Agenda
DAY 1 | Wednesday, September 1
Session 1: Executive Keynotes |
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10:00 - 10:10 |
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Opening Remarks |
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10:10 - 10:35 |
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Power Delivery for Heterogeneous Systems |
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10:35 - 11:00 |
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ST Imaging Solutions |
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11:00 - 11:25 |
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Sensing and Computing Technologies for AR/VR Systems |
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11:25 - 11:50 |
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The Image Sensor Journey - To the Human Eye and Beyond Haechang Lee, Senior VP Automotive Sensor, Samsung Electronics |
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11:50 - 12:15 |
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Technology Requirements from an ICT-player: MEMS and Semiconductors Dr. Walter Weigel, VP, Huawei European Research Institute |
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12:15 - 12:40 |
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MEMS, Micronano Technology, and Sensors for Healthcare Frank van de Scheur, GM, Business MEMS & Micro Devices, Philips |
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12:40 - 13:05 |
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The Future is Heterogeneous Integration Mark Gerber, Senior Director, Engineering & Technical Marketing, ASE Group |
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13:05 |
Break | ||||||||
Session 2: Technology Roadmap & Market Briefing |
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13:20 - 13:25 |
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Opening Remarks by Session Chair Eric Mazaleyrat, Technology Scouting and Innovation Director, STMicroelectronics |
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13:25 - 13:45 |
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Electronics Market and Supply-Chain Dynamics Driven by Heterogeneous Integration Technology Advances Martin Schrems, Senior Advisor, Boston Consulting Group |
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13:45 - 14:05 |
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European Photonics Industry: Overview and Analysis by Application Segment Jacques Cochard, Business Development, TEMATYS |
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14:05 - 14:25 |
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Updates from the 3D and Packaging Markets |
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14:25 - 14:40 |
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MEMS and CIS: Lithography and Bonding Equipment Market State and Outlook Taguhi Yeghoyan, Market and Technology Analyst, Semiconductor Manufacturing, Yole Développement |
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14:45 - 15:05 |
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Heterogeneous Integration: Market Disruption Ahead Thomas Uhrmann, Business Development Director, EV Group |
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15:05 - 15:35 |
Live Q&A | ||||||||
15:35 |
Break | ||||||||
Session 3.1: Equipment and Materials for Enabling High Performance |
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15:45 - 15:50 |
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Opening Remarks by Session Chair Chris Jones, Senior Director, PVD Product Management, SPTS Technologies Ltd. |
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15:50 - 15:55 |
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SUSS MicroTec - On the Latest Developments for Hybrid Bonding | |||||||
15:55 - 16:15 |
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Measuring Complex Permittivity for 5G/mmWave Materials Hanna Kahari, Technical Leader Materials, Nokia |
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16:15 - 16:35 |
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Die-to-Wafer and Wafer-to-Wafer Hybrid Bonding in Spotlight of Heterogeneous Integration Jürgen Burggraf, Process Technology Manager Bonding, EV Group |
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16:35 - 16:45 |
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High Precision Advanced Bonding Technology for Die to Wafer and Die to Die Bonding for Complex 3D Structures including Hybrid Bonding and TCB Bonding Ruurd Boomsma, CTO, Besi |
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16:45 - 16:55 |
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Technology Pushes Limits – Next Generation ECD Cu and E’less Deposition Dr. Christian Ohde, Global Product Director – SC/FEC, Atotech |
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16:55 |
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Live Q&A | |||||||
Session 3.2: Equipment and Materials for New MEMS & Imaging Sensors |
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15:45 - 15:50 |
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Opening Remarks by Session Chair Matthias Schicke, Global Senior Key Account Manager, FUJIFILM |
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15:50 - 15:55 |
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SCHOTT Thin and Ultra-Thin Glass - Contribution to Sensor Packaging Ulrich Peuchert, Global Senior Product Manager, SCHOTT |
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15:55 - 16:00 |
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ULVAC's MEMS Solutions Based on Piezoelectric PZT and Sc-AlN Thin Film Gihun Ryu, Senior Application Engineer, ULVAC Germany |
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16:00 - 16:20 |
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Smart Engineered Substrates for Imaging, MEMS and Photonics Alain Delpy, Business Development Manager for MEMS, Imager and Photonics, Soitec |
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16:20 - 16:40 |
