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2019 WSC Nanjing Agenda

Presentations

SOI Platforms for Automotive, IoT, 5G, AI/Edge Computing Applications

>The Perspective of China SOI Ecosystem, Jeffrey Wang, CEO, Simgui >SOI platforms for automotive, IoT, 5G; Jian Zhang, VP, NXP RF-SOI ecosystem”; Mostafa Emam, CEO, Incize >Automotive SOI with embedded PCRAM; Giorgio Cesana, Sr. Director, STMicroelectronics EDA/IP infrastructure and innovation >Design transparency with FD-SOI; Christophe Tretz, IBM & Design Expert, SOI Industry Consortium FDSOI Foundry Enablement – From Concept to Mass Production, Mao Liu, Product Manager, Cadence >Mixed signal computing with FD-SOI for AIoT; Hongjie Liu, CEO, Reexen >EDA Enablement for RF- and FD-SOI; Feng Ling, CEO, Xpeedic >SOI EDA/IP Overview; Jon Cheek, Executive Director, SOI Industry Consortium

 

United States

SOI Off Add to Calendar 2019-04-15 00:00:00 2019-04-15 00:00:00 World Semiconductor Congress - Nanjing, China, May 18, 2019 United States SEMI.org [email protected] America/Los_Angeles public
Brave New World - MSIG Conference on AI+IoT 2019

The SOI Industry Consortium participated in this conference during  SEMICON China 2019 with  invited presentations about ongoing application scenarios using well established MEMS sensors, AI chips, 5G, cloud, big data, and AI, thus enabling a real IoT era.

United States

SOI Off Add to Calendar 2019-02-20 00:00:00 2019-02-20 00:00:00 20 March 2019: China, Shanghai: SOI Industry Consortium talk United States SEMI.org [email protected] America/Los_Angeles public

Presentations of the two days are available for SOI Industry Consortium Members only. (login here).

 

2019 FD-SOI Forum Agenda

2019 RF-SOI Workshop Agenda

United States

SOI Off Add to Calendar 2019-02-02 00:00:00 2019-02-02 00:00:00 FD-SOI Forum & RF-SOI Workshop, Shanghai, China - September 16 & 17, 2019, United States SEMI.org [email protected] America/Los_Angeles public
This year’s Symposium focused on SOI products and applications, featuring speakers from Anokiwave, ARM, Core Avionics & Industrial, GlobalFoundries, IHS Markit, NXP, Samsung, STMicroelectronics, Synaptics, Leti-CEA, and EDA/IP innovators like Intento and Dolphin Integration. Two open forum panels  offered participants the chance to discuss with panelists from the fabless, foundry and EDA/IP community about Product and Application Drivers and EDA, IP and Design Infrastructure.Agenda April 9, 2019

Presentations

>Safe, Secure and Connected Embedded Processing for Future Applications

, Ron Martino, VP & GM, NXP >Samsung’s FDS with MRAM: Enabling Today’s Innovative Low Power Endpoint Products, Tim Dry, Director of Edge and Endpoints Marketing, Samsung Foundry (please use  "Source: Samsung Foundry Keynote at SOI Symposium 2019, USA" when using slides  out of this presentation) >Revolutionizing the User Experience through Secure Neural Network Acceleration at the Edge, Huibert Verhoeven, Senior VP & GM, IoT Division, Synaptics > Automotive and IoT Market Overview, Matthew Short, Senior Research Director, IHS Markit >The Evolution and Future of Safety, Lee Melatti, VP of Business Development, Core Avionics & Industrial >Automotive FD-SOI Microcontrollers with Embedded PCM, Roger Forchhammer, Director Business Development, STMicroelectronics Unleashing the mmWave Phase Array Using SOI for 5G and Satcom, Nitin Jain, CTO, Anokiwave (presentation not available) Capturing High Growth Market Opportunities with SOI, Mark Granger, VP Automotive Product Line, GlobalFoundries >Applications Around the Connected Car, Emmanuel Sabonnadière, CEO, Leti-CEA Tech >SOI EDA/ IP Overview: Jon Cheek, Executive Director, SOI Industry Consortium >Biased views on the industry's broadest FDSOI physical IP solution, Kelvin Low, VP of Marketing PDG, ARM inc >Analog Techniques for Low Power / High Performance Micro Processors in LP28FDSOI, Stefano Pietri, Technical Director, NXP >FD-SOI IP Platform for Energy-Efficient IoT SoC, Philippe Berger, CEO, Dolphin Integration >ID-XPLORE™: A Disruptive EDA for Emerging FDSOI Applications, Ramy Iskander, Founder & CEO, Intento Design  

