Agenda Annual Tokyo SOI Workshop

Presentations

During the one and a half day workshop, leading companies working in the domain of SOI based technologies were meeting together in Tokyo to discuss about SOI Ecosystem and “Convergence of IoT, Automotive through Connectivity”.

May 31^st, 2017: FDSOI  Ecosystem @ Yokohama Landmark Tower

TCAD, EDA and IP to Support FDSOI - 

 David Dutton, CEO Silvaco (presentation not public) FDX™ Goes Mainstream - Gregg Bartlett, SVP GlobalFoundries INVECAS IP Portfolio in 22FDX - Bhaskar Kolla, Sr.Director Business Development and Customer Engineering, Invecas FDSOI : A Low Power, High Performance Technology Scalable Down to 10nm - Laurent Grenouillet, Expert, CMOS & Memory Integration, CEA-Leti I-Fuse(tm): The Best OTP of Choice for FD-SOI and Sub-14nm Nodes - Shine Chung, Chairman, Attopsemi Technology Product Design Methodology - Christophe Tretz, SOI Consortium

June 1^st, 2017 , “Convergence of IoT, Automotive through Connectivity” @ Takeda Hall, Tokyo University, Tokyo

Ultra Low Power ApplicationsSony Semiconductor Solutions , Low Power IoT Solution -

Kenichi Nakano, General Manager, Sony IoT (presentation not public) Technologies for Automotive LIDARs and Sensor Fusion ECUs Advancing ADAS Architectures towards Automated Driving - Akhilesh Kona, Senior Analyst, IHS Markit MIPS Leading Heterogeneous Compute in Automotive & IoT - Steven Yeung, Design Manager, MIPS, Imagination Technologies Future of Automotive Industry - Road is Paved with SOI - Vincent Roger, Corporate Business Developer, CEA-Leti IoT – Connectivity - Infrastructure Enabling An Interconnected Digital World - Jonathan Smith, Director, Cadence Nokia Future X Network for 5G and IoT -Brian Cho, Head of Technology for APAC & Japan, Nokia on infrastructure for 4G/5G Delivering on the Promises of 5G: Semiconductor Solutions for the Next Wave of Data - Peter Rabbeni, Senior Director, GlobalFoundries Sensor-to-Cloud Connectivity Solution for IoT -  Hiroshi Noguchi, Director of AMG Product Marketing, STMicroelectronics Supply Chain Enabling SOI and IoT:  An Equipment and Materials Engineering Perspective - Sesh Ramaswami, Managing Director, Applied Materials (presentation not public) SCREEN Equipment Manufacturer: Full participation within the SOI Consortium - Hirofumi Uchida, Senior VP, Screen Role of Substrate in Accelerating Mass Adoption of SOI Technologies -Thomas Piliszczuk, EVP, Soitec (presentation not public)

United States

Feb 10, 2017 SOI Off Add to Calendar 2017-02-10 00:00:00 2017-02-10 00:00:00 The Annual Tokyo SOI Workshop - Japan, 2017 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019

During the full day training on “Designing with FD-SOI Technologies”, world-renown professors and scientists from UC Berkeley, Stanford, Toronto and Lund Universities and STMicroelectronics have given instruction on FD-SOI specific design techniques in the domains of analog, RF, mmW and mixed signal, as well as ultra-low power memories, energy efficient digital and analog-mixed signal processing designs.

The Tutorial Day was sponsored by  GLOBALFOUNDRIES and  SAMSUNG

Organization:

Andreia Cathelin, STMicroelectronics Carlos Mazuré and Giorgio Cesana, SOI Industry Consortium (Mentors)

The Tutorial book with the detailed presentations was distributed to the participants only on site and will not be published online.

