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Malaysia

Reaffirms Full Year 2023 Revenue Expectations Above $1.1 billion

BEVERLY, Mass., Jan. 16, 2024 -- Axcelis Technologies, Inc. (Nasdaq: ACLS), a leading supplier of enabling ion implantation solutions for the semiconductor industry, today increased financial guidance for the fourth quarter of 2023 and reaffirmed its expectations for the full year. Based on preliminary fourth quarter financial results, the Company expects revenue for the fourth quarter of 2023 to be greater than $300 million, above the approximately $295 million prior guidance, and reaffirmed its expectation for full year 2023 revenue above $1.1 billion. Earnings per diluted share for the fourth quarter of 2023 are now forecasted to be greater than $2.05, above prior guidance of approximately $2.00.

President and CEO Russell Low commented, “Our excellent financial performance in the fourth quarter and for the full year 2023 resulted from strong execution by Axcelis employees, combined with our leadership position in the growing power device market.” Low continued, “Based on our strong yearend backlog and fourth quarter bookings, especially in power devices, we expect the power device market to remain healthy in 2024. We also believe that the mature process technology and memory segments, two markets in which Axcelis is well-positioned, will recover in the second half of the year, enabling strong growth in 2025.”

James Coogan, executive vice president and chief financial officer said, “We look forward to discussing our results for 2023 and expectations for 2024 on our upcoming fourth quarter and full year earnings call. We believe we are still on track to achieve our $1.3 billion revenue model in 2025. This expectation is based on continued demand for the Purion product family, continued bookings strength, and a backlog stretching into 2025.” Coogan continued, “Additionally, we continue to manage spending to improve our earnings power and to invest in R&D to strengthen our market position.”

Fourth Quarter and Full Year 2023 Conference Call
The Company will release financial results for the fourth quarter and full year 2023 on Wednesday, February 7, 2024, at 4:00 p.m. Eastern Time (ET). The Company will host a call to discuss the results for the fourth quarter and full year 2023 on Thursday, February 8, 2024, at 8:30 a.m. ET. The call will be available to interested listeners via an audio webcast that can be accessed through the Investors page of Axcelis' website at www.axcelis.com, or by registering as a Participant here https://edge.media-server.com/mmc/p/su3u4oev. Webcast replays will be available for 30 days following the call.

Safe Harbor Statement
This press release contains forward-looking statements under the SEC safe harbor provisions. These statements, which include our guidance for future financial performance, are based on management’s current expectations and should be viewed with caution. They are subject to various risks and uncertainties, many of which are outside the control of the Company, including the timing of orders and shipments, the conversion of orders to revenue in any particular quarter, or at all, the continuing demand for semiconductor equipment, relative market growth, continuity of business relationships with and purchases by major customers, competitive pressure on sales and pricing, increases in material and other production costs that cannot be recouped in product pricing and global economic, political and financial conditions. These risks and other risk factors relating to Axcelis are described more fully in the most recent Form 10-K filed by Axcelis and in other documents filed from time to time with the Securities and Exchange Commission.

About Axcelis
Axcelis (Nasdaq: ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for over 40 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and complete life cycle support of ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at www.axcelis.com.

Kitchener, ON, January 11, 2024 – PEER Group®, the largest supplier of innovative factory automation software products for the semiconductor industry, is highlighting its lineup of SEMI Standards compliance test products at booth A434 during SEMICON Korea 2024.
“We are excited to return SEMICON Korea and look forward to connecting with our partners and customers at the show,” says Bob Kane, PEER Group’s Director of Factory Sales, Asia. “SEMI Standards compliance testing is critical for passing the factory acceptance test. OEMs that validate their tools using PEER Group’s test applications before shipping increase their chances of a successful factory integration and securing repeat business from factories.”
PEER Group’s test products include SECSIM Pro®+, which has been trusted by equipment manufacturers for more than 20 years to test and validate SECS/GEM communications. Also highlighted during the show are PFAT™, a workflow-based scenario test designer used by factories and OEMs to ensure equipment meets factory requirements, and CCS Envoy™, a factory automation standards compliance tester.
Visitors to booth A434 will have the opportunity to meet with representatives from PEER Group’s global sales team, as well as members from Toward Future, PEER Group’s exclusive sales partner serving South Korea. SEMICON Korea, which is happening January 31 - February 2, is the country’s leading semiconductor industry event.
To learn more, and to schedule a meeting during SEMICON Korea, visit PEER Group’s event page.

