Training day on analog, RF, high speed, millimeter wave and mixed-signal design techniques in FD-SOI technologiesOrganizer: Andreia Cathelin, STMicroelectronics Mentors: Carlos Mazuré, Giorgio Cesana, SOI Industry Consortium

World renowned professors and experts from industry delivered a series of four training sections of 1.5hrs each, dedicated to energy efficient and low power low voltage design techniques for analog, RF, high-speed, mmW and mixed-signal design. Attendees learned about design techniques that take full advantage of the unique features of FD-SOI, including body biasing capabilities, that further enhance the excellent analog/RF performances of these devices. Each section of this training day took the participants through concrete design examples that illustrate new implementation techniques enabled by FD-SOI technologies and 28nm, 22nm nodes and beyond. The design examples covered basic building blocks through SoC implementations.

TRAINING PROGRAM & ABSTRACTS

(complete decks will not be published)

Andreia Cathelin, Fellow, STMicroelectronics Crolles, France FDSOI specific design techniques for analog, RF and mmW applications    >Presentation Slide< Frank Zhang, Principal Member of Technical Staff, Globalfoundries Circuit Design Techniques in 22nm FD-SOI for 5G 28GHz Applications >Presentation Slide< Bora Nikolic, Professor, UC Berkeley, Berkeley, USA Energy-Efficient Design in FDSOI >Presentation Slide< Sorin Voinigescu, Professor, University of Toronto, Toronto, Canada mm-Wave and Fiber-optics Design in FD-SOI CMOS Technologies >Presentation Slide<

SPONSORS: 

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The need for low power microelectronics without sacrificing speed has developed a strong momentum behind FD-SOI technologies.  In previous SOI Consortium events, the focus was on the growth of the ecosystem, on the progress of the EDA/IP offering, on the foundry platforms, on the supply (Si Valley, Tokyo, Shanghai). The topic this year was  SOI adoption with Special Focus on FD-SOI and the Application Drivers.

AGENDA

Presentations

, CEO of Andes Technology Keynote: The Future of Embedded Processing with FD SOI, Ron Martino, VP & GM, NXP Session 2: Products and Opportunities Solutions, Opportunities & Innovation in Automotive Applications, Andre Blum, Project Manager, Audi Ready for Flight with FD-SOI, Olivier Notebaert, Expert, Airbus Low Power IoT Products of FDSOI Technology, Kenichi Nakano, GM, Sony (presentation not available) Session 3: Ecosystem in Evolution FD-SOI & finFET: And gate? Or gate? How Decision Maker and Influencer Views Changed Since 2016, Dan Hutcheson, CEO, VLSIResearch Invited Speech, Hong Hao, SVP Foundry Business, Samsung,  (presentation not available) FDX - Market Validated Differentiation , Bami Bastani, SVP, Globalfoundries China’s Strategy to Promote IC Industry,  Jeffrey Wang, CEO, Simgui Session 4: Innovative Applications FDSOI for IoT & Automotive, Ramkumar Subramanian, SVP, Ineda Systems AI Applications at the Very Edge, Loic Lietar, CEO, Greenwaves Automotive ADAS MPSoC Roadmap on 22nm FDSOI Technology, Jens Benndorf, CEO, Dreamchip Enabling Data-intensive IoT Applications Thanks to FD-SOI and eMRAM, Jean Pascal Bost, CEO, Evaderis Realizing Near-Threshold Computing with 22FDX & Low Power Memories, William Koven, CEO, Reduced Energy Microsystems   Symposium was sponsored by 

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Shanghai  FD-SOI Tutorial: from process through design insights towards system level implementations

World reputation professors and scientists, as well as industry specialists in the field of FD-SOI CMOS came to present during the one day tutorial dedicated to FD-SOI. The presentations covered diverse fields of this technology: from process flow and design related process features, through design techniques insights and up to system level Silicon implementations. They both covered analog and digital design topics, illustrated by up to date realizations.

