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Cylynt and Proof LCS are partnering to bring the software industry new capabilities for collecting installation/usage data, rapidly performing data analysis, and then monetizing those software licenses found to be over-installed or pirated.

The BSA Software Alliance has found that nearly 40% of all software installations worldwide are being used illegally. Software companies are losing more than $46 billion a year in revenue, making it vitally important for them to uncover misuse, gather evidentiary data, and pursue infringers to monetize their losses. Companies still employing home-grown license compliance solutions and internal teams to address this reality typically require an investment in technology and an increase in team capacity to move to the next level as in-house solutions become overextended.

The resources at Proof LCS have audited and negotiated resolutions with thousands of enterprise companies. Proof LCS is experienced at performing audits on entities that have tens of thousands of installations and equally adept at negotiating multi-million-dollar resolutions that consistently and fairly address discovered license issues.

“Partnering with Proof LCS to augment your audit and negotiation strength means you add highly experienced auditors and negotiators as a turnkey solution that can scale up and down as opportunity and licensing issues rise and fall,” remarks Lee Taylor, co-founder at Proof LCS. “Proof LCS is the new way to build a license compliance program—fast, easy, and effective.”

Cylynt’s software-as-a-service (SaaS)-based anti-piracy, license compliance and software monetization solutions gather telemetry and usage data that identifies parties who have used software beyond license limits, and provide precise, accurate details on who, where and how often the software is being used illegally. Cylynt usage analytics then analyze that data to deliver undeniable proof of illegal use that can reinforce legal settlement negotiations and successfully prevail in lawsuits.

“Cylynt’s industry-leading data gathering and usage analytics combined with Proof LCS’s auditing and negotiation expertise is a win/win for software companies,” says Ted Miracco, CEO of Cylynt. “Powered by Cylynt’s software technology, Proof LCS can discover licensing issues at customer sites faster, more economically, and, most importantly, quickly resolve these issues once discovered.”

“Using Cylynt technology, Proof LCS can discover licensing issues at customer sites faster and more economically, and, most importantly, quickly resolve these issues once discovered,” adds Ben Morgan, co-founder of Proof LCS.

About Proof LCS
Proof LCS represents a completely different approach to data collection, compliance program development/consulting, and negotiation resources. The people that we offer as resources have actually operated in world class compliance programs as negotiators and auditors. Proof LCS understands the importance of having a foundation of complete and accurate data underlying any resolution a company choses to pursue. Our measure of success is delivering data, and any other compliance resource, as efficiently and effectively as they have operated in our own previous programs.
Engage with Proof LCS at:
Website: www.prooflcs.com/
Email: [email protected]
Linkedin: https://www.linkedin.com/company/prooflcs/about/

About Cylynt
Cylynt, headquartered in Los Angeles and Dublin, Ireland, provides SaaS-based anti-piracy, license compliance and software monetization technology for the world’s leading software companies. Cylynt’s data-driven approach to software utilization enables technology companies to derive more value while protecting their intellectual property (IP). Cylynt helps clients make informed business decisions, correct licensing problems, and protect customers from unfair competition. With a solution for every budget, Cylynt’s innovative technologies organize, analyze, and interpret telemetry data into meaningful market insights and quality lead generation. To learn more about how Cylynt solutions can help protect software brand names and drive revenue generation efforts, call +1 (424) 278-9990 or email [email protected].

Engage with Cylynt at:
Website: www.cylynt.com
Email: [email protected]
Linkedin: https://www.linkedin.com/company/cylynt/

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Online, Pacific Time
United States

Standards

3D Packaging & Integration North America TC Chapter 

Spring Meeting

Date: Tuesday, March 23, 2021 

Time: 10:00-12:00 Noon Pacific 

via Virtual Meeting 

 

AGENDA 

(subject to change) 

Last updated: February 22, 2021

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

 

10:00 am - 12:00 pm Off Add to Calendar 2021-03-23 10:00:00 2021-03-23 12:00:00 3DP&I North America TC Chapter Spring Meeting 3D Packaging & Integration North America TC Chapter  Spring Meeting Date: Tuesday, March 23, 2021  Time: 10:00-12:00 Noon Pacific  via Virtual Meeting    AGENDA  (subject to change)  Last updated: February 22, 2021   NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here    Online, Pacific Time United States SEMI.org [email protected] America/Los_Angeles public

Cylynt today revealed it has traced more than one-billion usage events in its software-as-service (SaaS) portal resulting in approximately $2 billion of additional revenue for its customers since its founding in 2014.

