimonials 

See what course participants had to say about this course!

  • "Denny Frye knows so much about the history of the semiconductor industry that he was able to tie together many different industries and technologies that I have heard about but never knew how they were connected."
  • "Great overview of the semiconductor industry & market."
  • "This was a very detailed course on many facets of the industry, would recommend!"
  • "It was a great mix of technical and overview of the key players in the market!"
  • "Good blend on technical and commercial topics."
  • "Excellent introduction to the semiconductor world."
  • "Great session on the understanding of the semiconductor industry in a nutshell."

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support. 

United States

SEMI U

Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.

Pricing

Early Bird Pricing $100 off  

  • Members: $845 $745
  • Non-Members: $945 $845

* Group pricing for 20+ attendees: $9900
Any questions, please contact [email protected]

8:00 am - 5:00 pm Off Add to Calendar 2026-08-18 08:00:00 2026-08-18 17:00:00 Understanding Semiconductor Technology and Business (Americas) Embark on a journey through semiconductor design, manufacturing, and business in this illuminating course. Explore IC design techniques, transistor evolution, and market dynamics. Delve into substrate types and industry economics, discovering the fastest-growing markets and key players shaping the semiconductor landscape.PricingEarly Bird Pricing $100 off  Members: $845 $745Non-Members: $945 $845* Group pricing for 20+ attendees: $9900Any questions, please contact [email protected] United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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Registration

Registration is free

Webinar Contact: Krish Raghunath: [email protected] 

Register Now SEMI_IBS_Webinar_26 360x317_final Training

The semiconductor market will be $1.3 trillion in 2026, $1.9 trillion in 2030, and $3.7 trillion in 2035.

The high growth of the semiconductor market is changing from being driven by generative AI to being driven by agentic AI. Physical AI will also have strong growth in the future, which will further impact the semiconductor market.

New products being developed by semiconductor companies are also allowing AI to address new applications which result in demand for more semiconductors.

The presentation will provide more details on areas of growth, and what does it mean for the semiconductor and electronics industries. And it is also important to monitor the factors that can result in a down phase of the semiconductor industry.

United States

10:00 am - 10:05 am
Joe Stockunas
Joe Stockunas
President
SEMI Americas

Welcome Remarks

10:05 am - 10:50 am
Handel Jones
Handel Jones, PhD
CEO
International Business Strategies (IBS)

About IBS

10:50 am - 11:05 am

Q&A

11:05 am - 11:15 am
Pushkar Apte
Pushkar Apte
Strategic Technology Advisor
SEMI
Joe Stockunas
Joe Stockunas
President
SEMI Americas

AI Update and Closing Remarks

This webinar will discuss how AI is driving semiconductor market growth and shaping the future of the semiconductor and electronics industries.

10:00 am - 11:15 am Off Add to Calendar 2026-07-09 10:00:00 2026-07-09 11:15:00 AI Driving the Semiconductor Supercycle This webinar will discuss how AI is driving semiconductor market growth and shaping the future of the semiconductor and electronics industries. United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
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Belgium China France Germany India Ireland Italy Japan Malaysia Singapore South Korea Taiwan United States Vietnam Download the white paper Cost Benefit Calc cropped for events page Business Technical Training
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SEMI
United States

9:00 am - 9:15 pm
Peilun Sun headshot
Peilun Sun
Consortium Manager
SEMI

Setting the Stage: Industry Drivers & SCC Initiative Context

• Semiconductor Industry Decarbonization Challenges
• The Need for Quantified Business Cases
• SCC Initiative Background & Development Journey
• Vision for Industry Adoption & Collaboration

9:16 am - 9:34 am
Ben Gross Headshot
Ben Gross
Director DTMS - Sustainability
Applied Materials

SCC Cost-Benefit Calculator Overview & Walkthrough

• Tool Architecture & Methodology
• Key Inputs & Assumptions
• Understanding the Outputs & Metrics
• Live Demonstration & Example Scenario
• Current Limitations & Future Development Opportunities

9:36 am - 9:50 am
Jeff Rudnik Headshot
Jeff Rudnik
Director of Environmental Sustainability & Net Zero
ASM

Industry Use Cases & Practical Applications

• Evaluating Decarbonization Projects
• Comparing Alternative Mitigation Strategies
• Supporting Internal Investment Decisions
• Lessons Learned from Early Applications
• Opportunities for Industry Collaboration

9:51 am - 10:00 am

Open Discussion & Q&A

• Audience Questions
• Feedback & Enhancement Opportunities
• Next Steps & SCC Engagement Opportunity

Smart MFG Sustainability

The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.