United States

SOI Off Add to Calendar 2019-03-22 00:00:00 2019-03-22 00:00:00 SOI Silicon Valley Symposium - San Jose, California, April 9, 2019 United States SEMI.org [email protected] America/Los_Angeles public
IMG_1339-e1544095314807.jpg
LIVE WEBINAR [FREE TO ATTEND]
Thursday, December 13, 2018
10:00 AM Pacific / 1:00 PM Eastern
OVERVIEW
As digital-centric scaling pursues solutions in 3D device architectures such as gate-all-around (GAA) transistors, most applications in new leading-edge growth markets such as Edge AI/ML, IoT, automotive and 5G mmWave demand post-bulk processing power and also next-generation analog and RF performance. This webinar is an overview of production-proven fully-depleted silicon-on-insulator (FD-SOI), the only post-bulk planar transistor technology. We will explain and demonstrate how FD-SOI delivers FinFET-like performance, excellent mismatch and noise characteristics and best-in-class Ft and Fmax required for energy-efficient mmWave applications.
What You'll Learn:
  • Learn how fully-depleted silicon-on-insulator (FD-SOI) delivers FinFET-like performance, excellent mismatch and noise characteristics and best-in-class Ft and Fmax required for energy-efficient mmWave applications.
  • Hear why most applications in new leading-edge growth markets such as Edge AI/ML, IoT, automotive and 5G mmWave demand post-bulk processing power and also next-generation analog and RF performance.
  • Understand why production-proven FD-SOI is the only post-bulk planar transistor technology.
About the Speakers:
Dr. Jamie Schaeffer - Jamie Schaeffer is Senior Director of Product Offering Management at GLOBALFOUNDRIES.  Schaeffer is currently responsible for the FDX™ product offerings, including 22FDX® and 12FDX™, which enable differentiated solutions for mobile, wireless networking, Internet of Things and automotive markets. Prior to this, Schaeffer had an extensive career in technology development at GLOBALFOUNDRIES, Freescale Semiconductor, and its predecessor Motorola Semiconductor Products Sector.  Schaeffer helped lead the development and transfer into volume manufacturing of the 32nm and 28nm technologies and his earlier work in the semiconductor industry has been recognized with numerous invited talks and a Distinguished Innovator award for his contributions to technology innovation while at Freescale Semiconductor. Schaeffer holds a bachelor's degree in materials science and engineering from Cornell University and a Ph.D. in materials science and engineering from The University of Texas at Austin.
Dr. Brian Chen - Brian Chen currently serves as Director of FDX Offering Management at GLOBALFOUNDRIES.  Brian has worked in engineering, field, marketing, and operational roles at EDA, IDM, and foundry companies.  Previous products under his management include circuit simulation tools, Liberty library characterization product, device characterization and modeling software, and low-frequency noise measurement system.  Brian received his Ph.D and M.S. degrees in electrical and computer engineering from the Georgia Institute of Technology, U.S., and M.S. and B.S. degrees in engineering from Saint-Petersburg Electrotechnical University, Russia.
Sponsored by

United States

SOI Off Add to Calendar 2018-12-06 00:00:00 2018-12-06 00:00:00 13 December, 2018: FD-SOI: an Optimal Technology for Integrated IoT and 5G Designs United States SEMI.org [email protected] America/Los_Angeles public
Gain Expertise in FD-SOI

During two days, around 200 experienced Chinese designers interested in gaining a solid expertise in FD-SOI got a comprehensive understanding of design techniques for low-power chips including digital, mixed signal – RF & analog blocks, leveraging the multiple benefits and flexibility of FD-SOI technology. The training was offered by world-class Leti and industrial experts. PRESS RELEASE SOI ACADEMY