FD SOI Tutorial program 2017 Shanghai

Presentations

 Bich-Yen Nguyen, Senior Fellow, Soitec >Analog, RF and mixed signal design with FD-SOI, Andreia Cathelin, Fellow, STMicroelectronics Integrated RF Design Using 22 FDX, Tom McKay, Director, RF Innovation, RF Pathfinding- Santa Clara,  GlobalFoundries >Deep learning @ ST, Ultra Low Power Artificial Neural Network SOC in 28 FD-SOI, Nitin Chawla, Director, STMicroelectronics >FD-SOI EDA & IP Process Flow, Christophe Tretz, SOI Consortium >Digitalizing Embedded NVMs, Jean-Pascal Bost, CEO of Evaderis >Reverse and Forward Bias Design Using FD-SOI, Philippe Flatresse, Soitec >IoT Processors Using FD-SOI, Eric Flamand, CTO, Greenwaves Energy-Efficient Digital and Mixed-Signal Design in FDSOI, Borivoje Nikolić, Professor of UC Berkeley

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Nanjing SOI Workshop & Tutorial - September,  21 - 22, 2017

The 2 days event was sponsored by the City of Nanjing, co-organized by SOI Industry Consortium and the City of Nanjing. Over 200 participants attended the workshop and tutorial about SOI applications, SoC development and manufacturing, EDA & IP ecosystem, and the design tutorial for More than Moore SOI ecosystem.

Agenda, Thursday, September 21st

Presentations:

, Maggie Qiu, Director, NXP >SOI Neuromorphic architecture, Nitin Chawla, Director, STMicroelectronics >IoT processors, Eric Flamand, CTO, Greenwaves 28FDS Samsung Foundry Platform, Suk Won Kim, VP, Samsung Foundry >22FDX and RF-SOI for China, Zhi Yong Han, Head of China Sales, Globalfoundries >EDA platform, Jonathan Smith, Director,  Cadence >Digitalizing embedded NVMs, Jean-Pascal Bost, CEO, Evaderis >Embedding power regulation & activity control networks for best SoC PPA, Frederic Renoux, Director, Dolphin Integration >Design with FD-SOI, Innovation through Collaboration, Kenny Kwan, Director, Application Consulting, Synopsys China

AGENDA, FRIDAY, SEPTEMBER 22

PRESENTATIONS:

, Chen Liang, Nanjing Guobo Electronic >TCAD, EDA and IP to support SOI technologies, Naotomo Hori, Manager of technical marketing, PDK,  Silvaco >SOI substrate for Connectivity, Power, Imagers, Photonics, Stephen Lin, VP, Soitec >FD-SOI process flow, Christophe Tretz, Design, SOI Consortium >FD-SOI Analog & mixed signal, Andreia Cathelin, Fellow, STMicroelectronics >Reverse and Forward Bias in FD-SOI,  Philippe Flatresse, Soitec >Review of FD-SOI Technology,  Bich-Yen Nguyen, Senior Fellow, Soitec

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SAMSUNG FOUNDRY FORUM 2017 EMEA, WEDNESDAY, OCTOBER 18THOrganizer :  

Starting from 2017, Samsung Foundry will be hosting the annual Samsung Foundry Forum (SFF) at various regions throughout the globe. At SFF 2017 - EMEA, you will be introduced to Samsung's new Foundry Business with our advanced process and specialty process(8") offerings, design enablement and more information that will add value to your future business opportunities. - What : Samsung Foundry Forum 2017 - EMEA - Date : October 18, 2017 - Time : 10:30 - 15:20 (Including Lunch) - Where : Hotel Vier Jahreszeiten Kempinski München - Maximilianstr.17 -  80539 München. Germany The Samsung Foundry Forum event is on invitation only. If you are interested in participating, please ask for your invitation   Your registration will only be effective once you will have received a confirmation email from Samsung.  

