Business and Markets

Insights from the ISS Europe 2025 Press Briefing in SopotAt the SEMI Industry Strategy Symposium Europe (ISS Europe) 2025, held in Sopot, Poland, senior leaders from government, industry, and the investment community came together to share insights on Europe’s evolving semiconductor landscape. During a dedicated press briefing, they addressed Poland’s growing role in the ecosystem, the significance of international collaboration, and the strategic levers needed to bolster Europe’s competitiveness in semiconductors.Against the backdrop of accelerating investment through the EU Chips Act, speakers emphasized that building Europe’s semiconductor future will require more than funding. It will demand cross-border collaboration, cohesive public-private strategies, and a long-term vision to ensure talent pipelines and supply chain resilience.The briefing featured remarks and commentary from:Laith Altimime, President, SEMI EuropeAgnieszka Sygitowicz, President, The Polish-Taiwanese Chamber of Commerce and IndustryPawel Pudlowski, Ph.D., Deputy CEO, Polish Investment and Trade Agency (PAIH)Monika Morali-Majkut, Chairwoman of the Supervisory Board, Atlas WardBenedikt Ernst, Senior Vice President and Head of Strategy Transformation, Merck KGaA, Darmstadt, GermanyDionys van de Ven, President, Comet YxlonAnna-Riikka Vuorikari-Antikainen, Chief Commercial Officer, Okmetic From left to right: Agnieszka Sygitowicz, President, The Polish-Taiwanese Chamber of Commerce and Industry; Pawel Pudlowski, Ph.D., Deputy CEO, Polish Investment and Trade Agency; Monika Morali-Majkut, Chairwoman of the Supervisory Board, Atlas Ward; Laith Altimime, President, SEMI Europe; Benedikt Ernst, Senior Vice President and Head of Strategy Transformation, Merck KGaA, Darmstadt, Germany; Dionys van de Ven, President, Comet Yxlon; Anna-Riikka Vuorikari-Antikainen, Chief Commercial Officer, OkmeticSEMI: How are the private sector and international partners contributing to Poland’s ecosystem development?Morali-Majkut: The private sector is essential to building Poland’s semiconductor ecosystem. At Atlas Ward, together with like-minded companies, we’ve launched SEMICON Supply Poland to help develop a strong, scalable supply chain. We’re working to ensure that essential infrastructure is ready: land, utilities, materials, and specialized service providers that can meet the needs of incoming semiconductor investments. But this isn’t just a national effort. We’re closely aligned with ecosystem-building in Dresden, Prague, and across Central Europe. Collaboration across borders is essential.Sygitowicz: We believe strongly in the philosophy of “building bridges.” In our work with Taiwan and other partners, we focus on five “bridges”: knowledge, people, business, development, and shared success. These connections are critical for Poland to become an integral part of the global semiconductor supply chain. Poland is not trying to replicate what others have done, but to learn from it—particularly in ecosystem development. The long game is not just investment attraction; it’s ecosystem maturity. SEMI: Talent shortages remain a major concern across the industry. What steps are being taken to prepare the future-ready workforce?Morali-Majkut: We are working closely with academia to build the talent pipeline Poland will need as its semiconductor sector grows. Together with industry partners, we’re developing vocational training programs and university-level collaborations aimed at aligning skills with industry needs. There are already several R D-focused projects underway at Polish technical universities, and Poland’s strong foundation in technical education positions us well to support workforce growth as the industry scales up.The semiconductor industry has one of the most complex supply chains in the world. Investing in this industry creates ripple effects across a wide range of skill areas. When we invest in semiconductor education, the spillover benefits for the broader economy will be immense.Altimime: While the talent shortage is certainly a challenge, it also presents a massive opportunity. At SEMI, we’re committed to making Europe’s semiconductor investment a long-term success. Through strong collaboration with the European Commission and a broad network of consortium partners across Europe, including Poland and other Eastern European countries, we’re pushing forward both public and private sector engagement to ensure the continuity of growth and innovation.Europe is projected to face a shortage of 271,000 skilled workers in the semiconductor sector by 2030 if current trends persist. To address this challenge, SEMI is leading a range of initiatives focused on reskilling, upskilling, and cross-sector knowledge development. We’ve established an Educational Leaders Board with 18 consortium members and are organizing events to reach out to students and educational institutions – including the recent SEMI On Campus with the University of Gdańsk — all to foster stronger connections between academia and industry. SEMI: How can Europe strengthen its semiconductor supply chain resilience in the face of geopolitical challenges?Ernst: Resilience starts with recognizing and building on Europe’s existing strengths. While much attention is often given to gaps, Europe already has world-class players, technologies, and a strong consumer market. These are key strategic assets. What’s needed now is coordination—government and industry must work together to align efforts, avoid fragmentation, and ensure that political initiatives channel support in a unified direction.Van de Ven: For industry, true resilience means the freedom to operate globally. Trade controls and IP restrictions can create bottlenecks, so policies must support open access to markets across regions—including the U.S., Europe, and Asia. Companies also need to co-create with fabs and universities, embedding themselves where talent is trained and where innovation happens. This creates a robust, future-ready ecosystem. Location decisions are increasingly influenced by proximity to both production facilities and research institutions.Sygitowicz: Poland is well-positioned to support investment through a combination of ready-to-develop land, financial incentives (such as grants and tax exemptions), and ecosystem services. Beyond infrastructure, there is growing government support for talent development and innovation. Startups, accelerators, and academic partnerships are playing a larger role in building the technology pipeline—creating a more comprehensive, innovation-friendly environment for foreign investors.Vuorikari-Antikainen: Speed is an often overlooked but critical factor in competitiveness. Europe has historically moved slowly, but if countries like Poland can create fast-track pathways for permitting, investment, and project execution, they can set themselves apart. Pairing this agility with strong education and startup ecosystems will help deliver long-term resilience and responsiveness to market needs.Altimime: We must avoid country-centric thinking. Europe’s strength lies in its diversity with different regions excel in different areas, and the challenge is to bring those strengths together. Initiatives like the pilot lines are a great example of this in action, connecting capabilities in photonics, advanced packaging, and quantum technologies across the continent. With strong leadership from Europe’s research and technology organizations (RTOs), such as the Technical Research Centre of Finland (VTT), we’re seeing renewed momentum in areas where Europe has historically been strong, like communications and photonics.To truly accelerate Europe’s position in the global semiconductor landscape, we need to focus on integration—connecting the dots between regions, institutions, and industries. From left to right: Laith Altimime, President, SEMI Europe; Benedikt Ernst, Senior Vice President and Head of Strategy Transformation, Merck KGaA, Darmstadt, Germany; Dionys van de Ven, President, Comet Yxlon; Anna-Riikka Vuorikari-Antikainen, Chief Commercial Officer, OkmeticSEMI: With the European Commission discussing a potential second