The usage event number is expected to double every 12 months going forward.

Cylynt’s technology is integrated into $50 billion worth of customer software. Actionable insights from its technology have been central to customers recovering an additional $2 billion in revenue.

Built on machine-learning techniques, Cylynt’s SaaS-based solutions deliver detailed usage analytics with precise, actionable insights to help companies convert unlicensed users to paying customers yielding new revenue or to better understand how users interact with their products.

“Software companies rely on Cylynt to provide insights into the use of their software to help them effectively grow their business,” says Graham Kill, Cylynt’s executive chairman. “Field data collected from our portal is versatile. Many customers use it to prioritize development efforts. Others apply it to license agreement compliance to effectively maximize software revenue recovery and grow their business.”

Cylynt’s expert systems, employed by leading software companies globally to manage their intellectual property, can be deployed in multiple scenarios to provide detailed data-driven intelligence that detects potential tampering and piracy. Identifying the presence of illegal software installations additionally helps protect end users from the threats posed by malware and ransomware that often come bundled with cracked software installations.

Cylynt software is offered as standalone or bundled solutions that include license compliance and usage analytics packages. To find out more about Cylynt’s suite of software monetization and anti-piracy solutions, email: [email protected].

About Cylynt
Cylynt, based in Los Angeles and Dublin, Ireland, provides SaaS-based usage analytics tools and anti-piracy, license compliance and software monetization technology for the world’s leading software companies. Cylynt’s data-driven approach to software utilization enables technology companies to derive more value while protecting their intellectual property (IP). Cylynt helps clients make informed business decisions, correct licensing problems, and protect customers from unfair competition. With a solution for every budget, Cylynt’s innovative technologies organize, analyze, and interpret telemetry data into meaningful market insights and quality lead generation. To learn more about how Cylynt solutions can help protect software brand names and drive revenue generation efforts, call +1 (424) 278-9990 or email [email protected].

Engage with Cylynt at:
Website: www.cylynt.com
Email: [email protected]
Linkedin: https://www.linkedin.com/company/cylynt/
Twitter: @CylyntInc

SANTA ROSA, Calif., – February 17, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, today announced availability of the new TargetPoint TCM™ gyro-stabilized digital magnetic compass. TargetPoint TCM incorporates PNI’s high sensitivity Magneto-Inductive sensors with the latest high stability 3-axis MEMS accelerometer and 3-axis MEMS gyroscopes providing accurate orientation while in dynamic motion and in magnetically challenging environments. TargetPoint TCM excels in conditions that cause errors in traditional digital magnetic compasses.

TargetPoint TCM uses advanced magnetic distortion compensation and calibration scoring algorithms to counter the effects of hard and soft iron interference, providing highly accurate heading information in almost any environment and orientation.

TargetPoint TCM features and benefits include:
 Patented magnetic anomaly rejection algorithms eliminate errors due to magnetic distortion, even in magnetically harsh environments
 Gyro-stabilized compass for dynamic accuracy of sub-0.5 degrees of heading accuracy
 Multiple calibration methods, including 12-point hard- and soft-iron calibration methods, are available to ensure ease of calibration for all applications
 ITAR-free

“For military rangefinder and targeting systems developers who need accurate orientation in demanding conditions, TargetPoint TCM is a ruggedized digital magnetic compass built to handle weapons shock,” said Robin Stoecker, vice president of sales and marketing at PNI Sensor. “It’s an ideal choice for targeting applications that require reliability, consistency and accuracy.”

