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Standards

United States

Online, Pacific Time
United States

Standards

Traceability North America TC Chapter 

Fall Meeting 2021 

Date: Wednesday, November 17, 2021 

Time: 8:00 AM-1:00 PM Pacific 

Online via Virtual Meeting 

 

AGENDA

(subject to change) 

Last updated: November 15, 2021 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

Off Add to Calendar 2021-11-17 00:00:00 2021-11-17 00:00:00 Traceability North America TC Chapter Fall Meeting 2021 Traceability North America TC Chapter  Fall Meeting 2021  Date: Wednesday, November 17, 2021  Time: 8:00 AM-1:00 PM Pacific  Online via Virtual Meeting    AGENDA (subject to change)  Last updated: November 15, 2021    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public
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Standards Workforce Development

BIPV TASK FORCE MEETING

光伏建筑一体化(BIPV)屋顶抗风揭试验方法标准交流会

BIPV TASK FORCE MEETING

9:00 am - 5:30 pm Off Add to Calendar 2021-09-28 09:00:00 2021-09-28 17:30:00 BIPV TASK FORCE MEETING BIPV TASK FORCE MEETING 光伏建筑一体化(BIPV)屋顶抗风揭试验方法标准交流会 China SEMI.org [email protected] America/Los_Angeles public
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China

Standards Workforce Development

会议邀请:4H-SiC同质外延片工作组线上会议

4H-SiC Homoepitaxial Wafer Task Force Meeting 

 

Meeting:Link

Friday, September 17, 2021

10:00-11:30

10:00 am - 11:30 am Off Add to Calendar 2021-09-17 10:00:00 2021-09-17 11:30:00 4H-SiC Homoepitaxial Wafer Task Force Meeting 会议邀请:4H-SiC同质外延片工作组线上会议 4H-SiC Homoepitaxial Wafer Task Force Meeting    Meeting:Link Friday, September 17, 2021 10:00-11:30 China SEMI.org [email protected] America/Los_Angeles public
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Registration

Registration is free for SEMI Members.  Use your company email when registering for the system to recognize you as a member.  

Non-Member fee = $49

Contact Paul Trio at [email protected] with any questions.

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Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design?  These continue to emerge in parallel to ever shrinking semiconductor device geometries.

While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.  

To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes. 

It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.

Join us for this session for speakers and discussion on tackling some of these industry challenges.

Virtual
United States

7:30 am - 7:35 am
Paul Trio
Paul Trio
Senior Manager, Strategic Initiatives
SEMI

Welcome

7:35 am - 7:55 am
Archita Sangupta
Archita Sengupta
Sr. Technologist
Intel

IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools

Intel logo
7:55 am - 7:58 am
Robert McIntosh
Moderator
Robert McIntosh
Consultant
Enviro-Energy Solutions

Introduction to the Presentations

7:58 am - 8:13 am
Hiroyuki_Hamada_Daikin
Hiroyuki Hamada
Senior Scientist
Daikin - Chemicals Division

Contamination Control for PFA

Ashwin_Rao_Daikin
Ashwin Rao
Semiconductor Marketing Manager
Daikin - Chemicals Division

8:13 am - 8:14 am

Introduction: Ashutosh Bhabhe

8:14 am - 8:29 am
Ashutosh_Bhabhe_Entegris
Ashutosh Bhabhe
Wet Etch & Cleans Applications Manager
Entegris

Metrology: (Ideally) Enabling the What, When, How, and Where of Unknown Contamination Detection and Control

8:29 am - 8:30 am

Introduction: Fuhe Li

8:30 am - 8:45 am
Fuhe Li - Air Liquide / Balazs
Fuhe Li
Director, Advanced Materials, Thin Films and Nanoparticles
Air Liquide - Balazs

Challenges in detecting nanoparticle, NVR, native oxide, and trace metals for 5 nm and beyond processes

8:45 am - 8:46 am

Introduction: Hugh Gotts

8:46 am - 9:01 am
Hugh_Gotts_Balazs
Hugh Gotts
International Fellow, Director R&D
Air Liquide - Balazs

HMW Organic Contaminants: What, Where, How?

9:01 am - 9:02 am

Introduction: Gary Van Schooneveld

9:02 am - 9:17 am
Gary_Van_Schooneveld_CTAssociates
Gary Van Schooneveld
President
CT Associates

Advance Metrology for Particle Sizing and Identification in Ultrapure Liquids

9:17 am - 9:18 am

Introduction: Ali O Altun

9:18 am - 9:35 am
Ali_O_Altun_Unisers
Ali O Altun
Co-Founder & CEO
Unisers

On-wafer detection and characterization of organic defects with Unisers

9:35 am - 10:00 am

Open Discussion

CAST FOA SCIS Standards

New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.  