Agenda
Announcement
OrganizerSponsors

                      

United States

SOI Off Add to Calendar 2018-11-12 00:00:00 2018-11-12 00:00:00 19-20 November 2018: China, Shanghai - SOI Academy, FD-SOI Training United States SEMI.org [email protected] America/Los_Angeles public
Tuesday, November 13: "Realizing Europe’s potential in a world redefined by the Digital Transformation"AbstractPANEL 1,  

14:25 – 15:40   European Microelectronics Clusters and its Ecosystems Moderator: Luca De Ambroggi, Senior Research and Analyst Director, IHS Markit Panelists: Dr. Thomas Morgenstern, SVP and General Manager Fab 1, Globalfoundries Dr. Christophe Maleville, EVP Digital Business Unit, Soitec Dr. Lars Reger, CTO, NXP Dr. Ralf Bornefeld, VP & GM Automotive Sense & Control, Infineon Giorgio Cesana, Executive Director, SOI Industry Consortium

Thursday, November 15, 2018 "The SOI Ecosystem and Supply Chain"
Abstract PANEL 2:  12:55 – 14:00     Ecosystem Partnerships to build up industrial strength Moderator:

Dr. Jose Beriot, VP, Soitec Panelists: Karen Amram, Director for Europe, CEA-Tech Frank Bösenberg, Managing Director, Si Saxony Dr. ir. Yves Gigase, Head of Programmes of ECSEL JU Dr. Romy Liske, Head of Center Nanoelectronic Technologies, Fraunhofer IPMS Colette Maloney, Head of Unit responsible for Competitive Electronics Industry, DG Connect Dr. Sophie Cordeiro, Consultant Electronics and Microsystems, VDI/VDE Innovation + Technik GmbH Sascha Uhrig, Expert Embedded Computing Airbus Central Research and Technology XRC PANEL 3: 14:30 – 15:30    Synergy through Partnerships with the equipment industry Moderator: Carlos Mazure, Chairman & Executive Director, SOI Industry Consortium Panelists: Dr. Fabrice Geiger, VP, Leti-CEA Tech Dr. Christophe Maleville, EVP Digital Business Unit, Soitec Dr. James C. Robson, VP and Regional General Manager, Applied Materials Europe Dr. AkihikoTamura, Managing Director and CEO, SEH-Europe Dr.  Martin Hollfelder, Senior Manager Technology & Product Engineering, SCREEN SPE Germany Events were organized by the SOI Industry Consortium. 

United States

SOI Off Add to Calendar 2018-11-02 00:00:00 2018-11-02 00:00:00 13 & 15 November 2018: Germany, Munich SEMICON Europa - Talks and Panels United States SEMI.org [email protected] America/Los_Angeles public
The SOI Industry Consortium has organized for the 4th time its annual workshop in Japan. During the two day workshop, leading companies working with SOI technologies met in Yokohama and discussed about designing with FD & RF SOI technologies. The second day was held in Tokyo, on More than Moore, with special focus on silicon photonics, MEMS & sensors, and the SOI manufacturing ecosystem. 

PRESENTATIONS

Yokohama, Thursday, 25 October 2018: Design Methods and Tools for FD- & RF-SOI Products (Agenda)
22FDX based SoC Platform for L-4 Autonomous Driving, Wayne Dai, CEO, Verisilicon >Silvaco’s design flow and IP blocks for SOI, Thomas Blaesi, VP Global Marketing, Silvaco >Enabling SoC Differentiation with Collaborative Eco-System, Subramani Kengeri, CTO & VP of WW Client Solutions, Globalfoundries >FD-SOI Product Design Methodology, Christophe Tretz, Design Advisor, SOI Industry Consortium       >SOI at Synopsys: EDA Flow and IP Support, Akira Nikaido, Director &  Shunichi Suzuki, Synopsys >Addressing the Energy Efficiency Challenges of IoT end points, Frederic Renoux, EVP, Dolphin Integration >RF-SOI for RFFE Solution: EDA Perspective; Feng Ling, CEO, Xpeedic FDSOI Foundry Enablement – From Concept to Mass Production, Jonathan Smith, Director, Cadence  >RF-SOI Technology and Design Enablement; Mostafa Emam, CEO, Incize >Improving IC Reliability by Automating Power Net Robustness and Net-aware Fill with Calibre PERC, Calibre YieldEnhancer and Calibre Pattern Matching; Takashi Yabe, Application Engineering Consultant, Mentor Graphics
Tokyo - Friday, 26 October 2018 More than Moore and SOI Ecosystem (Agenda)
Distributed AI and computing at edge and nodes for sensors, 