Chips Act, what lessons should we carry forward from the first—and how can Poland play a stronger role?Van de Ven: The primary objective of the Chips Act should be to enable investment and industrial action. In some cases, we’ve seen frameworks become overly complex, attempting to define platforms or outcomes in ways that don’t always align with business needs. From an industry standpoint, what’s most helpful is straightforward support—mechanisms that empower companies to invest where it makes sense and move quickly. Ultimately, the private sector will determine how to build and scale the necessary infrastructure and innovation.Pudlowski: It’s true that Poland did not benefit from the first Chips Act to the extent that its assets and potential might suggest. We offer a combination of engineering talent, geographic advantage, and industrial readiness—yet, in terms of EU-level influence and visibility, we’ve been underrepresented. That is beginning to change.Poland now has a national semiconductor strategy backed by the government, and this, combined with growing engagement from organizations like SEMI, positions us for stronger inclusion going forward. At the same time, we need more bottom-up visibility. Companies in Poland should proactively present their capabilities and publish their work more widely. We have a great deal to offer, and now is the time to ensure that’s recognized in Brussels and across Europe.Altimime: Poland’s recent release of its national chip strategy is both timely and critical. From SEMI’s perspective, this is a proven model: a clear strategic roadmap, strong government backing, and industry alignment create the right environment for success. The first Chips Act delivered real progress and global attention, and with Poland’s new strategy in place, we expect to see even greater integration into the European semiconductor value chain in the next phase of the initiative.Morali-Majkut: During recent conversations with international partners, particularly in Asia, it became clear that while countries like Germany and the Czech Republic are well known within the semiconductor ecosystem, Poland has not always been equally visible—despite being geographically and industrially well-positioned. That perception is starting to shift.Poland has long played a vital role in Europe’s industrial supply chain, particularly in collaboration with Germany. We bring a strong foundation in engineering, education, cost-efficiency, and industrial land availability. These assets are highly relevant to semiconductor expansion. Rather than seeing countries in isolation, we should frame this as a collaborative regional model—linking Germany, the Czech Republic, and Poland as an integrated supply chain hub. SEMI ContactSitong He, Communications ManagerEmail: [email protected]

The semiconductor industry lies at the heart of Europe’s technological ambitions, powering breakthroughs in artificial intelligence, quantum computing, and advanced manufacturing. However, as the industry expands rapidly to meet surging global demand, the need for highly skilled workers is outpacing supply. According to the recently published ECSA Skills Strategy, Europe must train and hire tens of thousands of skilled professionals by 2030 to remain globally competitive. Without a robust and inclusive talent pipeline, the region’s independence in critical technologies might be at risk.At this year’s Industry Strategy Symposium Europe (ISS Europe) held in March, a panel discussion moderated by Maria Daniela Perez from SEMI Europe, brought together industry leaders and experts to explore solutions to this challenge. The discussion centered on how emerging technologies are reshaping the workforce, the role of education in preparing future professionals, and strategies for attracting and retaining diverse talent – all critical to ensuring sustainable workforce development in the semiconductor industry.Tackling Talent Acquisition and RetentionCatherine Le Lan, European University Program Manager from Synopsys, drew a direct connection between technological disruption and workforce challenges. “AI is driving unprecedented changes, and hardware is at the heart of the AI revolution,” said Le Lan. As the industry invests in new methodologies, leading-edge technologies, and innovative products, the demand for updated skillsets continues to outpace supply. This places a dual burden on companies – who must hire for both today’s and tomorrow’s skills – and on the education sector, which is expected to rapidly adapt.Meike Boekelmann, Chief of Human Resources at Comet, highlighted that the challenge is not just about attracting talent from within the semiconductor field – it is also about standing out in a crowded talent market. “We are not only competing within our industry for talent. We’re also competing against other industries: automotive, consumer electronics, and AI,” said Boekelmann. To succeed, companies must go beyond traditional incentives and offer meaningful, forward-looking career experiences. “Primarily what I see is that they’re really asking for creating an impact and also a sense of belonging… so they want to see what’s the outcome,” she explained. “There are more people leaving the labor market than entering the labor market,” added Thomas Kralinski from the Saxon State Secretary of Economic Affairs, Labour, Energy and Climate. “We need to think about immigration, family-work integration, and training.” His comments underscore the need for a holistic workforce strategy – one that not only fills immediate vacancies, but also strengthens the broader ecosystem through inclusive policies, targeted reskilling, and long-term demographic planning.Fostering Industry-Academia SynergyAs the industry evolves, so must its workforce. Andreas Schleicher, Director for Education and Skills at the OECD, made a stark observation. “There’s one thing worse than losing people – and that is to keep them and not upskill them.” He warned that the current pace of technological change demands far more than one-time training; it requires a culture of continuous learning. “Neither the industry nor the education sector has the capacity for upskilling and reskilling,” he noted, pointing out that while Europe performs well in early education, adult learning remains insufficient. “The incidence and intensity of upskilling and reskilling is so far out of what we will need.” Without scalable, lifelong learning systems, even experienced professionals risk being left behind.Building on this idea of future-readiness, Thomas Kralinski noted: “Do you know what kind of fab is going to be open in 10 years’ time or what startup is going to be founded in 10 years’ time? You probably don’t. But everybody who’s working there or will work there is born already – and is probably in school or at the university.” He underscored the need for steady investment in teachers, training systems, and educational infrastructure – not just to meet today’s demand but to ensure Europe’s long-term competitiveness.To truly inspire the next generation, Schleicher pointed to visibility as a vital factor. “You cannot be what you cannot see.” Without relatable role models or a clear understanding of how their interests connect to meaningful careers, young people – especially underrepresented students – often overlook STEM pathways. Schleicher described how even small actions, like industry professionals visiting schools to explain their work, can have a lasting impact. “You can bring someone from the semiconductors industry to speak to students and help them understand, for example, what’s in a mobile phone and that they can actually create tomorrow’s mobile phone.” That kind of engagement, he argued, helps “build dreams” and makes technology tangible, exciting, and inclusive.AI: An Enabler, Not a ThreatPanel moderator Maria Daniela Perez raised a critical question about the evolving role of AI in the workforce. Acknowledging the widespread concern that AI could lead to job displacement, she challenged the panel to consider a different perspective. How can AI be leveraged to broaden and accelerate the talent pipeline rather than replace it? In