FD-SOI detailed program and abstracts

One Slide Summary per Lecture

United States

Feb 10, 2017 SOI Off Add to Calendar 2017-02-10 00:00:00 2017-02-10 00:00:00 A full day training about “designing with FD-SOI technologies” – San Jose, California, April 14, 2017 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019

SOI Silicon Valley 2017 Symposium Agenda

Presentations

Technology Application In Embedded Processing

- GEOFF LEES, SVP & GM, Microcontrollers, NXP Low Power IP: Essential Ingredients for IoT Opportunities - RON MOORE, VP, Physical Design Group, ARM Growth Areas for IOT and Impact on FDSOI - HANDEL JONES, CEO, IBS FD-SOI in a Connected World - JOHN KOETER, VP, Marketing Solutions Group, Synopsys IoT Unique Identity Overlooked - MAURIZIO PAGANINI, CMO, Megachips A New Computer Vision Processor Chip Design for Automotive ADAS CNN Applications in 22nm FDSOI - JENS BENNDORF, COO, Dreamchip Enabling the Smart IoT - LOIC LIETAR, CEO, Greenwaves FDSOI Factors of Success Pave New Roadmaps - MARIE-NOELLE SEMERIA, CEO, Leti, Institut de CEATech  

United States

Feb 9, 2017 SOI Off Add to Calendar 2017-02-09 00:00:00 2017-02-09 00:00:00 SOI Silicon Valley Symposium – Santa Clara, CA, April 13, 2017 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019

Presentations

> Digital Business Transformation - Why IOT is changing everything? By Aglaia Kong, CTO/VP, IOT Solution, Cisco Systems > Enabling the Digital Connected World with FDSOI by Thinh Tran, President & CEO, Sigma Designs > Smart Technology Choices and Leadership Application Processors by Ron Martino, Vice President, Application Processors Product Line, NXP Semiconductors > Enabling Next Generation Semiconductor Product Innovations with 22FDX™ by Subramani Kengeri, VP CMOS Business Unit, GLOBALFOUNDRIES > Realize the potential of FDSOI by Will Abbey, General Manager, Physical Design Group, ARM > 28FDS - Industry's first mass produced FDSOI technology for IoT era, with single platform benefits by Kelvin Low, Senior Director, Foundry Marketing, Samsung Semiconductor Inc (SSI) > Low Power GPS design with RF circuit by the FDSOI 28nm by Kenichi Nakano, Senior Manager, Section8 System Analog Product Department, Analog LSI Business Division, Device Solution Business Group, Sony Semiconductor Corporation > FD SOI: Disruptive or Just Another Process? by Dan Hutcheson, CEO and Chairman, VLSI Research > A Case Study of Half Power SERDES in FDSOI by Mahesh Tirupattur, EVP, Analog Bits > Synopsys 28FDSOI Solutions by Mike McAweeney, VP IP Product Sales, Synopsys > High-speed optical communication ASIC: FDSOI promise and reality by Naim Ben-Hamida, Senior Manager, Ciena > Cadence FD-SOI Implementation Solution by Rod Metcalfe, Group Director, Digital and Signoff Business Group, Cadence > Mixed-Signal Design Innovations in FDSOI Technology by Boris Murmann, Professor of Electrical Engineering, Stanford University > Communication Infrastructure Disruptions Caused by the Forthcoming IoT Data Deluge: the FD-SOI Solution by Simon Callewaert, Sr. Manager Digital/Mixed Signal ASICs Marketing, STMicroelectronics > FD-SOI Power Optimization Challenges by Ali Erdengiz, Business Developer, CEA-LETI

Posters

> Silicon Impulse: Your gateway to FD-SOI success by CEA-Leti > FD-SOI power optimization flow by CEA-Leti > Impact of Backplane Configuration on the Statistical Variability in 22nm FDSOI CMOS by Gold Standard Simulations (GSS) & GLOBALFOUNDRIES > Wafer Supplier Aspects of FD-SOI and RF-SOI by Shin-Etsu Handotai > When Power is Paramount by by surecore

