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SEMI Press Release
SEMI 3D & Systems Summit to Spotlight Heterogeneous Integration as Key to Europe's Semiconductor Future
Industry Leaders to Gather in Dresden Next Week to Bolster Europe’s Industry AmbitionsDRESDEN, Germany — June 12, 2026 — The SEMI 3D & Systems Summit, taking place June 17–19, 2026 in...
SEMI Press Release
European Commission Presents Chips Act 2.0 at SEMI Europe Policy Forum to Accelerate Semiconductor Innovation and Investment
Updated Framework Underscores Importance of Industry-Government Collaboration to Strengthen Europe’s CompetitivenessBRUSSELS – June 3, 2026 – The European Commission today officially...
Blog
Inspiring Semiconductor Talent: SEMI on Campus at the University of Catania
This blog series explores how collaboration between industry and academia can empower the next generation of semiconductor innovators. Through insights from leaders, educators, and students, we’ll...
SEMI Press Release
SEMI 3D & Systems Summit to Advance Heterogeneous Systems Integration with Focus on AI, Hybrid Bonding, and Europe's Chiplet Ecosystem
DRESDEN, Germany — May 6, 2026 — Global experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden,...
Blog
Engineering the Future of Chips: David Coenen on Photonics and Thermal Innovation
The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20...
Blog
Building Reliable Solutions at Scale: Pascal Fasel on Engineering in Semiconductors
The Rising Stars: 20 Under 30 blog series celebrates the brightest young leaders shaping the future of the semiconductor industry. These exceptional individuals have earned the SEMI Europe 20...
SEMI Press Release
SEMI Europe Highlights Six Key Policy Recommendations to Optimize the Chips Act 2.0 into a Strategic Instrument for Europe
BRUSSELS – April 27, 2026 – SEMI Europe today announced the publication of its Position Paper on the Chips Act 2.0, presenting a set of strategic recommendations aimed at reinforcing...
Blog
SEMI ISS Europe 2026: Navigating Geopolitics and Shaping Europe’s Semiconductor Future
As competition within the semiconductor industry continues to intensify, the need for Europe to strengthen its current position within the global supply chain and develop new partnerships are more...
SEMI Press Release
ECDA Launches Second Survey to Strengthen Talent Retention in the Semiconductor Sector
BRUSSELS — April 16, 2026 — The European Chips Diversity Alliance (ECDA), a European Union-funded initiative coordinated by SEMI Europe, today launched its second inclusion survey to better...
SEMI Press Release
European Chips Skills Academy Launches the ECSA Learning Platform
Offers Skills Development Resources and Career Opportunities for European Semiconductor WorkforceBRUSSELS — April 6, 2026 — The European Chips Skills Academy (ECSA), an European Union...
SEMI Press Release
SEMI Europe Policy Forum Brussels 2026 to Focus on Chips Act 2.0 in Shaping the Future of Europe's Semiconductor Industry
Forum Fosters Collaboration for a Unified, Competitive, and Sustainable Semiconductor Ecosystem in Europe BRUSSELS — April 14, 2026 — The SEMI Europe Policy Forum Brussels 2026 to be held...
SEMI Press Release
SEMI Europe Applauds the European Commission’s Implementation Dialogue on the Chips Act 2.0
BRUSSELS – March 26, 2026 – SEMI Europe today participated in the European Commission’s Implementation Dialogue on the Chips Act, chaired by Henna Virkkunen, Executive Vice-President of the European...