response, the panelists emphasized that AI is not a disruptor but an accelerator. Rather than eliminating jobs, AI-driven tools enhance productivity by automating repetitive tasks, freeing professionals to focus on innovation, problem-solving, and high-value work. Catherine Le Lan provided a compelling example, explaining how AI-powered electronic design automation (EDA) tools are enabling engineers to push the boundaries of technological advancement. She referred to a university study that compared two groups of students – one with access to AI tools and one without. “They found out that those AI tools helped to improve productivity and also helped to improve skills of the students,” she said. “The student who had used AI tools had better skills than the one who hadn’t used AI tools… because they had been able to focus on the high-level skills, and they got rid of the low-level skills.” Her remarks underscored how AI, when integrated into education, can accelerate both efficiency and learning outcomes.Collaboration: The Key to Sustainable Workforce DevelopmentAddressing the workforce challenge requires cross-sector collaboration among industry, academia, and policymakers. There is a shared responsibility to invest in long-term education strategies, develop structured training initiatives, and create an ecosystem where talent can thrive. This is precisely the mission of two SEMI Europe-led initiatives.The European Chips Skills Academy (ECSA) and the European Chips Diversity Alliance (ECDA) are playing a critical role in shaping Europe’s semiconductor workforce. ECSA is driving efforts to align education and training with industry needs, ensuring that both students and professionals are equipped with the technical expertise and practical experience required for the sector’s future. Meanwhile, ECDA focuses on building a more inclusive semiconductor workforce across the industry. By creating opportunities for underrepresented groups, ECDA is ensuring that the industry benefits from a broad talent pool.Securing Europe’s Semiconductor FutureIn her closing remarks, Maria Daniela Perez brought the discussion full circle, emphasizing that addressing the semiconductor talent gap requires collective ownership: “In the end, it ends up being all about collaboration,” said Perez. From engaging technology users to amplifying the industry’s visibility, to aligning with academia and policymakers, the path forward depends on shared action. By fostering this ecosystem-wide commitment – and investing in the people behind the progress – Europe can bridge the talent gap and shape a resilient, inclusive, and globally competitive semiconductor workforce.SEMI ContactKartikey Srivastava, Senior Specialist, CommunicationsEmail: [email protected]

The European semiconductor ecosystem continues to evolve, driven by the ambitions outlined in the EU Chips Act. With goals to strengthen Europe’s technological leadership and double its semiconductor manufacturing market share to 20% by 2030, collaboration across the value chain is imperative. Heterogeneous Integration for Connectivity and Sustainability (HiCONNECTS), a Horizon Europe-funded project, exemplifies this collaborative spirit. The initiative aims to develop next-generation electronic components and systems using advanced heterogeneous integration core technology solutions.The HiCONNECTS consortium, comprising 65 partners with diverse expertise, is addressing key societal and industrial challenges. These efforts focus on advancing core technology solutions for energy-efficient, high-performance wireless and wired cloud and edge computing, as well as automotive radar systems.“Collaborating with 65 partners is no small feat—it’s akin to orchestrating a complex IT network,” says Ilan Englard, Coordinator of the HiCONNECTS project. “We streamline progress by creating local networks of partners, all interconnected through a central management framework of tasks, work packages, and coordination. Such large consortia form intricate systems where complexity fosters innovation, often leading to surprising and transformative outcomes.” As the three-year project progresses, HiCONNECTS is working to establish pilot lines focused on key areas:RF Electronic Heterogeneous IntegrationPhotonic Components for Heterogeneous IntegrationAdvanced Packaging for Heterogeneous IntegrationThese pilot lines, led by organizations such as the Ferdinand Braun Institute and imec, will develop systems and modules through advanced equipment development, manufacturing optimization, and integration of electronic and photonic components. Validation of equipment in integrated process flows will further enhance the heterogeneous integration landscape.Now in its third year, HiCONNECTS continues to welcome new members. This inclusiveness underscores the project’s flexibility and its commitment to incorporating fresh perspectives as new trends and challenges emerge. At the 12-month consortium meeting in Catania last February, Arbonaut was unanimously inducted to contribute to the forest fire use case, further expanding the project’s scope.“The upcoming months are critical, as we move closer to delivering modules, systems, and demonstrators,” says Englard. “Our goal is to heterogeneously integrate the next generation of RF, electronic, and photonic components into networking, telecom, and radar systems, with support from module and equipment makers.”HiCONNECTS members at the 12-month consortium meeting in Catania, February 2024As this ambitious work progresses, sharing project results and achievements remains a top priority for the consortium to ensure meaningful social, political, and economic impact. By drawing attention to the results of the project, the consortium enhances the visibility, comprehension, and implementation of these advancements. Recently, four partners—Excillum, TNO, SANLAB, and Centria University of Applied Sciences—participated in a webinar titled “Heterogeneous Integration for Future High Speed Communication,” organized by SEMI Europe. The webinar is now available on demand for viewers worldwide.The significance of HiCONNECTS was further highlighted at SEMICON Europa 2024, where seven consortium members presented progress on topics ranging from advanced packaging to photonic integration. At the TechARENA, representatives from SEMI Europe, Excillum, Centria, Arbonaut, AT S, imec, and Applied Materials showcased the project’s contributions to the semiconductor ecosystem. “I was thrilled to present at the TECHArena and engage with the HiConnects partners,” said Julius Hållstedt, Head of segment - Semi Electronics, Excillum. “I especially appreciated the high attendance at my talk, which validated the strong interest in X-ray solutions for semiconductor applications. The insightful discussions at the SEMICON Europa exhibition and advanced packaging conference was a rewarding bonus.”HiCONNECTS Speakers at SEMICON Europa 2024By disseminating research and breakthroughs across various channels, such as publications, webinars, and conferences, HiCONNECTS is promoting knowledge sharing and fostering collaboration across the semiconductor ecosystem. This openness accelerates the adoption of new technologies, ensuring that European industry players remain at the forefront of critical advancements. Furthermore, sharing these results strengthens Europe’s position as a hub for cutting-edge research and development, driving both economic growth and technological leadership on the global stage.SEMI Europe is proud to be a consortium member of HiCONNECTS under the Chips Joint Undertaking (Chips JU), which is funded by the EU Horizon Europe program and supported by numerous countries, including Austria, Italy, Germany, and Sweden.About HiCONNECTS:HiCONNECTS (Heterogeneous Integration for Connectivity and Sustainability) is a three-year project bringing together 65 partners to develop sustainable, energy-efficient cloud and edge computing platforms. The project focuses on high-performance computing, storage infrastructure, network interfaces, and real-time analysis of IoT sensors and big data.Kartikey Srivastava is Senior Specialist – Communications at SEMI Europe.

