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Member Price: $99.00

Note:  Use company email address to log in for automatic recognition as a member.  Members must be current SEMI Members for member discounts.

Non-Member Price: $199.00

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During the workshop recording, you will hear perspectives from the key stakeholder segments and develop a greater understanding of the overall efforts and progress of the task force.

The workshop is focused on diagnosing and improving SEMI F47, Specification for Semiconductor Processing Equipment Voltage Sag Immunity, widely adopted across the industry, the governing standard that defines voltage sag test levels and requirements for semiconductor tools.

Since the implementation of SEMI F47, the vulnerability of semiconductor manufacturing to single-phase and two-phase voltage sags has improved greatly. However, semiconductor manufacturers continue to experience significant product loss and downtime due to voltage sag events.

Given the ongoing issues with semiconductor plant downtime, a new SEMI Voltage Sag Immunity Task Force was formed to take a fresh look at the issue. The workshop and the task force:

  • Reviews the characteristics of the power quality events that cause downtime.
  • Takes a new look at the sensitivities in the process equipment.
  • Determines any potential adjustments to equipment design, facility design, utility systems, or SEMI Standards to further reduce voltage sag induced losses by the semiconductor industry.

Speaker Biographies

United States

10:00 am - 10:05 am
James Amano
James Amano
Sr. Director, Standards
SEMI

Welcome

10:05 am - 10:25 am
Mark Stephens EPRI
Mark Stephens
Principal Project Manager & Leader, Voltage Sag Immunity Task Force
EPRI

Introduction to the SEMI Voltage Sag Immunity Task Force Effort

A review of the key objectives of the voltage sag task force will be discussed along with the characteristics of the power quality events that are still causing semiconductor plant process downtime. A new look at the sensitivities in the tooling and process equipment is required to determine any potential adjustments to equipment design, facility design, utility systems or standards to further reduce voltage sag induced losses by the semiconductor industry. This important work will help utilities, semiconductor manufacturers, and tool equipment providers to better understand the tolerance and susceptibility of today’s generation of semiconductor processing tools and then to develop effective strategies to improve uptime and lower product losses due not only to single-phase (Type I) and two-phase (Type II) voltage sag events but for three-phase (Type III) events as well.

10:25 am - 10:50 am
Clay Burns
Clayton Burns
Principal Engineer
National Grid

Regional Voltage Sags- Importance of Addressing Three-Phase Voltage Sags in SEMI F47

A review of voltage sags at a National Grid substation which were produced by two lightning-caused three-phase transmission faults at locations fairly remote to the substation.  This will show the regional effect of transmission level faults on voltage.  The voltage sags will be compared to the existing SEMI-F47 standard and the accepted sag definition.  Additionally, a proposed regional voltage sag study will be considered in light of the changing make-up of the future electric system and the influx of large inverter-based resources.

10:50 am - 11:15 am
Ed McGann
Ed McGann
Manager of Engineering
VELCO

Utility Dynamic VAR device fault response, fault mitigation techniques, and power quality measures addressed with protection design

Co- presenters:
Greg Rieder, GlobalFoundries
Josh Burroughs, VELCO
John Fiske, VELCO

VELCO recently conducted a refurbishment of its STATCOM facility as part of a planned controls system upgrade. The system planning need for this facility is to provide area voltage support during transmission system contingencies. The refurbishment project team recognized the benefits of the STATCOM’s ability to provide voltage support during system faults and specified fault performance requirements in the vendor specifications. This presentation will discuss those performance requirements, review pre and post project upgrade system fault record’s and review project lessons learned. The second half of the presentation will cover utility fault mitigation design strategies for substation and transmission line assets as well as protective relaying techniques to improve power quality

11:15 am - 11:50 am
Michael Noth Austin Energy
Michael Noth
Power System Managing Engineer
Austin Energy

Seeing it from both sides: The importance of Power Quality Metering at the utility and inside the Fab Distribution System.

