Technology and Trends

In the rapidly-evolving semiconductor industry, maintaining a competitive edge is crucial. To position Europe at the forefront of global semiconductor innovation, imec is leading the NanoIC pilot line initiative. Aligned with the European Chips Act, this initiative is a strategic move to bolster Europe's leadership in key markets like high performance computing, automotive, and healthcare.SEMI spoke with Srikanth Samavedam and Jo De Boeck from imec, Belgium, to learn more about the NanoIC pilot line and to better understand its goals, challenges, and prospects. From transitioning to gate-all-around (GAA) nanosheet devices, to developing advanced memory technologies and interconnects, this conversation highlights the cutting-edge advancements made possible through collaboration across the industry’s value chain.SEMI: How is the NanoIC pilot line working to revolutionize the semiconductor industry, and what are its main objectives?Samavedam: The NanoIC pilot line is a European initiative aimed at bridging the gap between R D and industrial innovation. The project is creating a beyond-2nm system-on-chip (SoC) pilot line, developing advanced logic, memory, and interconnect technologies. This effort supports the European Chips Act's vision for leadership and competitiveness in global semiconductor innovation, particularly in critical markets like high performance computing, communication, automotive, energy, and healthcare. However, advanced technologies come with more complexity, and addressing these complexity challenges requires more mature module baseline flows. By improving baseline flow repeatability and variability while reducing defectivity, we can accelerate the development of future technologies. The NanoIC pilot line is working to provide access to these advanced technologies and baselines to develop future compute systems. This will help ensure European competitiveness across the industry – from semiconductor materials, equipment and design to systems and applications.SEMI: Who are the core partners involved in this initiative?De Boeck: Key partners of the pilot line include CEA-Leti, Fraunhofer-Gesellschaft, VTT Technical Research Centre of Finland, Tyndall National Institute, and the Center for Surface Science and Nanotechnology of the University POLITEHNICA of Bucharest. This project is also supported by the Flemish government, other participating states, and the Chips Joint Undertaking of the EU Chips Act.These institutions and organizations bring a wealth of knowledge and resources, and imec compliments their efforts by providing access to its global partnerships with key industry leaders. The NanoIC pilot line is helping strengthen Europe’s global semiconductor industry leadership while aligning efforts with other regional Chips Acts. SEMI: Can you elaborate on the significance of transitioning from field-effect transistors (FinFETs) transistors to GAA nanosheet devices in CMOS technology?Samavedam: The transition from FinFETs to GAA nanosheet devices is a significant advancement in CMOS device technology. FinFETs have been the backbone of CMOS technology from the 22nm to the 3nm node. But starting at the 2nm node, nanosheet devices will need to be introduced. Nanosheet devices, including variants like Forksheet devices, are expected to drive scaling and performance through three generations – 2nm, A14, and A10. Complementary FET (CFET) architectures are also expected to be introduced around 2031 at the A7 node, which will represent another major inflection point in CMOS device design. This progression requires extensive research into new materials, process modules, equipment, and advanced patterning capabilities using high numerical aperture extreme ultraviolet (high NA EUV) lithography – all of which will be implemented on the NanoIC pilot line. FIGURE PROVIDED BY IMEC │ SCHEMATIC ILLUSTRATION OF A FUTURE COMPUTE SYSTEM. THE SYSTEM IS MADE OF LARGE MULTI-DIE ELECTRICAL-OPTICAL INTERPOSER PROVIDING ELECTRICAL AND OPTICAL INTERCONNECTS BETWEEN THE VARIOUS CHIPLETS (CPUS, GPUS, HBM). ALSO SHOWN ARE CONNECTIONS TO PACKAGE SUBSTRATE, AS WELL AS FIBER CONNECTORS AND AN INTEGRATED LASER SOURCE. CENTRAL PROCESSING UNIT (CPU); GRAPHICS PROCESSING UNIT (GPU); HIGH BANDWITH MEMORY (HBM); PROCESSING UNIT THAT CAN INCLUDE CPUS, GPUS, AND OTHER SPECIALIZED PROCESSORS (XPU); APPLICATION-SPECIFIC INTEGRATED CIRCUIT (ASIC); ELECTRONIC INTEGRATED CIRCUIT (EIC); FF-LEVEL: FEMTOFARAD-LEVEL; FIELD-PROGRAMMABLE GATE ARRAY (FGPA); GAAS QD: GALLIUM ARSENIDE QUANTUM DOT; INTEGRATED SILICON PHOTONICS PLATFORM 300MM (ISIPP300); REDISTRIBUTION LAYER (RDL); SILICON PHOTONICS (SIPHO); THROUGH PACKAGE VIA (TPV). SEMI: What are the key innovations necessary for advancing memory technology?Samavedam: As SRAM scaling slows, the exploration of novel, dense embedded memory concepts will become imperative. Technologies like spin orbit torque magnetic RAM (SOT-MRAM) and 2-transistor 0-capacitor (2T0C) embedded DRAM using deposited semiconductors like indium gallium zinc oxide (IGZO) are promising. These innovations address memory capacity and bandwidth challenges from new workloads in compute systems. Additionally, developing a 3D memory platform to explore future memory options will be essential for improving SRAM and DRAM. These advancements will help meet the demands of new applications like machine learning, augmented and virtual reality, and autonomous vehicles.SEMI: How do advanced interconnect technologies contribute to the future of semiconductor design?Samavedam: Advanced interconnect technologies, like chip-to-chip lateral (2.5D