Giorgio Cesana, Sr. Director, STMicroelectronics >RF- & FD-SOI: addressing substrate supply to support accelerated growth, Jean-Marc LeMeil, Director, Soitec >FD-SOI for ultra low power edge computing, Jon Cheek, Director, NXP A Time-of-Flight Range Image Sensor with High Near Infrared Quantum Efficiency Using SOI-Based Fully-Depleted-Substrate Detectors, Prof. Shoji Kawahito, Shizuoka University >An Overview of SOI based MEMS, Jean-Philippe Polizzi, MEMS Business Development Manager, Leti-CEA >Smart Cut technology applied to MEMS: illustration in the field of ultrasonic transducers; Bruno Ghyselen, Sr. Expert, Soitec >Si Photonics Foundry, Makoto Ueda, Director, GlobalFoundries >Si Photonics design, Yoshimi Kitagawa, Technical Leader, Cadence Si Photonics Applications, Giorgio Cesana, Sr. Director, STMicroelectronics >Validation Flow for SOI photonic Integrated Circuits, Tohru Mogami, PETRA >Putting Curves in an Orthogonal World, Masahiro Shiina, Technical Marketing Engineer, Mentor Graphics

 

United States

SOI Off Add to Calendar 2018-10-03 00:00:00 2018-10-03 00:00:00 25 & 26 October 2018: Japan SOI Design Workshop United States SEMI.org [email protected] America/Los_Angeles public

The Chinese microelectronics ecosystem as well as leading companies worldwide have been meeting again for the sixth time in Shanghai at the Shangri-La Hotel during two days and exchanged on FD-SOI and RF-SOI technologies and applications.FD-SOI FORUM AGENDA - SEPTEMBER 18

PRESENTATIONS: FD-SOI FORUM

>Mass production and recent achievements of FD-SOI,

Gitae Jeong, SVP, Samsung Electronics, (presentation not available) >Driving Differentiated Solutions with FD-SOI for Demanding Markets, Thomas Morgenstern, SVP & GM, Fab 1, GlobalFoundries >FinFET and FD-SOI: Market and Cost Analysis, Handel Jones, CEO, IBS Deployment of FD-SOI: AIoT and Automotive Electronics, Wayne Dai, Chairman, President and CEO, VeriSilicon Battery Powered Security and Monitoring Cameras for Smart Home, Yantao Jia, Head of ASIC & China Operations, Amazon/Blink (presentation not available) >I-fuse (tm) for FD-SOI: ultra-high reliability and ultra-low power OTP, Shine Chung, Chairman, Attopsemi >Addressing the Energy Efficiency Challenges of IoT End Points, Frederic Renoux, EVP, Dolphin Integration FD-SOI for Automotive: acceleration through ecosystem partnerships, Carlos Mazure, Chairman & Executive Director, SOI Industry Consortium >L-4 Autonomous Solution based on 22FDX, Jiong Zhu, Director, Design Implementation, VeriSilicon >Future applications yc AI with FD-SOI, Emmanuel Sabonnadière, CEO, LETI-CEA Tech  

The second day was dedicated entirely to 5G connectivity and its infrastructure showcasing end users, fabless and the supply chain. For both days the program featured timely keynotes and in-depth panels discussing the hottest topics. RF-SOI WORKSHOP AGENDA - SEPTEMBER 18