United States

Apr 18, 2016 SOI Off Add to Calendar 2016-04-18 00:00:00 2016-04-18 00:00:00 FD-SOI Symposium - San Jose, 2016 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019

Presentations

> Opening Keynote by Babu Mandava, CEO, Ineda Systems > Ultralow-Voltage Design and Technology of Silicon-on-Thin-Buried-Oxide (SOTB) CMOS for Highly Energy Efficient Electronics in IoT Era by Shiro Kamohara, Chief Professional, Renesas Electronics Corp. > Enabling SoC Innovations with 22FDXTM by Subramani Kengeri, VP of Global Design Solutions, GlobalFoundries > The industry’s first mass-produced FDSOI technology for the IoT era, with single design platform benefits by Yongjoo Jeon, Principal Engineer in SEC Foundry marketing, Samsung > FD-SOI In The Connected World by Navraj Nandra, Sr. Director, IP Product Sales, Synopsys > FDSOI Technology Advantages for Analog/RF and Mixed-Signal Designs by Andreia Cathelin, Senior Member of Technical Staff, STMicroelectronics - ST FD-SOI Technology > Expanding FD-SOI Design and Application Options by Shirley Jin, Sr. Director of Engineering, Verisilicon > Paradigm Shift from Standard Cell design methodology to the Platform ASIC Design methodology with SOI by Seiji Miwa, President Japan, Baysand > Substrate maturity and readiness in large volume to support mass adoption of ULP FDSOI platforms by Christophe Maleville, Senior Vice President, Digital Electronics BU, Soitec > Introduction on VDEC activities and FD-SOI Chip Fabrication Services by Makoto Ikeda, Professor, VDEC, University of Tokyo > 300mm RFSOI Development toward IoT Era by Kenji Tateiwa, General Manager of R&D Strategic Planning, TPSCo > RFSOI: Defining the RF-Digital Boundary for 5G by Peter Rabbeni, Sr. Director RF Product Marketing and Business Development, GlobalFoundries > Tunable FEM Integration and Architecture Innovation in RF SOI CMOS by Barend van Liempd, PhD Researcher, imec and Vrije Universiteit Brussels > SOI Needs Better than IR-Drop by François Clément, CTO, CWSEDA > ST H9SOI_FEM: 0.13µm RF-SOI Technology for Front End Module Integration by Pietro Maestri, RF Product Line Director, STMicroelectronics > LAPIS’s SOI Sensor Technology by Masao Okihara, Sensor Development Group, Device Technology Development Division, Lapis > MEMS&NEMS at the heart of More than Moore: technologies and integration overview by Yann Lamy, Program Manager, CEA-Leti > SOI based Image Sensors Using Backgate Pinning Techniques for Soft X-ray, Near Infrared and Time-of-flight Range Imaging by Shoji Kawahito, Professor, Research Institute of Electronics, Shizuoka University / Chairman CTO, Brookman Technology Inc. > 100G Optical Communication using ST Silicon Photonics Products by Kirk Ouellette, Director Digital Product Group, STMicroelectronics > Silicon Photonics Technology on SOI wafers for Optical Interconnect by Tohru Mogami, Chief Manager, PETRA

Posters

> Impact of Backplane Configuration on the Statistical Variability in 22nm FDSOI CMOS by Gold Standard Simulations (GSS) & GlobalFoundries > Advanced Technology Entablement for RF SOI by Incize > Wafer Supplier Aspects of FD-SOI and RF-SOI by Shin-Etsu Handotai > Soitec, your innovation partner by Soitec > When Power is Paramount by SureCore

United States

Jan 25, 2016 SOI Off Add to Calendar 2016-01-25 00:00:00 2016-01-25 00:00:00 FD-SOI and RF-SOI Forum – Tokyo, Japan, 2016 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019