In this presentation we will discuss the importance of having power quality-based metering on both sides of the point of connection and other parts of the distribution system.  Mike will share some examples and stories of how important that can be.

11:50 am - 12:15 pm
Tony Sabin DAn Hunt
Dan Sabin & Tony Hunt
Schneider Electric

Waveform captures of voltage sag events can be automatically analyzed by software to determine their source and impact

This presentation will summarize efforts to categorize events automatically that exceed SEMI F47 limits, and to determine the source of those disturbances. It will also present recent efforts to analyze the impact of voltage sags automatically on electrical loads. This research has resulted in automatic algorithms to determine which voltage sags caused downtime and which ones did not. Combining all of this information together provides a means to more precisely and effectively diagnose, manage, and mitigate voltage sag disturbances.

12:15 pm - 12:25 pm
Christopher "Dale" Moffitt
Electrical Systems Engineering
HP

Power Quality and Monitoring, What Does the Data Tell Us?

Power Quality (PQ) has a long and diverse history dating back to the first power grids in the United States. Impacts and concerns about PQ events have evolved and will continue to evolve as our usage of electricity changes. Recent natural disasters have highlighted the importance of a robust power grid and the changing landscape of power generation presents new PQ challenges. As power consumers, a key element in any PQ strategy is adequate power monitoring. This provides the data that can drive conversation with the utility, discover opportunities in our infrastructure and deliver to our facilities the power quality necessary to sustain our businesses.

12:25 pm - 12:50 pm
Willem Meijs ASML
Willem Meijs & Giel Croonen
Low Voltage expert in electrical engineering on supply distribution system for machines
ASML

SEMI F47 and Power Quality Perspectives and Considerations from a Tool OEM

This presentation will address power quality perspectives and consideration from the point of a lithographic tools manufacture. Effect of different test methods on the sag immunity, test strategy on systems, sub-systems and components. How to divide a large installation up in to testable units and maintaining performance integrity. 3 phase type III test generator topology and the impact on harmonic emission and immunity in relation to voltage sag immunity.

12:50 pm - 1:15 pm
Josh Pankratz Advanced Energy
Josh Pankratz
Director of Engineering
Advanced Energy, Inc.

Power Supply Considerations and Standards for Voltage Sag Ride Through

Disturbances in utility power during semiconductor manufacturing can result in loss of revenue, productivity, production yields, and product quality. Focus on power quality continues to grow as new fabs are built in developing regions, which historically suffer from poor infrastructure. Highly automated fabs have driven a demand for systems that can ride through power glitches without shutting down tools and production lines. This presentation examines how power quality, most typically resulting in voltage sag events, affects semiconductor manufacturing and how industry standards and guidelines for tool immunity to those events affect the design of power supplies.

1:15 pm - 1:40 pm
Steve Lewis, Lam Research, square
Steve Lewis
Lam Research

Round Table Discussion & Q&A

1:40 pm - 1:55 pm
Mark Stephens EPRI
Mark Stephens
Principal Project Manager
EPRI

Next Steps for SEMI Voltage Sag Immunity Task Force

Based on the initial findings from utility and fab power quality data, the task force is poised to move forward to re-evaluate semiconductor tools against voltage sag additional characteristics that are indicative of measured events still causing downtime. Utilities, semiconductor fabs and equipment OEMs will be invited to actively participate in this effort to obtain the required test data.

1:55 pm - 2:00 pm

Closing Remarks & Adjourn

James Amano, SEMI

CAST FlexTech FOA ITL MSIG SCIS SE&A Standards EPRI and SEMI logos

SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain. 

