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Online, Pacific Time
United States

Jul 12, 2021 - Jul 13, 2021 Standards 9:00 am - 6:00 pm Off Add to Calendar 2021-07-12 09:00:00 2021-07-13 18:00:00 Silicon Wafer Standards North America Summer Meetings Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public Jul 9, 2021

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Online, Pacific Time
United States

Jun 23, 2021 - Jun 24, 2021 Standards

Liquid Chemicals

North America TC Chapter 

Summer Meeting

Date: June 23-24, 2021

Time: 10:00-11:30 AM Pacific 

via Virtual Meeting

 

AGENDA

• Day 1: Wednesday, June 23
• Day 2: Thursday, June 24

(subject to change) 

Last updated: June 16, 2021 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

 

10:00 am - 11:30 am Off Add to Calendar 2021-06-23 10:00:00 2021-06-24 11:30:00 Liquid Chemicals North America TC Chapter Summer Meeting 2021 Liquid Chemicals North America TC Chapter  Summer Meeting Date: June 23-24, 2021 Time: 10:00-11:30 AM Pacific  via Virtual Meeting   AGENDA Day 1: Wednesday, June 23 Day 2: Thursday, June 24 (subject to change)  Last updated: June 16, 2021    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here   Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public Jun 16, 2021

United States

Online
United States

Jun 15, 2021 Standards

ATE North America TC Chapter 

Date: Tuesday, June 15, 2021 

Time: 8:00 AM - 10:00 AM (Pacific Time)

Online via Virtual Meeting 

 

AGENDA 

(subject to change) 

Last updated: May 15, 2021 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

Off Add to Calendar 2021-06-15 00:00:00 2021-06-15 00:00:00 ATE North America TC Chapter Meeting June 2021 ATE North America TC Chapter  Date: Tuesday, June 15, 2021  Time: 8:00 AM - 10:00 AM (Pacific Time) Online via Virtual Meeting    AGENDA  (subject to change)  Last updated: May 15, 2021    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Online United States SEMI.org [email protected] America/Los_Angeles public May 15, 2021

Japan

SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Aug 5, 2021 Standards

Physical Interfaces & Carriers Japan TC Chapter Meeting 

Date: August 5th, 2021

Time: 9:00-12:00 [JST]

via Web Conference

 

AGENDA

 

Standards Contact Information:

Hirofumi Kanno

SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5760

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

9:00 am - 12:00 pm Off Add to Calendar 2021-08-05 09:00:00 2021-08-05 12:00:00 Physical Interfaces & Carriers Japan TC Chapter Meeting Physical Interfaces & Carriers Japan TC Chapter Meeting  Date: August 5th, 2021 Time: 9:00-12:00 [JST] via Web Conference   AGENDA   Standards Contact Information: Hirofumi Kanno SEMI Japan Email: [email protected]  Phone: 81.3.3222.5760   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Jun 30, 2021 Asia/Tokyo

Japan

SEMIジャパン
市ヶ谷
1-17
千代田区 九段南, Tokyo
1020074
Japan

Oct 28, 2021 Standards

Automation Technology Japan TC Chapter Meeting

Date: October 28, 2021

Time: 13:30-17:30 [JST]

via Web Conference

 

AGENDA

 

Standards Contact Information:

Hirofumi Kanno

SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5760

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

1:30 pm - 5:30 pm Off Add to Calendar 2021-10-28 13:30:00 2021-10-28 17:30:00 Automation Technology Japan TC Chapter Meeting Automation Technology Japan TC Chapter Meeting Date: October 28, 2021 Time: 13:30-17:30 [JST] via Web Conference   AGENDA   Standards Contact Information: Hirofumi Kanno SEMI Japan Email: [email protected]  Phone: 81.3.3222.5760   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMIジャパン 市ヶ谷 1-17 千代田区 九段南, Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Oct 4, 2021 Asia/Tokyo

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Check out SEMI Products on these topics:

A Day Spent on Applying Digital Transformation Theories to your business 

SEMI Market Data Products for seeing the impact of Chip Demand

 

Recommended for You

Join us at the upcoming event, Innovation for a Transforming World Virtual Event
from July 13–14, 2021 to:

• Explore how to garner a competitive edge in times of crisis.
• Gain new strategies for customer engagement.
• Build business resilience during disruption. 
• Access mid-year market outlook, technology trends, market indicators, and drivers to help guide business decisions.
• Hear expert insights from Altimeter | Bank of America, Merrill Lynch | Cornami | Dell Technologies | Deloitte | SEMI | TechSearch International and more.

