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Armstadt, Germany, March 4, 2021 – Merck KGaA, Darmstadt, Germany, a leading science and technology company, is changing the name of its Performance Materials business sector to Electronics. The new name is the visible result of the strategic realignment conducted over the past several years and a further milestone of the “Bright Future” transformation program, which began in 2018.

“The renaming of our business sector to Electronics is a logical step for us. After all, the new name underscores our strategic focus on the electronics industry. At the same time, it clearly illustrates our contribution to a world characterized by tremendous technological advances and exponential data growth,” said Kai Beckmann, Member of the Executive Board of Merck KGaA, Darmstadt, Germany, and CEO Electronics. “Under the ‘Bright Future’ umbrella, we’ve developed into a leading player within the electronics industry over the last few years. And with the new name Electronics, we’re now also making it clear, at a glance, what our business sector represents.”

As the company behind the companies advancing digital living, the Electronics business sector is involved in all major technology trends – be it 5G, Big Data, autonomous driving, artificial intelligence, or the Internet of Things. Thanks to these and other megatrends, the demand for ever smaller, faster and more energy-efficient electronics is continuously growing. For example, more and more of the components in modern chips are now approaching atomic dimensions.

“Bright Future” – A successful transformation program

The acquisitions of Intermolecular and Versum Materials in 2019 represented two very important moves within the scope of the ongoing transformation program. Thanks to the integration of Intermolecular, which offers unique processes and R&D capacities, Merck KGaA, Darmstadt, Germany, is now capable of making the latest material innovations available to its customers in the electronics industry even more rapidly. Through the acquisition of Versum Materials, the company has expanded its portfolio to include innovation-driven, ultra-high-purity process chemicals, gases and equipment for semiconductor manufacturing. The name Versum Materials, which has been in use separately until now, will be superseded by the new name of the business sector.

However, the name change will not have any effect on the existing organizational structure of the business sector, which comprises the three business units Semiconductor Solutions, Display Solutions and Surface Solutions. Electronics thus covers a particularly broad range of products and solutions, including high-tech materials and solutions for the semiconductor industry as well as liquid crystals and OLED materials for displays and effect pigments for coatings and cosmetics.

In September 2020, Merck KGaA, Darmstadt, Germany, raised its expectations for average annual organic sales growth of Electronics to 3% to 4% against the backdrop of its focus on the semiconductor industry, which is showing strong growth. The business sector currently generates around 90% of its sales in the two business units Semiconductor Solutions and Display Solutions.

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Seoul
South Korea

Standards

Information & Control Korea TC Chapter 

Date: Friday, April 9, 2021

Time: 15:00 PM - 17:00 PM KST 

via hybrid

 

AGENDA 

April 9, 2021

Last updated: March 11, 2021 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

Off Add to Calendar 2021-04-09 00:00:00 2021-04-09 00:00:00 I&C Korea TC Chapter Meeting Information & Control Korea TC Chapter  Date: Friday, April 9, 2021 Time: 15:00 PM - 17:00 PM KST  via hybrid   AGENDA  April 9, 2021 Last updated: March 11, 2021    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Seoul South Korea SEMI.org [email protected] America/Los_Angeles public
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Seoul
South Korea

Standards

FPD Metrology Korea TC Chapter 

Date: Friday, March 26, 2021 

Time: 15:00 PM -17:00 PM KST

via Of

 

AGENDA 

March 26, 2021 (subject to change) 

Last updated: February 23, 2021 

 

NOTE: 

Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend. 

If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today! 

Questions? Contact your local staff coordinator: Click here 

Off Add to Calendar 2021-03-26 00:00:00 2021-03-26 00:00:00 FPD Metrology Korea TC Chapter Meeting FPD Metrology Korea TC Chapter  Date: Friday, March 26, 2021  Time: 15:00 PM -17:00 PM KST via Of   AGENDA  March 26, 2021 (subject to change)  Last updated: February 23, 2021    NOTE:  Standards meetings are open to all, but you must be a SEMI Standards Program Member to attend.  If you are not a Member, please register for the International SEMI Standards Program and start making a big contribution to the industry’s progress, complete an application form today!  Questions? Contact your local staff coordinator: Click here  Seoul South Korea SEMI.org [email protected] America/Los_Angeles public

SANTA ROSA, Calif., – February 17, 2021 – PNI Sensor, the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications, today announced availability of the new TargetPoint TCM™ gyro-stabilized digital magnetic compass. TargetPoint TCM incorporates PNI’s high sensitivity Magneto-Inductive sensors with the latest high stability 3-axis MEMS accelerometer and 3-axis MEMS gyroscopes providing accurate orientation while in dynamic motion and in magnetically challenging environments. TargetPoint TCM excels in conditions that cause errors in traditional digital magnetic compasses.