Pricing and Availability
For product specifications, download the TargetPoint TCM product sheet. For pricing and availability, please contact PNI Sales or your regional PNI representative.

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and other mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

Media Contact:
Robin Stoecker
PNI Sensor
Tel: +1 707-566-2260 |Email: [email protected]

BERLIN, Germany – 17 February, 2021 –Qurv and Infineon Technologies have won the MEMS & Imaging Sensors Technology Showcase at the Technology Unites Global Summit, SEMI announced today. The Qurv wide-spectrum image sensor was recognized as the best imaging technology and the Infineon Technologies environmental sensor as the leading MEMS technology. The winners were selected from five finalists in each category in a vote by a committee of industry experts.

“Image and MEMS sensors advances are delivering tremendous societal and economic benefits, making our lives safer and healthier and the air cleaner,” said Laith Altimime, president of SEMI Europe. “The Qurv and Infineon Technologies innovations epitomize electronics industry innovation.”

The Technology Showcase honors standout applications enabled by MEMS and image sensors technology. The awards were presented by Dr. Martina Vogel of Fraunhofer ENAS.

Technology Showcase Winners

 Qurv Enabling a World of Enhanced Vision

Qurv developed wide spectrum image sensors that capture information hidden by ambient light interference or information not available in the visible light spectrum for next-gen computer vision applications. Qurv's technology leverages current CMOS scalable manufacturing and advanced materials to unlock new levels of performance, reliability and function. All Qurv image sensors are designed with AI and machine perception in mind. The technology was presented by Stijn Goossens, Co-founder and CTO of Qurv.

Qurv logo

 

Infineon TechnologiesXENSIV™ PAS CO2 Sensor, a new Environmental Sensor Technology. Photoacoustic Spectroscopy (PAS) Miniaturizes CO2 Sensors for High-volume Applications

Leveraging its advanced MEMS microphone technology, Infineon Technologies developed a disruptive CO2 sensor based on photoacoustic spectroscopy (PAS). Exceptionally miniaturized, the sensor is designed to accommodate high-volume manufacturing. The first CO2 sensor with SMD capabilities, the innovation will enable widespread adoption of air quality monitoring in high-volume applications in a variety of markets such as industrial, medical and Internet of Things (IoT). The platform was presented by Andreas Kopetz, Senior Director of Environmental Sensing at Infineon Technologies.  

Infineon Logo

 

The Technology Showcase demonstrations are available for on-demand viewing. The awards, organized by SEMI, are offered each year for companies across a range of sectors from IoT and consumer electronics to robotics and biomedical equipment. Winners receive a free exhibition booth at SEMI MEMS & Imaging Sensors Summit.

Technology Showcase Finalists

Stay in touch on Twitter and LinkedIn @SEMIEurope: #TechnologyUnites #SEMIEurope #SensorsSummit #MEMS #Imaging

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

 

Semiconductor equipment manufacturer ClassOne Technology has just released its proprietary new SoftSeal™ Plating Rotor, designed to enhance processing performance on the company’s Solstice® electroplating systems. The announcement was made by ClassOne’s CEO, Byron Exarcos and Senior Technology Director, John Ghekiere.

“Together with the plating reactor, the plating rotor design is key to maximizing on-wafer performance,” said Exarcos. “It’s responsible for distributing the electrical supply across the wafer, isolating electrolytes from the electrical contacts, and a great deal more. Which is why we’re constantly working to optimize rotor performance. The new SoftSeal is our latest and most advanced generation in Solstice rotors, and it’s already achieving unprecedented levels of electroplating uniformity along with reduced cost of ownership.”

“This highly-uniform performance comes from a combination of finely-tuned rotating-disk electrode physics and an optimized density of electrical contacts around the wafer,” said Ghekiere. "The ‘SoftSeal’ name comes from its high-performance FFKM elastomer seal which very effectively isolates plating chemistries from the wafer’s edge-exclusion zone. The new rotor also adapts automatically to substrate thickness, so it can accept thick or thin substrates without any adjustment. The design accommodates both flatted and multi-flat wafers, and it’s customizable to non-standard wafer sizes. Plus, the seal is more robust than on competitive rotors, meaning longer part life and no handling concerns.”