About PEER Group
PEER Group® is the largest supplier of innovative factory automation software products for the semiconductor industry. Since 1992, our solutions have helped the world’s most advanced OEMs and factories reduce time to market and lower costs by solving their equipment automation, data management, and process control problems. An award-winning company, PEER Group’s commitment to quality has been recognized by Intel’s EPIC Supplier Program, naming PEER Group a Distinguished Supplier in 2023 and an Outstanding Supplier in 2022. Follow PEER Group on LinkedIn.

Malaysia Singapore Vietnam Members' Networking Night Mar 2024 Business Executive

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SEMI Southeast Asia's Members' Night | Penang, Malaysia

Join SEMI Southeast Asia for a night of networking and celebration at our Members' Night. Get a chance to connect with other industry leaders, exchange valuable insight on the sector, and unlock a myriad of business opportunities with our Members' Networking Night. 


BROWSE OUR PHOTO GALLERY

https://prod8.semi.org/en/event/membersnight-mar2024/photo-gallery

Over & Above
3, Pengkalan Weld, George Town
10300 Penang
Pulau Pinang
Malaysia

6:00 pm

Registration

6:30 pm
LindaTan_200px_round
Ms. Linda Tan

Welcome Speech

Ms. Linda Tan | President, SEMI Southeast Asia

6:45 pm

Semiconductor Market Trend and OSAT Outlook

Inviting

6:55 pm

Presentation of Certificate

For New SEMI Southeast Asia Members

7:00 pm

Dinner

Standing Buffet

8:00 pm

Lucky Draw

9:00 pm

Grand Draw

9:30 pm

End of Networking Night and Collection of Welcome Gift

Note: Program is subject to changes.

Connect, collaborate, and celebrate the new year with SEMI Southeast Asia Members' Networking Night over at Penang, Malaysia! This networking night is designed to elevate your professional connections.

 

Non-member fee: SGD 800 (limited tickets available)

Members: Free (restricted to 2 pax per member company)

 

Contact us for enquiries!

For the Event: 

Mr. Glenn Tan | [email protected] | +65.8228.0662

For Registration: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

6:00 pm - 9:30 pm Off Add to Calendar 2024-03-07 18:00:00 2024-03-07 21:30:00 Penang Business Summit Members' Night Connect, collaborate, and celebrate the new year with SEMI Southeast Asia Members' Networking Night over at Penang, Malaysia! This networking night is designed to elevate your professional connections. Non-member fee: SGD 800 (limited tickets available)Members: Free (restricted to 2 pax per member company) Contact us for enquiries!For the Event: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration: Ms. Gillian Lim | [email protected] | +65.9048.1123 Over & Above 3, Pengkalan Weld, George Town 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur Register Today
Malaysia Singapore Vietnam Seminar 2: Revolutionizing Manufacturing Business Executive

Supporting Partners

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Who should attend

This seminar is designed to offer a platform where executives, managers, and engineers who specialize in process development, equipment maintenance,  factory automation, and manufacturing can come together to discuss ways to improve production output,  increase yield and work efficiency through implementing some of AI solutions presented in this seminar.

 


BROWSE OUR PHOTO GALLERY

PBS Seminar 2 2024 Photo Gallery Web banner

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

1:00 pm

Registration & Lunch

2:00 pm
LindaTan_2023
Ms. Linda Tan

Welcome Speech

Ms. Linda Tan | President, SEMI Southeast Asia

semi-logo
2:05 pm
KCAng_2022
Mr. KC Ang

Opening Speech: Unleashing the Power of AI in Wafer Fab Manufacturing

Mr. KC Ang | Chairman, SEMI Southeast Asia Regional Advisory Board | Chief Manufacturing Officer, GlobalFoundries

Global Foundries
2:20 pm
Mr Amarjit Singh Sandhu
Mr. Amarjit Sandhu

Keynote Speech: Memory at the heart of future technologies

Mr. Amarjit Sandhu | Corporate Vice President, Assembly and Test NAND Operations, Micron Technology

MICRON
2:55 pm
Mr. Jan Thomas Nicholas
Mr. Jan Thomas Nicholas

The Impact of Gen AI on the Semiconductor Value Chain

Mr. Jan Thomas Nicholas | Executive Director, Tech Sector Leader, Southeast Asia, Semiconductor Consulting Leader, Southeast Asia, Deloitte Consulting (SEA) Sdn. Bhd.