United States

Jun 2, 2021 Standards Workforce Development

The demand for microelectronics surged this past year as the COVID-19 pandemic accelerated a digital transformation of the way many of us work and live.

Join your C-suite colleagues in a webinar, hosted by Ajit Manocha, President & CEO of SEMI, for an analysis of the emerging business landscape and what post-pandemic operations and opportunities will look like. Featured speakers from McKinsey & Co. and Wells Fargo Securities will share their insights on the impact of the surge and the economic policies being enacted to strengthen the worldwide economy.

This webinar is a timely forum to better gauge future demand and ongoing challenges – and how to adapt your business accordingly.

CEO Webinar Series: Surging Chip Demand, Digital Transformation, and the Pandemic – What’s Next?

8:00 am - 9:30 am Off Add to Calendar Disabled May 28, 2021 America/Los_Angeles

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

Flexible Hybrid Master Classes are offered on many topics!  Visit this page for entire list and links to more detailed information on each one.

Watch Now

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OVERVIEW

In the last few years, electronics packaging has rightfully emerged from the shadows of CMOS scaling to make a significant impact in high performance and mobile appliance computing.  

In this course, we reviewed the key developments in this paradigm change and the implications these have on Flexible Hybrid Electronics especially the use of bare dielets, fine pitch interconnects and novel substrate materials.

The area of Flexible Hybrid Electronics (FHE) has also developed and is making a significant impact in the area of medical and wellness electronics.  The first generation of these devices have, for most part, adapted Printed Circuit Board (PCB) technology by using thinner PCBs and assembling either thinned or thin packaged “older” generation of chips on to these platforms, typically with coarse printed wiring to connect a small number of such chips.

This approach, while immensely useful to get  the field going, needs to adapt and borrow from the both silicon and advanced packaging technology trends, so that we can advance this trend to the next level. The key paradigm challenges ahead are: scaling  FHE in general – this includes the adoption of dielet (chiplet) technology in more advanced CMOS nodes including edge-AI, higher performance interconnects, flexible high-density energy storage, wireless communication and advanced ergonomics and all of these at lower cost and higher reliability.

This talk addresses the challenges and outline a possible technology roadmap to achieve these goals in the next few years.

Featured Speaker Biography: Subramanian S. Iyer (Subu) is Distinguished Professor and holds the Charles P. Reames Endowed Chair in the Electrical Engineering Department and a joint appointment in the Materials Science and Engineering Department at the University of California at Los Angeles. He is Director of the Center for Heterogeneous Integration and Performance Scaling (CHIPS). Prior to that he was an IBM Fellow. His key technical contributions have been the development of the world’s first SiGe base HBT, Salicide, electrical fuses, embedded DRAM and 45nm technology node used to make the first generation of truly low power portable devices as well as the first commercial interposer and 3D integrated products. He also was among the first to commercialize bonded SOI for CMOS applications through a start-up called SiBond LLC.

More recently, he has been exploring new packaging paradigms and device innovations that they may enable wafer-scale architectures, in-memory analog compute and medical engineering applications. He has published over 300 papers and holds over 75 patents. He has received several outstanding technical achievements and corporate awards at IBM. He is an IEEE Fellow, an APS Fellow, an iMAPS Fellow and a Distinguished Lecturer of the IEEE EDS and EPS and a member of the Board of Governors of IEEE EPS. He is also a Fellow of the National Academy of Inventors. He is a Distinguished Alumnus of IIT Bombay and received the IEEE Daniel Noble Medal for emerging technologies in 2012 and the 2020 iMAPS Daniel C. Hughes Jr Memorial award.