“In addition, the SoftSeal rotor’s low profile enables bubble-free entry into the plating bath,” Ghekiere noted. “And a unique design feature directs excess chemistry back into the bath at the end of the plating process. This is particularly important for conserving expensive plating baths such as gold. And, after processing, a special wafer retrieval method eliminates wafer flexing and stress by eliminating the need for extraction force at the center of the wafer.”

ClassOne stated that the new SoftSeal rotor is designed to fit all models of the company's Solstice electroplating systems and it will be standard equipment on all of the new tools going forward.

ClassOne Solstice systems are designed to provide high-performance, cost-efficient, single-wafer electroplating specifically for ≤200mm processing. The series includes the Solstice S8 and Solstice S4 for fully automated 8-chamber and 4-chamber high-speed production. It also includes the semiautomated Solstice LT, with up to three chambers that can be used both for process development and production. In addition to electroplating, the unique Plating-Plus™ capabilities of the Solstice platform enable it to handle many other important surface preparation functions, such as wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch, and more. Class-leading performance and flexibility consistently make Solstice the tool of choice for ≤200mm plating across a range of product categories.

BERLIN, Germany ─ February 15, 2021 ─ The Catholic University of Leuven, Technical University of Dresden and CEA-Leti have won the 2019 European SEMI Award at the SEMI Technology Unites Global Summit for their pivotal contributions in the fields of telecommunications and nanotechnology. The award winners’ pioneering research and collaboration with academia and industry led to major advances in semiconductor technologies and their market adoption.

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The European SEMI Award, established 32 years ago, recognizes key players in the global manufacturing supply chain for their leadership excellence and strategic contributions that help drive critical advances in the microelectronics industry.

2019 SEMI European Award Winners

  • Willy Sansen, Professor in Engineering Science at the Catholic University of Leuven (KU Leuven) and Gerhard Fettweis, Professor in Communications Engineering and Vodafone Chair at the Technical University of Dresden (TU Dresden),made outstanding research contributions in analog design and digital design techniques for a wide variety of applications.
     
  • Jean-Frédéric Clerc, Vice President, Technological Research Division of CEA-Leti, Grenoble-based French Alternative Energies and Atomic Energy Commission, received the European SEMI Special Service Award 2019 for outstanding research in nanotechnologies and contributions to the European semiconductor community throughout his career. With hundreds of patents to his name, Clerc drove research that led to innovations in liquid crystal flat screens and microsystems and is contributing to the development of biochips.

Winner Profiles

Willy Sansen

 

Willy Sansen, the Catholic University of Leuven

Since 1980 Sansen has served as full professor at the KU Leuven, where he has headed the ESAT-MICAS laboratory on analog design since 1984.
He has supervised 63 Ph.D. theses and authored or coauthored more than 635 publications and 16 books. He is a Fellow of the IEEE, was program chair of the ISSCC-2002 conference and is a Past-President of IEEE Solid-State Circuits.

Catholic University of Leuven Logo

 

Gerhard Fettweis Photo

 

Gerhard Fettweis, the Technical University of Dresden, and Barkhausen Institut

Fettweis has coordinated the Cluster of Excellence Center for Advancing Electronics Dresden and the Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) Highly Adaptive Energy Efficient Computing (HAEC) for the TU Dresden since 2012. He founded the 5G Lab Germany in 2014, and among 12 startups Systemonic AG in 1999 and Signalion in 2003.

Technical University of Dresden Logo

 

Barkhausen Institut logo
Jean-Frédéric Clerc photo

 

Jean-Frédéric Clerc, CEA-Leti

Clerc was as an engineer at CEA-Leti from 1977 to 1984 and later became group leader at CEA-Leti. He worked as Research and Process Development Manager at Pixtech, a CEA-Leti startup, and served as CEA-Leti deputy Director at CEA-Leti and as Deputy Director of Division of Technological Research head of Division for Strategy and Programs.