Join the SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scrope 1.

SCC members can download the Cost Benefit Calculator Report here.

9:00 am - 10:00 am Off Add to Calendar 2026-06-16 09:00:00 2026-06-16 10:00:00 SCC: Cost Benefit Calculator Webinar The semiconductor industry is under increasing pressure to decarbonize its operations, particularly with regard to Scope 1 emissions — direct greenhouse gas emissions (GHG) from owned or controlled sources. Yet many companies face a persistent challenge: how to make a clear, consistent, and financially credible case for emissions reduction investments. To help address this need, the Semiconductor Climate Consortium (SCC) has developed a Cost-Benefit Calculator — a simplified and flexible tool that offers a structured starting point for evaluating carbon emissions reduction projects. The calculator enables users to estimate the Net Present Cost (NPC) per ton of CO₂ equivalent emissions reduction, helping to translate environmental impact into business-relevant terms.Join the SEMI's Semiconductor Climate Consortium (SCC) Scope 1 Working Group and document authors for a webinar discussing their journey creating the Cost-Benefit Calculator and outlining the use cases for this tool.  The Cost-Benefit Calculator is a functional spreadsheet with built in report creation tools. For business managers who need to calculate emissions for Scrope 1.SCC members can download the Cost Benefit Calculator Report here. SEMI United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Today!
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China India Malaysia Singapore South Korea Taiwan Vietnam Reshaping Moore's Law with Advanced Packagin4 Training
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Course Description 

This workshop explores how advanced packaging is redefining the trajectory of Moore's Law. Participants will gain insight into cutting-edge approaches, such as heterogeneous integration and chiplet architectures, that enable continued performance growth beyond traditional scaling limits. 

We will delve into key packaging, including wafer-level packaging, fan-out wafer and panel-level solutions, 3D integration, and embedded packaging- highlighting how each enhances transistor density and system performance, along with the associated technical challenges. The session will also cover next-generation interconnect and bonding techniques, including thermocompression and hybrid bonding used in advanced die-stacking solutions such as SoIC-X and SoIC-P. 

In addition, the workshop will examine evolving interposer architectures (2.1D, 2.3D, 2.5D, and beyond), including platforms such as CoWoS-S, CoWoS-L, and CoWoS-R. It will also explore emerging interposer materials like glass substrates, covering their benefits, fabrication processes, technical challenges, and supply chain landscape in supporting the continued evolution of Moore's Law.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Directors
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Understand the principles in the evolution of IC packaging and how the semiconductor industry has evolved with time.
  • Understand the principles of Interconnections ranging from TAB, and Wirebond to various Flip Chip bonding, such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development.
  • Review the interposer of leadframe, ceramic, flex to BT substrates for Microelectronics packaging.
  • Explain the assembly flow and new assembly techniques from backgrinding to singulation.
  • Describe the material characterization from bulk to interfaces to reduce stress and enhance interfacial adhesion for reliability enhancement.

Course Topics

  • Advanced packaging and material characterization.
  • Packaging principles and how packaging evolves into heterogeneous packaging.
  • Packaging concepts such as Fan-in, Fan-out WLP, Embedded packaging technology, 3D packaging, TSV.
  • Wirebond and Flip chip interconnect technologies inclusive of interposer technologies, such as leadframe, ceramic, flex and substrate.
  • Assembly processes from backgrinding to singulation for QFP and FBGA packages.
  • Material characterization to select materials to reduce stress and strengthen the interface for reliability enhancement.