or interposer technologies) and vertical interconnects (3D technologies), play a crucial role in addressing memory capacity and bandwidth challenges. These technologies enable the partitioning of SoC functions into separate dies, allowing for more efficient and scalable designs. Advances like pitch scaling of micro-bumps and copper (Cu) hybrid bonding are facilitating this fine-grained partitioning of SoC functions. Additionally, optical interconnects and 3D interconnect-enabled co-packaging provide high-bandwidth and low-power connectivity at wafer scale. The rise of chiplet architectures and standardization will also increase the demand for low-cost, tight-pitch interconnect technologies like Cu/polymer redistribution layers.SEMI: How do your collaborators benefit from the NanoIC pilot line? De Boeck: One of the biggest collaborator benefits is the pilot line’s commitment to knowledge sharing through R D access and training. We invite foundries, IDMs, materials suppliers, equipment suppliers, and system companies/OEMs to jointly develop the materials, process modules, and integration flows to accelerate the development of beyond-2nm SoC technology pillars.Design pathfinding and system exploration process design kits (PDKs) will be available for start-ups, small- and medium enterprises, universities, and design and system companies to aid in prototyping and testing their designs. The NanoIC pilot line will also offer comprehensive training programs, including virtual PDK training, bootcamps for faculty, and internships and expert courses for students. To learn more, experts and key partners of the NanoIC pilot line will be presenting from 14 -16:40 at SEMICON Europa on November 12. imec’s program, ITF Chip into the Future, will highlight advancements in digital technology, capacity building through the European Chips Act, and the role of the NanoIC pilot line in accelerating beyond-2nm innovation. The conversation will also address industry requirements for pilot lines, emerging initiatives boosting Europe’s innovation and competitiveness, and perspectives on advanced materials and semiconductor equipment. Srikanth Samavedam, Senior Vice President of Semiconductor Technologies at imec, oversees programs in logic, memory, photonics, and 3D integration. Previously, he was a senior director at GlobalFoundries, leading 14nm FinFET technology into production and developing 7nm CMOS. Starting his career at Motorola, he worked on strained silicon and other advanced materials. He holds a Ph.D. in materials science and engineering from MIT and a master's degree from Purdue University. Jo De Boeck, Executive Vice President and Chief Strategy Officer at imec, oversees the company’s strategic direction and serves on its executive board. He joined imec in 1991 after earning his Ph.D. from KU Leuven and has since held various leadership roles, including head of imec’s Smart Systems and Energy Technology business unit and CTO. De Boeck is also a part-time professor at KU Leuven. Maria Daniela Perez / Communications Manager, SEMI EuropePhone: +49 160 2562977Email: [email protected]

With the rapid proliferation of electronics applications with more powerful embedded intelligence, demand for smarter, more efficient sensors is increasing to help devices connect to the world around them. As the semiconductor industry drives the future of connected technologies and sustainable solutions, it faces challenges in energy consumption, resource management, and ensuring data security.SEMI spoke with Simone Ferri, Vice President and General Manager at STMicroelectronics (ST), about current trends and challenges in the Micro-electromechanical Systems (MEMS) and imaging sensors market and how ST is driving innovation in this rapidly evolving industry. Ferri shared insights ahead of his keynote presentation at the SEMI MEMS Imaging Sensors Summit on November 14, 2024, in Munich. Registration is open.SEMI: Welcome, Simone, and thank you for sharing your perspective on the dynamics and trends for today’s MEMS and imaging sensors. To start, how would you describe the current market dynamics for these technologies, and what key factors are influencing these dynamics? Ferri: Right now, the MEMS and imaging sensors market is primarily driven by applications such as automotive electronics, consumer medical devices, AI-powered devices, and intelligent wake-up systems.According to Omdia, the MEMS market is projected to reach approximately $11 billion by 2027, with a CAGR of 2.8% from 2022 and 2027. Currently, automotive applications account for 50% of this market, with industrial at 15% and consumer at 35%. Notably, the automotive sector is the fastest growing, with a 5.4% CAGR, driven by the increasing use of inertial measurement units (IMUs) and microphones.In addition, Yole Group estimates that the imaging market, including optical sensing, will grow at a 4.7% CAGR between 2023 and 2029. Although mobile phone applications remain the primary driver of Complementary Metal-Oxide-Semiconductor (CMOS) image sensors (CIS) volumes, other sectors, including consumer electronics, automotive, and security imaging, are also contributing to the growth.Long-term forecasts for smartphone sales have been trending downwards, but mobile phones still remain a major driver of applications, innovation, and overall volume in the imaging market. Notably, the automotive imaging sector is one of the fastest growing markets and is expected to drive additional demand for CIS.Factors that influence the current market include global economic conditions, regulatory changes, geopolitical factors, technological