CEA-Leti logo

 

Prior European SEMI Award recipients hailed from companies including STMicroelectronics, EV Group, Infineon, imec, Semilab, Deutsche Solar and the Fraunhofer Institute.

See the list of past SEMI European Award recipients. Nominations for the 2020 contributions are now open. To participate, please check the award guidelines online.

 

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

 

ESPOO, Finland, 12th February 2021 – Picosun Group, the leading provider of AGILE ALD® (Atomic Layer Deposition) thin film coating technology and solutions, reports excellent aseptic properties measured from its ALD materials.

Numerous ALD oxide coatings deposited with Picosun’s processes showed remarkable reduction of microbial growth and had low values of bacterial endotoxin contamination(*). The coatings were characterized by an independent third party laboratory according to ISO 22196:2011 antimicrobial standard and ANSI/AAMI ST72:2019 bacterial endotoxin standards. These results, along with the earlier tests validating the non-cytotoxicity of Picosun’s ALD films, prove the safety and aseptic benefits of these materials in medical devices, both implanted and external ones.

Millions of people worldwide live with medical implants and the trend is towards even more complex solutions that combine highly advanced microelectronics with miniaturized devices embedded into sensitive areas of the body such as brain, spine, eyes, and heart. Protecting these devices from the corrosive environment of the human body, and vice versa, is of utmost importance considering the safety, correct operation, and lifetime of the implant.

Picosun is the trailblazer in providing medical ALD solutions to device manufacturers. Picosun’s ultra-thin, biocompatible ALD coatings guarantee hermetic encapsulation of the implanted device, with a fraction of film thickness compared to other coating methods and with superior film uniformity and conformality, ensuring pinhole-free coverage over even the smallest details of the device. Extended lifetime and operational reliability of the implant reduces the need for corrective or replacement surgeries, thus saving expensive hospital stays and improving the patient’s quality of life. For manufacturers, hermetic protective coating enables use of more common base materials, e.g. stainless steels instead of precious metals, which in turn makes the manufacturing process easier and saves costs.

“The aseptic properties of our ALD films are so excellent that they surpass even the strictest requirements of the medical implant industry. We are excited to bring our new, advanced medical ALD solutions to the market and help our customers keep spearheading their industries with safer, longer-lasting and user-friendly products,” states Juhani Taskinen, Head of Medical Business Area of Picosun Group.

Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

(*)The results are part of ULIMPIA project, funded by PENTA under grant number PENTA-2017-Call2-16101-ULIMPIA.

More information:
Mr. Juhani Taskinen
Head of Medical Business Area, Picosun Group
Tel: +358 50 4066 957
Email: [email protected]
Web: www.picosun.com

BERLIN, Germany – 15 February, 2021 – SEMI Technology Unites Global Summit opens today with keynotes on the power of technology to unite the world and insights on how the microelectronics industry can enable a secure and sustainable digital future. 15-19 February, the virtual event connects industry leaders and stakeholders across the entire electronics design and manufacturing value chain for the latest developments, trends, and innovations in key areas of industry growth including smart mobility, smart medtech, and MEMS and sensors. Registration is open.

TUGS LogoAt the opening day Executive Forum, international technology leaders will offer insights into the future of smart technologies as industry stakeholders gather to help shape the digital future for societal and economic prosperity.

Innovations across smart technologies such as 5G, artificial intelligence (AI) and Internet of Things (IoT) and industries including healthcare and mobility are transforming the way people work and live. The summit enables connections and partnerships while highlighting market opportunities in the digital transformation.

“While the past year brought tremendous societal and geopolitical challenges, it showcased the important contributions technology is making to improve all our lives, keeping us connected and working while accelerating the path to vaccines,” said Ajit Manocha, SEMI president and CEO. “The SEMI Technology Unites Global Summit will share insights from some of the microelectronics industry’s brightest minds on technology trends critical to advancing social and economic prosperity – and to staying ahead of the pace of digital transformation.”