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Deposition and Etch Processing of Highly-Doped AlScN for Piezo-MEMS Applications Dr. Anthony Barker, Senior PVD Product Manager, SPTS Technologies Ltd |
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16:40 - 17:00 |
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Innovative Processing Solutions in 3D Sensor Manufacturing |
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17:00 - 17:20 |
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Enhanced Bonded SOI wafers for novel MEMS solutions |
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17:20 - 17:30 |
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Another Step Ahead with Novel Solutions for AlScN and PZT Deposition Maurus Tschirky, Senior Manager Product Marketing, Evatec |
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17:30 |
Live Q&A | ||||||||
Evening Get Together |
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18:00 |
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We welcome you to unwind for the day with a glass in hand and meet your peers during an informal evening networking. |
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DAY 2 | Thursday, September 2
Session 1: Metrology Advances for Digitized ECS Industry 4.0: Digitization of Manufacturing for Enhanced Productivity |
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10:00 - 10:05 |
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Open Remarks by Session Chair Marek Kysela, Senior Coordinator Advocacy, SEMI Europe |
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10:05 - 10:30 |
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CIS Latest Innovations Addressing the Challenges of Industry 4.0 Yoav Hirsch, Project Manager CIS R&D, Tower Semiconductor |
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Session 2: Diversity & Inclusion in the Semiconductor Industry |
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10:30 - 10:35 |
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Opening Remarks Cassandra Melvin, Director, Operations & Business Development, SEMI Europe |
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10:35 - 10:55 |
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Diversity and Inclusion in Semiconductor R&D: Insights from Merck’s Materials Innovation Team Beate Burkhart, Head of Materials Innovation Pipeline, Semiconductor Solutions, Merck |
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10:55 - 11:05 |
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Knowledge + Action = Change Christine Pelissier, Business Line Manager EMEA, Edwards Vacuum |
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11:05 - 11:25 |
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Building a Foundational Employee Resource Group (ERG) for Supporting and Promoting Women in a Global Semiconductor Equipment Company – KLA’s Inside Out Approach Mor Azarya, Senior Director of Engineering, KLA |
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11:25 - 12:00 |
Live Q&A | ||||||||
12:00 |
Break | ||||||||
Session 3.1: Requirements & Design in 3D |
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12:30 - 12:35 |
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Opening by Session Chair |
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12:35 - 12:55 |
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3D Integration and Packaging for Scalable Silicon Quantum Computing Jean Charbonnier, R&D Project Leader, CEA Leti |
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12:55 - 13:15 |
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Key Enabler of Edge & Tiny AI – Neuromorphic Computing and Heterogeneous Integration Dr. Wenke Weinreich, Deputy Institute Director, Fraunhofer IPMS-CNT |
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M. Jürgen Wolf, Head of Department, Fraunhofer IZM-ASSID | ||||||||
13:15 - 13:35 |
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3D-SOC Fine Pitch Memory-logic Partitioning, System Performance Benefits and 3D-Design Considerations Dragomir Milojevic, Senior Scientist, imec |
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13:35 - 13:55 |
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Enabling Alternative AI Micro-architectures Using Heterogeneous Integration Tony Mastroianni, Advanced Packaging Solutions Director, Siemens Digital Industries Software |
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13:55 - 14:30 |
Live Q&A | ||||||||
14:30 |
Break | ||||||||
Session 3.2: Technologies Roadmap for Advanced Imaging and MEMS Systems |
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12:25 - 12:30 |
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Welcome Note by MEMS & Imaging Committee Chair Jean-Luc Jaffard, Consultant and Advisor, RedBelt SA |
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12:30 - 12:35 |
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Opening by Session Chair |
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12:35 - 12:40 |
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Towards Advanced Silicon Wafers for Optimized MEMS Processes Jani Karttunen, Product Manager for Patterned Products, Okmetic |
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12:40 - 13:00 |
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MEMS Microphones: Enabling Next-Generation Features of TWS Earbuds Darragh Corrigan, Senior Staff Product Definition Engineer – MEMS Microphones, Infineon Technologies AG |
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13:00 - 13:20 |
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Image Sensor Innovations in 2020-21 Vladimir Koifman, CTO & Founder, Analog Value Ltd. |
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13:20 - 13:40 |
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Advanced 3D Technologies and Architectures for 3D Smart Imagers Pascal Vivet, Scientific Director of the Digital Systems and Integrated Circuits Division, CEA-LIST |