Instructor

Dr. Lee Teck Kheng

Institue of Technical Education

Instructor Bio

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

Singapore

SEMI U

As transistor scaling slows under the physical limits of lithography, the semiconductor industry is entering a new era-one where innovation is driven not just by node shrink, but by how chips are integrated and packaged.

Pricing
  • Members: $599
  • Non-Members: $649

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. 

8:30 am - 5:00 pm Off Add to Calendar 2026-08-03 08:30:00 2026-08-03 17:00:00 Reshaping Moore's Law with Advanced Packaging (Asia) As transistor scaling slows under the physical limits of lithography, the semiconductor industry is entering a new era-one where innovation is driven not just by node shrink, but by how chips are integrated and packaged.PricingMembers: $599Non-Members: $649* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].  Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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Belgium France Germany Ireland Italy United States Adv_Packaging Training Featured Speakers

Course Description 

This course will stress the impace of the IC and End product requirements, i.e., smaller, better, cheaper" and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, attaching dies and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as well as emerging technologies, namely, 3-D and stacked die, and packaging reliability issues.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Engineers
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Identify the wide variety of package types and how they align with different application uses.
  • Understand chip interconnection technologies (such as wirebond, flip chip, or thin film) and chip encapsulation
  • Identify the materials and processes used in packaging.
  • Summarize the current state of the art packages, such as chiplets and heterogeneous packaging.
  • Gain a foundational understanding of what packaging is and its importance to the microelectronics industry. 

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

Dr. Terry Alford
Dr. Terry Alford
PT International
- SEMI U

Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets. 

Pricing

             Early Bird Pricing $100 off

  • Members: $845   $745
  • Non-Members: $945  $845

* * Group pricing for 20+ attendees: $9900
Any questions, please contact [email protected]

7:30 am - 11:30 am Off Add to Calendar Disabled America/Los_Angeles Register Now
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India Japan Malaysia Singapore South Korea Taiwan United States Vietnam Inside the Fab Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

Who Should Attend

Anyone interested in understanding semiconductor manufacturing, including new employees, professionals in related industries, and those seeking to broaden their knowledge of the field.  

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Basic Electronics and Microelectronics
  • Process Nodes
  • Device Physics and Transistor Operation
  • Crystal Growth and Wafer Preparation
  • Advanced Transistor Technologies
  • Circuit Design and Layout
  • Wafer Processing

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Kalya Shubhakar
Kalya Shubhakar
Senior Lecturer
Biography
 

 

Singapore

- SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

Pricing                     
  • Members:  $399
  • Non-Members:  $449

* * Group pricing for 10+ attendees: $3,800 and 20+ attendees: $7,600
Any questions, please contact [email protected]

10:00 am - 2:00 pm Off Add to Calendar 2026-08-10 10:00:00 2026-08-13 14:00:00 Inside the Fab: An Introduction to Semiconductor Manufacturing (Asia) Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. Pricing                     Members:  $399Non-Members:  $449* * Group pricing for 10+ attendees: $3,800 and 20+ attendees: $7,600Any questions, please contact [email protected] Singapore SEMI.org [email protected] Asia/Singapore public Asia/Singapore Register Now
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Belgium France Germany Ireland Italy United States Wafer Training

Course Description 

This course provides a comprehensive introduction to semiconductor manufacturing, guiding participants through the complete journey from silicon fundamentals to chip fabrication and packaging. Designed for professionals new to the semiconductor industry, the course explains key concepts, terminology, devices, and manufacturing processes used in modern fabs. 

This course is divided into four modules, enabling a progressive learning experience that builds from fundamentals to manufacturing execution. Participants will gain a clear understanding of how chips are made, the role of transistors, and the steps involved in front-end manufacturing, followed by back-end assembly and packaging processes. The course also introduces the broader semiconductor ecosystem, including supply chain players, helping learners connect technical fundamentals with real-world manufacturing practices. 

Who Should Attend

This course is designed for sales and marketing professionals, as well as new employees, students, and anyone interested in gaining a knowledge about semiconductor manufacturing.   