10:00 am - 2:00 pm Off Add to Calendar 2021-04-21 10:00:00 2021-04-21 14:00:00 Voltage Sag Workshop for Manufacturing Fabs SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

Registration

Registration

REGISTRATION

  • Registration Close: 6 pm, Friday, July 2(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 250,000
    • Non-members: KRW 300,000
Registration
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SPONSORS

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NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.
  • Presentations will be provided 24/7 during the event period(July 7-13)

 


 

CONTACT

 

Virtual
South Korea

Keynote

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Dragos Maciuca
Executive Technical Director,
Ford

Automotive Sensors and Applications (English)

Denis Marcon.jpg
Denis Marcon
Senior Business Development Manager,
imec

The Power of Nanoelectronics to Bring Disruptive Innovation in Healthcare (English)

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Manuel Tagliavini
Principal Analyst,
Omdia

MEMS & Sensors: How the Market Changed after the Year of the Global Pandemic (English) [Cancelled]

Session 1: Life Science/Healthcare

Seong-Hyok Kim.jpg
Seong-Hyok Kim
Seong-Hyok Kim,
LG Electronics

AI Sensing for Home Appliance (Korean)

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Kyung-Hak Choi
Chief Technology Officer,
OPTOLANE Technologies

Digital Real-Time PCR: A Next Generation Nucleic Acid Amplification and Quantification (Korean)

Session 2: Environmental

Jeff Hawkins.jpg
Jeff Hawkins
Senior Product Manager
Amphenol Sensors

Trends and Technologies in Indoor Air Quality Sensing (English)

Cees Draijer.jpg
Cees Draijer
Business Line Director Infrared Imaging,
Teledyne Digital Imaging

Microbolometer Based Thermal Imaging for Automotive Applications: Benefits, Limitations and Trends (English)

Dohoon Kim.jpg
Dohoon Kim
Executive Director, R&D center,
Samyoung S&C

Application of Environmental Sensors for Timely Ventilation of Indoor Air (Korean)

Session 3: Mobility

Wanil Kim.jpg
Wanil Kim
Executive Director / Head of R&D,
Mando-Hella Electronics

Smart Tire Monitoring Sensor – Enhancing the Safety of ADAS and AD (Korean)

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Tim Wong
Director of Technical Marketing- Autonomous Technology,
NVIDIA

Solution & Platform for ADAS (English)

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Saptarshi Saradindubasu
Head of Program New Mobility Business and Non-Automotive,
Continental AG

Future of Urban Mobility & Impact to City Infrastructure (English)

Session 4: Industrial

David Horsley.jpg
Dave Horsley
CTO,
Chirp Microsystems(a TDK Group Company)

A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors (English)

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Byeng Dong Youn
Ph.D. / CEO & Professor
OnePredict / Seoul National University

Digital Transformation and Beyond for Smart Plants (Korean)

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Greg Nagler
Director OEM,
FLIR Systems

Benefits of Thermal Sensors (LWIR) with Intelligent Analytics for Commercial and Defense Products (English)

Session 5: Core Technologies

Stanley Park.png
Stanley Park
Sensor systems technical marketing, lead principal engineer,
Infineon

Smart Sensors & Smart Ears (Korean)

Jeongpyo Kim.jpg
Jeongpyo Kim
CEO,
Cesign

Circuit Consideration in Sensor Application (Korean)

Bill Grube.jpg
Bill Grube
Senior Product Marketing Manager,
Energetiq

Advances in Testing and Calibration of Modern Optical Sensors (English)

Michelle Bourke.jpg
Michelle Bourke
Senior Director of Strategic Marketing, Customer Support Business Group (CSBG),
Lam Research

Bridging the Gap Between 200mm and 300mm Manufacturing to Enable Manufacturing Solutions for CMOS Image Sensors and Advanced Inertial MEMS (English)

-

[NOTICE] Due to the Social Distancing for preventing COVID-19, MEMS & Sensor Forum 2021 will be held as a Virtual Conference.