Deloitte
3:20 pm
George Ng
Mr. George Ng

Reimagining factory of the future for growth and resilience

Mr. George Ng | Vice President and Head of Backend Ops Industry 4.0, Infineon Technologies

infineon
3:45 pm

Break

4:00 pm
Mr. Gary Leong
Mr. Gary Leong

From Cliffs to Cloud: The adventurous climb of digitalization and AI in manufacturing

Mr. Gary Leong | Business Development Senior Director, ViTrox Technologies, Malaysia

Vitrox
4:25 pm
Joseph Ervin
Dr. Joseph Ervin

A Single Digital Twin for Semiconductor Manufacturing? Semiverse™ Solutions and Building the Digital Family

Dr. Joseph Ervin | Senior Director of Semiverse™ Solutions, Lam Research

LAM Logo
4:50 pm

Break

4:55 pm

Panel Discussion

Moderator: Mr. Jan Thomas Nicholas

Panelists:
Mr. Amarjit Singh Sandhu, Mr. Gary Leong, Mr. George Ng, and Dr. Joseph Ervin

5:35 pm

Q&A Session

5:45 pm

Appreciation and Closing Remarks

6:00 pm

End of Seminar

Note: Program is subject to changes.

Seminar 2 and Seminar 1 timing will overlap on 7 Mar.

Smart MFG

The role of AI in Future Factories

The landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.

This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.

This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.

*Note: Seminar 2 and Seminar 1 timing will overlap on 7 Mar 

 

Participating Fee:

Usual Member Rate: SGD 152
Usual Non-member Rate: SGD 227

*The above rates are inclusive of coffee/tea breaks and luncheon

30% Early Bird Rate extended until 1 March 2024!

 

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*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

 

Contact us for enquiries!

For Program: 

Mr. Glenn Tan | [email protected] | +65.8228.0662

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Presentation slides can be found HERE!

1:00 pm - 6:00 pm Off Add to Calendar 2024-03-07 13:00:00 2024-03-07 18:00:00 Penang Business Summit Seminar 2: Revolutionizing Manufacturing The role of AI in Future FactoriesThe landscape of Semiconductor manufacturing is undergoing a profound transformation, with Artificial Intelligence (AI) emerging as a driving force behind the evolution of future factories.This theme invites participants to delve into the intricate interplay between advanced AI technologies and the manufacturing sector, showcasing the pivotal role AI plays in reshaping the entire manufacturing ecosystem.This conference aims to provide a comprehensive platform for industry leaders, researchers, and innovators to exchange ideas, share success stories, and envision the future trajectory of manufacturing under the influence of AI.*Note: Seminar 2 and Seminar 1 timing will overlap on 7 Mar  Participating Fee:Usual Member Rate: SGD 152Usual Non-member Rate: SGD 227*The above rates are inclusive of coffee/tea breaks and luncheon30% Early Bird Rate extended until 1 March 2024!  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 2: Revolutionizing Manufacturing (The role of AI in Future Factories) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Mr. Glenn Tan | [email protected] | +65.8228.0662For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123 Presentation slides can be found HERE! Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur Register Today
Malaysia Singapore APS Workshop Mar 2024 Executive Technical

Supporting Partners

HRDC_2023
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Featured Speakers
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This course will cover:

  • Evolution of IC Packaging – Fan-in, Fan-out WLP, Embedded Packaging technology, System on Chip (SOC), System in Package (SiP), 3D IC, WLP, TSV etc.
  • Principles of Interconnects ranging from TAB, Wirebond to various Flip Chip bonding such as thermocompression bonding with NCP, C4, ACF for manufacturing and R&D development
  • Board level assembly and its soldering materials and failure mechanisms for 2nd level interconnect
  • Overview of interposer of lead frame, ceramic, flex to BT substrates for Microelectronics Packaging
  • Assembly flow and new assembly techniques such as stealth dicing, compression molding, underfill molding etc., and its assembly materials for Microelectronics packaging
  • Material characterization from bulk to interfaces for Microelectronics packaging

Why should I attend?

  • Gain technical knowledge for industry professionals
  • Enhance knowledge in manufacturing and R&D know-how in IC packaging
  • Apply Key Technical Concepts in Problem Solving through Real Case Studies
  • Networking opportunities with industry peers

Who should attend?