TargetPoint TCM uses advanced magnetic distortion compensation and calibration scoring algorithms to counter the effects of hard and soft iron interference, providing highly accurate heading information in almost any environment and orientation.

TargetPoint TCM features and benefits include:
 Patented magnetic anomaly rejection algorithms eliminate errors due to magnetic distortion, even in magnetically harsh environments
 Gyro-stabilized compass for dynamic accuracy of sub-0.5 degrees of heading accuracy
 Multiple calibration methods, including 12-point hard- and soft-iron calibration methods, are available to ensure ease of calibration for all applications
 ITAR-free

“For military rangefinder and targeting systems developers who need accurate orientation in demanding conditions, TargetPoint TCM is a ruggedized digital magnetic compass built to handle weapons shock,” said Robin Stoecker, vice president of sales and marketing at PNI Sensor. “It’s an ideal choice for targeting applications that require reliability, consistency and accuracy.”

Pricing and Availability
For product specifications, download the TargetPoint TCM product sheet. For pricing and availability, please contact PNI Sales or your regional PNI representative.

About PNI Sensor
With over 30 years of experience, PNI is the world’s foremost expert in precision location, motion tracking, and fusion of sensor systems into real-world applications. PNI’s sensors and algorithms serve as the cornerstone of successful IoT projects and other mission-critical applications where pinpoint location, accuracy, and low power consumption are essential. Building on decades of patented sensor and algorithm development, PNI offers the industry’s highest-performance geomagnetic sensor in its class, location and motion coprocessors, high-performance modules, sensor fusion algorithms, and complete sensor systems. To learn more, please visit www.pnicorp.com.

Media Contact:
Robin Stoecker
PNI Sensor
Tel: +1 707-566-2260 |Email: [email protected]

Semiconductor equipment manufacturer ClassOne Technology has just released its proprietary new SoftSeal™ Plating Rotor, designed to enhance processing performance on the company’s Solstice® electroplating systems. The announcement was made by ClassOne’s CEO, Byron Exarcos and Senior Technology Director, John Ghekiere.

“Together with the plating reactor, the plating rotor design is key to maximizing on-wafer performance,” said Exarcos. “It’s responsible for distributing the electrical supply across the wafer, isolating electrolytes from the electrical contacts, and a great deal more. Which is why we’re constantly working to optimize rotor performance. The new SoftSeal is our latest and most advanced generation in Solstice rotors, and it’s already achieving unprecedented levels of electroplating uniformity along with reduced cost of ownership.”

“This highly-uniform performance comes from a combination of finely-tuned rotating-disk electrode physics and an optimized density of electrical contacts around the wafer,” said Ghekiere. "The ‘SoftSeal’ name comes from its high-performance FFKM elastomer seal which very effectively isolates plating chemistries from the wafer’s edge-exclusion zone. The new rotor also adapts automatically to substrate thickness, so it can accept thick or thin substrates without any adjustment. The design accommodates both flatted and multi-flat wafers, and it’s customizable to non-standard wafer sizes. Plus, the seal is more robust than on competitive rotors, meaning longer part life and no handling concerns.”

“In addition, the SoftSeal rotor’s low profile enables bubble-free entry into the plating bath,” Ghekiere noted. “And a unique design feature directs excess chemistry back into the bath at the end of the plating process. This is particularly important for conserving expensive plating baths such as gold. And, after processing, a special wafer retrieval method eliminates wafer flexing and stress by eliminating the need for extraction force at the center of the wafer.”

ClassOne stated that the new SoftSeal rotor is designed to fit all models of the company's Solstice electroplating systems and it will be standard equipment on all of the new tools going forward.