Learning Objectives

Upon completion of the course, participants should be able to:

  • Explain fundamental semiconductor concepts, including silicon materials, doping, PN junctions, and basic device behavior. 
  • Identify and correctly use common semiconductor manufacturing terminology.
  • Outline the key steps involved in front-end wafer fabrication, from bare silicon to patterned wafers.
  • Summarize back-end manufacturing processes, including assembly, packaging, and testing.

Topics Included

  • Module 1: Semiconductor Fundamentals

    Introduces semiconductor basics, silicon materials, doping PN junctions, and core device concepts, building a foundation for understanding how electronic devices function.

  • Module 2: Semiconductor Terminologies and Manufacturing Context

    Covers essential semiconductor terminology, cleanroom concepts, supply chain players, process nodes, and packaging to help learners navigate manufacturing discussions with confidence.

  • Module 3: Front-end and Back-end Semiconductor Manufacturing

    Provides an overview of the key steps involved in front-end wafer fabrication and back-end assembly, packaging, and testing processes.

  • Module 4: Transistors and Their Operation

    Explains different types of transistors and their working principles, showing how transistors function as switches and amplifiers inside integrated circuits. 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of the training? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders 24 hours in advance and 1 hour before, with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Mayura Padmanabhan
Program Manager
SEMI
Instructor Bio

 

United States

SEMI U

Strengthen your knowledge and skills by learning about the journey from silicon fundamentals to chip fabrication and packaging. 

Pricing                     
  • Members:  $149
  • Non-Members:  $179

* * Group pricing for 10+ attendees: $1,299 and 20+ attendees: $2,399
Any questions, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles Register Now
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Belgium France Germany Ireland Italy United States Security Training

Course Description

This course introduces key cybersecurity principles, practices, and strategies tailored for semiconductor manufacturing environments. Participants will explore foundational concepts in cybersecurity, risk management, and best practices to secure semiconductor manufacturing systems and data.

Who Should Attend

This course is designed for:

  • Engineers and technicians in semiconductor manufacturing
  • IT professionals managing manufacturing systems
  • System administrators are responsible for securing semiconductor equipment and networks
  • Individuals tasked with implementing cybersecurity strategies in industrial settings

Prerequisites

  • Basic understanding of semiconductor manufacturing processes
  • Familiarity with IT infrastructure (networks, computers, and systems)

Learning Objectives

By the end of the course, participants will: 

  • Understand the basic principles of cybersecurity and their importance in a manufacturing environment.
  • Be able to assess and manage cybersecurity risks within the semiconductor manufacturing systems.
  • Learn practical strategies for implementing cybersecurity measures to protect critical infrastructure, devices, and data.
  • Gain insights into responding to and recovering from cybersecurity incidents.

  • Be prepared to develop and promote a strong security culture within their organization. 

     

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access course knowledge. 

Can't find the training link day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in an advance and an hour before with the same link. Please keep these emails on hand to access the trainings on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

United States

SEMI U Standards

Unlock the secrets to safeguarding semiconductor manufacturing systems with this comprehensive cybersecurity course. Learn essential principles, risk management strategies, and best practices to protect critical infrastructure and data from cyber threats. Equip yourself with the knowledge to implement robust security measures and respond effectively to incidents in industrial environments.

Pricing
  • Members: $ 99
  • Non-Members: $129

* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected]. 

8:00 am - 12:00 pm Off Add to Calendar 2026-07-13 08:00:00 2026-07-13 12:00:00 Implementing Basic Cybersecurity Principles in Semiconductor Manufacturing (Virtual Training (Americas & EU) Unlock the secrets to safeguarding semiconductor manufacturing systems with this comprehensive cybersecurity course. Learn essential principles, risk management strategies, and best practices to protect critical infrastructure and data from cyber threats. Equip yourself with the knowledge to implement robust security measures and respond effectively to incidents in industrial environments.PricingMembers: $ 99Non-Members: $129* For group orders with 10+ attendees, and for Students/Veterans discounted pricing, please contact [email protected].  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register Now
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Belgium France Germany Ireland Italy United States Seimconductor Device Assembly Training

Course Description 

This three-day virtual workshop (4 hours a day) provides a complete overview of the semiconductor manufacturing process. The class focuses on key process steps needed to form a functioning device. Some important science and engineering ideas needed to understand device manufacturing will be discussed. The workshop is designed for non-technical personnel needing an understanding of the fab process steps.  Some technical background from attendees will improve the workshop learning. 