  • Beneficial for directors, managers, process & equipment engineers, R&D engineers and Quality & Reliability engineers working in the areas of microelectronics packaging
  • Useful for sale or application engineers who supply packaging materials and tools to the industry

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Penang Business Summit Seminar 1: Advanced Packaging

Royale Chulan Penang
No 1 & 2, Pengkalan Weld, Georgetown
10300 Penang
Pulau Pinang
Malaysia

Image of Dr Lee Teck Kheng
MEET OUR SPEAKER
Dr. Lee Teck Kheng
Director, Technology Development Centre, Institute of Technical Education Singapore,
SEMI SEA Advance Packaging Technical Committee Member
9:00 am

Introduction to IC Packaging & Interconnects

Introduction to IC Packaging
• Functions of Packaging – Mechanical, Material, Electrical and Chemical
• Review of Packaging Trend – BGA, CSP, Fan-in & Fan-out WLP, 3D Packaging, SoC vs SiP etc
• Challenges in Assembly and Packaging

Interconnects
• Overview
• TAB Bonding
• Wirebonding – Ultrasonic, Thermocompression, Thermosonic mechanisms
• Flip Chip Bondings – Thermocompression, C4, Re-cap reflow, solid-state, ACF, Conductive paste bonding

12:00 pm

Lunch

1:00 pm

Board Assembly and Soldering & PCB and IC Carriers

Board Assembly and Soldering
• Through Hole & SMT – Stencil Print Process, Reflow Profile
• Solder Materials – Alloy, Flux, Solvents, self-alignment effect
• Pb Free Solder – Ternary phase diagram, SnAgCu
• Intermetallics and Growth – Diffusion mechanism, Arrhenius equation
• Testing and Reliability – Ball shear & pull failure strength and modes, Fatigue, Weibull distribution

PCB and IC Carriers
• PCB Technology – Material properties, PCB fabrication process, drilling, patterning, plating, solder resist, laminating
• IC Carriers – Design rule, Leadframe, LTCC, Flex and BT substrates
• Substrate Development

4:00 pm

Q&A | Case Studies

5:00 pm

End of Day 1

9:00 am

Assembly Process

• Thickness Reduction – Grinding, Lapping, Polishing, CMP
• Dicing/Singulation – Blade, Laser, Stealth dicing, Dicing after grind
• Die Attach – Eutectic bonding, DA materials, Collets
• Plasma – Argon, Oxygen plasma, Surface tension
• Encapsulation – Mold constitutes and properties, Transfer, Film and compression molding, Dam and fill
• Plating – Solder plating, NiPd finish, PPF
• Trim & Form – ESD, Lead formation, Spring back mechanism

12:00 pm

Lunch

1:00 pm

Material Characterization Techniques

• Introduction
• Bulk Material Characterization – Stress strain, Bending, Impact toughness, TGA, DSC, TMA, DMA
• Interfaces Characterization – Failure mode and strength, Wire pull, Ball pull, Double cantilever bending, Die shear, Mold button shear, Ball shear

2:30 pm

Q&A | Case Studies

3:30 pm

Lucky Draw

3:35 pm

End of Workshop

Note: Program is subject to changes.

Seminar 1 and Seminar 2 timing will overlap on 7 Mar .

- APHI Workforce Development

Advanced Packaging and Material Characterization

*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar

 

Participating Fee:

Usual Member Rate: SGD 750 
Usual Non-member Rate: SGD 935 

*The above rates are inclusive of coffee/tea breaks and luncheon for both days

Register before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates.

 

A certificate of completion will be awarded at the end of the seminar.

 

HRD Corp Logo
 

*Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).
For HRDC claims, please refer to the following links on the claiming matrix and guidelines:

 

Contact us for enquiries!

For Program: 

Ms. Cecelia Fong | [email protected] | +65.9750.2382 

For Registration / HRDC Claims: 

Ms. Gillian Lim | [email protected] | +65.9048.1123

 

Off Add to Calendar 2024-03-06 00:00:00 2024-03-07 00:00:00 Penang Business Summit Seminar 1: Advanced Packaging Advanced Packaging and Material Characterization*Note: Seminar 1 and Seminar 2 timing will overlap on 7 Mar Participating Fee:Usual Member Rate: SGD 750 Usual Non-member Rate: SGD 935 *The above rates are inclusive of coffee/tea breaks and luncheon for both daysRegister before 23 February 2024 to enjoy Early Bird rate of 15% off the above rates. A certificate of completion will be awarded at the end of the seminar.  *Malaysian Companies - HRDC Claimable for Penang Business Summit Seminar 1: Advanced Packaging (Advanced Packaging and Material Characterization) (subject to T&C, please contact HRDC for more information).For HRDC claims, please refer to the following links on the claiming matrix and guidelines:HRDC Approval Letter for Penang Business SummitAllowable Cost MatrixHRDC SBL Grant HelperHRDC SBL Claim Helper Contact us for enquiries!For Program: Ms. Cecelia Fong | [email protected] | +65.9750.2382 For Registration / HRDC Claims: Ms. Gillian Lim | [email protected] | +65.9048.1123  Royale Chulan Penang No 1 & 2, Pengkalan Weld, Georgetown 10300 Penang Pulau Pinang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur SOLD OUT