ClassOne Solstice systems are designed to provide high-performance, cost-efficient, single-wafer electroplating specifically for ≤200mm processing. The series includes the Solstice S8 and Solstice S4 for fully automated 8-chamber and 4-chamber high-speed production. It also includes the semiautomated Solstice LT, with up to three chambers that can be used both for process development and production. In addition to electroplating, the unique Plating-Plus™ capabilities of the Solstice platform enable it to handle many other important surface preparation functions, such as wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch, and more. Class-leading performance and flexibility consistently make Solstice the tool of choice for ≤200mm plating across a range of product categories.

ECM Lab Solutions is a new offer from the ECM Group, dedicated to laboratories, research centers and universities. This offer combines equipment from three companies and four brands: ECM Technologies, ECM Greentech, SEMCO Technologies & Cyberstar.

With more than 90 years of experience in manufacturing industrial equipment, this ECM Group offer highlights the diverse and flexbile nature of ECM's technology and expertise by transitioning from heat treating steels and automotive applications to a wide range of research and specialty fields.

With advanced technologies for crystal growth, vacuum heat treatment and chemical vapor deposition, ECM Lab Solutions offers reliable solutions for semiconductor, solar, medical and other mechanical applications.

Registration Details

Member Price: $99.00

Note:  Use company email address to log in for automatic recognition as a member.  Members must be current SEMI Members for member discounts.

Non-Member Price: $199.00

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During the workshop recording, you will hear perspectives from the key stakeholder segments and develop a greater understanding of the overall efforts and progress of the task force.

The workshop is focused on diagnosing and improving SEMI F47, Specification for Semiconductor Processing Equipment Voltage Sag Immunity, widely adopted across the industry, the governing standard that defines voltage sag test levels and requirements for semiconductor tools.

Since the implementation of SEMI F47, the vulnerability of semiconductor manufacturing to single-phase and two-phase voltage sags has improved greatly. However, semiconductor manufacturers continue to experience significant product loss and downtime due to voltage sag events.

Given the ongoing issues with semiconductor plant downtime, a new SEMI Voltage Sag Immunity Task Force was formed to take a fresh look at the issue. The workshop and the task force:

  • Reviews the characteristics of the power quality events that cause downtime.
  • Takes a new look at the sensitivities in the process equipment.
  • Determines any potential adjustments to equipment design, facility design, utility systems, or SEMI Standards to further reduce voltage sag induced losses by the semiconductor industry.

Speaker Biographies

United States

10:00 am - 10:05 am
James Amano
James Amano
Sr. Director, Standards
SEMI

Welcome

10:05 am - 10:25 am
Mark Stephens EPRI
Mark Stephens
Principal Project Manager & Leader, Voltage Sag Immunity Task Force
EPRI

Introduction to the SEMI Voltage Sag Immunity Task Force Effort

A review of the key objectives of the voltage sag task force will be discussed along with the characteristics of the power quality events that are still causing semiconductor plant process downtime. A new look at the sensitivities in the tooling and process equipment is required to determine any potential adjustments to equipment design, facility design, utility systems or standards to further reduce voltage sag induced losses by the semiconductor industry. This important work will help utilities, semiconductor manufacturers, and tool equipment providers to better understand the tolerance and susceptibility of today’s generation of semiconductor processing tools and then to develop effective strategies to improve uptime and lower product losses due not only to single-phase (Type I) and two-phase (Type II) voltage sag events but for three-phase (Type III) events as well.

10:25 am - 10:50 am
Clay Burns
Clayton Burns
Principal Engineer
National Grid

Regional Voltage Sags- Importance of Addressing Three-Phase Voltage Sags in SEMI F47

A review of voltage sags at a National Grid substation which were produced by two lightning-caused three-phase transmission faults at locations fairly remote to the substation.  This will show the regional effect of transmission level faults on voltage.  The voltage sags will be compared to the existing SEMI-F47 standard and the accepted sag definition.  Additionally, a proposed regional voltage sag study will be considered in light of the changing make-up of the future electric system and the influx of large inverter-based resources.