 

Sensors: Transforming How We Live and Work

The age of sensorization is upon us as the world becomes more connected with more devices that monitor our surroundings to transform how we work and live.  
Industry leaders and visionaries will gather at the SEMI MEMS & Sensors Forum 2021, a premier business and technology event in Korea, to provide insights into the latest MEMS and sensors technologies, innovation challenges and opportunities, market trends and new business opportunities. 
Join us to meet speakers, industry leaders and peers as the event features 18 presentations accessible on-demand 24/7.

Off Add to Calendar 2021-07-07 00:00:00 2021-07-13 00:00:00 MEMS & Sensor Forum 2021 [NOTICE] Due to the Social Distancing for preventing COVID-19, MEMS & Sensor Forum 2021 will be held as a Virtual Conference.   Sensors: Transforming How We Live and Work The age of sensorization is upon us as the world becomes more connected with more devices that monitor our surroundings to transform how we work and live.   Industry leaders and visionaries will gather at the SEMI MEMS & Sensors Forum 2021, a premier business and technology event in Korea, to provide insights into the latest MEMS and sensors technologies, innovation challenges and opportunities, market trends and new business opportunities.  Join us to meet speakers, industry leaders and peers as the event features 18 presentations accessible on-demand 24/7. Virtual South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

Registration

Registration

REGISTRATION

  • Registration Close: 6 pm, Friday, May 7(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 280,000
    • Non-members: 330,000
Registration
South Korea SMC-Banner_Square.png Technical

SPONSORS

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Air_0.png SK M_0.pngEntergris_1.pngLinx_1.png KC Tech_0.png 

 

NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.
  • Live session will be live streamed on Afternoon, Wednesday, May 12(KST).
  • On-demand Session will be provided 24/7 during the event period(May 12-18)

 


 

CONTACT

South Korea

[LIVE] Collaboration – May 12(Wed)

2:00 pm - 2:05 pm

Welcome

2:05 pm - 2:35 pm
Hyun-Goo Kang.jpg
Hyun-Goo Kang
Team Leader of C&C Material Development Team of R&D Center,
SK hynix

Advanced Material Development in Perspectives of CMP & Cleaning Process for Semiconductor (Korean)

2:35 pm - 3:05 pm
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Yun-Ho Kim
Material Technology Group Leader (Foundry Division),
Samsung Electronics

Special Singularity beyond Material; Winter but Opportunity is Coming (Korean)

[On-demand] Keynote (Translation provided)

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Christoph Adelmann
Scientific Director,
imec

Materials for Sub-5-nm Semiconductor Devices (English)

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Bruce Tufts
Vice President, Fab Materials Organization, Global Supply Chain,
Intel

Trends and Observations in Materials Quality at Advanced Process Nodes (English)

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Jijen Vazhaeparambil
Senior Vice President and General Manager, Surfscan and ADE,
KLA

Cost-Effective Fab Material Qualification with Un-patterned Wafer Inspection (English)

[On-demand] Session 1: Emerging Materials and Patterning

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Myoung-Kuy Lee
Manager of Strategic Business Development Field Marketing,
ASML

0.33 NA EUV Systems for High Volume Manufacturing (Korean)

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Takanori Kawakami
General Manager at Lithography Materials Lab. of Fine Electronic Materials Research Laboratories
JSR Corporation

Stochastic Effects on EUV CAR Systems: Investigation of Materials Impact (English)

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Kazuma Yamamoto
Associate Manager, Global R&D,
Merck KGaA, Darmstadt, Germany

Mitigation of Pattern Collapse in EUVL (English)

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Ashutosh Bhabhe
Global Wet Etch and Cleans Applications Manager,
Entegris

Removal of Trace Metals from High Temperature Isopropyl Alcohol (IPA) (English)

[On-demand] Session 2: Materials Integration and Challenges

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Young Hun Kim
Epi. Technical Engineering Team Leader,
SK Siltron

Current Demands on Wafers for CIS (Korean)

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Youngwoo Park
EVP/Senior Technology GM,
Tokyo Electron

Gate-All-Around Transistors: Fundamentals & Structures (Korean)