Deventer, December 12, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, and HE System Electronic GmbH, an established development and manufacturing partner for sensors and power electronics, today announce their cooperation to perform certified validation of power modules in the field of electromobility. All qualification and reliability tests will be carried out in compliance with the AQG 324 standard, among others, and the final product will be used in high power solutions such as car batteries. The partnership was initiated in 2021 and is now even stronger with this new project.

The majority of projects at HE System Electronic are located in the automotive sector. In this area, it is important to be certified or accredited according to quality management standards such as VDA 6.2 and DIN EN ISO / IEC 17025:2018.

“RoodMicrotec is one of the few independent service providers in the European region that can carry out a complete validation according to AQG 324. This makes the cooperation with RoodMicrotec so valuable,” says Axel Weber, CEO of HE System Electronic GmbH.

For RoodMicrotec, this partnership fits well into their general range of services and the company is looking forward to realizing further projects in this area, thus planning to expand its capacities.

“The final product from HE System Electronic is highly interesting. Because of this, we have added power cycling to our qualification capabilities. An additional tester with extended high power capabilities has already been ordered, so we can expand our capabilities and provide additional support to our customers,” says Martin Sallenhag, CEO of RoodMicrotec.

About HE System Electronic GmbH
HE System Electronic is a medium-sized electronics and microsystems technology company based in Veitsbronn in the location for business of the metropolitan region Nuremberg. Founded as a provider for electronic manufacturing services in the field of hybrid technology, HE System Electronic is well established as a competent partner for development and manufacturing and has been successful on the market for its customers in the product areas of sensor technology and power electronics for many years. The parent company, TKH Technologie Deutschland AG, based in Bielefeld, is supporting the growth and thus, HE System Electronic offers its customers the best of two worlds: the financially stable background of a healthy and profitable holding company as well as the innovative strength and short distances of a medium-sized company.
For more information please visit he-system.com/en.
Further information
Axel Weber – CEO, Klaus Aßmann – Distribution
Phone +49 911 97 58 10, E-mail: [email protected].

About RoodMicrotec
With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is a leading independent company for semiconductor supply and quality services. RoodMicrotec is a highly valued partner for many companies worldwide and offers specifically tailored turnkey solutions for each single customer's requirements. The turnkey services include project management, wafer test, assembly, final test, qualification, failure analysis, and logistics. All services provided by RoodMicrotec meet the high quality standards of the automotive, industrial, healthcare, and high reliability aerospace sectors. RoodMicrotec is headquartered in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany.
For more information, please visit https://www.roodmicrotec.com.
Further information
Martin Sallenhag, CEO or Arvid Ladega, CFO
Phone +31 570 745623, E-mail [email protected].

This press release is available in English and German. In case of conflict between these versions, the English version shall prevail.

Registration for this course is free.

For questions, please contact Paul Trio at [email protected]

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Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam EMS course Ad tile Business Executive

Electromagnetic Interference and Electrical Overstress Management: Why, What, and How

Electromagnetic interference (EMI) is becoming more critical in all aspects of semiconductor manufacturing, affecting productivity and yield.  

The SEMI E176 Standard, "Guide to Assess and Minimize Electromagnetic Interference (EMI) in a Semiconductor Manufacturing Environment," addresses this issue. This document provides practical, actionable guidance on establishing an acceptable EMI environment in semiconductor processes: from assessing the EMI environment to EMI mitigation to verification. SEMI E176 sets recommended EMI limits for different process categories. The Standard can benefit every stage of the semiconductor process and electronic assembly.  
 