While many individuals in leadership positions are seen as role models, only a select few have the ability to create a lasting impact on both individuals and organizations. Role models play a pivotal role in the growth of individuals, teams, and entire companies. Whether intentionally or not, role models possess the power to shape the possibilities others envision for themselves, and exceptional role models harness this power to empower and inspire.The Role Models article series shines a light on remarkable individuals who serve as inspirational leaders for their achievements, leadership, and positive influence. In each installment, we delve into the life and accomplishments of these exceptional role models, exploring their journeys, values, and the impact they've made on their organizations, communities, and across industries. Join us in celebrating these outstanding individuals and discover the valuable lessons they offer for aspiring leaders and changemakers.Role Model - Stephan HaferlIn an industry driven by innovation and high-tech advancements, Stephan Haferl stands out as a transformative leader at the helm of Comet, a globally recognized Swiss technology leader specializing in x-ray and radio frequency solutions for the semiconductor industry. As CEO, Stephan Haferl has successfully guided the company through a period of transformation, focusing on innovation, operational excellence, and customer satisfaction. With extensive experience in business management and a Ph.D. in mechanical and process engineering from the Swiss Federal Institute of Technology (ETH), Haferl has led Comet’s transformation while also contributing to the broader industry as a member of the Board of Directors at Belimed AG and the SEMI Europe Advisory Board.In this interview, Haferl shares his personal journey and leadership philosophy, offering invaluable insights into the mindset of a successful business leader and the values that drive his work. His dedication to mentorship, diversity, and cross-functional learning serves as a beacon for future generations of leaders.SEMI: Please tell us about your background and professional experience.Haferl: My father passed away from cancer when I was a young child, and though I have only faint memories of him, he left behind a remarkable legacy. He had a great library filled with books on physics, math, and engineering, as well as stories and photographs showcasing his passion for tinkering and DIY projects. In many ways, this collection became a foundation for my intellectual development. Reading his books, going through his notes from university, and exploring his projects allowed me to feel spiritually connected with him. Fortunately, his passion for the technical world was something I inherited. I became a dedicated engineer and tinkerer, and that mindset has helped me embrace every challenge I encounter. While this is a large part of “what I am”, I believe that “who I am” is even more important. That was shaped largely by my maternal grandmother. She lost her husband, my grandfather, during the war when my mother was just a baby. Despite this hardship, she remained single throughout her life, focusing on raising my mother and running my late grandfather’s little shop in post-war rural Norway. She was tougher than nails, stoic, industrious, but above all, she was humble and kind. My grandmother has been, and will always be, my role model, in both my personal and professional life. “It is my conviction and advice to aspiring leaders: If you want to be successful in business, go on a cross-functional learning journey.”– Stephan Haferl SEMI: What was your journey to becoming the CEO of Comet?Haferl: Driven by curiosity and a desire to understand as many aspects of business as possible, my journey has been one of evolution. I started in engineering and moved through various areas, including operations, R D, product management, sales, and business development. Overtime, I transitioned from being an individual contributor to a team leader, and eventually to management roles with higher levels of responsibility. There were moments when I stepped away from activities that were comfortable and familiar, like R D, in order to have new experiences and learn something new, even when it went against advice or my own judgement. I intentionally chose to become a seasoned generalist with a few areas of specialty, rather than a functional specialist. Although it may sound a bit idealistic, I never had a specific plan to end up in my current role.That said, if I could offer advice to aspiring leaders, it would be this: To succeed in business, embark on a cross-functional learning journey. Nothing prepares you more for a leadership role than hands-on experience across as many areas of business as possible.Ribbon Cutting Ceremony of the new facility in San Jose.SEMI: What has been your greatest challenge as CEO?Haferl: My greatest challenge as CEO has been and will always be, creating a healthy balance between the things I’m passionate about: the responsibilities of my job, the people around me, my family, and ultimately, myself. While a crisis or challenge in business can be overcome with the support of your entire organization and external systems, managing your time, maintaining well-being, and ensuring you’re fully present is entirely your own responsibility. The larger the role, the more demanding this balance becomes.SEMI: What has been your greatest learning as CEO?Haferl: There isn’t one single greatest learning. Instead, being a CEO offers you the opportunity to experience many truisms firsthand, such as:As a CEO, you are often alone in the spotlight and must learn to be comfortable absorbing the pressure that comes with it, entirely on your own.Your title means little unless you strive to earn it every day. If you’re a good leader, you don’t need to create followers – they will emerge naturally.A team of excellent individual contributors can be outperformed by a cohesive group – a true team of average players who stick together and go the extra miles for one another. I’ve seen this dynamic play out many times during my younger years in team sports. SEMI: What makes a great leader?Haferl: With so much literature on leadership, one might believe that there is an easy answer to this question. However, the sheer volume of attention leadership receives highlights that there isn’t a single definitive answer. I believe a great leader creates clarity and drives closure while also inspiring and motivating the team to achieve their goals while being approachable and ethical. Leadership effectiveness often depends on the team being managed, as there are various archetypal leadership styles.I’ve always aimed to build teams made up of individuals who are loyal, ambitious, disciplined, smart, honest, and kind. Within such teams, I find that a highly participative leadership style is most effective. Chinese New Year Dinner in China.SEMI: Has mentorship played a significant role in your professional success?Haferl: Mentorship has played, and continues to play, a pivotal role in my career. I have gained invaluable insights from highly experienced people who took me under their wings and showed me the ropes. Even now, as a CEO and often feeling peerless within the company, having someone to confide in and seek advice from, or get a second opinion when I am uncertain is absolutely essential.Additionally, I find it deeply rewarding to mentor two or three individuals at any given time. It is a way me to give back while continuing to learn through the process. Staying connected with younger staff is equally important – they are a valuable source of fresh insights and candid feedback.SEMI: How are you setting an example for your generation and demonstrating what you'd like to see from your generation's leaders?Haferl: Let me reframe the question by sharing the characteristics I prioritize when hiring people. As mentioned earlier, I value loyalty, ambition, discipline, intelligence, honesty, and kindness. I strive to embody these qualities in my own leadership and seek out individuals who share the same values. By consistently upholding these principles and surrounding myself with like-minded people, I aim to set a positive example and influence those around me. Townhall in Japan.SEMI: How have you helped to empower the next generation of leaders and in particular women?Haferl: I’m actively involved as mentor to a select group of high-potential employees within the company, many of whom I’ve supported for years. Even those I’ve coached who have since moved on to outside the company remain in touch, and I continue to offer guidance when needed. Interestingly, the women I have mentored have made the greatest impact, both within and beyond the company, which has been incredibly rewarding