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Shanghai FD-SOI Forum, Tuesday, SEPTEMBER 26TH

Organizer: This 5th Shanghai FD-SOI Forum was focused on IoT, Ultra Low Power pervasive computing, smart driving, mixed signal, and RF.

FD SOI Forum program 2017 Shanghai

Dr. Sanjay Jha, CEO of Globalfoundries Cutting-edge Technology from a Trusted Foundry, Dr. ES Jung, EVP & GM of Samsung Foundry Advancement in Edge Computing with HMI Interfaces, Artificial Intelligence and FD-SOI, Ron Martino, VP & GM of NXP >FD-SOI Opportunities in Deep Learning and Artificial Intelligence Applications, Dr. Handel Jones, CEO of IBS NSIG Support of SOI Ecosystem, Nabeel Gareeb, CEO of NSIG Accelerating SOI Mass Adoption, Paul Boudre, CEO of Soitec Benefits of 22FDX for NB-IOT RF Integration, Tom McKay, Director, RF Innovation, RF Pathfinding - Santa Clara, Globalfoundries >Energy Efficient RISC-V Processor Design Using 28 FDS, Borivoje Nikolic, Professor of UC Berkeley >SoC Product Design with Body Biasing Using FD-SOI, Jiong Zhu, Director of VeriSilicon > From Concept to Mass Production, Qi Wang, VP of Cadence >Design with FD-SOI, Innovation through Collaboration, Swami Venkat, Director of Synopsys

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International RF-SOI Workshop, Wednesday, September 27th

Organizer: This 5th International RF Workshop was focused on IoT, mobile, 5G connectivity, and mmW.

AGENDA WEDNESDAY, 27TH SEPTEMBER

, Russell Ellwanger, CEO, TowerJazz >Antenna Tuning Progress and SOI Single Chip Integration for 4G/5G UE, Hidetoshi Kawasaki, GM, Sony Semiconductors Solutions Corporation >Embrace a Brand New Cooperation in 5G Era, Danni Song, Project Manager, China Mobile China RF-SOI Ecosystem RF-SOI in Current and Future RFFE Solution, Joseph Jia,  AVP of Engineering, RDA >Reconfigurable RF Front End in 5G, Peter Li, CTO, Smartermicro SMIC 0.13um RFSOI Platform Updates, Jeff Zhu, Assistant Director, SMIC >RFSOI - A Secured Substrate Supply, Kerui Wang, Senior Director, Simgui >RF SOI – To Embrace or Not? Xiaoyong Li, CEO, Will-Microelectronics RF-SOI Supply chain >RFSOI: Delivering Performance and Integration for the Next Generation of Mobile, Peter Rabbeni, Senior Director, GlobalFoundries Engineered Substrates as Foundation of Innovation in RF Connectivity, Bernard Aspar, EVP & GM, SOITEC >Differential Complementary Millimeter Wave Power Amplifier for 5G using 45RFSOI process, Denis Masliah , CEO, IDDO-IC >Leveraging SOI in RFIC Analog Subsystems, Yoshiharu Furui, Vice Chairman, Silvaco Japan SOI Ecosystem Participation and Benefits: A Perspective from SCREEN Semiconductor Solution as an Equipment Supplier, Oliver Vatel, Corporate Director, Senior VP, CTO, SCREEN   Semiconductor Solutions

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The Chinese microelectronics ecosystem as well as leading companies worldwide will meet again for the fourth time in Shanghai for two days to discuss and exchange on FD-SOI and RF-SOI technologies, applications and opportunities. This is a unique opportunity to sense the strong advancement of the field. These two events are co-organized by the SOI Consortium, Verisilicon, Simgui, SITRI, SIMIT, with several keynotes, invited presentations, panel and demos. The preliminary program and registration details will be published soon. Event location:  Pudong Kerry Hotel Shanghai.  No. 1388, Hua Mu Road, Pudong New Area, Shanghai

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3rd ANNUAL SOI TOKYO WORKSHOP, 1.5 DAYS EVENT

Thursday, June 1^st, 2017 (DAY 2)

ONLINE REGISTRATION IS CLOSED, PLEASE REGISTER ON SITE AT TAKEDA HALL.