Andreas Fischer.jpg
Andreas Fischer
Technical Director
Lam Research

Thermal Atomic Layer Etching – An Emerging and Enabling Etching Technology (English)

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Mihaela Balseanu
Sr. Technology Director
Applied Materials

Selective ALD in a Continuous World, New Techniques and Advancements (English)

[On-demand] Session 3: New Waves in Materials

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JinSuk Jeong
Director / Project Leader,
Amkor Technology

Advanced Packaging : Trends, Technologies and Challenges (Korean)

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Luis Andia
RF Business Development Senior Manager,
Soitec

Engineered Substrates for New Waveforms and New Applications (English)

Marco Arnold.jpg
Marco Arnold
Global R&D Manager,
BASF

Next Generation Metallization Solutions for Advanced Packaging (English)

[On-demand] Session 4: Market Trends

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Bob Johnson
VP Analyst
Gartner

Semiconductor Market Outlook: Strong Growth Ahead (English)

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Brandon Prior
Senior Consultant
Prismark

Advanced Packaging Growth: Focus on New Package Approaches (English)

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Mark Thrisk
Managing Partner,
Linx Consulting

Materials Demand in the Next Supercycle (English)

-

[NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.

 

Materials: Driving a New Leap Forward 

Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.  

SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.  

Off Add to Calendar 2021-05-12 00:00:00 2021-05-18 00:00:00 SMC Korea 2021 [NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.   Materials: Driving a New Leap Forward  Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.   SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.   South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
Event format
Promote in calendar
Off

ClassOne Technology, global supplier of high-performance semiconductor electroplating and surface preparation systems, announced the sale of its Solstice® S8 system to South Korean chip manufacturer, Point Engineering Co. The eight-chambered Solstice plating tool will be installed at Point Engineering’s manufacturing facility in Asan City, South Korea. The announcement was made by ClassOne‘s CEO, Byron Exarcos, and PEC‘s CEO, Bum-Mo Ahn.

"Our products call for unique manufacturing approaches,” said Bum-Mo. “In addition to copper, we require plating of palladium cobalt alloy into highly variant features; and this plating is done on a proprietary substrate. We needed a volume-manufacturing platform that has the necessary flexibility without sacrificing reliability. The Solstice S8 covers these needs very well, and it also has a compact footprint to conserve fab space."

Exarcos pointed out that Point Engineering's new Solstice configuration includes a CopperMax™ processing chamber, a ClassOne-proprietary feature specifically designed to optimize copper plating. The chamber enables consistent high-quality, high-rate copper plating, while maximizing uptime and dramatically reducing bottom-line operating costs.

“Point Engineering has gained considerable respect in the industry for its semiconductor parts, which frequently go into probe pins and micro power inductors," said Exarcos. “In today’s semiconductor industry, we’re seeing that new product categories often drive the need for novel approaches in manufacturing. Point Engineering’s groundbreaking new products demand a process-experienced equipment provider and a flexible platform. We’re gratified that Point Engineering has chosen ClassOne and Solstice to partner with them on their next-generation products.”

The Solstice S8 is an 8-chambered system designed and built by ClassOne for high-performance, fully-automated electroplating and surface preparation, specifically for ≤200mm semiconductor wafer processing. The Solstice series also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, Solstice systems also provide Plating-Plus™ surface preparation capabilities, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility allows users to streamline wafer production and increase cost efficiencies by reducing the number of different processing tools required in the fab.

Villach, Austria, 20 Jan 2021 — mechatronic systemtechnik, a leading global supplier of automation equipment for semiconductor wafer handling, today announces the availability of the mWL.cs mechatronic calotte loader. A fully automated stand-alone system for transferring wafers between cassettes and calottes, the mWL.cs provides integrated device manufacturers (IDMs) an opportunity to increase yield and improve process traceability at a high throughput.