to witness. SEMI: What advice do you have for the next generation of industry leaders?Haferl: It is wise to develop a strong foundation of functional expertise in one area before expanding your knowledge. However, as a leader, you cannot rely solely on being a subject matter expert. Leadership requires understanding people, grasping the big picture, and knowing when to focus on the finer details in certain areas. To make decisive decisions, create clarity, and drive closure, you need a broad understanding of the work you’re leading. Q A with the team in South Korea.SEMI: What are the best ways to attract students and especially women to consider careers in the semiconductor industry?Haferl: Inspire them with purpose, ignite their passion, and cultivate their curiosity. Provide safe and meaningful access to the industry through internships and opportunities to work on small projects. There are many ways to pave the road for the next generation, and the semiconductor industry has the resources to make it happen. There are no excuses!SEMI: What role should diversity, equity, inclusion, and belonging play in an organization's strategy?Haferl: This is incredibly important, and I always explain to my team using this analogy: If you want to win the Champions League in football, you can’t just hire the best goalies. You need a corresponding specialist for each role to build a winning team. If you fail to treat those specialists equitably, you will lose their passion and, ultimately, their unique strength. Finally, even if you hire the best players, you’ll lose against a cohesive team of mediocre players if you don’t foster a sense of inclusion and belonging – where everyone is united as “all for one, one for all.”Groundbreaking Ceremony of Comet’s new facility in Malaysia.Through his journey and leadership philosophy, Stephan Haferl demonstrates that being a great leader is not about titles or expertise alone, but about fostering clarity and purpose, building strong teams, and nurturing those around you. His emphasis on mentorship, the importance of a diverse and inclusive environment, and the value of broadening one's knowledge to encompass all aspects of business highlights his commitment to developing well-rounded leaders. For Haferl, leadership is a dynamic balance – between personal and professional commitments, passion and discipline, and individual contributions and team success. By continuously learning, mentoring, and staying connected to the next generation of talent, he sets an inspiring example for current and future leaders in the semiconductor industry and beyond.SEMI ContactCassandra Melvin, Senior Director of Business Development and OperationsEmail: [email protected]

As artificial intelligence (AI) continues to revolutionize industries, the technology behind AI chips is advancing at an unprecedented pace. Meeting the demands of faster processing, greater efficiency, and increased complexity requires cutting-edge solutions in semiconductor manufacturing. SEMI spoke with Kai Beckmann, Member of the Executive Board at Merck and CEO of the Electronics business sector, who shared insights into Merck's latest strategic move that underscores the company’s commitment to innovation in semiconductor and optics technologies. With the acquisition of Unity-SC, a leading provider of advanced measurement and inspection technology, this marks a significant milestone in the evolution of AI chip manufacturing and beyond by bridging expertise in electronics and optics to drive innovation.Strengthening AI Chip Manufacturing with Unity-SC On October 31, 2024, Merck’s Electronics business acquired Unity-SC, a global leader in metrology tools for semiconductors. According to Beckmann, this acquisition not only enhances Merck’s portfolio in advanced measurement and quality inspection but also bolsters its position in the development of AI chips. These chips, essential for driving AI, rely on cutting-edge manufacturing processes like advanced packaging and heterogeneous integration.“Unity-SC brings precision to the table,” Beckmann explained. “Its technology is vital for managing the complex production sequences involved in creating high-density, three-dimensional chip structures. Without this precision, the production of AI chips at the necessary scale and quality would be nearly impossible.”The expertise of Unity-SC is pivotal for ensuring reliability in semiconductor manufacturing, reducing waste, and optimizing performance. With Merck’s established relationships with major chip manufacturers, the integration of Unity-SC's technology is set to create synergies that will benefit the entire industry.A New Era for Merck: Electronics Meets OpticsThe acquisition of Unity-SC aligns with Merck’s broader strategy of combining expertise in semiconductors and optics, a vision that includes rebranding its display business as Optronics. This move represents a transformation from a traditional display specialist to a pioneer in optical technologies that complement electronic advancements. “Integrating optics with electronics opens up vast opportunities,” Beckmann shared. He highlighted key areas of focus like silicon photonics, which is revolutionizing data transmission, and augmented reality, where lightweight, powerful headsets represent the next frontier.Merck’s foray into these domains underscores the importance of merging light management and materials expertise. For instance, the precision metrology brought by Unity-SC dovetails with Merck’s work in materials science, forming a foundation for advancements in next-generation technologies such as quantum computing and neuromorphic systems. Driving Innovation in AIAdvanced packaging and heterogeneous integration are at the core of today’s AI revolution. These technologies make it possible to stack chips in 3D configurations, reducing energy consumption and increasing processing power. “Unity-SC plays a crucial role in this process,” Beckmann noted, emphasizing that the precise measurement of intricate structures ensures the reliability and efficiency of these complex systems.By mastering these technologies, Merck is positioning itself as a leader in both materials and metrology for semiconductor manufacturing. “Integrating metrology and inspection into our portfolio is a leap forward in aligning our expertise with the needs of the AI-driven semiconductor industry,” Beckmann said. Looking AheadMerck’s combination of semiconductor and optics expertise is not just about advancing technology but about creating a stronger, more resilient organization capable of tackling future challenges. The integration of Unity-SC is a step toward achieving this vision, fostering innovation at the intersection of light and materials.“Working in the semiconductor industry has always been exciting,” Beckmann shared. “But now, with AI reshaping the landscape, the opportunities for innovation and growth are unparalleled. Together with Unity-SC, we’re not just keeping pace—we’re leading the charge.”Merck’s strategic evolution signals a promising future for AI, semiconductors, and the broader field of optoelectronics, where the interplay of light and materials continues to unlock new horizons.Kai Beckmann is a Member of the Executive Board of Merck and CEO of the Electronics business sector. Joining Merck in 1989, he has held roles in IT, consulting, and international management, including as Merck’s first CIO. Since 2017, he has led the Electronics sector (operating under the name EMD Electronics in the US and Canada), driving innovation in semiconductors and optics. Beckmann also oversees the Darmstadt site and co-determination in Germany. He holds a computer science degree from TU Darmstadt and earned a doctorate in economics in 1998.SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