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13:40 - 14:00 |
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Technology Solutions for Complex Integration Challenges of Next Generation MEMS Products M. Jacques Renaud, Ph.D., Process Integration Manager, Teledyne DALSA Semiconductor |
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14:00 - 14:30 |
Live Q&A | ||||||||
14:30 |
Break | ||||||||
Session 4.1: New Bonding Technologies and How to Inspect |
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14:45 - 14:50 |
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Opening by Session Chair Franz Schrank, Director R&D - Wafer Level Integration & Photonics, ams-OSRAM group |
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14:50 - 14:55 |
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Improving Plating Uniformity for Hybrid Bonding and Micro Bumping Tim Skunes, VP of R&D, CyberOptics Corporation |
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14:55 - 15:15 |
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Wafer Level Etch & Deposition Technologies for Hybrid Bonding Dr. Dave Thomas, VP Product Management, SPTS Technologies Ltd |
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15:15 - 15:35 |
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Towards Cu-Cu Direct Bonding: Controlled Crystal Growth of Copper Deposits for Minimization of Interface Formation During Bonding Dr. Ralf Schmidt, Manager R&D – Semiconductor, Atotech |
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15:35 - 15:55 |
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Hybrid Bonding: Process, Inspection, and Metrology Challenges Maarten Liebens, Product Marketing Manager, KLA |
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15:55 - 16:15 |
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Advanced Process Control Solution for 3D Stacking Industry Dario Alliata, Director of Applications, Unity-SC |
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16:15 |
Live Q&A | ||||||||
Session 4.2: Advanced MEMS and Imaging System Solutions |
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14:45 - 14:50 |
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Opening by Session Chair Dimitrios Damianos, Custom Project Business Development / Technology & Market Analyst, Yole Développement |
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14:50 - 14:55 |
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Enabling Process Solutions for Imaging and MEMS: Leveraging Solutions from the Leading Edge David Haynes, Managing Director, CSBG Strategic Marketing, Lam Research |
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14:55 - 15:15 |
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How MEMS Sensors and Embedded AI Facilitate our Daily-life Ralf Schellin, Head of Product Area MEMS, Robert Bosch GmbH |
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15:15 - 15:35 |
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Integrated Sensors with Optical Readout: Optical Microphone and Pressure Sensors Xavier Rottenberg, Scientific Director - Group Leader Wave-Based Sensors and Actuators, imec |
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15:35 - 15:55 |
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From Miniaturized Bulk-MEMS Fabry-Pérot Filters to Modular Spectrometer Systems for the Visible to Infrared Range Dr. Alexander Weiss, Department Manager Fraunhofer ENAS |
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15:55 - 16:05 |
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Advanced Materials for Next generation Microlens Nicolas Blouin, Sr Manager R&D, JSR Micro NV |
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16:05 - 17:00 |
Live Q&A | ||||||||
DAY 3 | Friday, September 3
Technology Showcase |
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10:00 - 10:10 |
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Introduction to the Session by Chair and Explanation of Voting Process Dr. Martina Vogel, Advisor to the institute management, Manager Marketing/PR, Fraunhofer ENAS |
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Steven Steen, Director, Product Management - 3D Memory Solutions, ASML | |||
10:10 - 10:20 |
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Zero EC - Zero Energy Consumption Daniel Graf, Business Development Manager, Zero EC |
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10:20 - 10:30 |
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Next Generation Aerosol Printing – Printed Coils Wireless Charging/Communications David Keicher, VP, IDS |
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10:30 - 10:40 |
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Ultra-Precise Deposition of Nanomaterials for Heterogeneous Integration Łukasz Kosior, Business Development Manager, XTPL |
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10:40 - 10:50 |
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Transient Liquid Phase Sintering (Tlps) -Assembly for Heterogeneous Integration Takashi Mochizuki, Global Product Manager, Merck |
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10:50 - 11:00 |
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SILINA, a Deep Tech Startup to Curve CMOS Image Sensors at Industrial Scale Michael Bailly, CEO, Silina |
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11:00 - 11:10 |
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Hybrid Bonding Technology Enabling Next Generation of Semiconductors Abul Nuruzzaman, Vice President, Product Marketing, Xperi Corporation |
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11:10 - 11:30 |
Break | |||
11:30 - 11:50 |
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Updates from Past Technology Showcase Winner Andreas Kopetz, Vice President Environmental Sensing, Infineon Technologies |
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11:50 - 11:55 |
Live Announcement of Winner | |||
11:55 - 12:00 |
Wrap up of the Event | |||
12:00 |
End of the Connecting Heterogeneous Integration Systems Summit | |||