PRESENTATIONS

> The Right Technology at the Right Time by Sanjay Jha, CEO, GlobalFoundries (no public version) > Why China is a Good Market for FD-SOI by Handel Jones, CEO, IBS, Inc. > FD-SOI Opportunities, Challenges and Ecosystem in China by Wayne Dai, Chairman, President and CEO, VeriSilicon (no public version) > FD-SOI Technologies Enabling Fast Growing Markets by Philippe Magarschack, CTO of Embedded Processing Solutions segment, STMicroelectronics > Smart Technology Choices and Leadership i.MX Application Processors by Ronald M. Martino, VP of i.MX Application Processor Business and Advanced Technology Adoption Microcontroller Group, Freescale Semiconductor Corporation > 22FDX - Enabling the Next Wave of Innovative Ultra Low Power Products by Subramani Kengeri, VP of Global Design Solutions, GlobalFoundries > Synapse Enabling Billion Unit IoT Play Using FD-SOI by Satish Bagalkotkar, CEO, Synapse Design > FD-SOI in the Connected World by Joachim Kunkel, Executive VP and General Manager of Solutions Group, Synopsys Inc. (no public version) > FD-SOI IP Ecosystem by Allen Wu, Executive VP and President of Greater China, ARM > Low Variability Layout Solutions for Maximizing Benefits of FD-SOI Technology by Andrzej Strojwas, Chief Technologist, PDF Solutions

United States

Sep 21, 2015 SOI Off Add to Calendar 2015-09-21 00:00:00 2015-09-21 00:00:00 Forum: Design for FD-SOI - Shanghai 2015 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019

On September 16th, 2015 the SOI Industry Consortium, VeriSilicon, the Shanghai Institute of Microsystem and Information Technology (SIMIT) and Shanghai Industrial µTechnology Research Institute (SITRI) organized with many sponsors The 2015 International RF-SOI Workshop: “Interconnected world”. This event has given the opportunity to listen to executives, decision makers and technology owners from Skyworks, Qorvo, TowerJazz, GlobalFoundries, STMicroelectronics, IBS, Leti and many others. This 1 day event has once again demonstrated the great interest in RF-SOI technology with more than 200 participants from the industry and most of the decision makers and technology owners of the Chinese industry as well as the press.

Presentations

> RF Opportunities for SOI and China Perspective

by Handel Jones, CEO, IBS, Inc. > RF-SOI for 4G Applications and Beyond by Yumin Lu, VP of RF Technology, SITRI > SOI for More than Moore Applications by Marie-Noelle Semeria, CEO, Leti-CEA > SOI RF CMOS Innovations Enable New Levels of Integration by Paul Hurwitz, Director of Device Technology, TowerJazz > RF-SOI-on-HR-Si Technologies for Wireless Reconfigurable Applications by Julio Costa, Director of Technology, Qorvo > RF-SOI: Replacing GaAs, One Smartphone at a Time by Peter Rabbeni, Director of RF Product Marketing and Business Development, GlobalFoundries > ST H9SOI_FEM: 0.13um RF-SOI Technology for Front End Module Integration by Flavio Benetti, Group VP and General Manager of Digital and Mixed processes ASIC (DMA) Division, STMicroelectronics > RF SOI Enabling mmWaves for 5G by Steve Kovacic, VP of Technology, Skyworks > Surface and Bulk Acoustic Wave Devices for Mobile Communications - Current Status and Prospect by Ken-ya Hashimoto, Professor of Graduate School of Engineering, Chiba University, Professor of Graduate School of Engineering, Shanghai Jiaotong University > RF SOI Innovation, Production, Cost-down, and Time-to-market by Yuan Quan, Manager of Business Development, China and SE Asia, The MOSIS Service > Silicon Impulse by Ali Erdengiz, Director of Industrial Partnerships, Leti-CEA/CMP

SOI Offer and Industrial Readiness

> Nobuhiko Noto

, General Manager of SOI Division, Shin-Etsu Handotai > Xing Wei, Manager of R&D Department, Shanghai Simgui Technology Co,. Ltd. > Thomas Piliszczuk, SVP of Global Sales, Marketing and Business Development, Soitec > Horacio Mendez, Senior VP and General Manager of SOI and Advanced Solutions, SunEdison Semiconductor Ltd.