New pilot lines offer European innovators access to the most advanced semiconductor technologies for product development and validation.The global semiconductor landscape has undergone significant transformation in recent years. With disruptions such as the semiconductor supply chain crisis and the challenges it posed to the automotive sector, Europe’s dependence on external fabrication facilities, particularly in Taiwan, has become a pressing concern. In response, the European Union (EU) introduced the EU Chips Act, a comprehensive framework designed to reduce this reliance and boost Europe’s share of the global semiconductor market. ITF Chip into the Future, hosted by imec at SEMICON Europa 2024, was a pivotal event that brought together industry leaders, policymakers, and experts to explore the implementation of the EU Chips Act and the future of Europe’s semiconductor ecosystem. Jari Kinaret, Executive Director of the Chips Joint Undertaking (Chips JU)—the body overseeing the EU’s semiconductor investments—explained, “The Chips JU is about capacity building to drive semiconductor innovation in Europe. We will continue to be dependent on the rest of the world, but we want to make sure that the rest of the world depends on us as well.” Jari Kinaret, Executive Director, Chips JUEuropean research is driving progress towards sub-nanometer fabricationOne of the pilot lines, located at imec’s research center in Belgium, is focused on advancing methods that push Moore’s Law forward by achieving smaller and more efficient circuit features. As Luc Van den hove, President and CEO of imec, explained, “imec is now powering innovation for tomorrow’s chip designs, including stacked layers of chips, with each layer containing specific functionality implemented on chip processes optimized for each function. This allows us to scale much further than if all functionality had to be implemented on a single monolithic layer.”Luc Van den hove, President and CEO, imec Another pilot line, based in France and operated by CEA-Leti, is focused on pushing the limits of technology across multiple dimensions. CEA-Leti CEO, Sébastien Dauvé, explained that the goal of the FAMES pilot line is to advance “not only FD-SOI at 10nm and 7nm nodes, but also novel non-volatile memory technologies, RF components, 3D integration, and the development of small inductors for DC-DC converters.” Sébastien Dauvé, CEO, CEA-LetiAdvancements in 3D integration and chiplet technologies are closely tied to innovation in chip packaging. Christoph Kutter, Executive Director of Fraunhofer EMS, described how the Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems (APECS) pilot line in Germany is designed to meet the needs of industrial customers’ growing demand for advanced packaging solutions. Kutter noted “Customers told us that they needed to integrate logic and power, sensors and logic, and other combinations of functions. We have built the APECS pilot line to provide what they asked for.”Christoph Kutter, Executive Director, Fraunhofer EMSThe EU Chips Act is spurring investments not only in chip fabrication but also in the underlying technologies which support chipmaking. Emmanuel Sabonnadière, EVP at Soitec, highlighted how fabrication of advanced silicon carbide (SiC) power devices “is enabled by SmartSiC™ technology from Soitec – part of a built-in-Europe solution for silicon carbide.” Sabonnadière explained that SmartSiC technology “creates very thin layers of SiC material which make really differentiated substrates supporting the production of high-performance SiC devices.” Emmanuel Sabonnadière, EVP, SoitecInnovation in materials emerged as an important theme at ITF Chip into the Future. Julien Arcamone, Vice President of Corporate R D at ASM, described the critical role of materials for atomic layer deposition (ALD) in the advancing 3D semiconductor integration. Arcamone emphasized the importance of collaboration across the semiconductor value chain, describing ASM’s partnership with imec as part of “a win-win ecosystem.” Julien Arcamone, Vice President of Corporate R D, ASMDeveloping the skills to implement advanced semiconductor technologiesWhile the EU Chips Act is subsidizing the construction of new facilities including pilot lines needed for the hardware of the semiconductor industry’s expansion – the ITF speakers underlined the equally important “software” element of the semiconductor industry ecosystem: the knowledge and expertise of the people working in the industry. One of the biggest challenges in implementing the EU Chips Act is addressing Europe’s talent gap. Katrien Marent, Executive Vice President and Chief Marketing and Communications Officer at imec, said that the gap is in part “because students who graduate in STEM subjects are not trained in advanced semiconductor technologies.” From left to right: Katrien Marent, Executive Vice President and Chief Marketing and Communications Officer, imec; Julien Arcamone, Vice President of Corporate R D, ASM; Thomas Heurung, CEO, Siemens EDA; Frédérique Le Grevès, President STMicroelectronics France and Executive Vice President, Europe France Public Affairs, STMicroelectronics; Romano Hoofman, Director imec.IC-link, imec; and Christophe Frey, Vice-President of EU engagements Managing Director, ARM.Thomas Heurung, CEO of Siemens EDA, highlighted the need for educational reform in the electronics industry. He suggested that “we might not have the right degree-level curriculum for changing times in the electronics industry. We need to change the way that we train students at university, and we need more scope for early or mid-career training on specialist micro-curriculums aimed at a particular skill or knowledge set.”The industry also struggles to attract individuals. Frédérique Le Grevès, President of STMicroelectronics France and Executive Vice President, Europe France Public Affairs of STMicroelectronics, emphasizes the importance of rebranding the industry to attract new talent. She remarked, “The word ‘semiconductor’ itself isn't very exciting—it’s even off-putting to some. By simply changing the name of educational programs, we’ve seen significant increases in enrollment. This demonstrates the power of language in shaping perceptions and interest.”Thomas Heurung of Siemens EDA also called for a stronger emphasis on entrepreneurship, noting “there is a big contrast between Europe and the US, particularly Silicon Valley.” He explained how his company’s Cre8Ventures unit had been set up to help start-ups through the key stages of creating a successful new company, including product development, attracting funding, and bringing the product to market. Thomas Fleischmann, Program Manager at Robert Bosch, explained how the EU Chips Act has accelerated the formation of the European Semiconductor Manufacturing Company (ESMC) joint venture, in which Bosch is a key stakeholder. ESMC is building a new semiconductor fabrication plant in Dresden, dedicated to producing chips for the automotive and industrial sectors. Fleischmann emphasized that ESMC will play a crucial role in helping Europe “scale advanced technologies to high volumes at a competitive cost.”In addition, the EU Chips Act also provides a broader platform for the expansion of Europe’s deep tech capacity. This includes the creation of five pilot lines, which will offer European companies access to manufacturing capacity for prototyping at the most advanced semiconductor technology nodes.Thomas Fleischmann, Program Manager, Robert BoschITF Chip into the Future at SEMICON Europa 2024 highlighted the broad scope of the EU Chips Act – not only supporting the building of advanced fabs but also providing the foundations for technology development, production, and marketing – all aimed at supporting semiconductor innovation in Europe. SEMI ContactMaria Daniela Perez, Communications ManagerEmail: [email protected]

Leaders in the semiconductor industry are finding ways to balance rapid demand growth with strategies to mitigate the risks of geopolitical uncertainty and a complex supply chain.At the CxO Summit during SEMICON Europa, industry leaders gathered to share insights into the immense opportunities ahead for the semiconductor sector, as well as the challenges that could impede growth. Laith Altimime, President of SEMI Europe, highlighted how discussions last year centered on reaching $1 trillion in global sales by 2030. “The conversation today is about how far above $1 trillion we will be in 2030,” said Altimime. “Artificial intelligence is an amazing and exciting technology, and the semiconductor industry is at the heart of it.”Laith Altimime, President, SEMI EuropeAjit Manocha, President and CEO of SEMI, described the current state of the semiconductor industry with one word – “unprecedented”. Emphasizing quantum computing as the next growth driver after AI, Manocha urged leaders to prepare for the next landmark - $4 trillion in global sales by 2040. However, the challenges facing the industry are equally unprecedented. Manocha identified four key obstacles: geopolitical volatility, the Net Zero challenge, the competition for top talent, and supply chain disruptions. “We need to work together to solve these challenges – we need unprecedented collaboration,” he explained. Ajit Manocha, President and CEO, SEMIA European Perspective on the Industry’s ChallengesWith the CHIPS Act in the US and the European Union (EU) Chips Act, the industry is also seeing unprecedented governmental engagement. Gustav Kolbe, Acting Director of Enabling and Emerging Technologies at Directorate-General for Communications Networks, Content and Technology of the European Commission, explained that Europe had been deeply impacted by the effect of trade tensions and supply chain disruptions. “In the field of