10:50 am - 11:15 am
Ed McGann
Ed McGann
Manager of Engineering
VELCO

Utility Dynamic VAR device fault response, fault mitigation techniques, and power quality measures addressed with protection design

Co- presenters:
Greg Rieder, GlobalFoundries
Josh Burroughs, VELCO
John Fiske, VELCO

VELCO recently conducted a refurbishment of its STATCOM facility as part of a planned controls system upgrade. The system planning need for this facility is to provide area voltage support during transmission system contingencies. The refurbishment project team recognized the benefits of the STATCOM’s ability to provide voltage support during system faults and specified fault performance requirements in the vendor specifications. This presentation will discuss those performance requirements, review pre and post project upgrade system fault record’s and review project lessons learned. The second half of the presentation will cover utility fault mitigation design strategies for substation and transmission line assets as well as protective relaying techniques to improve power quality

11:15 am - 11:50 am
Michael Noth Austin Energy
Michael Noth
Power System Managing Engineer
Austin Energy

Seeing it from both sides: The importance of Power Quality Metering at the utility and inside the Fab Distribution System.

In this presentation we will discuss the importance of having power quality-based metering on both sides of the point of connection and other parts of the distribution system.  Mike will share some examples and stories of how important that can be.

11:50 am - 12:15 pm
Tony Sabin DAn Hunt
Dan Sabin & Tony Hunt
Schneider Electric

Waveform captures of voltage sag events can be automatically analyzed by software to determine their source and impact

This presentation will summarize efforts to categorize events automatically that exceed SEMI F47 limits, and to determine the source of those disturbances. It will also present recent efforts to analyze the impact of voltage sags automatically on electrical loads. This research has resulted in automatic algorithms to determine which voltage sags caused downtime and which ones did not. Combining all of this information together provides a means to more precisely and effectively diagnose, manage, and mitigate voltage sag disturbances.

12:15 pm - 12:25 pm
Christopher "Dale" Moffitt
Electrical Systems Engineering
HP

Power Quality and Monitoring, What Does the Data Tell Us?

Power Quality (PQ) has a long and diverse history dating back to the first power grids in the United States. Impacts and concerns about PQ events have evolved and will continue to evolve as our usage of electricity changes. Recent natural disasters have highlighted the importance of a robust power grid and the changing landscape of power generation presents new PQ challenges. As power consumers, a key element in any PQ strategy is adequate power monitoring. This provides the data that can drive conversation with the utility, discover opportunities in our infrastructure and deliver to our facilities the power quality necessary to sustain our businesses.

12:25 pm - 12:50 pm
Willem Meijs ASML
Willem Meijs & Giel Croonen
Low Voltage expert in electrical engineering on supply distribution system for machines
ASML

SEMI F47 and Power Quality Perspectives and Considerations from a Tool OEM

This presentation will address power quality perspectives and consideration from the point of a lithographic tools manufacture. Effect of different test methods on the sag immunity, test strategy on systems, sub-systems and components. How to divide a large installation up in to testable units and maintaining performance integrity. 3 phase type III test generator topology and the impact on harmonic emission and immunity in relation to voltage sag immunity.

12:50 pm - 1:15 pm
Josh Pankratz Advanced Energy
Josh Pankratz
Director of Engineering
Advanced Energy, Inc.

Power Supply Considerations and Standards for Voltage Sag Ride Through

Disturbances in utility power during semiconductor manufacturing can result in loss of revenue, productivity, production yields, and product quality. Focus on power quality continues to grow as new fabs are built in developing regions, which historically suffer from poor infrastructure. Highly automated fabs have driven a demand for systems that can ride through power glitches without shutting down tools and production lines. This presentation examines how power quality, most typically resulting in voltage sag events, affects semiconductor manufacturing and how industry standards and guidelines for tool immunity to those events affect the design of power supplies.

1:15 pm - 1:40 pm
Steve Lewis, Lam Research, square
Steve Lewis
Lam Research

Round Table Discussion & Q&A

1:40 pm - 1:55 pm
Mark Stephens EPRI
Mark Stephens
Principal Project Manager
EPRI

Next Steps for SEMI Voltage Sag Immunity Task Force

Based on the initial findings from utility and fab power quality data, the task force is poised to move forward to re-evaluate semiconductor tools against voltage sag additional characteristics that are indicative of measured events still causing downtime. Utilities, semiconductor fabs and equipment OEMs will be invited to actively participate in this effort to obtain the required test data.