innovations, and the emergence of new applications and use cases.SEMI: Can you elaborate on the growth strategies that STMicroelectronics is adopting to stay competitive in the MEMS and imaging sensors market? Ferri: ST has played a pivotal role in both the MEMS and imaging sensors markets for over two decades with its proprietary silicon technologies. We fully leverage our Integrated Device Manufacturer (IDM) business model, which allows us to support our customers through integrated capabilities for both design and manufacturing.To remain competitive, we are exploring new markets for MEMS sensors, particularly in digital healthcare with biosensors, where wearable devices are expected to exceed 500 million units per year by 2027.We’re focusing on the growing demand for automotive sensors such as accelerometers, Inertial Measurement Units (IMU), and pressure sensors, particularly with the rise of electric vehicles. We are enhancing the integration and synergy between automotive and personal devices. For example, we are combining high-g and low-g accelerometers within a single IMU, enabling accurate fall and crash detection, along with precise orientation and wake-up functionality.AI is another one of our priorities. In today's digitalized world, AI enables real-time, contextual understanding and the ability to make decisions that optimize and reduce the power consumption of the final device. Sensors are no longer merely for data collection. Thanks to AI, sensors can interact with their environment and significantly contribute to innovation and sustainability.We are also prioritizing low power consumption. Our MEMS technology operates in low-power mode with almost negligible energy use, activating only when necessary, without waking up the system to understand its environment or to be reconfigured.In addition, we’ve seen optical sensing continue to grow year over year. Optical sensing now offers features such as 3D capture, low-power and low-footprint computer vision, Near InfraRed (NIR) and even Short Wavelength InfraRed (SWIR).We are accelerating and leveraging our IDM model and broadband semiconductor supplier positioning to propose wider system offerings based on the array of sensors and microprocessors that ST develops. As the world shifts toward widespread use of sensors and data collection, the demand for secure sensing technologies is growing, extending beyond mobile and PC applications to spatial computing and AR/VR environments. For example, if we are talking about recognizing specific persons in an AR environment, we don't want the data related to these persons to be sent to the cloud before a decision is made about whether they are supposed to be there or not, as such information can be intercepted. We want all the data to be managed at sensor level and only a warning of rejection or acceptance to be transferred outside our secure sensor. SEMI: What are some of the latest technological innovations in MEMS and imaging sensors that are shaping the industry? Ferri: In MEMS, we're seeing significant advancements in three key areas:- In-sensor AI is integrating technologies in the sensors such as machine learning core (MLC), adaptive self-configuration (ASC), and intelligent sensor processing units (ISPU).- Open sensors are designed to interface seamlessly with other sensors, allowing third parties to benefit from on-sensor processing innovations, while building an ecosystem to create joint value with customers.- Accurate sensors are providing high-precision data, enabling better decision-making and smoother, more natural user interactions. These sensors also reduce factory calibration time and resources, leading to overall lower energy consumption. Because of their accuracy, onboard MLC, and ASC, the sensors can also reconfigure themselves without interaction with the processor, thus guaranteeing the proper accuracy at lower power consumption, at any time, under any condition.In the imaging sensor market, key trends include:- Higher Pixel performance is leading to improved signal-to-noise ratio (SNR), low light performance, better quantum efficiency (QE) and lower noise performance. Despite post processing, pixel performance remains the key factor as SNR performance must remain high while the pixel shrink roadmap advances.- Embedded Intelligence is providing local processing for local decision making, enhanced security, advanced image sensor processing (ISP) for improved image quality, and fusing sensor functions to deliver a better user-experience.- "Always on" capabilities are supporting mass sensorization and deployment of optical sensing solutions everywhere through specific low-power design techniques, process development, and overall system architecture optimization.SEMI: Looking toward the future, what trends do you anticipate will have the most significant impact on the MEMS and imaging sensors market? Ferri: Some macrotrends for sensors include:Electrification: Certain consumer and industrial applications are now being adopted in the automotive sector, especially with the rise of electric vehicles creating new opportunities for innovation and for new players to enter the market. As example, the predictive maintenance that has been developed for industrial electric motors is ported 1:1 to electric vehicles.AI: Regarding data transmission, distributed architecture will push AI towards edge computing, increasingly supported by advancements in 6G and foldable technologies. Additionally, as AI becomes more integrated, the maintenance and security for AI will require more attention.Smart home, buildings, and cities: As cities