Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
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Add to Calendar2021-11-17 00:00:002021-11-17 00:00:00Traceability North America TC Chapter Fall Meeting 2021Traceability North America TC Chapter
Fall Meeting 2021
Date: Wednesday, November 17, 2021
Time: 8:00 AM-1:00 PM Pacific
Online via Virtual Meeting
AGENDA
(subject to change)
Last updated: November 15, 2021
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here Online, Pacific Time United StatesSEMI.org[email protected]America/Los_Angelespublic
9:00 am - 5:30 pm
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Add to Calendar2021-09-28 09:00:002021-09-28 17:30:00BIPV TASK FORCE MEETINGBIPV TASK FORCE MEETING
光伏建筑一体化(BIPV)屋顶抗风揭试验方法标准交流会ChinaSEMI.org[email protected]America/Los_Angelespublic
10:00 am - 11:30 am
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Add to Calendar2021-09-17 10:00:002021-09-17 11:30:004H-SiC Homoepitaxial Wafer Task Force Meeting 会议邀请:4H-SiC同质外延片工作组线上会议
4H-SiC Homoepitaxial Wafer Task Force Meeting
Meeting:Link
Friday, September 17, 2021
10:00-11:30ChinaSEMI.org[email protected]America/Los_Angelespublic
Do you sometimes feel like you are operating in the dark when dealing with the new challenges and opportunities in process and design? These continue to emerge in parallel to ever shrinking semiconductor device geometries.
While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
To detect, identify, understand the source and eliminate yield limiter defectivity are key for total wafer environment contamination characterization and control and are essential for yield enhancement to ensure the success of the latest technology nodes.
It is more imperative than ever that the semiconductor industry works together to enable improved defect detection, speciation/characterization metrology, and as needed, hybrid analytical technology for upcoming HVM readiness.
Join us for this session for speakers and discussion on tackling some of these industry challenges.
Virtual United States
7:30 am
-
7:35 am
Paul Trio
Senior Manager, Strategic Initiatives
SEMI
Welcome
7:35 am
-
7:55 am
Archita Sengupta
Sr. Technologist
Intel
IDM Perspective of Defectivity with regard to Next-Gen Metrology and Analysis Tools
New challenges and opportunities in process and design continue to emerge in parallel to ever shrinking semiconductor device geometries. While Moore’s law and beyond are driving scale reduction, the industry is facing increased process sensitivity and complexity, and is redefining on-wafer defect tolerance in terms of size and complexity.
Join us for this webinar-like session to discuss best-known methods from industry leaders
Challenges in Metrology & Analysis for Next Gen Semiconductor Industry
7:30 am - 10:00 am
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America/Los_Angeles
Flexible Hybrid Electronics (FHE) Japan TC Chapter Meeting
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
3:00 pm - 5:00 pm
Off
Add to Calendar2022-01-14 15:00:002022-01-14 17:00:00Flexible Hybrid Electronics (FHE) Japan TC Chapter MeetingFLEXIBLE HYBRID ELECTRONICS (FHE) JAPAN TC CHAPTER MEETING
Date: Friday, January, 2022
Time: 15:00 - 17:00 [Japan Standard Time]
via Web Conference
AGENDA
Standards Contact Information:
Keigo Nakajima
Coordinator, SEMI Japan
Email: [email protected]
Phone: 81.3.3222.5863
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click hereSEMI Japan Office 市ヶ谷 九段南4-7-15 千代田区 Tokyo 1020074 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
10:00 am - 12:00 pm
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Add to Calendar2021-12-24 10:00:002021-12-24 12:00:00Traceability Japan TC Chapter MeetingTRACEABILITY JAPAN TC CHAPTER MEETING
Date: December 24, 2021
Time: 10:00-12:00 [JST]
via Web Conference
AGENDA
Standards Contact Information:
Keigo Nakajima
Coordinator, SEMI Japan
Email: [email protected]
Phone: 81.3.3222.5863
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click hereSEMI Japan Office 九段南4-7-15 千代田区 Tokyo 1020074 JapanSEMI.org[email protected]Asia/Tokyopublic
Asia/Tokyo
