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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://www.semiconchina.org/zh/5 Business Executive Technical
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China

- CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Off Add to Calendar 2022-06-14 00:00:00 2022-07-12 00:00:00 CSTIC 中国国际半导体技术大会 China SEMI.org [email protected] America/Los_Angeles public
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Belgium China France Germany Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam https://www.semiconchina.org/en/5 Business Executive Technical
Highlighted content

China

- CAST EMG ESD Alliance FlexTech FOA ITL MSIG SCIS SE&A SiPAT SOI Off Add to Calendar 2022-06-14 00:00:00 2022-07-12 00:00:00 China Semiconductor Technology International Conference (CSTIC) China SEMI.org [email protected] America/Los_Angeles public
Event format

How and when State-of-the-Art Si-Photonics will replace chip-to-chip interconnect in VLSI

Years ago, we used optocouplers to interface various boards or actuators. Today, we have transceivers capable of 100GbE to 400GbE and beyond; all in a small mechanical housing. With the increase of data flow for cloud computing and 5G, the industry is working to reduce cost, power, and enhance the capability of the high speed transmission for short or long distances. The efficiency of the CMOS industry using silicon photonics leads to very small in package optical chiplets around the dice (using 3D structure, multi stacking, TSV). Therefore optical I/Os and digital logic are converging to offer disruptive architecture for chips but also for system level. In this workshop, we explore state of the art of Silicon photonics and look to the future with a debate to understand "When will silicon photonics supplant copper interfaces for VLSI and beyond for datatcom?"

ABSTRACTS

PRESENTATIONS

Enabling SiPh packaging features to unleash next gen C2C solutions in a Wild West World

Dan Berger, Senior Director of Advanced Silicon Packaging, GLOBALFOUNDRIES (please contact [email protected] if you desire a copy) Transitioning to Integrated Optics Brad Booth, Microsoft COBO Leveraging the Benefits of Co-Packaged Silicon Photonics to Meet Future Data Center/HPC Needs Seyedi Ashkan, Senior Research Scientist, Hewlett Packard Labs Path to Co-packaged Photonic I/O for Large-scale Chip-to-Chip Interconnect Thomas Liljeberg, GM Photonic Integration, Silicon Photonics Product Division, Intel Si-Photonics Market Perspectives: From Pluggable Transceivers to Co-Packaged Switches ASIC Eric Mounier, Fellow Analyst, Yole Developpement Next-Generation Optical I/O for Multi-Tbps Applications Prof. Vladimir Stojanovic, Chief Architect, and Co-Founder, Ayar Labs Photonic Fully Integrated Circuits with large volume production capability Sylvie Menezo, CEO&CTO, SCINTIL Photonics

United States

SOI Off Add to Calendar 2020-06-12 00:00:00 2020-06-12 00:00:00 20-23 July, 2020: Silicon Photonics @ Semicon West – VIRTUAL EVENT United States SEMI.org [email protected] America/Los_Angeles public

Spanning the entire electronics value chain, SEMICON Japan 2019 will gather industry visionaries to explore strategies for creating an even smarter world as the event sets its sights on the latest developments and trends in robotics, 5G mobile communications, Smart Manufacturing, Smart cars and other Smart applications. December 11-13 at Tokyo Big Sight in Tokyo, SEMICON Japan is the largest and most influential exhibition in Japan for the electronics manufacturing supply chain. Registration for SEMICON Japan 2019 is now open.    

United States

SOI Off Add to Calendar 2019-12-07 00:00:00 2019-12-07 00:00:00 11 - 13 December 2019 - Partner Event: Japan, Tokyo - SEMICON JAPAN United States SEMI.org [email protected] America/Los_Angeles public

'@ DoubleTree by Hilton San Jose IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference On its 45th anniversary, the IEEE S3S Conference continues to grow and attract more attention from the industrial and academic arenas. The race to develop the right technology for the 5G and IoT markets is revolutionizing the semiconductor industry. With more than 20 billion smart connected devices expected by 2021, the demand on ultra-low power operation, 3D integration, millimeter-wave connectivity, computational efficiency and design flexibility is going to unprecedented edges. These aspects of technology have been covered by the IEEE S3S Conference for years, and this year is no exception. This year, the conference delivers more than 100 invited and contributed presentations throughout 20 technical sessions and a full-day short course dedicated to FDSOI circuit design.

ABSTRACT & PROGRAM

Registration

United States

SOI Off Add to Calendar 2019-10-03 00:00:00 2019-10-03 00:00:00 October 14-17, 2019 - Member Event: USA, San Jose United States SEMI.org [email protected] America/Los_Angeles public