Who Should Attend:

  • Semiconductor Device Manufacturers
    • Manufacturing and Quality Directors
    • Department and Production Managers
    • Line Supervisors
    • Sales: VP and Managers
  • Equipment Manufacturers
    • Director-Level and VP Engineering and QA
    • Engineering Department Managers
    • Sales: VP and Managers (customer satisfaction)

 

Meet the Instructor

Vladimir Kraz

 

 

 

 

 

Vladimir Kraz, President, OnFILTER

Biography

 

 

SEMI HQ
CA
United States

1. Overview of SEMI and SEMI Standards
- SEMI as a resource for your company

2. EMI and EMC - an overview

3. Effect of EMI on processes and equipment
- EMI and Electrical Overstress
- Equipment precision
- Process variations
- Other problems

4. Sources and propagation of EMI

5. Overview of SEMI E.33
- Emphasis on Table 1: Compliance Assignment/Responsibility Table

6. Overview of SEMI E.176

7. Basics of a viable EMI program at a factory based on SEMI E.176
- Purpose
- Structure
- Resources and budget
- Similarity and synergy with already-existing ESD program

Standards

Join us for a hybrid experience with both in-person and virtual attendance options.

4:00 pm - 5:00 pm Off Add to Calendar 2023-12-18 16:00:00 2023-12-18 17:00:00 EMI and EOS Management Course Join us for a hybrid experience with both in-person and virtual attendance options. SEMI HQ CA United States SEMI.org [email protected] America/Los_Angeles public America/Los_Angeles Register now
Event format

Registration

Registration for this workshop is free.

For questions, please contact Mayura Padmanabhan at [email protected].

 

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Belgium China France Germany India Ireland Italy Japan Malaysia Russia Singapore South Korea Taiwan United States Vietnam Cybersecurity workshop new location Business Executive Technical
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SEMI Cybersecurity Launch Workshop

Join us for a 2-day working session to align our industry on concrete next steps to secure semiconductor manufacturing against an ever-evolving threat environment. With our complex and interconnected supply chains, no single company can be safe unless all companies are safe. Our consortium of device makers, foundries, equipment makers, component suppliers, and software suppliers are working together to rapidly develop a practical plan to improve security now, and for years to come while minimizing costs and avoiding duplication.

 

Who should attend:

• Device makers • Foundries • Tool suppliers • Component makers • Software suppliers ​and CISOs • Executives • Decision-makers • Managers • Security professionals

Intel - SC12 - Santa Clara 12
CA
United States

Day 1: December 6, 2023 - Noon - 7 pm PT

12:00 pm - 7:00 pm

• Consortia governance, structure, deliverables, and roadmap for 2024
• E187 SEMI Standard implementation ideation session
• Develop a method to survey, evaluate, and certify manufacturing equipment cybersecurity protections
• Globalization of SEMI Taiwan’s E187 reference architecture and checklist

Day 2: December 7, 2023 - 8 am - 3 pm PT

8:00 am - 3:00 pm

• Opportunities for collaboration and information sharing for cyber threats and incidents
• Supply Chain Cybersecurity working session
• Create a semiconductor industry-specific framework to measure security and implementation approach across the entire ecosystem
• Review NIST industry profiles and evaluate for suitability in semiconductor
• Next steps: Including forming working groups and assigning leaders

- Standards

Join us for a 2-day workshop aimed at developing and advocating a practical, standards-based, industry-wide approach to improving cybersecurity and resilience across the semiconductor supply chain.

Time:

Day 1: Noon - 7 pm PT

Day 2: 8 am – 3 pm PT

In-person registration has reached capacity. However, you can still register to participate online.

 

Off Add to Calendar Disabled America/Los_Angeles Register now
Event format
Malaysia TECH TALK OVER COFFEE Banner Business

Supporting Partner

InvestPenang_logo_2022
MSIA_logo_2022
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Macallum Connoisseurs
1, Gat Lebuh Macallum, 10300 George Town, Pulau Pinang, Malaysia
Penang
Malaysia

2:00 pm

Welcome Remarks & Introduction of Speaker

2:15 pm

Navigating Semiconductor Industry in Malaysia: Challenges & Opportunities for Young Engineers

2:45 pm

Dialogue Session

3:15 pm

Networking Tea break

5:00 pm

Program End

Workforce Development

Navigating Semiconductor industry in Malaysia: Challenges & Opportunities for young engineers

This coffee talk session serves as an informal and insightful dialogue for young engineers entering the dynamic semiconductor industry in Malaysia. The discussion focuses on the challenges and opportunities that await them in this vibrant sector. Malaysia's semiconductor landscape is thriving, with numerous multinational corporations contributing significantly to the global supply chain. However, as with any dynamic industry, challenges exist, including staying current with technological advancements, navigating global competition, ensuring quality and reliability, adhering to environmental and regulatory standards, and preparing for potential supply chain disruptions.