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
10:00 am - 11:30 am
Off
Add to Calendar2021-10-06 10:00:002021-10-06 11:30:00Liquid Chemicals North America TC Chapter Fall Meeting 2021Liquid Chemicals
North America TC Chapter
Fall Meeting
Date: Wednesday, October 6, 2021
Time: 10:00-11:30 AM Pacific
via Virtual Meeting
AGENDA
(Subject to change)
Last updated: September 6, 2021
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
Online, Pacific Time United StatesSEMI.org[email protected]America/Los_Angelespublic
MEMS/NEMS North America TC Chapter Fall Meeting 2021
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
1:30 pm - 2:30 pm
Off
Add to Calendar2021-09-29 13:30:002021-09-29 14:30:00MEMS/NEMS North America TC Chapter Fall Meeting 2021MEMS/NEMS
North America TC Chapter
Fall Meeting
Date: Wednesday, September 29, 2021
Time: 1:30-2:30 PM Pacific
via Virtual Meeting
AGENDA
(Subject to change)
Last updated: September 20, 2021
NOTE:
Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.
If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!
Questions? Contact your local staff coordinator: Click here
Online, Pacific Time United StatesSEMI.org[email protected]America/Los_Angelespublic
Optimizing Design and Fabrication of FHE #9
SEMI Members: $49
Use your corporate email address during log in to be recognized as a SEMI Member.
Non-Members: $99
Students: Free
Contact Gity Samadi ([email protected]) with a picture of your student ID to receive your discount code.
Flexible Hybrid Master Classes are offered on many topics! Visit this page for entire list and links to more detailed information on each one.
Electromechanical evaluation of printed interconnects
Additive manufacturing of resistors and capacitors
Highly stretchable conductors
Interconnecting in the z direction - printed vias
Printed RF devices and antennas
Device and component placement and assembly
Thinned semiconductor devices
Approaches to bond devices and components to flexible substrates
Concepts of operation and evaluation of performance and reliability
Applications to medical and industrial sensors will be incorporated throughout
About the Instructor
Mark D. Poliks, Ph.D. is a SUNY Distinguished Professor of Engineering and Empire Innovation Professor in Systems Science and Industrial Engineering and Materials Science and Engineering at the State University of New York at Binghamton. He is director of the Center for Advanced Microelectronics Manufacturing (CAMM), a New York State Center of Advanced Technology and home to the New York Node of NextFlex. He serves as Chair of the Smart Energy Transdisciplinary Area of Excellence at the Binghamton campus.
His research is in the areas of industry relevant topics that include high performance electronics packaging, flexible hybrid electronics, medical and industrial sensors, printed RF components, materials, processing, aerosol jet printing, roll-to-roll manufacturing, in-line quality control and reliability of electronics. He is the recipient of the SUNY Chancellor’s Award for Excellence in Research.
He received SEMI FLEXI awards for leadership in Technology and Education in 2009 and 2019. He has authored over one hundred fifty technical papers and holds forty-eight US patents. He was the General Chair of the 69th IEEE ECTC and serves as a IEEE Electronics Packaging Society (EPS) Distinguished Lecturer and an elected member of the IEEE EPS Board of Governors.
This course, the 9th in the FlexTech Master Class Series, takes a deep dive into best known methods for optimizing flexible electronics into medical devices and industrial products. Our expert speaker cover the most important considerations when designing flexible and printable parts and circuits into systems or subsystems and the many approaches to consider.
This course is appropriate for those new to electronics design, as well as those familiar but looking for a refresher on the latest materials and techniques.
Optimizing Design and Fabrication of FHE for Medical and Industrial Applications
ON DEMAND
10:00 am - 12:00 pm
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America/Los_Angeles