1:55 pm - 2:00 pm

Closing Remarks & Adjourn

James Amano, SEMI

CAST FlexTech FOA ITL MSIG SCIS SE&A Standards EPRI and SEMI logos

SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain. 

10:00 am - 2:00 pm Off Add to Calendar 2021-04-21 10:00:00 2021-04-21 14:00:00 Voltage Sag Workshop for Manufacturing Fabs SEMI & EPRI invite you to view a workshop held on April 21, 2021, to hear perspectives from all stakeholders on a persistent and difficult issue in microelectronics manufacturing - uncertain power quality. As work on SEMI Standard F47, the Specification for Semiconductor Processing Voltage Sag Immunity, continues this is the opportunity to hear from distinct parts of the supply chain.  United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles
Event format

Registration

Registration

REGISTRATION

  • Registration Close: 6 pm, Friday, July 2(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 250,000
    • Non-members: KRW 300,000
Registration
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SPONSORS

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NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.
  • Presentations will be provided 24/7 during the event period(July 7-13)

 


 

CONTACT

 

Virtual
South Korea

Keynote

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Dragos Maciuca
Executive Technical Director,
Ford

Automotive Sensors and Applications (English)

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Denis Marcon
Senior Business Development Manager,
imec

The Power of Nanoelectronics to Bring Disruptive Innovation in Healthcare (English)

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Manuel Tagliavini
Principal Analyst,
Omdia

MEMS & Sensors: How the Market Changed after the Year of the Global Pandemic (English) [Cancelled]

Session 1: Life Science/Healthcare

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Seong-Hyok Kim
Seong-Hyok Kim,
LG Electronics

AI Sensing for Home Appliance (Korean)

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Kyung-Hak Choi
Chief Technology Officer,
OPTOLANE Technologies

Digital Real-Time PCR: A Next Generation Nucleic Acid Amplification and Quantification (Korean)

Session 2: Environmental

Jeff Hawkins.jpg
Jeff Hawkins
Senior Product Manager
Amphenol Sensors

Trends and Technologies in Indoor Air Quality Sensing (English)

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Cees Draijer
Business Line Director Infrared Imaging,
Teledyne Digital Imaging

Microbolometer Based Thermal Imaging for Automotive Applications: Benefits, Limitations and Trends (English)

Dohoon Kim.jpg
Dohoon Kim
Executive Director, R&D center,
Samyoung S&C

Application of Environmental Sensors for Timely Ventilation of Indoor Air (Korean)

Session 3: Mobility

Wanil Kim.jpg
Wanil Kim
Executive Director / Head of R&D,
Mando-Hella Electronics

Smart Tire Monitoring Sensor – Enhancing the Safety of ADAS and AD (Korean)

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Tim Wong
Director of Technical Marketing- Autonomous Technology,
NVIDIA

Solution & Platform for ADAS (English)

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Saptarshi Saradindubasu
Head of Program New Mobility Business and Non-Automotive,
Continental AG

Future of Urban Mobility & Impact to City Infrastructure (English)

Session 4: Industrial

David Horsley.jpg
Dave Horsley
CTO,
Chirp Microsystems(a TDK Group Company)

A Wearable Social Distancing Solution Based on Ultrasonic Time-of-Flight Sensors (English)

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Byeng Dong Youn
Ph.D. / CEO & Professor
OnePredict / Seoul National University

Digital Transformation and Beyond for Smart Plants (Korean)

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Greg Nagler
Director OEM,
FLIR Systems

Benefits of Thermal Sensors (LWIR) with Intelligent Analytics for Commercial and Defense Products (English)

Session 5: Core Technologies

Stanley Park.png
Stanley Park
Sensor systems technical marketing, lead principal engineer,
Infineon

Smart Sensors & Smart Ears (Korean)

Jeongpyo Kim.jpg
Jeongpyo Kim
CEO,
Cesign

Circuit Consideration in Sensor Application (Korean)

Bill Grube.jpg
Bill Grube
Senior Product Marketing Manager,
Energetiq

Advances in Testing and Calibration of Modern Optical Sensors (English)

Michelle Bourke.jpg
Michelle Bourke
Senior Director of Strategic Marketing, Customer Support Business Group (CSBG),
Lam Research

Bridging the Gap Between 200mm and 300mm Manufacturing to Enable Manufacturing Solutions for CMOS Image Sensors and Advanced Inertial MEMS (English)

-

[NOTICE] Due to the Social Distancing for preventing COVID-19, MEMS & Sensor Forum 2021 will be held as a Virtual Conference.