Amidst these challenges lies a world of opportunities for young engineers. The semiconductor industry offers an ideal platform for innovation, career growth, global exposure, societal impact, and networking. This session offers valuable recommendations, including embracing lifelong learning, seeking mentorship, building a professional network, cultivating adaptability, finding purpose in work, and maintaining a healthy work-life balance.

The session will emphasize the need to embrace challenges as stepping stones to success while seizing the opportunities to make a meaningful impact in the semiconductor industry. It is an encouragement to the young engineers, assuring them that their talent and determination will leave a significant mark on the industry's landscape.

 

About Speaker: 

Encik Noorazidi Bin Che Azib

Encik Noorazidi Bin Che Azib

Deputy Vice President, Operation Technology, Strategic Program (OTSP), Inari-Amerton Bhd

Noorazidi (Azidi), a Mechanical Engineering graduate from the University of Nevada, Reno, USA, currently holds the position of Deputy Vice President at INARI, overseeing OTSP (Operation Technology and Strategic Programs) and EHS (Environment, Health, and Safety). Azidi began his career in high-volume semiconductor manufacturing, process engineering, automation system design, Industry 4.0, and environmental sectors, accumulating 35 years of experience at multinational corporations such as AMD, Hewlett Packard, Agilent, and Avago before joining INARI in 2012.

He played a pivotal role in INARI's transformation towards digitalization and the adoption of cyber-physical systems. Known for his passion for innovation and commitment to talent development, he collaborates closely with local academia and industrial skill development centers, helping to prepare over 3,000 interns in the past five years for industry roles.

Azidi's expertise in Industry 4.0 has made him a key figure in collaborations with government agencies, actively supports the development of electrical and electronic supply chains, local small-medium-enterprises (SME) productivity, adoption of advanced technology, and business development. Together with the Group CEO, Mr KC Lau, INARI has also initiated numerous SME development programs under the Inari Waterfall Effect Model, which in line with their Industry 4.0 Roadmap.

 

Attendee Fees: RM 120 / pax

- Goodie bag, snacks, and drinks are included for session

Contact: [email protected] for any questions

 

Register Now!

2:00 pm - 5:00 pm Off Add to Calendar 2023-11-30 14:00:00 2023-11-30 17:00:00 Tech Talk Over Coffee | Malaysia, Penang Navigating Semiconductor industry in Malaysia: Challenges & Opportunities for young engineersThis coffee talk session serves as an informal and insightful dialogue for young engineers entering the dynamic semiconductor industry in Malaysia. The discussion focuses on the challenges and opportunities that await them in this vibrant sector. Malaysia's semiconductor landscape is thriving, with numerous multinational corporations contributing significantly to the global supply chain. However, as with any dynamic industry, challenges exist, including staying current with technological advancements, navigating global competition, ensuring quality and reliability, adhering to environmental and regulatory standards, and preparing for potential supply chain disruptions.Amidst these challenges lies a world of opportunities for young engineers. The semiconductor industry offers an ideal platform for innovation, career growth, global exposure, societal impact, and networking. This session offers valuable recommendations, including embracing lifelong learning, seeking mentorship, building a professional network, cultivating adaptability, finding purpose in work, and maintaining a healthy work-life balance.The session will emphasize the need to embrace challenges as stepping stones to success while seizing the opportunities to make a meaningful impact in the semiconductor industry. It is an encouragement to the young engineers, assuring them that their talent and determination will leave a significant mark on the industry's landscape. About Speaker: Encik Noorazidi Bin Che AzibDeputy Vice President, Operation Technology, Strategic Program (OTSP), Inari-Amerton BhdNoorazidi (Azidi), a Mechanical Engineering graduate from the University of Nevada, Reno, USA, currently holds the position of Deputy Vice President at INARI, overseeing OTSP (Operation Technology and Strategic Programs) and EHS (Environment, Health, and Safety). Azidi began his career in high-volume semiconductor manufacturing, process engineering, automation system design, Industry 4.0, and environmental sectors, accumulating 35 years of experience at multinational corporations such as AMD, Hewlett Packard, Agilent, and Avago before joining INARI in 2012.He played a pivotal role in INARI's transformation towards digitalization and the adoption of cyber-physical systems. Known for his passion for innovation and commitment to talent development, he collaborates closely with local academia and industrial skill development centers, helping to prepare over 3,000 interns in the past five years for industry roles.Azidi's expertise in Industry 4.0 has made him a key figure in collaborations with government agencies, actively supports the development of electrical and electronic supply chains, local small-medium-enterprises (SME) productivity, adoption of advanced technology, and business development. Together with the Group CEO, Mr KC Lau, INARI has also initiated numerous SME development programs under the Inari Waterfall Effect Model, which in line with their Industry 4.0 Roadmap. Attendee Fees: RM 120 / pax- Goodie bag, snacks, and drinks are included for sessionContact: [email protected] for any questions Register Now! Macallum Connoisseurs 1, Gat Lebuh Macallum, 10300 George Town, Pulau Pinang, Malaysia Penang Malaysia SEMI.org [email protected] Asia/Kuala_Lumpur public Asia/Kuala_Lumpur SIGN UP