grow, the demand for smart homes and buildings rises, requiring more sensors to manage energy, security, and urban infrastructure efficiently. Over 55% of the global population and 70% of the EU population reside in cities. Urban areas generate more than 80% of the world’s GDP, and by 2030, it's anticipated that 68% of the global population will be urban dwellers, pointing to the growing need for smart cities.Aging population and digital health: The integration of biosensors with MEMS technology will be crucial for addressing the needs of an aging population.Overall, the use of image sensors for environmental sensing is steadily increasing. This is a major focus for ST, particularly in 3D sensing. New use cases, such as presence detection, are enhancing security and reducing power consumption due to efficient data processing. Additionally, the average number of cameras in smartphones, automobiles, and even in devices like robots and vacuum cleaners, continues to grow.SEMI: What has STMicroelectronics been working on, and what are your plans for the upcoming years? Ferri: To date, we have shipped over 23 billion MEMS sensors. Still, we remain committed to continuously improving our products and enhancing our MEMS technology in terms of affordability, miniaturization, performance, and novelty. We are striving to set the stage for a future defined by innovation and excellence with:Evolution of our current product portfolio by investing in lower power consumption, lower supply voltage, and additional and more sophisticated in-sensor AI for an effective distributed AI conceptNew sensors for presence detection, like infrared (IR) sensors, and health-focused sensors such as biosensors.MEMS sensors are also becoming increasingly accurate, open towards different ecosystems of technologies, and so intelligent that they can self-configure and reduce power consumption thanks to optimal data processing. These attributes allow us to provide meaningful and sustainable solutions across sectors such as automotive, industrial, infrastructure, and personal electronics, enabling us to improve energy efficiency, reduce waste, and support sustainable practices for a greener planet.For the past 10 years, ST has focused on depth sensing across multiple use cases. Today, ST is the number one in the world for time-of-flight solutions through our ST FlightSense product family. More recently, we launched our global shutter image sensors family, ST BrightSense, to address markets like personal electronics, automotive, industrial, communications equipment, and computers and peripherals.More specifically on the automotive side, we have the portfolio, customers, and customer program awards to lead the driver and occupancy monitoring market. We continue to secure design wins from our growing customer base while we expand our product portfolio and broaden our customer and application footprints.SEMI: What are some of the biggest challenges facing the MEMS and imaging sensors industry today, and how is ST addressing them? Ferri: The MEMS and imaging sensors industry faces several challenges, but with strategic planning and innovative solutions, companies can overcome these obstacles by focusing on the following:Integration: With our biosensors, we are doing more with less space. For example, in a standard accelerometer, we integrate an analog front end for electrocardiogram (ECG) analysis, enhancing functionality without increasing the device footprint.Performance enhancement: Ensuring high performance and reliability in various environmental conditions is crucial, especially in automotive and healthcare applications. To meet these demands, we deploy comprehensive testing protocols to ensure our sensors meet performance and reliability standards.Power efficiency: Reducing power consumption is vital, particularly for battery-operated devices like smartphones and IoT devices. We are developing low-power architectures to address this need.Data security: With the growing use of imaging sensors in surveillance and personal devices, data security and privacy have become paramount. Our solutions include encryption for data transmission and storage, as well as robust access control mechanisms to prevent unauthorized access to sensor data.Additionally, supply chain issues remain a significant challenge today. We believe our strategy and capacity as an IDM, combined with our strong innovation capabilities, give us a competitive edge in supply chain management.SEMI: What are you most looking forward to at the MEMS Imaging Sensors Summit, and what does it mean for the European semiconductor industry? Ferri: I look forward to the Summit as a valuable opportunity to connect with industry peers, share insights, and explore new collaborations. I encourage my peers to attend, as it’s a unique platform to collectively shape the future of our industry and sustain Europe’s leadership in semiconductor innovation. About Simone FerriSimone Ferri is Vice President of APMS Group and General Manager for MEMS sub-group at STMicroelectronics. Ferri began his career in STMicroelectronics in 1999 as an R D engineer before becoming a digital designer for the company’s audio division, leading into product management after 5 years. In 2014, ST entrusted Ferri with MEMS consumer sensors followed by global MEMS-sensor related Marketing and Application activities across all markets and segments, leading into his current role. Ferri graduated with a degree in microelectronics from Politecnico di Milano (Polytechnic of Milan), where he also completed his MBA. 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