semiconductors, we realized that we cannot keep doing business as usual and expect to achieve more resilience and reduced dependence on non-European supply chains,” Kolbe said. Gustav Kolbe, Acting Director of Enabling and Emerging Technologies, DG CONNECT, European CommissionJari Kinaret, Executive Director of the Chips Joint Undertaking (Chips JU), which is responsible for implementing EU Chips Act programs, described how its projects amplify the effect of EU funding by leveraging matching contributions from member states and participating companies. “This means that our budget of €4 billion actually produces investments in the semiconductor industry of about €11 billion,” he noted. Jari Kinaret, Executive Director, Chips JUThe Chips JU funded projects are designed to position Europe at the forefront of advanced semiconductor technology. Belgium’s imec, for example, is operating a Chips JU pilot line focused on leading-edge semiconductor innovation. Luc Van den hove, President and CEO of imec, highlighted the potential for 3D integration, “We can now combine multiple chips through silicon interposers with very fast connectivity between them. This allows us to build compute platforms which are far larger than what can be made with a single silicon chip,” he explained referring to this approach as “CMOS 2.0.” However, Van den hove warned that Europe cannot achieve its goals alone, emphasizing the complex semiconductor value chain and the need for collaboration. “Self-sufficiency leads to mediocrity,” he warned, advocating for a global approach that leverages the “best of the best.”Luc Van den hove, President and CEO, imecStephan Haferl, Chief Executive Officer of Comet Group, introduced the CA20, a tool designed to improve efficiency and quality in semiconductor manufacturing. The CA20 uses advanced imaging and AI to quickly identify and address production challenges, such as defects in solder bumps, without damaging components. Now fully automated, it integrates smoothly into factory workflows, providing real-time information to help manufacturers maintain high standards and increase production yields. This innovation highlights the role of new technologies in overcoming key obstacles and driving progress in the semiconductor industry.Left to right: Isabella Drolz, Vice President Marketing Product Strategy, Comet Yxlon; Laith Altimime, President, SEMI Europe; Stephan Haferl, Chief Executive Officer, Comet Group; and Dionys van de Ven, President, Comet YxlonCarlos Mazure, Chief Strategy Officer at Institute of Microelectronics – A*STAR in Singapore, illustrated this point by highlighting the institute’s focus on advanced packaging, a key Singaporean strength. “We have built a state-of-the-art 300mm prototyping line, enabling companies to implement wafer-to-wafer and chip-to-wafer bonding as well as fanout chip packaging,” Mazure said. Carlos Mazure, Chief Strategy Officer, Institute of Microelectronics – A*STARTurning back to Europe, Pierre Barnabé, CEO of Soitec, highlighted materials science as a regional strength. Soitec’s engineered substrates are driving energy efficiency breakthroughs in electronic, acoustic, and photonic applications. “We can bond anything to anything, creating advanced substrates for any active layer,” Barnabé explained. Pierre Barnabé, CEO, SoitecKai Beckmann, Member of the Executive Board and CEO Electronics at Merck KGaA, Darmstadt, Germany, also emphasized the role of materials in enabling sustainable growth. “The semiconductor industry faces a challenge with the contribution of process gases to its total greenhouse gas emissions. We hope to solve the problem by using AI to support materials research, and to design new molecules – an approach we have learned from the pharmaceuticals industry,” Beckmann shared. Kai Beckmann, Member of the Executive Board and CEO Electronics, Merck KGaA, Darmstadt, GermanyCollaboration Strengthens the Semiconductor Supply Chain Despite the breadth of enabling technologies emerging from Europe, the rapid growth in semiconductor demand has not always been matched by a secure supply. Barbara Frenkel, Member of the Executive Board Purchase at Porsche, shared that the company is collaborating with the industry to improve its access to the chips needed for automotive electrification. This includes joining industry groups such as the SEMI Global Automotive Advisory Council (GAAC) and, as she said, “learning your language.” Frenkel added, “Porsche aims to emulate Apple’s approach with Intel and Motorola to drive innovation – we will do the same with suppliers of automotive chips.”Barbara Frenkel, Member of the Executive Board Purchase, PorscheAnother solution to supply constraints is to widen the supply pipeline. John Behnke, General Manager for Smart Manufacturing at Inficon, described how smart technology can significantly improve efficiency and output. “A semiconductor fab is 100 times more complicated than anything else in the world – it is a mathematical nightmare to model it. That gives massive opportunities for improved productivity if we can implement smart control technologies,” Behnke explained. John Behnke, General Manager for Smart Manufacturing, InficonThe Challenge of Achieving Sustainable GrowthWhile the prospect of exceeding $1 trillion in annual sales energizes the industry, there is widespread recognition that growth must not come at the expense of environmental responsibility. As the industry doubles in size in the 2020s, it cannot afford to double its use of resources, such as energy or greenhouse gas emissions. Frédéric Godemel, Executive Vice President for Power Systems and Services at Schneider Electric, shared that the biggest impact on sustainability could come from “energy frugality” – using energy more efficiently. He explained that implementing data fusion in a semiconductor fab – combining detailed analysis of the operation of chillers with external data sets, such as weather conditions to allow for more efficient use – results in energy savings of 10%. “This approach saved costs, reduced CO2 emissions, and provided a financial payback in less than one year,” Godemel said.Frédéric Godemel, Executive Vice President for Power Systems and Services, Schneider ElectricThe value of smart control in fab operations was also highlighted by Katharina Westrich, Global Vice President of Electronics, Semiconductors Simulation Digital Industries at Siemens. She described how Siemens makes digital twins of factories before they are built. “This is an approach that the semiconductor industry can also adopt,” Westrich said. “A digital twin enables more efficient allocation of resources to the fab and sub-fab, allowing simulation of fab operation and optimization of processes and resources.”Katharina Westrich, Global Vice President of Electronics, Semiconductors Simulation Digital Industries, SiemensThe semiconductor industry faces a future full of opportunity, yet also marked by significant obstacles—ones that delegates at the CxO Summit are now better equipped to tackle head-on.On behalf of SEMI, the SEMI Europe team would like to express appreciation to the industry leaders for sharing their visions and readiness to collaborate during the CxO Summit.SEMI ContactCassandra Melvin, Senior Director of Business Development and OperationsEmail: [email protected]

Silicon carbide (SiC), with its wide band gap and high thermal conductivity, is increasingly favored for semiconductor power applications across several fast-growing industries. Its ability to operate at higher voltages and frequencies enables significant efficiency gains, particularly in e-mobility, where SiC offers key advantages in size, weight, and speed compared to traditional silicon-based power devices.However, as promising as SiC is, the industry still faces critical challenges in scaling to meet growing demand. Key barriers include cost, reliability, and manufacturing capacity, all of which must be addressed for SiC to fully mature.SEMI spoke with Entegris Senior Director - Advanced Technology Engagements, Office of the CTO Mark Puttock, Ph.D., to discuss the challenges of scaling SiC power chip manufacturing from a material supplier’s perspective. Puttock shared insights ahead of his presentation at the Entegris session, Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain, taking place on November 14, 2024, at SEMICON Europa in Munich, Germany. Don’t miss the opportunity to engage with experts from Entegris and other industry leaders. Registration is now open. SEMI: Global megatrends like environmental crises and AI drive the necessity for SiC power semiconductors. What is the current status? Puttock: The increasing demand for efficient power electronics — fueled by global megatrends such as vehicle electrification, environmental de-carbonization, and