Program

“Convergence of IoT, Automotive through Connectivity”

(@ Takeda Hall, Tokyo University, Tokyo) 8:30 – 9:20am             Registration 9:20 – 9:30am             Welcome - Carlos Mazure, Executive Director, SOI Industry Consortium Ultra Low Power Applications 9:30 – 10:00am          Kenichi Nakano, General Manager, Sony IoT 10:00 – 10:30am       Value Added FD-SOI Technology to be Major Player in IoT, Automotive, and Connectivity - Yongjoo Jeon, Principal Designer in Foundry Marketing, Samsung 10:30 – 11:00am       Networking Break Technologies for Automotive 11:00 – 11:30am       LIDARs and Sensor Fusion ECUs  Advancing ADAS Architectures towards Automated Driving - Akhilesh Kona, Senior Analyst, IHS Markit 11:30 – 12:00pm      MIPS Leading Heterogeneous Compute in Automotive & IoT - Steven Yeung, Design Manager, MIPS, Imagination Technologies 12:00 – 12:30pm     Future of Automotive Industry - Road is Paved with SOI - Vincent Roger, Corporate Business Developer, CEA-Leti 12:30 – 1:30pm          Lunch IoT – Connectivity - Infrastructure 1:30 – 2:00pm             Enabling An Interconnected Digital World - Jonathan Smith, Director, Cadence 2:00 – 2:30pm           Nokia Future X Network for 5G and IoT -Brian Cho, Head of Technology for APAC & Japan, Nokia on infrastructure for 4G/5G 2:30 – 3:00pm             Delivering on the Promises of 5G: Semiconductor Solutions for the Next Wave of Data - Peter Rabbeni, Senior Director, GlobalFoundries 3:00 – 3:30pm            Sensor-to-Cloud Connectivity Solution for IoT -  Hiroshi Noguchi, Director of AMG Product Marketing, STMicroelectronics 3:30 – 4:00pm             Coffee Break Supply Chain 4:00 – 4:30pm             Enabling SOI and IoT:  An Equipment and Materials Engineering Perspective - Sesh Ramaswami, Managing Director, Applied Materials 4:30 – 5:00pm             SCREEN Equipment Manufacturer: Full participation within the SOI Consortium - Hirofumi Uchida, Senior VP, Screen 5:00 – 5:30pm             Role of Substrate in Accelerating Mass Adoption of SOI Technologies -Thomas Piliszczuk, EVP, Soitec Closing Remarks 5:30 – 5:40pm             Giorgio Cesana, Executive Co-Director, SOI Industry Consortium

ACCESS EVENT LOCATION June 1st

• June 1^st, 2017 @ Takeda Hall, Tokyo University, Tokyo,
  University of Tokyo, Takeda Hall, 7 Chome-7-3-1 Hongo, Bunkyo-ku, Tokyo-to 113-8654, Japan

  Photo: Tokyo Aerial View 15 ©Tokyo Convention & Visitors Bureau  

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SITRI is proudly co-organizing MEMS Technology Workshop with CEA-Leti, a leading global center for applied research in microelectronics, nanotechnologies and integrated systems. Topics to be addressed cover the M&NEMS platform, which is a disruptive generic platform for sensor fusion. We will introduce SITRI’s micro-fabrication line which provides leading-edge IC capabilities for “More than Moore” technologies. The workshop is by invitation only, the targeted participation is C-level, VP technology owners and industry influencers. You are cordially invited to this workshop at 13:00pm on March 16th afternoon in Kerry Hotel, Pudong, Shanghai.

Time: Thursday, March 16^th, 2017, 13:00-16:00. Registration starts at 12:45

Venue: Kerry Hotel Pudong, 1388 Huamu Road, Pudong, Shanghai

INFORMATION & REGISTRATION

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