 

Sensors: Transforming How We Live and Work

The age of sensorization is upon us as the world becomes more connected with more devices that monitor our surroundings to transform how we work and live.  
Industry leaders and visionaries will gather at the SEMI MEMS & Sensors Forum 2021, a premier business and technology event in Korea, to provide insights into the latest MEMS and sensors technologies, innovation challenges and opportunities, market trends and new business opportunities. 
Join us to meet speakers, industry leaders and peers as the event features 18 presentations accessible on-demand 24/7.

Off Add to Calendar 2021-07-07 00:00:00 2021-07-13 00:00:00 MEMS & Sensor Forum 2021 [NOTICE] Due to the Social Distancing for preventing COVID-19, MEMS & Sensor Forum 2021 will be held as a Virtual Conference.   Sensors: Transforming How We Live and Work The age of sensorization is upon us as the world becomes more connected with more devices that monitor our surroundings to transform how we work and live.   Industry leaders and visionaries will gather at the SEMI MEMS & Sensors Forum 2021, a premier business and technology event in Korea, to provide insights into the latest MEMS and sensors technologies, innovation challenges and opportunities, market trends and new business opportunities.  Join us to meet speakers, industry leaders and peers as the event features 18 presentations accessible on-demand 24/7. Virtual South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul

Registration

Registration

REGISTRATION

  • Registration Close: 6 pm, Friday, May 7(KST)
  • Registration Fee
    • SEMI Members / Students: KRW 280,000
    • Non-members: 330,000
Registration
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SPONSORS

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Air_0.png SK M_0.pngEntergris_1.pngLinx_1.png KC Tech_0.png 

 

NOTICE

  • The agenda will be subject to change without notice.
  • Presentation files agreed by speakers will be provided to attendees.
  • Live session will be live streamed on Afternoon, Wednesday, May 12(KST).
  • On-demand Session will be provided 24/7 during the event period(May 12-18)

 


 

CONTACT

South Korea

[LIVE] Collaboration – May 12(Wed)

2:00 pm - 2:05 pm

Welcome

2:05 pm - 2:35 pm
Hyun-Goo Kang.jpg
Hyun-Goo Kang
Team Leader of C&C Material Development Team of R&D Center,
SK hynix

Advanced Material Development in Perspectives of CMP & Cleaning Process for Semiconductor (Korean)

2:35 pm - 3:05 pm
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Yun-Ho Kim
Material Technology Group Leader (Foundry Division),
Samsung Electronics

Special Singularity beyond Material; Winter but Opportunity is Coming (Korean)

[On-demand] Keynote (Translation provided)

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Christoph Adelmann
Scientific Director,
imec

Materials for Sub-5-nm Semiconductor Devices (English)

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Bruce Tufts
Vice President, Fab Materials Organization, Global Supply Chain,
Intel

Trends and Observations in Materials Quality at Advanced Process Nodes (English)

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Jijen Vazhaeparambil
Senior Vice President and General Manager, Surfscan and ADE,
KLA

Cost-Effective Fab Material Qualification with Un-patterned Wafer Inspection (English)

[On-demand] Session 1: Emerging Materials and Patterning

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Myoung-Kuy Lee
Manager of Strategic Business Development Field Marketing,
ASML

0.33 NA EUV Systems for High Volume Manufacturing (Korean)

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Takanori Kawakami
General Manager at Lithography Materials Lab. of Fine Electronic Materials Research Laboratories
JSR Corporation

Stochastic Effects on EUV CAR Systems: Investigation of Materials Impact (English)

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Kazuma Yamamoto
Associate Manager, Global R&D,
Merck KGaA, Darmstadt, Germany

Mitigation of Pattern Collapse in EUVL (English)

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Ashutosh Bhabhe
Global Wet Etch and Cleans Applications Manager,
Entegris

Removal of Trace Metals from High Temperature Isopropyl Alcohol (IPA) (English)

[On-demand] Session 2: Materials Integration and Challenges

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Young Hun Kim
Epi. Technical Engineering Team Leader,
SK Siltron

Current Demands on Wafers for CIS (Korean)