Evaporation process tools often utilize spherical carriers and rings to meet uniformity and defectivity targets. However, the design of these tools has made it challenging to introduce automated wafer handling in this step of the manufacturing process. IDMs invariably default to manual wafer loading, which has resulted in yield degradation and an increased risk for misprocessing.

“Automating the wafer loading and unloading system for evaporation type metal deposition is a step that bears much potential,” shared Stefan Detterbeck, Sales Director. “By eliminating human error from the equation, our system enables manufacturers to achieve higher yield and reduce damage to wafers. Enhanced process traceability also supports quality improvement measures to meet the conformity requirements of critical customer industries.”

Key features of the mWL.cs mechatronic calotte loader include:
 Superior handling accuracy and repeatability — hand-off position measurement and auto-teaching capabilities (About mechatronic systemtechnik
mechatronic systemtechnik, headquartered in Villach, Austria, is a leading global supplier of automation equipment for semiconductor wafer handling. Founded in 1998, the company specializes in addressing the industry’s needs for reliable, safe, and fully automated handling of non-standard substrates — including stacked, thin, or warped wafers, and also eWLP, MEMS, TAIKO, bumped, and film frames. Through a modular approach, mechatronic offers its customers cost-efficient handling systems that feature its proprietary technology. These solutions are capable of accommodating a wide range of substrate types and their specific characteristics. Major OEMs and fabrication plants across the globe rely on mechatronic’s unique solutions for some of their most complex wafer handling needs.

For more information, please visit www.mechatronic.at or connect with us on social media:

LinkedIn: www.linkedin.com/company/mechatronic-systemtechnik
YouTube: www.youtube.com/user/MechatronicAustria

mechatronic systemtechnik is a subsidiary of Accuron Industrial Technologies.

Editorial Contact:

Ms Gracine Wee | e: [email protected] | t: +65 6220 4787

HAYWARD, CA, JANUARY 06, 2021: Delphon, a worldwide provider of engineered polymer and adhesive products for the semiconductor, photonics, medical and aerospace industries, announced today the appointment of Joseph Montano as President. Reporting directly to CEO Jeanne Beacham, Joe will serve a critical role in the company’s leadership team as Delphon continues to grow through new product innovations and future acquisitions.

Joe has spent more than 25 years in the electronics and electronic materials technology segments. He has an extensive technical and commercial background, with experience spanning from the R&D bench to executive management. Most recently Joe served as Sr. Vice President of Sales and Marketing at Intermolecular where he was instrumental in returning the company to profitability and orchestrating its acquisition by Merck KGaA, Darmstadt, Germany in 2019. Prior to working for Intermolecular, Joe was the Global Business Director for MacDermid Enthone’s Advanced Electronics division. Joe holds a Bachelor of Science degree in Chemical Engineering from Northeastern University in Boston.

“I am very excited to have Joe join us. As Delphon continues to grow and expand into new markets, I am confident that Joe’s extensive experience in semiconductor materials and business development will be an asset to our leadership team,” says Jeanne Beacham, Delphon CEO.

About Delphon
Delphon provides innovative polymer and adhesive solutions to the semiconductor, photonics, medical and aerospace industries. Through its Gel-Pak®, UltraTape®, and TouchMark divisions, the company has developed breakthrough products that provide solutions for manufacturing processes in a wide range of markets. Customers from around the globe know that they can trust these products even in the most critical environments.

For more information, please contact Jennifer Dossee Nunes, Sr. Director of Marketing, at [email protected] or visit www.delphon.com

Totowa, New Jersey – January 6, 2020 – ECI Technology, Inc. a leading manufacturer of chemical management systems for the semiconductor, printed circuit board (PCB), and other high-technology industries, announced today that it has received the Best Cooperation Supplier Award from one of Korea’s largest semiconductor manufacturing foundries. This award is in recognition of the development of process control for new applications and for the strategic role ECI Technology R&D and ECI Korea regional support teams play in supporting the foundry’s wafer manufacturing processes. The award recognizes companies that have made an outstanding contribution to its ability to drive superior products. ECI was measured on its best-in-class R&D technology for unique chemical metrology for new manufacturing processes. This supplier relationship between the two companies spans over 20 years and stands as testimony to the foundry’s confidence in ECI Technology and recognition of its value.