Join us for this webinar-like session to discuss best-known methods from industry leaders

7:30 am - 10:00 am Off Add to Calendar Disabled America/Los_Angeles
Japan standards
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SEMI Japan Office
市ヶ谷 九段南4-7-15
千代田区
Tokyo
1020074
Japan

Standards

FLEXIBLE HYBRID ELECTRONICS (FHE) JAPAN TC CHAPTER MEETING


Date: Friday, January, 2022 

Time: 15:00 - 17:00 [Japan Standard Time]
via Web Conference


AGENDA

 

Standards Contact Information:

Keigo Nakajima

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5863

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

3:00 pm - 5:00 pm Off Add to Calendar 2022-01-14 15:00:00 2022-01-14 17:00:00 Flexible Hybrid Electronics (FHE) Japan TC Chapter Meeting FLEXIBLE HYBRID ELECTRONICS (FHE) JAPAN TC CHAPTER MEETING Date: Friday, January, 2022  Time: 15:00 - 17:00 [Japan Standard Time] via Web Conference AGENDA   Standards Contact Information: Keigo Nakajima Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5863   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 市ヶ谷 九段南4-7-15 千代田区 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
Japan Standards
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SEMI Japan Office
九段南4-7-15
千代田区
Tokyo
1020074
Japan

Standards

TRACEABILITY JAPAN TC CHAPTER MEETING

Date: December 24, 2021

Time: 10:00-12:00 [JST]

via Web Conference

 

AGENDA

 

Standards Contact Information:

Keigo Nakajima

Coordinator, SEMI Japan

Email: [email protected] 

Phone: 81.3.3222.5863

 

NOTE:

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!

Questions? Contact your local staff coordinator: Click here

10:00 am - 12:00 pm Off Add to Calendar 2021-12-24 10:00:00 2021-12-24 12:00:00 Traceability Japan TC Chapter Meeting TRACEABILITY JAPAN TC CHAPTER MEETING Date: December 24, 2021 Time: 10:00-12:00 [JST] via Web Conference   AGENDA   Standards Contact Information: Keigo Nakajima Coordinator, SEMI Japan Email: [email protected]  Phone: 81.3.3222.5863   NOTE: Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! Questions? Contact your local staff coordinator: Click here SEMI Japan Office 九段南4-7-15 千代田区 Tokyo 1020074 Japan SEMI.org [email protected] Asia/Tokyo public Asia/Tokyo
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China

CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT Standards Workforce Development Off Add to Calendar 2021-09-24 00:00:00 2021-09-24 00:00:00 SEMI China Smart Mobility Webinar China SEMI.org [email protected] America/Los_Angeles public
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United States Standards%20.jpg

Online, Pacific Time
United States

Standards

Liquid Chemicals

North America TC Chapter

Fall Meeting

Date: Wednesday, October 6, 2021

Time: 10:00-11:30 AM Pacific 

via Virtual Meeting

 

AGENDA

(Subject to change)

Last updated: September 6, 2021

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

 

10:00 am - 11:30 am Off Add to Calendar 2021-10-06 10:00:00 2021-10-06 11:30:00 Liquid Chemicals North America TC Chapter Fall Meeting 2021 Liquid Chemicals North America TC Chapter Fall Meeting Date: Wednesday, October 6, 2021 Time: 10:00-11:30 AM Pacific  via Virtual Meeting   AGENDA (Subject to change) Last updated: September 6, 2021   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here   Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public
United States Standards%20.jpg

Online, Pacific Time
United States

Standards

MEMS/NEMS

North America TC Chapter

Fall Meeting

Date: Wednesday, September 29, 2021

Time: 1:30-2:30 PM Pacific 

via Virtual Meeting

 

AGENDA

(Subject to change)

Last updated: September 20, 2021

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here

 

1:30 pm - 2:30 pm Off Add to Calendar 2021-09-29 13:30:00 2021-09-29 14:30:00 MEMS/NEMS North America TC Chapter Fall Meeting 2021 MEMS/NEMS North America TC Chapter Fall Meeting Date: Wednesday, September 29, 2021 Time: 1:30-2:30 PM Pacific  via Virtual Meeting   AGENDA (Subject to change) Last updated: September 20, 2021   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here   Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public

SEMI Members:  $49

Use your corporate email address during log in to be recognized as a SEMI Member.

Non-Members:  $99

Students:  Free

Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code. 

Flexible Hybrid Master Classes are offered on many topics!  Visit this page for entire list and links to more detailed information on each one.

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Course Outline

  1. Flexible hybrid electronics:  definition, design, and fabrication
  2. Challenges to interface hard and soft electronic components
  3. Introduction to the IEEE Heterogeneous Integration Roadmap (HIR)
  4. Overview of inks and encapsulants
  5. Printing methods: dispense, inkjet, screen printing, multi-axis aerosol jet printing
  6. Electromechanical evaluation of printed interconnects
  7. Additive manufacturing of resistors and capacitors
  8. Highly stretchable conductors
  9. Interconnecting in the z direction - printed vias
  10. Printed RF devices and antennas
  11. Device and component placement and assembly
  12. Thinned semiconductor devices
  13. Approaches to bond devices and components to flexible substrates
  14. Concepts of operation and evaluation of performance and reliability
  15. Applications to medical and industrial sensors will be incorporated throughout

About the Instructor

Mark PoliksMark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton.  He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex.  He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus. 

His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics.  He is the recipient of the SUNY Chancellor’s Award for Excellence in Research. 

He received SEMI FLEXI awards for leadership in Technology and Education in 2009 and 2019.  He has authored over one hundred fifty technical papers and holds forty-eight US patents.   He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society (EPS) Distinguished Lecturer and an elected member of the IEEE EPS Board of Governors. 

United States

EMG FlexTech Standards

This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products.  Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.

This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.  

10:00 am - 12:00 pm Off Add to Calendar Disabled America/Los_Angeles
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