the rise of power-hungry AI chips — drives the necessity of wide bandgap semiconductors. SiC offers advantages of weight, size, and speed over traditional silicon (Si) solutions, which are particularly vital in automotive applications 600V and above. However, SiC chip manufacturing has not reached the maturity of silicon-based processing. Greater maturity will help reduce costs, which will accelerate adoption in the market.SEMI: What are the main challenges in scaling SiC?Puttock: Challenges in scaling SiC power chip manufacturing to high volumes are not surprising. That’s because high volume producers have not been operating long enough to resolve early-stage issues. From a material perspective, SiC is more challenging to manage compared to Si. The challenges we identify include:Chemical Mechanical Planarization (CMP): SiC is nearly as hard as diamond and significantly harder than Si, making it challenging to achieve a high removal rate while maintaining both planarity and low defectivity. This step is crucial toward the end of the wafering process and before the epitaxial growth of device layers.Handling: SiC is more brittle than Si, making it more susceptible to damage or breakage.Implantation: SiC is more difficult to implant than Si, requiring higher temperatures and the use of aluminum instead of boron as a P-type implant species. Additionally, it is a significant challenge to achieve a reliable aluminum source with a long and stable lifetime.Thermal Processing for Wafer Growth and Epitaxy Processes: SiC processes run hotter than Si ( 2000° C for wafering, 1500° C for epitaxial growth), demanding resilient chamber parts to achieve good lifetimes.Sustainability: Because SiC is extremely hard, the CMP process requires significant amounts of slurry. Improving slurry recycling and wastewater management continues to be a challenge.On October 29, we will address these issues in our webinar, “Challenges in Scaling SiC Power Chip Manufacturing: A Material Supplier's Perspective” This session will provide valuable insights and considerations for advancing maturity in high-volume SiC power chip manufacturing. SEMI: Can you elaborate on the challenges associated with CMP for SiC wafers? Puttock: SiC wafers are challenging to process, requiring specialized materials and methods compared to traditional silicon. Defects in the SiC wafer crystal during non-optimized CMP processing can propagate into the device epitaxial layers. This leads to yield loss, increased electrical resistance, reduced performance, and wasted power.SiC wafers must be cut, ground, lapped, and polished to create the necessary surface properties before depositing active layers. As the demand for these devices grows, optimizing the CMP process is essential to ensure the desired surface quality and planarity required for device fabrication. For a deeper understanding of these challenges, we recommend downloading our latest white paper, “Solving CMP Challenges in High-Volume SiC Production,” which covers:Achieving maximum smoothness with high removal ratesReducing the total cost of ownership Optimizing CMP slurry and pads for the unique wafer chemistry and topology of SiC wafersSEMI: What do you mean by optimizing slurry for SiC CMP?Puttock: CMP slurry typically consists of abrasive nanoparticle powder dispersed in a chemically reactive solution. The objective is to achieve a smooth, defect-free surface (less than 1 A Ra) with a high removal rate (greater than 7 µm/m).Traditionally, achieving high removal rates and smooth surfaces required two separate slurries. This approach sometimes forced SiC wafer manufacturers to choose a defect-free surface over a faster, more efficient CMP process, depending on their fab capabilities. Today, optimization allows SiC wafer manufacturers to achieve both high polishing capacity and good final surface quality using a single slurry.Additionally, while the slurry is the most critical part of the CMP process, the pad must be compatible with the application. This ensures the desired planarity while also preventing scratches or contamination of the SiC wafer surface. Research shows that optimized thermoplastic polyurethane CMP pads outperform traditional thermoset polyurethane pads. The optimized pads minimize surface damage and enhance removal rates due to their bulk hardness.SEMI: What are the future challenges for SiC devices? Puttock: SiC devices are increasingly favored for their superior energy efficiency and reduced environmental impact. However, the SiC manufacturing process presents challenges due to its high-temperature operations, which consumes significant amounts of energy and shortens the lifespan of chamber components. To address this, improving efficiency in these processes will be crucial in the coming years.Recycling is another important challenge. For example, CMP slurries present an opportunity for water recycling and conservation. At Entegris, we are committed to this issue and are actively collaborating with key industry players to enhance material circularity and prioritize sustainability in our new product development.SEMI: How is Entegris contributing to advancements in SiC technology, and what initiatives or partnerships do you have planned for the near future? Puttock: Entegris is an active member of the SEMI Global Automotive Advisory Council (GAAC) and participates in a working group focused on SiC with key industry leaders such as Volkswagen, BMW, Porsche Consulting, onsemi, Infineon, STMicroelectronics, and others. Our engagement spans the entire semiconductor supply chain, collaborating with integrated device manufacturers and original equipment manufacturers in fabs worldwide. Additionally, we recently announced our latest long-term agreement with onsemi, which underscores our commitment to advancing SiC technology.SEMI: What are your expectations regarding your participation at SEMICON Europa? Puttock: SEMICON Europa is a unique platform to connect with the semiconductor and automotive ecosystems. Last year, we organized a highly successful SiC session in collaboration with SEMI at both SEMICON West and SEMICON Europa, focusing on “Connecting the Automotive Ecosystem Towards More Mature SiC Manufacturing.”This year, we will continue the discussion with industry leaders during our session, “Cultivating a Thriving SiC Market: Tackling Key Challenges Across the Value Chain.” Our goal is to provide insights and propose solutions that will enable SiC power chips to achieve their anticipated role in future technology ecosystems.We will present alongside Porsche Consulting, and the talks will be followed by a panel discussion that will explore the current state and future prospects of SiC technology in power electronics. We invite visitors to join us at the Executive Forum on Thursday, November 14, from 1:40 – 3:00 p.m. and to visit us at Silicon Saxony booth 219 in Hall C1.About Mark PuttockMark Puttock, Ph.D., is the senior director of advanced technology engagements in the office of the CTO at Entegris. He has worked in the semiconductor industry for over 30 years with a background in physics and plasma processing. As a team member of the Entegris CTO office since 2014, Mark has followed technology trends and collaborated with Entegris’ global product development teams to develop timely and differentiated new materials, chemistries, and components for all the world’s semiconductor manufacturers. Maria Daniela Perez is Communications Manager at SEMI Europe.

Vacuum pumps, pressure gauges, and vacuum valves combined make up the biggest expense on the bill of materials for semiconductor OEMs. The semiconductor industry consumed almost $2.7 billion worth of vacuum subsystems in 2020, with over 60% supplied by vendors based in Europe.

Themed Think Smart, Make Smart, SEMICON SEA 2021 will gather industry experts to highlight the latest developments, innovations and trends in segments of electronics including smart manufacturing, smart mobility, smart data, AI and 5G as technology continues to reshape the way people work and live. SEMICON SEA is the premier electronics manufacturing event in Southeast Asia. SEMICON SEA 2021 will offer traditional opportunities to generate new business opportunities at physical booths and as hybrid event will add a new online networking lounge, chat rooms on various key industry topics, and live broadcasts to enable business matching. Themed Think Smart, Make Smart, SEMICON SEA 2021 will gather industry experts to highlight the latest developments, innovations and trends in segments of electronics including smart manufacturing, smart mobility, smart data, AI and 5G as technology continues to reshape the way people work and live. SEMICON SEA is the premier electronics manufacturing event in Southeast Asia. Video Video 2