The first day will overview the fab process steps with a brief summary of how a transistor functions. We will discuss how multiple transistors are connected to form a logic or memory device. We will also cover how a transistor works with respect to the physical layout of Bipolar and MOSFET transistors. 

The second day will cover key fab process steps. Ion implantation, photolithography including DUV and EUV processes, plasma processes including deposition and etch, rapid thermal processing, and wet etch processing. Specific emphasis will be given to the different wet etch processes. 

The third day of the workshop will focus on the new transistor designs, including FinFET and CFET designs. We will also cover reasons for changing the transistor design and newer materials, including tantalum, hafnium, silicon germanium, and low-k dielectrics.  We will also review roadmaps of leading companies, including TSMC, Intel, and Samsung. 

After completing the workshop, the student will be able to describe all the fabrication and assembly process steps and have an understanding of how the process steps work together to form the completed integrated circuit, in addition to an understanding of future structures.

 

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Process Technicians
  • Material Engineers
  • Process Engineers
  • Equipment Manufactures
  • Technical Marketing Engineers

Topics Included

  • Silicon wafer manufacturing
  • Basic operating principles of transistors and semiconductor devices
  • Planar, FinFET, and GAA transistor formation and design differences

  • Fab processes needed to form a semiconductor, including the following:

    • Lithography, with a focus on DUV and EUV methods
    • Etching, including wet and plasma processes
    • Deposition, thermal, plasma, electroplating deposition
    • CMP and modern CMP processes

     

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Tom Dory
ITM Consulting, Inc
Instructor Bio

United States

- SEMI U

Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets. 

Pricing         

              Early Bird Pricing: $100 off

  • Members:  $699   $599
  • Non-Members:  $749   $649

* * Group pricing for 20+ attendees: $11,500
Any questions, please contact [email protected]

8:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles Register Now
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Advanced Packaging in person Training

Course Description 

This course will stress the impace of the IC and End product requirements, i.e., smaller, better, cheaper" and their influence on the manufacturing processes. Topics include area packaging - ball grid arrays, flip chip, fanout, attaching dies and chip scale packages, and the assembly technologies - chip & wire, tape automated bonding, and flip chip, as well as emerging technologies, namely, 3-D and stacked die, and packaging reliability issues.

Who Should Attend

This course is intended for both manufacturing and R&D know-how in IC packaging professionals, including but not limited to:

  • Engeineers
  • Managers
  • Process Engineers
  • R&D Engineers
  • Sales and Application Engineers who supply packaging materials and tools

Learning Objectives

  • Identify the wide variety of package types and how they align with different application uses.
  • Understand chip interconnection technologies (such as wirebond, flip chip, or thin film) and chip encapsulation
  • Identify the materials and processes used in packaging.
  • Summarize the current state-of-the-art packages, such as chiplets and heterogeneous packaging.
  • Gain a foundational understanding of what packaging is and its importance to the microelectronics industry. 

 

Important Information

Note that only the person who registered will receive a certificate of completion. This virtual training will not be recorded. Attendees must be present to access the course knowledge. 

Can't find the training link on the day of? After you register, you will receive the link to the live training via the email address you provided. In addition, you will receive email reminders about 24 hours in advance and an hour before with the same link. Please keep these emails on hand to access the training on time. If you do not see any confirmation emails, please check your junk/spam folders before contacting SEMI U for support.

 

Featured Speakers

Dr.  Terry Alford
PT International LLC
Biography

Aloft Tempe
951 East Playa Del Norte Dr.
Meeting Room - Tactic
Tempe, AZ 85281
United States

SEMI U

Strengthen your knowledge and skills by learning about IC packaging, assembly, and package/substrate and Heterogeneous Integration & Chiplets. 

Pricing

             Early Bird Pricing $100 off

  • Members: $995   $895
  • Non-Members: $1,095   $995

* Group pricing for 20+ attendees: $9900
Any questions, please contact [email protected]

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