“We are dedicated to continue delivering the most advanced solutions and strategic value to our customers and this award confirms our vital relationship with a global leader in advanced semiconductor technology,” stated Marianna Rabinovitch, CEO, ECI Technology. “It is an honor to be recognized for the value our technology and service teams provide. ECI Technology strives to continue meeting and exceeding our customers’ technology advancements.”

About ECI Technology
ECI Technology is a leading provider of chemical management systems for semiconductor, PV, and PCB industries. Our technologies making possible the manufacturing of the most advanced semiconductors, flat panels, solar panels, printed circuit boards, and more. ECI has global operations and is ISO 9001 certified. It has R&D facilities, manufacturing, and customer service in the United States with regional sales and customer support teams in Japan, Korea, and Taiwan with representatives in China, Europe, Southeast Asia, and Israel. For additional information visit www.ecitechnology.com.

Totowa, New Jersey – January 6, 2021 – ECI Technology, Inc. a leading manufacturer of chemical management systems for the semiconductor, printed circuit board (PCB), and other high-technology industries, was commended and received a Certificate of Appreciation Best Partner Award from one of the world’s largest semiconductor manufacturing foundries. ECI Technology’s Taiwan office was established in 2015 and its Taichung team was honored for its prompt, high-quality service in support of ECI’s online analyzers. ECI’s tools are used to optimize bath chemistry in high-volume FinFET semiconductor manufacturing that delivers advanced chips used in critical technologies such as artificial intelligence, data centers, 5G communications, and smartphones.

ECI’s Taiwan teams are well-positioned to be responsive to customers’ process needs through scientific and engineering collaboration to develop process solutions for the most complex chemical materials – qualifying incoming chemical supplies, managing tool inputs, adjusting chamber/ bath conditions, and monitoring process waste – all critical enablers to accelerate development and production ramp.

“Our sincerest thanks for recognition from this world-leading wafer foundry. ECI has developed long-term partnerships with semiconductor manufacturers around the world, providing advanced process technologies tailored to meet customers’ precise specifications," stated Marianna Rabinovitch, CEO, ECI Technology. “As we look ahead, we are eager to continue to serve customers with process control solutions for volume production. That’s been a core philosophy of ECI throughout its 34-year history.”

About ECI Technology
ECI Technology is a world-class provider of chemical management systems for semiconductor, PV, and PCB industries. Our technologies making possible the manufacturing of the most advanced semiconductors, flat panels, solar panels, printed circuit boards, and more. ECI has global operations and is ISO 9001 certified. It has R&D facilities, manufacturing, and customer service in the United States with regional sales and customer support teams in Japan, Korea, and Taiwan with representatives in China, Europe, Southeast Asia, and Israel. For additional information visit www.ecitechnology.com.

ESPOO, Finland, 16th December 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology, has established a new business area, PicoMedical, for medical and healthcare ALD segments.

The newly established business area will reinforce and streamline Picosun Group’s activities in the medical field. These activities include product and solutions development for medical ALD applications, driving the profitable growth from the medical segment, and increasing the Picosun brand awareness in the healthcare and medical industries. PicoMedical will also manage the Group’s extensive medical ALD patent portfolio of 18 patent families, and coordinate and execute research activities and collaboration projects in the medical field.

Picosun has appointed Mr. Juhani Taskinen to lead the PicoMedical business area. The appointment was made in the Picosun Board meeting. Mr. Taskinen will start in his position 5th January 2021. Mr. Taskinen has extensive international career and background in the medical field, and proven track record in driving profitable business growth and leading successful collaboration activities in these industries. He has held various leading general management, sales and marketing, and business development positions in pharma, biotech, and healthcare companies such as Johnson & Johnson, Merck KGaA, Darmstadt, Germany, and Abbott.