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Youngwoo Park
EVP/Senior Technology GM,
Tokyo Electron

Gate-All-Around Transistors: Fundamentals & Structures (Korean)

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Andreas Fischer
Technical Director
Lam Research

Thermal Atomic Layer Etching – An Emerging and Enabling Etching Technology (English)

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Mihaela Balseanu
Sr. Technology Director
Applied Materials

Selective ALD in a Continuous World, New Techniques and Advancements (English)

[On-demand] Session 3: New Waves in Materials

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JinSuk Jeong
Director / Project Leader,
Amkor Technology

Advanced Packaging : Trends, Technologies and Challenges (Korean)

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Luis Andia
RF Business Development Senior Manager,
Soitec

Engineered Substrates for New Waveforms and New Applications (English)

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Marco Arnold
Global R&D Manager,
BASF

Next Generation Metallization Solutions for Advanced Packaging (English)

[On-demand] Session 4: Market Trends

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Bob Johnson
VP Analyst
Gartner

Semiconductor Market Outlook: Strong Growth Ahead (English)

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Brandon Prior
Senior Consultant
Prismark

Advanced Packaging Growth: Focus on New Package Approaches (English)

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Mark Thrisk
Managing Partner,
Linx Consulting

Materials Demand in the Next Supercycle (English)

-

[NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.

 

Materials: Driving a New Leap Forward 

Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.  

SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.  

Off Add to Calendar 2021-05-12 00:00:00 2021-05-18 00:00:00 SMC Korea 2021 [NOTICE] Due to the Social Distancing for preventing COVID-19, SMC Korea 2021 will be held as a Virtual Conference.   Materials: Driving a New Leap Forward  Reshoring, the trade war and mergers and acquisitions have reshaped the global semiconductor supply chain, presenting new challenges. Join us at SMC Korea 2021, May 12-18, for insights into the latest technology trends and how the chip ecosystem can tackle these challenges and uncover new opportunities.   SMC Korea 2021, a virtual event, will highlight developments across more topics than ever including EUV, packaging, foundry and materials.   South Korea SEMI.org [email protected] Asia/Seoul public Asia/Seoul
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ClassOne Technology, global supplier of high-performance semiconductor electroplating and surface preparation systems, announced the sale of its Solstice® S8 system to South Korean chip manufacturer, Point Engineering Co. The eight-chambered Solstice plating tool will be installed at Point Engineering’s manufacturing facility in Asan City, South Korea. The announcement was made by ClassOne‘s CEO, Byron Exarcos, and PEC‘s CEO, Bum-Mo Ahn.

"Our products call for unique manufacturing approaches,” said Bum-Mo. “In addition to copper, we require plating of palladium cobalt alloy into highly variant features; and this plating is done on a proprietary substrate. We needed a volume-manufacturing platform that has the necessary flexibility without sacrificing reliability. The Solstice S8 covers these needs very well, and it also has a compact footprint to conserve fab space."

Exarcos pointed out that Point Engineering's new Solstice configuration includes a CopperMax™ processing chamber, a ClassOne-proprietary feature specifically designed to optimize copper plating. The chamber enables consistent high-quality, high-rate copper plating, while maximizing uptime and dramatically reducing bottom-line operating costs.

“Point Engineering has gained considerable respect in the industry for its semiconductor parts, which frequently go into probe pins and micro power inductors," said Exarcos. “In today’s semiconductor industry, we’re seeing that new product categories often drive the need for novel approaches in manufacturing. Point Engineering’s groundbreaking new products demand a process-experienced equipment provider and a flexible platform. We’re gratified that Point Engineering has chosen ClassOne and Solstice to partner with them on their next-generation products.”

The Solstice S8 is an 8-chambered system designed and built by ClassOne for high-performance, fully-automated electroplating and surface preparation, specifically for ≤200mm semiconductor wafer processing. The Solstice series also includes the S4, which provides up to four processing chambers, and the LT, with up to three chambers. In addition to electroplating, Solstice systems also provide Plating-Plus™ surface preparation capabilities, including wafer cleaning, high-pressure metal lift-off, resist strip, UBM etch and more. This multi-processing flexibility allows users to streamline wafer production and increase cost efficiencies by reducing the number of different processing tools required in the fab.