Technology Unites Global Summit Highlights

  • Executive Forum
    • Global thought leaders will enable connections and partnerships and illuminate market opportunities for creating a smart, sustainable future. The executive forum will feature keynotes by executives from Infineon Technologies, imec, CEA-Leti, TEL, TSMC, NXP Semiconductors, Google, Umicore, JSR Corporation, Alibaba, Comet, Edwards Vacuum, AEM and UTAC.
       
  • Global Reach
    • The digital international exhibition will showcase new products and technologies while inviting interactions with a global audience.
    • Easy-to-navigate platform with opportunities for attendees to select content matching their professional interests and connect with like-minded industry experts.
       
  • Programs and Hosted Sessions
    • The Technology Unites Global Summit will highlight technologies and applications across key pillars of the next wave of microelectronics industry innovation and growth including mobility, advanced packaging, medtech, fab management, manufacturing, MEMS and sensors, advocacy, and diversity and inclusion.
    • Hosted sessions will provide the latest insights in start-up best practices, heterogeneous integration, smart manufacturing processes and standards, electronic systems design (ESD), advanced technologies, hardware for next-generation computing (NGC), ALD technologies, environmental sensors, and wet-chemical surface treatments.
       
  • Networking
    • Attendees will have direct access to technology leaders for answers to pressing questions.
    • Attendees will also enjoy opportunities to network with speakers, participants and customers through meet-the-expert sessions, live chats and video meetings.
       
  • Workforce Development
    • Those interested in careers in microelectronics will be able to tap current job vacancies in the industry.

Registration for the Technology Unites Global Summit for on-demand viewing of all content is open until March 26, 2021. The all-in-pass provides access to the entire event including forums, pavilions and the exhibition. Students, engineers, and startups can register at a special price.

Visit www.technologyunites.org or contact [email protected] for more information.

Follow #TechnologyUnites @SEMIEurope on LinkedIn and Twitter.   

  
Technology Unites Global Summit Premium Sponsors

Platinum 
ASE Group, CyberOptics Corporation, INFICON, Infineon Technologies, MADEin4, METIS, Picosun Oy, RENA Technologies GmbH, SPTS Technologies, a KLA company

Gold
AP&S International GmbH, Beneq Oy, Edwards Vacuum, EV Group, JSR Corporation, Merck KGaA, Darmstadt, Germany, Semics Inc., SÜSS MicroTec, Tokyo Electron Limited

Silver 
Comet, Evatec AG, FUJIFILM Electronic Materials, Okmetic Oy, SPEA Automatic Test Equipment, VAT Group 

Event sponsors: Advantest, Airspace, Applied Materials, CNW, DAS Environmental Expert GmbH, DB Schenker, Fraunhofer Institute for Photonic Microsystems IPMS, imec, Infinitesima, Lam Research, Max Group, PEER Group, Pfeiffer Vacuum, Posas GmbH, TRUMPF Hüttinger, Trymax Semiconductor Equipment BV, Watlow

 

About SEMI
SEMI® connects more than 2,400 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Technology Communities, defined communities within SEMI focused on specific technologies. Visit www.semi.org to learn more, contact one of our worldwide offices, and connect with SEMI on LinkedIn and Twitter.

Association Contact
Serena Brischetto/SEMI Europe
Phone: +49 30 3030 8077-11
Email: [email protected]
www.semi.org/eu

ECM Lab Solutions is a new offer from the ECM Group, dedicated to laboratories, research centers and universities. This offer combines equipment from three companies and four brands: ECM Technologies, ECM Greentech, SEMCO Technologies & Cyberstar.

With more than 90 years of experience in manufacturing industrial equipment, this ECM Group offer highlights the diverse and flexbile nature of ECM's technology and expertise by transitioning from heat treating steels and automotive applications to a wide range of research and specialty fields.

With advanced technologies for crystal growth, vacuum heat treatment and chemical vapor deposition, ECM Lab Solutions offers reliable solutions for semiconductor, solar, medical and other mechanical applications.