United States

Sep 21, 2015 SOI Off Add to Calendar 2015-09-21 00:00:00 2015-09-21 00:00:00 Workshop: Interconnected world - Shanghai 2015 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019

On 7 July 2015, the Silicon Saxony Community got together for the 10th Silicon Saxony Day in Dresden. Within the project Silicon Europe and in collaboration with the SOI Consortium, an SOI (Silicon-on-Insulator) workshop was held during the afternoon. This 3-hour workshop has been a great opportunity to get a comprehensive overview of the SOI technologies and applications listening to high profile speakers from leading companies such as Globalfoundries , NXP or Infineon, Universities such as UCL (Université Catholique de Louvain), and market analyst Yole.

Presentations

> Road to self-driving cars – The view from a semiconductor supplier

by Hans Adlkofer, Vice President Automotive System Group, Infineon > More than Moore Market Analysis and Opportunities by Jérôme Azémar, Senior Technology & Market Analyst and Business Developer, Yole > SOI in Automotive IC Design by Henk Boezen, Senior IC Architect, Product line Automotive Solid State Lighting, NXP Semiconductors > Analog/RF, Sensors and MEMS in SOI: demos and performance assessment by Prof. Denis Flandre, Université Catholique de Louvain > From 32/28nm PD to FD-SOI: Technology and Applications from Foundry Perspective by Dr. Manfred Hortsmann, Sr. Director Products and Integration, GlobalFoundries (not yet received) > Advances in Applications and Ecosystem for the FD-SOI Technology by Giorgio Cesana, Co-Executive Director, SOI Consortium > European Pilot Line Projects on FD-SOI by Dr. Helmut Ennen, Policy Advisor, ECSEL JU

United States

Jul 7, 2015 SOI Off Add to Calendar 2015-07-07 00:00:00 2015-07-07 00:00:00 Workshop: SOI Workshop - Dresden, 2015 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019

After an introduction of the FDSOI industrial ecosystem by the SOI Consortium, the first morning session “Silicon proven design experience in 28nm FDSOI” focused on 28nm FDSOI discussing low power, high speed, back-biasing techniques for digital and analog applications. During the following session “A full chain to enable 28nm FDSOI from design to prototyping” the participants were exposed to the FDSOI ecosystem offering and had the opportunity to discuss and inquire about the different services of the FDSOI package.

Presentations

> Welcome speech - Leti & AEPI introduction by Marie-Noëlle Semeria, Leti CEO (not yet received)

FD-SOI Ecosystem

> FD-SOI ecosystem

by Carlos Mazure, Executive Director, SOI Consortium > FD-SOI design by Thierry Collette, VP of Architecture & IC Design & Embedded Software Division Division, Dolphin/Leti

Silicon Proven Design Experience in 28nm FD-SOI

> Energy efficient digital design in FD-SOI

by Ahmed Jerraya, Research Director & Head of the Design Center Initiative, Leti > Efficient Reconfigurable Power Amplifier in FD-SOI by Baudouin Martineau, Research Engineer, Leti > Energy friendly MCU based on ReRAM for IoT Applications by Olivier Thomas, Silicon Impulse project leader, Leti

A Full Chain to Enable 28nm FD-SOI from Design to Prototyping

> Silicon Impulse Initiative

by Olivier Thomas, Silicon Impulse project leader, Leti > L-IoT design platform to accelerate IoT product design by Ali Erdengiz, Sr. Business Development Manager, Leti

United States

May 29, 2015 SOI Off Add to Calendar 2015-05-29 00:00:00 2015-05-29 00:00:00 Workshop: Impulsion to products - Taiwan, 2015 United States SEMI.org [email protected] America/Los_Angeles public Feb 1, 2019