Explore how to garner a competitive edge in times of crisis.
Gain new strategies for customer engagement.
Build business resilience during disruption.
Access mid-year market outlook, technology trends, market indicators, and drivers to help guide business decisions.
Hear expert insights from Altimeter | Bank of America, Merrill Lynch | Cornami | Dell Technologies | Deloitte | SEMI | TechSearch International and more.
United States
8:00 am
-
8:10 am
Ajit Manocha
CEO and President
SEMI
Welcome & SEMI Survey Results
8:10 am
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8:20 am
Heidi M. Hoffman
Senior Director, Corporate Marketing
SEMI
SEMI Member Survey on COVID Response & Impact
8:20 am
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8:40 am
Sven Smit
Chairman & Director
McKinsey Global Institute
Leading Toward and Beyond the COVID Exit
8:40 am
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9:05 am
Jennie Raubacher
Global Head of Semiconductor, Clean Tech & Auto Tech Investment Banking
The demand for microelectronics surged this past year as the COVID-19 pandemic accelerated a digital transformation of the way many of us work and live.
Join your C-suite colleagues in a webinar, hosted by Ajit Manocha, President & CEO of SEMI, for an analysis of the emerging business landscape and what post-pandemic operations and opportunities will look like. Featured speakers from McKinsey & Co. and Wells Fargo Securities will share their insights on the impact of the surge and the economic policies being enacted to strengthen the worldwide economy.
This webinar is a timely forum to better gauge future demand and ongoing challenges – and how to adapt your business accordingly.
CEO Webinar Series: Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next?
8:00 am - 9:30 am
Off
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America/Los_Angeles
In the last few years, electronics packaging has rightfully emerged from the shadows of CMOS scaling to make a significant impact in high performance and mobile appliance computing.
In this course, we reviewed the key developments in this paradigm change and the implications these have on Flexible Hybrid Electronics especially the use of bare dielets, fine pitch interconnects and novel substrate materials.
The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact in the area of medical and wellness electronics. The first generation of these devices have, for most part, adapted Printed Circuit Board (PCB) technology by using thinner PCBs and assembling either thinned or thin packaged “older” generation of chips on to these platforms, typically with coarse printed wiring to connect a small number of such chips.
This approach, while immensely useful to get the field going, needs to adapt and borrow from the both silicon and advanced packaging technology trends, so that we can advance this trend to the next level. The key paradigm challenges ahead are: scaling FHE in general – this includes the adoption of dielet (chiplet) technology in more advanced CMOS nodes including edge-AI, higher performance interconnects, flexible high-density energy storage, wireless communication and advanced ergonomics and all of these at lower cost and higher reliability.
This talk addresses the challenges and outline a possible technology roadmap to achieve these goals in the next few years.
Featured Speaker Biography: Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start-up called SiBond LLC.
More recently, he has been exploring new packaging paradigms and device innovations that they may enable wafer-scale architectures, in-memory analog compute and medical engineering applications. He has published over 300 papers and holds over 75 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Fellow, an APS Fellow, an iMAPS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS and a member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award.
View this Master Class On Demand! Learn why and how new packaging paradigms like chiplets and dielets are impacting the world of flexible hybrid electronics (FHE) from one of the industry's foremost experts, Dr. Subramanian Iyer of UCLA. The course explores how these packages are packing such a punch and enabling advanced performance in a much smaller and flexible footprint.
Flexible Hybrid Electronics 2.0 based on Fan-out Wafer Packaging
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
8:00 am - 10:00 am
Off
Add to Calendar2021-05-04 08:00:002021-05-04 10:00:00ATE North America TC Chapter MeetingAutomated Test Equipment (ATE) North America TC Chapter Meeting
Date: Tuesday, May 4
Time: 8:00 AM – 10:00 AM Pacific Time
Location: Online via Web Conference
AGENDA
(subject to change)
Last updated: April 3, 2021
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here Online United StatesSEMI.org[email protected]America/Los_Angelespublic
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
PIC North America TC Chapter Spring Meeting 2021
3:00 pm - 4:30 pm
Off
Add to Calendar2021-04-26 15:00:002021-04-26 16:30:00PIC North America TC Chapter Spring Meeting 2021Physical Interfaces & Carriers
North America TC Chapter
Spring Meeting
Date: Monday, April 26, 2021
Time: 15:00-16:30 Pacific
via Virtual Meeting
AGENDA
(subject to change)
Last updated: March 26, 2021
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
Online, Pacific Time United StatesSEMI.org[email protected]America/Los_Angelespublic
PV Industrial Technology Development in Post-PERC Era Seminar
SEMI International Standards Program
PV Industrial Technology Development in Post-PERC Era Seminar
Thursday, April 22, 2021
13:30-17:00
Yiwu, China
Standards Contact information:
Isadora Jin
SEMI China
Email: [email protected]
Phone: 86.21.6027.8578
PV Industrial Technology Development in Post-PERC Era Seminar
1:30 pm - 5:00 pm
Off
Add to Calendar2021-04-22 13:30:002021-04-22 17:00:00PV Industrial Technology Development in Post-PERC Era SeminarSEMI International Standards Program
PV Industrial Technology Development in Post-PERC Era Seminar
Thursday, April 22, 2021
13:30-17:00
Yiwu, China
Standards Contact information:
Isadora Jin
SEMI China
Email: [email protected]
Phone: 86.21.6027.8578Yiwu ChinaSEMI.org[email protected]America/Los_Angelespublic
PV and PV Materials China Joint TC Chapter Spring Meeting 2021
REGISTRATION
If you are SEMI Standards program member, please register here.
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
2:00 pm - 5:00 pm
Off
Add to Calendar2021-04-14 14:00:002021-04-14 17:00:00Metrics North America TC Chapter MeetingMetrics North America TC Chapter Meeting
Wednesday, April 14, 2021
2:00 PM - 5:00 PM (Pacific Time)
Via Web Conference
AGENDA
(subject to change)
Last updated: April 13, 2021
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here Online United StatesSEMI.org[email protected]America/Los_Angelespublic
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
10:00 am - 12:30 pm
Off
Add to Calendar2021-04-07 10:00:002021-04-07 12:30:00Traceability NA TC Chapter MeetingTraceability North America TC Chapter Meeting
Date: Wednesday, April 7
Time: 10:00 AM – 12:30 PM Pacific Time
Location: Online via Web Conference
AGENDA
(subject to change)
Last updated: March 8, 2021
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here Online United StatesSEMI.org[email protected]America/Los_Angelespublic