“Right now, ALD is disrupting healthcare technologies just like it did to microelectronics in the early 2000’s. Picosun is the trailblazer and spearhead in medical ALD solutions. I’m happy to start in my new position as the head of Picosun’s PicoMedical business area to speed this company into even greater success in the healthcare segment,” states Mr. Taskinen.

“It’s great to welcome Mr. Juhani Taskinen into our team. ALD has amazing possibilities to offer to the healthcare industries. We are sure that with Mr. Taskinen’s skills, background and expertise we can truly make several new breakthroughs in this field,” continues Mr. Jussi Rautee, CEO of Picosun Group.

About Picosun
Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Japan, South Korea, China mainland and Taiwan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

More information:
Mr. Jussi Rautee
CEO, Picosun Group
Tel: +358 50 345 4457
Email: [email protected]
Web: www.picosun.com

Semiconductor equipment manufacturer ClassOne Technology announced the sale of its Solstice® S8 electroplating system to a major semiconductor foundry service based in Taiwan. This is the second S8 to be purchased by the company. The 8-chambered Solstice platform is designed specifically for ≤200mm wafer processing. The new tool will be used to produce Heterojunction Bipolar Transistors (HBTs) and Vertical Cavity Surface Emitting Lasers (VCSELs). The announcement was made by ClassOne’s CEO, Byron Exarcos, and Senior Technology Director, John Ghekiere.

“This user is a high-volume semiconductor manufacturer,” said Ghekiere. "So they are interested not only in the Solstice's superior plating performance, but also in its reliable, fully-automated high throughput. The tool is being used for wafer level packaging processes, including copper pillar and solder bump electroplating.”

“This customer has been using our Solstice S8 electroplating equipment for several years now," said Exarcos. “The tool has been fully qualified for their processes and is meeting their aggressive performance goals. Now, their business is rapidly expanding, and they've chosen to bring in a second S8 to support that growth. We're actually seeing this pattern across the industry today. As Solstice is becoming embedded into customer processes, the repeat orders are coming in with increased frequency. We're very gratified by this vote of confidence in the Solstice and in ClassOne.”

Ghekiere noted that today’s HBT devices are used in many ultrafast circuits and those requiring high power efficiency, including next-generation RF power amplifiers, 5G cellular phones, etc. VCSELs are used in 2D and 3D imaging, facial recognition, smart-glasses, fiber optic communications, LiDAR, and much more.

The ClassOne Solstice S8 is an 8-chamber system for high-performance, fully-automated electroplating and surface preparation. The Solstice series, which was specifically designed for ≤200mm wafer processing, also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, the tool’s special Plating-Plus™ capabilities enable it to handle a number of other surface preparation functions, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility serves to streamline process production and can reduce the number of different tools a user needs to purchase.

About ClassOne Technology
ClassOne Technology (classone.com) provides innovative wet-chemical equipment solutions, including electroplaters, spin-rinse-dryers, spray solvent tools and more. The company focuses on making advanced processing technology available to users of ≤200mm wafers, such as compound semiconductor and many emerging markets, who traditionally have been underserved by the larger equipment manufacturers. ClassOne Technology’s equipment has become known for its unique combination of advanced performance, flexibility and cost-efficiency Based in Kalispell, Montana, ClassOne Technology is built upon decades of experience from industry veterans creating high-performance semiconductor equipment. ClassOne Technology is a sister company to ClassOne Equipment (ClassOneEquipment.com), the industry’s premier provider of refurbished name-brand processing tools, with over 2,500 systems installed worldwide.

For more information, contact:
Byron Exarcos
ClassOne Technology
109 Cooperative Way
Kalispell, MT 59901
tel: +1 (678) 772-9086
email: [email protected]