Trading Update: RoodMicrotec announces total income for the third quarter of 2023

• Total income for the third quarter of 2023 was EUR 4.2 million (2022: EUR 4.3 million)
• Total income for the first nine months of 2023 was EUR 12.9 million (2022: EUR 11.7 million)
• Order book value increased compared to the beginning of the quarter

Deventer, October 19, 2023 – RoodMicrotec N.V., a leading independent company for semiconductors supply and quality services, today releases its trading update for the third quarter of 2023. The total income for the third quarter of 2023 was EUR 4.2 million, marginally lower than in the third quarter of 2022 (EUR 4.3 million). The total income for the first nine months of 2023 was EUR 12.9 million, an increase of 10% compared to the same period in 2022 (EUR 11.7 million). The good start in the first quarter of this year and the stable development in the second and third quarters are the base for this increase.
The order book increased compared to the beginning of the quarter and continues to be filled with long-term contracts and engagements as well as short-term orders. The long-term contracts and engagements are mainly in the SCM and Test Operations units and the short-term orders in the Failure Analysis & Qualification unit.
“It is encouraging to see that the total income for the first nine months is higher than for the same period last year even though the market situation with high inflation and rising interest rates is getting worse. We continue to support our customers with high quality services and they highly appreciate it.”, says Martin Sallenhag, CEO of RoodMicrotec. “The steady increase in the order book value is building a good foundation for our future business.”

Outlook
RoodMicrotec expects the total income for 2023 to be in the range of EUR 17.0 million to EUR 17.5 million, with a profit before tax ratio from 5 to 10% of total income, excluding the advisory expenses incurred for the public offering process. This projection is in line with the financial targets communicated to the financial market previously. The geopolitical situation in the world and the trends with higher inflation, rising prices, and increasing interest rates throughout Europe could have an impact on the Company’s business. The Management is keeping a close eye on the situation and is doing everything possible to mitigate any potentially negative impact.

Audit
The financial data in this press release have not been audited.

Today’s Extraordinary Meeting of Shareholders
RoodMicrotec will hold an Extraordinary Meeting of Shareholders at Amsterdam Stock Exchange (Euronext), Beursplein 5, 1012 JW in Amsterdam, the Netherlands, this afternoon starting at 14:00 CEST in relation to the recommended public offer by Microtest S.p.A. for all the issued and outstanding ordinary shares in the capital of RoodMicrotec N.V.

About RoodMicrotec
RoodMicrotec is a leading independent company for semiconductor supply and quality services. With more than 50 years of experience in the semiconductor and electronics industry, RoodMicrotec is well-established as a highly valued partner for many companies worldwide. The Company provides full-turnkey ASIC services for complex microchips that are customized to handle specific applications for individual customers. In cooperation with strong partners, RoodMicrotec manages the entire development and production flow of ASICs in the target volume, ranging from low quantities up to multiple millions per year. The turnkey solution includes project management, wafer test, assembly, final test, qualification, failure analysis and logistics. All services comply with the industrial and quality requirements of the high reliability, aerospace, automotive, healthcare and industrial sectors. RoodMicrotec’s headquarters are located in Deventer, Netherlands, with operational units in Nördlingen and Stuttgart, Germany
For more information visit https://www.roodmicrotec.com

This press release is published in English and German. In case of conflict between these versions the English version shall prevail. This communication contains information that qualifies as inside information within the meaning of Article 7(1) of the EU Market Abuse Regulation. The company’s managing director and CEO Martin Sallenhag, is responsible for arranging the release of this document on behalf of RoodMicrotec.