PRESENTATIONS:  International RF-SOI Workshop

>Join Hands with Industry Partners – Hop on the 5G Shuttle Together,

Danni Song, Project Manager, China Mobile Riding the 5G Silicon Wave: How Advances in 5G Radio Architectures Benefit from RF-SOI , Michael Reiha, Head of RFIC R&D, Nokia Mobile Networks >RFSOI Enabling the RF Wireless Front End : History, Future and Challenges  Julio Costa, Director of Technology Development, Qorvo >Mobile Radio Transformation in the Age of 5G: A Perspective on Opportunities for SOI, Peter Rabbeni, VP Segment Offering Management, Business Development and Marketing, GlobalFoundries  >Engineered Substrates - At the Heart of 5G Connectivity, Thomas Piliszczuk, EVP, Soitec RFSOI and Extended Silicon-Based Solutions: Prospectus for 5G Front-End Components and System Integration, Herb Huang, CEO, NSI HHGrace 0.13um RFSOI: Enabling Integration of RFFE for 5G, Ruofan Dai, Senior Engineer, HHGrace (presentation not available) >RF-SOI in 5G Era, Yangyang Peng, Director, SmarterMicro >Sub-5G RF Front-End Components Based on Advanced SOI CMOS Process, Wayne Ni, CTO and Board Chairman, CanaanTek >RF-SOI for RFFE Solution: An EDA Perspective, Feng Ling, Founder and CEO, Xpeedic  >Engineered Substrates: At the Heart of 4G/5G Front End Module Evolution, Bernard Aspar, EVP & GM, Soitec >RF and SOI Technologies for 5G Deployment, Kirk Ouellette, VP of World Wide Strategy, STMicroelectronics >RF Technology and Design Enablement for Next Generations, Mostafa Eman, CEO, Incize >Applied Materials 300mm FEOL Products Status for RF-SOI, Papo Chen, Sr. Product Manager, Applied Materials >Introduction to the Virtuoso RF Solution for Co-Design of RF Chips and Modules, Liang, Jiang, Principal Customer Engagement Engineer, Cadence   These two events were co-organized by

United States

SOI Off Add to Calendar 2018-08-08 00:00:00 2018-08-08 00:00:00 18 & 19 September 2018: FD-SOI Forum & International RF-SOI Workshop-Shanghai United States SEMI.org [email protected] America/Los_Angeles public

SOI technology is at the base of cellular wireless connectivity: 4G and 5G are driving up the demand for both 300mm and 200mm capacity, both in short supply.  The 4G expansion and the introduction of 5G are also enlarging the scope to new applications and new frequency ranges, up to supporting mm-wave. The demand is not only about supporting continuously growing volumes, but requires to develop solutions using differentiated silicon technologies (RF-SOI, PD-SOI, FD-SOI) and to offer integrated system solutions (in-package modules, including integrated antennas). The workshop has develop such requirements and the current solutions available from a supply chain perspective, involving substrate suppliers, equipment and material suppliers (for both substrate/silicon manufacturing and packaging solutions), and foundries.

AGENDA

Presentations

Market Overview and FD SOI Opportunities

, Handel Jones, CEO, IBS 4G/5G with SOI Technologies, Peter Rabbeni, Vice President, Globalfoundries SOI Innovation from Materials through Applications, Emmanuel Sabonnadière, CEO, Leti-CEA Enabling the Engineered SOI Wafer, Sesh Ramaswami, Managing Director, Applied Materials (presentation not available) SOI Substrates for 4G/5G, Thomas Piliszczuk, Executive Vice President, Soitec Synergies with the SOI Industry, Olivier Vatel, Corporate Director, Senior Vice President and CTO of SCREEN Semiconductor Solutions, Screen (presentation not available) Ultra-thin Double Layer Metrology with High Lateral Resolution, Bernd Srocka, Vice President, Unity GmbH China 5G Plan and SOI Ecosystem, Jeffrey Wang, CEO, Simgui Inspection and Metrology Relevance in SOI Manufacturing,  Jijen Vazhaeparambil, Vice President  & General Manager, KLA-Tencor

United States

SOI Off Add to Calendar 2018-07-04 00:00:00 2018-07-04 00:00:00 11 July 2018: 4G/5G Connectivity: Opportunities for the SOI Supply Chain, San Francisco, CA United States SEMI.org [email protected] America/Los_Angeles public
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