Read More About Dr. Subramanian Iyer

On-Demand, Online
United States

Subramanian S. Iyer, PhD

Distinguished Chancellor's Professor & Charles P. Reames Endowed Chair

UCLA

Jun 30, 2021 - Jun 30, 2022 FlexTech Standards

View this Master Class On Demand!  Learn why and how new packaging paradigms like chiplets and dielets are impacting the world of flexible hybrid electronics (FHE) from one of the industry's foremost experts, Dr. Subramanian Iyer of UCLA.  The course explores how these packages are packing such a punch and enabling advanced performance in a much smaller and flexible footprint.

Flexible Hybrid Electronics 2.0 based on Fan-out Wafer Packaging

A Flexible Electronics Master Class On Demand

10:00 am - 12:00 pm Off Add to Calendar Disabled Jan 26, 2026

Taiwan

East District, Hsinchu City
Taiwan

Oct 1, 2021 Standards

Due to process ballots adjudication, Co-chair considers to hold the PV Taiwan TC Chapter meeting on Oct. 1. 

Friday, Oct. 1, 2021

Virtual / OVTCCM

14:00-16:00 (Taiwan Time)

 

 

Standards Contact Information:

Cher Wu 吳琇君

Senior Executive Consultant | Standards

SEMI Taiwan

+886-933-976766

[email protected]

2:00 pm - 4:00 pm Off Add to Calendar 2021-10-01 14:00:00 2021-10-01 16:00:00 Photovoltaic Taiwan TC Chapter Meeting Due to process ballots adjudication, Co-chair considers to hold the PV Taiwan TC Chapter meeting on Oct. 1.  Friday, Oct. 1, 2021 Virtual / OVTCCM 14:00-16:00 (Taiwan Time)   PV TC Meeting Agenda_20211001.pdf   Standards Contact Information: Cher Wu 吳琇君 Senior Executive Consultant | Standards SEMI Taiwan +886-933-976766 [email protected] East District, Hsinchu City Taiwan SEMI.org [email protected] Asia/Taipei public Sep 26, 2021 Asia/Taipei

United States

Online
United States

May 4, 2021 Standards

Automated Test Equipment (ATE) North America TC Chapter Meeting

Date: Tuesday, May 4

Time: 8:00 AM – 10:00 AM Pacific Time

Location: Online via Web Conference

 

AGENDA

(subject to change) 

Last updated: April 3, 2021 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

8:00 am - 10:00 am Off Add to Calendar 2021-05-04 08:00:00 2021-05-04 10:00:00 ATE North America TC Chapter Meeting Automated Test Equipment (ATE) North America TC Chapter Meeting Date: Tuesday, May 4 Time: 8:00 AM – 10:00 AM Pacific Time Location: Online via Web Conference   AGENDA (subject to change)  Last updated: April 3, 2021    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Online United States SEMI.org [email protected] America/Los_Angeles public Apr 3, 2021

United States Standards%20.jpg

Online, Pacific Time
United States

Apr 26, 2021 Standards

Physical Interfaces & Carriers

North America TC Chapter 

Spring Meeting

Date: Monday, April 26, 2021

Time: 15:00-16:30 Pacific 

via Virtual Meeting

 

AGENDA

(subject to change) 

Last updated: March 26, 2021 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

 

PIC North America TC Chapter Spring Meeting 2021

3:00 pm - 4:30 pm Off Add to Calendar 2021-04-26 15:00:00 2021-04-26 16:30:00 PIC North America TC Chapter Spring Meeting 2021 Physical Interfaces & Carriers North America TC Chapter  Spring Meeting Date: Monday, April 26, 2021 Time: 15:00-16:30 Pacific  via Virtual Meeting   AGENDA (subject to change)  Last updated: March 26, 2021    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here    Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public Mar 26, 2021